Abstract: The invention relates to particles with an average particle size of 300 to 1000 ?m, comprising a modified polyvinyl alcohol having vinyl alcohol units and structural units represented by formula (1), wherein a content of the vinyl alcohol units is 60 to 90 mol % based on the total structural units: wherein R1 represents a hydrogen atom or a methyl group. Thus, the present invention provides particles containing a modified polyvinyl alcohol having high water solubility and high affinity for a photosensitive monomer, which are highly photosensitive.

Abstract: A chemically amplified positive resist composition comprising (A) a triarylsulfonium salt of 2,3,3,3-tetrafluoro-2-(1,1,2,2,3,3,3-heptafluoropropoxy)propionic acid, (B) an acid generator, (C) a base resin, and (D) an organic solvent is suited for ArF immersion lithography. The sulfonium salt is highly hydrophobic and little leached out in immersion water. By virtue of controlled acid diffusion, a pattern profile with high resolution can be constructed.

Abstract: A printing plate precursor for laser engraving, including a relief forming layer including a cured resin material formed by thermally crosslinking a resin composition including at least (A) non-porous inorganic particles, (B) a binder polymer having a glass transition temperature (Tg) of 20° C. or higher, and (C) a crosslinking agent.

Abstract: To provide a resist polymer comprising, as a structural unit, an acid-decomposable unit having a structure represented by formula (1) or (2) which exhibits a small line edge roughness and produces little defects in DUV excimer laser lithography or the like.

Abstract: The invention provides a positive resist composition comprising, as base resins contained therein, (A) a polymer having a weight-average molecular weight of 1000 to 500000 and containing a repeating unit which contains a structure having a hydrogen atom of a carboxyl group thereof substituted with an acid-labile group having a cyclic structure and (B) a novolak resin of a substituted or an unsubstituted naphtholphthalein, and in addition, a photo acid generator. There can be provided a positive resist composition having an appropriate absorption to form a pattern on a highly reflective substrate, excellent characteristics in adhesion and implantation onto a non-planar substrate, a good pattern profile after light exposure, and an ion implantation resistance at the time of ion implantation; and a patterning process.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes (A) a compound capable of generating a specific acid having a norbornyl structure upon irradiation with an actinic ray or radiation, and (B) a resin capable of increasing the dissolution rate of the resin (B) in an alkali developer by an action of an acid, the resin (B) containing a specific repeating unit having a lactone structure on the resin side chain through a linking group, and a pattern forming method uses the composition.

Abstract: Disclosed is a lithographic composition for forming a resist underlayer film, which can be used as a lower layer antireflection film by which an exposure light striking on a photoresist formed on a semiconductor substrate is inhibited from being reflected from the substrate in a lithographic process of manufacturing semiconductor equipment, a planarization film for flattening a semiconductor substrate having a rugged surface used in order to fill in a hole formed on the semiconductor substrate, a film which prevents a photoresist from being contaminated by a substance generated from a semiconductor substrate during heating/burning, or the like.

Abstract: The present invention provides a positive resist composition and a resist pattern forming method that are capable of forming a resist pattern with a reduced level of roughness. The positive resist composition includes the compound represented by the general formula (I) below. The present invention also provides the resist pattern forming method using the positive resist composition above. [wherein, in formula (I), R11 and R12 each represents, independently, an alkyl group of 1 to 10 carbon atoms or an aromatic hydrocarbon group, and may include a hetero atom in the structure thereof; R21 to R24 each represents, independently, a hydrogen atom or an acid dissociable, dissolution inhibiting group, and two of the R21 to R24 represents a hydrogen atom and the others represents an acid dissociable, dissolution inhibiting group; X is a group represented by general formulas (Ia) or (Ib) below].

Abstract: The present invention relates to a novel alkali-developable resin, a method of producing the alkali-developable resin, a photosensitive resin composition including the alkali-developable resin, and a device that is manufactured by using the photosensitive composition. In the case of when the alkali-developable resin is used as a component of the photosensitive composition, the photosensitivity, the developability and the film remaining rate of the pattern are improved.

Abstract: The present invention refers to new organic molecules, derived from the class of polycarbocycle derivatives, and their application as components of photoresists, and in particular as components of photoresist compositions where no polymer is comprised as one of the photoresists components. In these photoresist formulations the new molecule(s) is/are the main component(s) (i.e. percentage higher than 50% w/w).

Abstract: A radiation-sensitive composition containing a resist compound having a high sensitivity, a high resolution, a high etching resistance, and a low outgas which forms a resist pattern with a good shape is described. Further described is a method of forming a resist pattern using the radiation-sensitive composition. Still further described are a novel composition for forming a photoresist under coat film which is excellent in optical properties and etching resistance and contains substantially no sublimable substance and an under coat film formed by the composition.

Abstract: A heat-sensitive positive-working lithographic printing plate precursor includes a support having a hydrophilic surface or which is provided with a hydrophilic layer, a heat-sensitive coating including an IR absorbing agent, a phenolic resin, and a first polymer, wherein the first polymer is an alkaline soluble polymer including a monomeric unit having a structure according to Formula I or Formula II, wherein at least one of the aromatic groups Ar1 and Ar2 is an optionally substituted heteroaromatic group:

Abstract: A method of making a lithographic printing plate includes the steps of: a) providing a lithographic printing plate precursor including (i) a support having a hydrophilic surface or which is provided with a hydrophilic layer, (ii) a coating on the support including an imaging layer, and, optionally, an intermediate layer between the imaging layer and the support, wherein the imaging layer includes a switchable polymer, b) image-wise exposing the coating, whereby the polymer undergoes a chemical reaction induced by the exposing step thereby creating a lithographic image consisting of printing areas and non-printing areas wherein the non-printing areas are removable from the support by a gum solution, and c) developing the precursor by treating the coating of the precursor with the gum solution thereby removing the non-printing areas.

Abstract: There is provided a gap fill material forming composition for lithography that is used in dual damascene process and is excellent in flattening property and fill property. Concretely, it is a gap fill material forming composition characterized in that the composition is used in manufacture of semiconductor device by a method comprising coating a photoresist on a semiconductor substrate having a hole with aspect ratio shown in height/diameter of 1 or more, and transferring an image to the semiconductor substrate by use of lithography process, and that comprises a polymer, a crosslinking agent and a solvent.

Abstract: A coating material including a low-molecular or medium-molecular organic compound represented by general formula (1). (In the formula, R1 is a single bond, methylene, ethylene or oxygen; and R2 is a hydrogen atom, or a hydrocarbon group, a fluorine-containing alkyl group, a cyclic form containing an aromatic group or aliphatic group, which may contain hydroxy group, carboxyl group, amino group, amide group, imide group, glycidyl group, cyano group, fluorocarbinol group, sulfonic group or sulfonylamide group, and a complex thereof, and may contain a fluorine atom, oxygen atom, nitrogen atom, silicon atom or sulfur atom, and R2's of the same type or different type may be connected by an ester bond, amide bond, ether bond, thioether bond, thioester bond or urethane bond.). This compound can be derived from a diol compound and bicyclo[2.2.2]octane-2,3:5,6-tetracarboxylic anhydride.

Abstract: A resin for photoresist compositions is disclosed with excellent resolution and line edge roughness characteristics. A photoresist composition and a method for forming a resist pattern using such a resin are also disclosed. The resin has a hydroxyl group bonded to a carbon atom at a polymer terminal, and the carbon atom in the ?-position to the hydroxyl group has at least one electron attractive group.

Abstract: By using a branched long chained chain scission polymer as a photoresist for high resolution extreme ultraviolet (EUV), e-beam or 193 nanometer lithography applications, a relatively higher molecular weight polymer with good mechanical properties may be achieved. In addition, by using chain scission technology, line edge roughness and resolution may be improved at the same time.

Abstract: A resin for photoresist compositions is disclosed with excellent resolution and line edge roughness characteristics. A photoresist composition and a method for forming a resist pattern using such a resin are also disclosed. The resin has a hydroxyl group bonded to a carbon atom at a polymer terminal, and the carbon atom in the ?-position to the hydroxyl group has at least one electron attractive group.

Abstract: There is provided a novel polyester compound having in its main polymer chain an aliphatic cyclic structure with carboxylic acids or carboxylic acid ester groups as represented by the chemical formula (1), a resist material containing the polyester compound and a patterning method using the resist material.

Abstract: The present invention relates to a process for preparing a resin binder for toner, comprising the steps of (A) carrying out an addition polymerization reaction of addition polymerization resin monomers including styrene in the presence or absence of an organic solvent; and (B) mixing the resulting reaction mixture from the step (A) with water at a rate of 0.002 to 0.5 parts by weight based on 100 parts by weight of the addition polymerization resin monomers per minute at a temperature of 100° to 300° C. during and/or after the step (A), wherein the amount of water to be mixed in the step (B) is 0.1 to 50 parts by weight based on 100 parts by weight of the addition polymerization resin monomers. The resin binder for a toner obtained according to the present invention can be used, for instance, for developing electrostatic latent images formed in electrophotography, electrostatic recording method, electrostatic printing method, and the like, and a toner containing the resin binder.

Abstract: A photosensitive resin (A) consisting substantially of a product obtained by reacting a polyester (c) which is a reaction product of a polyol (a) with a tetrabasic acid dianhydride (b) with a compound (d) having an ethylenically unsaturated group and an epoxy group in the molecule; an alkali-soluble photosensitive resin (AA) obtained by reacting the photosensitive resin (A) with a di- or tri-basic acid mono-anhydride (e); photosensitive resin compositions prepared by incorporating the above photosensitive resin with a diluent (XX), a crosslinking agent (B) and/or a photopolymerization initiator (C); products of curing of the compositions; and articles equipped with these products. The resins and resin compositions give cured articles which are suitable for the formation of optical waveguides and excellent in processability, transparency, developability, close adhesion, resistance to soldering heat, and so on.

Abstract: The present invention relates to a novel antireflective coating composition comprising a polymer, a crosslinking agent and an acid generator. The present invention further relates to a process for using the novel composition, particularly at 193 nm. The polymer of the present invention contains at least one unit selected from structures 1, 2 and 3, where, Y is a hydrocarbyl linking group of 1 to about 10 carbon atoms, R, R1, R? and R? are independently hydrogen, hydrocarbyl group of 1 to about 10 carbon atoms, halogen, —O(CO)Z, —C(CF3)2Z, —C(CF3)2(CO)OZ, —SO2CF3, —(CO)OZ, —SO3Z, —COZ, —OZ, —NZ2, —SZ, —SO2Z, —NHCOZ, —NZCOZ or —SO2NZ2, where Z is H or a hydrocarbyl group of 1 to about 10 carbon atoms, n=1–4, X is O, CO, S, COO, CH2O, CH2COO, SO2, NH, NL, OWO, OW, W, and where L and W are independently hydrocarbyl groups of 1 to about 10 carbon atoms, and m=0–3.

Abstract: By using a branched long chained chain scission polymer as a photoresist for EUV and 157 nanometer applications, a relatively higher molecular weight polymer with good mechanical properties may be achieved. In addition, by using chain scission technology, line edge roughness and resolution may be improved at the same time.

Abstract: A polymeric compound for photoresist of the invention includes at least one monomer unit represented by following Formula (I): wherein R1, R2, R3, R4 and R5 are the same or different and are each a hydrogen atom or a methyl group; m, p and q each denote an integer of from 0 to 2; and n denotes 0 or 1, where the hydroxyl group and carbonyloxy group extending from a principle chain in the formula are independently combined with either of two carbon atoms on the far-left portion of the rings. By using the polymeric compound for photoresist as a base of a photoresist, the resulting photoresist exhibits well-rounded adhesion to substrates and resistance to etching.

Abstract: A photoresist includes a polymer which has acid-cleavable groups in its main chain. The polymer can thus be cleaved by acid into short cleavage products which can be removed from the substrate through the use of a developer. The polymer is completely or partially fluorinated, and consequently has an improved transparency to light of short wavelengths.

Abstract: The present invention provides novel alicyclic-esterified norbornene carboxylates monomers, polymers and photoresist compositions that comprise the polymers as a resin binder component. Methods for synthesis of the monomers and polymers of the invention are also provided. The photoresist compositions of the invention can provide highly resolved relief images upon exposure to short wavelengths, including sub-300 and sub-200 nm wavelengths such as 193 nm and 157 nm.

Abstract: Novel silicon-containing polymers are provided comprising recurring units having a POSS pendant and units which improve alkali solubility under the action of an acid. Resist compositions comprising the polymers are sensitive to high-energy radiation and have a high sensitivity and resolution at a wavelength of up to 300 nm and improved resistance to oxygen plasma etching.

Abstract: The present invention also includes an imageable element, comprising a substrate and a thermally imageable composition comprising a thermally sensitive polymer which exhibits an increased solubility in an aqueous developer solution upon heating. The thermally sensitive polymer includes at least one covalently bonded unit and at least one thermally reversible non-covalently bonded unit, which includes a two or more centered H-bond within each of the non-covalently bonded unit. The present invention also includes a method of producing the imaged element. The present invention still further includes a thermally imageable composition comprising comprising a thermally sensitive polymer according to the present invention and a process for preparing the thermally sensitive polymer, which is a supramolecular polymer.

Abstract: A positive working lithographic printing plate precursor comprising a lower layer containing a water-insoluble and alkali-soluble resin, and an upper heat-sensitive layer containing a water-insoluble and alkali-soluble resin and an infrared absorbing dye and increasing the solubility in an alkaline aqueous solution by heating, provided in this order on a hydrophilic support, and (a) the upper heat-sensitive layer containing at least two kinds of surface active agents, or (b) the lower layer and upper heat-sensitive layer each containing a surface active agent different from each other.

Abstract: The use of certain mercapto compounds as shelf life improvers for infrared-sensitive lithographic printing plate precursors is disclosed. The compounds are five-membered heteroaromatic rings containing a nitrogen atom and at least one other heteroatom, which can be oxygen, sulfur, or another nitrogen atom, such that two ring heteroatoms are bonded to a ring carbon bearing a thiol group.

Abstract: A radiation sensitive refractive index changing composition whose refractive index of a material is changed by a simple method, whose changed refractive index difference is sufficiently large, and which can provide a stable refractive index pattern and a stable optical material regardless of their use conditions. The radiation sensitive refractive index changing composition comprises (A) a polymerizable compound, (B) a non-polymerizable compound having a lower refractive index than the polymer of the polymerizable compound (A), and (C) a radiation sensitive polymerization initiator.

Abstract: Polymeric material, containing a latent acid which can be converted to an acid by irradiation by a laser and optionally further ingredients.

Abstract: A method of colouring a polymeric material containing a) a latent acid, b) a colour former and c) optionally further ingredients by irradiation with UV-light.

Abstract: Polymer materials are described that undergo a two-level three-dimensional crosslinking process. During this process, hydrophilic polymers are crosslinked at two levels, the first results in a low level of crosslinking which leads to a toughening of the layer preventing dissolution by the fountain solution but with the layer remaining hydrophilic. The second level of crosslinking is higher and is the result of exposure to a laser diode thermal imaging device. The crosslinking at this second level results in a loss of hydrophilicity and provides instead an oleophilic image capable of accepting and transferring oil-based ink. The polymer materials are particularly useful in lithographic printing systems where they may used in articles such as a printing plate comprising a substrate having coated thereon a layer that becomes less hydrophilic upon exposure to thermal energy (e.g.

Abstract: The present invention relates to a radiation sensitive photoresist composition comprising a photoacid initiator and a polycyclic polymer comprising repeating units that contain pendant acid labile groups. Upon exposure to an imaging radiation source the photoacid initiator generates an acid which cleaves the pendant acid labile groups effecting a polarity change in the polymer. The polymer is rendered soluble in an aqueous base in the areas exposed to the imaging source.

Abstract: A pattern formation material contains a base polymer including a siloxane compound represented by Chemical Formula 1: wherein R1 are the same or different compounds selected from the group consisting of an alkyl compound, an ester compound, an ether compound, a sulfone compound, a sulfonyl compound and an aromatic compound.

Abstract: Disclosed is a negative-type photosensitive resin composition comprising component (A) that is a product of the Michael addition reaction between an amino group-containing compound (a-1) represented by the general formula (I): 1

Abstract: A negative resist composition comprising (A) an alkali-soluble polymer, (B) a cross-linking agent forming cross-links between molecules of the alkali-soluble polymer (A) under the action of an acid and (C) a specified acid generator, which can satisfy all of performance requirements concerning sensitivity, resolution, pattern profile and line-edge roughness in the pattern formation by irradiation with electron beams or X-rays.

Abstract: A polymeric compound for photoresist of the invention includes at least one monomer unit represented by following Formula (I): 1

Abstract: A polymer comprising recurring units of formula (1) wherein R1 is H or methyl, R2 is H or C1-8 alkyl, R3 is hydrogen or CO2R4, and R4 is C1-15 alkyl and recurring units having a carboxylic acid protected with an acid-decomposable protecting group containing an adamantane or tetracyclo-[4.4.0.12,5.17,10]dodecane structure and having a Mw of 1,000-500,000 is novel. A resist composition comprising the polymer as a base resin is sensitive to high-energy radiation, has excellent sensitivity, resolution and etching resistance and lends itself to micropatterning with electron beams or deep-UV.

Abstract: The use of certain mercapto compounds as shelf life improvers for infrared-sensitive lithographic printing plate precursors is disclosed. The compounds are five-membered heteroaromatic rings containing a nitrogen atom and at least one other heteroatom, which can be oxygen, sulfur, or another nitrogen atom, such that two ring heteroatoms are bonded to a ring carbon bearing a thiol group.

Abstract: The present invention relates to compositions that may be cured under the action of UV radiation and contain A) 40 to 80 parts by weight of a polyester resin component containing one or more ethylenically unsaturated polyester resins prepared from a carboxylic acid component containing a 1,2-alkenyl dicarboxylic acid monodicyclopentenyl ester and fumaric acid, maleic acid and/or maleic anhydride and an alcohol component containing a dyhydric alcohol, B) 20 to 60 parts by weight of a copolymerizable monomer such as styrene and C) 0.1 to 10 parts by weight of a photoinitiator. The present invention also relates to coated substrates, in particular wood or imitation wood, prepared from these compositions at an application viscosity of less than 60 seconds measured at 23° C. in a DIN 4 cup to DIN 53211 under the action of UV radiation.

Abstract: A chemical amplifying type positive resist composition which provides a resist pattern having an exceedingly improved line edge roughness, and is excellent in various resist performances such as dry etching resistance, sensitivity and resolution; and comprises:

Abstract: A resist composition is prepared by reacting an alkali-soluble polymer having a phenolic hydroxyl or carboxyl groups with a vinyl ether compound in an aprotic solvent, such as propylene glycol monomethyl ether acetate, in the presence of an acid catalyst, suspending the reaction by the addition of a base, and directly adding a photoacid generator to the reaction solution. When a dialkyl dicarbonate is used in stead of the vinyl ether compound, a resist composition is prepared by carrying out the reaction in the presence of a basic catalyst and adding a photoacid generator directly to the reaction. Thus resist compositions can be prepared without isolating or purifying an alkali-soluble polymer which has been substituted by a catalytic reaction.

Abstract: A positive photoresist composition comprising a polymer, a photoactived agent and an dissolution inhibitor represented by the following formula (1): wherein R1 and R2 each independently is a hydroxyl group, a C1-8 hydroxyalkyl group, or a C3-8 hydroxycycloalkyl group; R3, R4 and R5 each independently is a hydrogen, a C1-8 hydroxyalkyl group, a C1-6 carboxylic acid or a C3-8 carboxylic acid ester; k is an integer of 0, 1, 2, 3, 4, 5 or 6. The photoresist composition has high transparency to deep UV light and is capable of forming good fine patterns, roughness and high sensitivity, thus being useful as a chemically amplified type resist when exposed to deep UV light from an KrF and ArF excimer laser.

Abstract: A heat-shrinkable polyester film including: a repeating unit of trimethyleneterephtalate of 5-30% by mole; a repeating unit of 2,2-dimethyl(-1,3-propylene)terephtalate of 5-30% by mole of the total composition; and a repeating unit of ethyleneterephtalate for the balance. The heat-shrinkable polyester film has excellent printability, mechanical properties, film-and-flux adhesiveness and shrinkage properties, and ease of drawing process. Thus, the heat-shrinkable polyester film can be used as labels or coverings for a variety of containers.

Abstract: Optical waveguides prepared by irradiating selected regions of positive photochromic polymeric materials with actinic radiation are disclosed. The photochromic materials undergo an irreversible photochemical change which results in an increase in the refractive index of light-exposed regions. In addition, the materials exhibit negligible second-order polarizability prior to exposure and excellent nonlinear optical properties after exposure and polarization. Thus, the exposed regions are particularly useful as the core in active waveguides for use in second-order nonlinear optical applications, as well as the core in passive waveguides. In addition, a simple two step process is disclosed for forming optical waveguides from the positive photochromic polymers. Optical structures, such as optical integrated circuits, and optical devices which incorporate the waveguides are also disclosed.

Abstract: An image forming process comprises the steps of image-wise exposing to light a light-sensitive material, heating the light-sensitive material to develop the silver halide within the exposed area and to harden the hardening layer, and removing the light-sensitive layer and the unhardened area of the hardening layer from the light-sensitive material with an etching solution to form a replica image of the hardened area on the support. The light-sensitive material comprises a support, a hardening layer and a light-sensitive layer in this order. The hardening layer contains an ethylenically unsaturated polymerizable compound represented by the formula (I).A(--NH--CO--Y--L--Q.sub.n).sub.m (I)in which A is an m-valent organic group having 1 to 50 carbon atoms; Y is --O-- or --NR--, wherein R is hydrogen or an alkyl group having 1 to 12 carbon atoms; L is an (n+1)-valent aliphatic group having 1 to 10 carbon atoms; Q is acryloyloxy or methacryloyloxy; n is 1, 2 or 3; and m is 2, 3, 4, 5 or 6.

Abstract: A polycarbonate containing repeating units (1) represented by the general formula (1), a polycarbonate molding produced by molding the polycarbonate, and an electrophotographic photoreceptor having a photosensitive layer which has a surface layer containing the polycarbonate: ##STR1## wherein R is an aliphatic unsaturation-free monovalent hydrocarbon group, R.sup.1 is a halogen atom, an alkyl group, an alkoxy group or an aryl group, X is an alkylene group or an alkyleneoxyalkylene group, X' is an alkylene group of 2 or more carbon atoms, an alkyleneoxyalkylene group or oxygen atom, a is an integer of 0 to 4, na is 0 or 1, nb is 1 or 2, nc is 1 or 2, provided na+nb+nc=3, n1, n2, n3 and n4 are 0 or an integer of 1 or more, provided n1+n2+n3+n4 is an integer of 0 to 450.

Abstract: New polymers and new anti-reflective compositions containing such polymers are provided. The compositions comprise a polymer (e.g., epoxy cresol novolac resins) bonded with a chromophore (4-hydroxybenzoic acid, trimellitic anhydride). The inventive compositions can be applied to substrates (e.g., silicon wafers) to form anti-reflective coating layers having high etch rates which minimize or prevent reflection during subsequent photoresist exposure and developing.