Abstract: Method of reducing the formation of folds on metal strips (1) exposed to rapid heating in continuous heat-treatment lines, in which lines said strips are caused to pass through heating sections (2) comprising successive and separate heating means (5; 5a; 5b; 5c; 5d), wherein the average slope of the increase in temperature of the strip between the inlet and the outlet of a heating means decreases from one heating means to the following heating means.

Abstract: A substrate firing device having an increased contact area between the substrate and substrate support portions, thereby preventing the substrate support portions from generating scratches on the substrate when the substrate expands and contracts due to heating and cooling. By increasing the contact area to the substrate and by using quartz on items that contact the substrate, it is possible to prevent scratches occurring on a substrate, even after an etching process of the substrate, thereby improving quality of the slimmer final product.

Abstract: A heat treatment operation can be executed, suppressing a wave-shaped deformation at a non heat-treatment region of an article to be heat treated. To an elongated-shaped article to be heat treated to which a raised portion extending in the longitudinal direction is formed, a hardening region, as a heat-treated region defined to extend in a longitudinal direction at a part of the raised portion, and a non-hardening region, as a non-heat-treated region defined to extend in the longitudinal direction at flange portion, and other parts of the raised portion are arranged side by side in a width direction orthogonal to the longitudinal direction. The flange portion is clamped by a first and a second clamp, arranged in the longitudinal direction, and one first clamp is a tight clamp for holding fixedly the flange portion and a plurality of second clamps are loose clamps for clamping loosely the flange portion, allowing the article to be heat treated to be convex on the side of the heated hardening region.

Abstract: A device for magnetically annealing magnetoresistive elements formed on wafers includes a heated chuck and a delivery mechanism for individually placing the wafers individually on the chuck one at a time. A coil is adjacent to the chuck and generates a magnetic field after the wafer is heated to a Néel temperature of an anti-ferromagnetic layer. A control system regulates the temperature of the heated chuck, the strength of the magnetic field, and a time period during which each chuck is heated to control the annealing process. The annealed elements are incorporated in the fabrication of magnetic memory devices.

Abstract: A pipe heating apparatus for heating pvc pipe to facilitate bending. The pipe heating apparatus includes a housing having a lower portion and an upper portion, and at least one aperture extending through a wall of the housing. The lower portion includes a bottom wall for resting upon a horizontal support surface, and a lower perimeter wall extending upwardly from the bottom wall. Similarly, the upper portion includes an top wall and a upper perimeter wall extending downwardly from the top wall. The lower perimeter wall and the upper perimeter wall both have the same form and size. The upper portion may be positioned to rest upon the lower portion. Thus, an edge of the upper perimeter wall abuts an edge of the lower perimeter wall. The housing defines an interior space for receiving a portion of a pvc pipe.

Abstract: A thin metallic ferromagnetic alloy ribbon is annealed by continuously transporting it through an oven in order to induce specific magnetic characteristics and in order to remove a production-inherent longitudinal curvature of the ribbon. While the heat-treatment occurs, the ribbon is guided by a channel in a substantially straight annealing fixture. The channel is characterized by slight curvatures along portions of its length, in particular where the ribbon enters into the annealing oven. The curved channel provides an improved thermal contact between the ribbon and the heat reservoir. As a consequence the process can be conducted at particularly high annealing speeds without degrading the desired characteristics.

Abstract: When carrying workpieces from a loading area in which the workpieces are handled into a heat treatment furnace to make the workpieces subjected to a heat treatment process using a predetermined process gas, the loading area is evacuated and controlled at a predetermined low negative pressure. An exhaust for evacuating the loading area is connected to the loading area, and a controller controls the exhaust so that the loading area is maintained at the predetermined low negative pressure. A specific gas and particles contained in a gas discharged from the loading area are removed by filters.

Abstract: Pins that are small protrusions are disposed on the upper surface of a heat process board. Through-holes are formed between the pins so as to deaerate from a space thereof. In a predetermined time period in the initial stage of the heat process, a deaerating process is performed using the through-holes. Thus, a negative pressure is applied to the space between the lower surface of the substrate and the upper surface of the heat process board so as to contact the substrate and the heat process board. Thereafter, the vacuum degree is lowered. Due to the rigidity of the substrate, the substrate and the heat process board are separated. In the initial stage of the heat process, since the substrate and the heat process board directly contact, the temperature of the substrate quickly and equally rises. In addition, when the heat shrinkage is large, since the substrate and the heat process board are separated, static electricity due to friction hardly takes place. Thus, a static breakdown can be prevented.

Abstract: A tool for soldering pin-in-hole electronic circuit components includes a tool plate with a set of via holes corresponding to the holes of a circuit board on which a circuit component is soldered. The board is aligned with the tool plate and hot gas is supplied through the set of plate vias to reflow solder in the board holes. The tool is particularly suitable for use in removing and replacing pinned circuit components. Use of particular gases (e.g., nitrogen) allows soldering to be carried out without the use of flux. Advantages of the tool are that it prevents burning the circuit board and/or unintentionally reflowing other circuit components mounted on the board (by directing hot gas only substantially onto the circuit board's solder-containing holes).

Abstract: A heating apparatus 1 includes a plurality of closable heating units 10 arranged at specified intervals and each provided with a heater 14, a conveyor 20 for conveying the closable heating units 10 along a loop-shaped conveyance path including a setting station 31, an unloading station 32 and a cooling station 33, and a controller for controlling the heater 14 to heat a solder containing wire connector set in the heating unit at the setting station 31 until the heating unit sent out from the setting station 31 reaches the cooling station 33. The heating apparatus 1 thus constructed heats a wire connection, in particular a connector, such that the wire connection is secure and watertight, and has a good working efficiency.

Abstract: The present invention relates to a process permitting the modification of the chemical composition of the inner face of a barrel, consisting in heating and in moistening the inner face of the shell (1) of this barrel, characterized in that it consists in alternately heating and moistening, according to a specified heating power and liquid flow rate, and for a specified time, the heating being distributed over the entire height of the shell.It also relates to a machine implementing this process and comprising a rotating support (12), heating means (19) and moistening means (20, 21, 22) which are vertically displaceable with respect to the main axis of the barrel.Application: barrels for wines and alcohols.

Abstract: A support is provided for supporting the lower header plate and adjacent tube ends of a radiator core within an oven area for even heating thereof preparatory to manually pry and scrapping softened epoxy material from the header plate and about the tube ends. A method also is incorporated wherein after the original epoxy has been removed, fresh epoxy is applied to the header plate about the tube ends and allowed to cure.

Abstract: A rapid thermal processor for heat treating and cooling semiconductor material in an elongated process chamber having a base, side and top walls which enclose a heater plate assembly through which thin pins longitudinally move to carry workpieces vertically to and from the heater assembly. A cooling shutter is adapted in the chamber to shield the workpiece from the heater plate when the cooling process takes place. The chamber has gaseous ambient control means which regulates the type of atmosphere or vacuum in the chamber during heat processing of the workpieces.

Abstract: It is common practice to apply a shrink sleeve to a weld joint in a pipeline. The success of such application depends upon the ability to transport equipment from joint to joint and the adaptability of the heating apparatus to a variety of pipe sizes. A relatively simple apparatus for meeting the above defined requirements includes a skeletal frame carried by rollers for movably supporting the apparatus on a pipe to be heated, a clamp on the frame for releasably engaging the pipe to stabilize the apparatus, and heaters pivotally mounted on the frame for rotation between a closed position around the pipe and an open position permitting movement of the apparatus to another joint. By making the height of the frame variable, the apparatus can be adapted to pipes of different diameters.

Abstract: An apparatus for supporting a workpiece has an enclosure, a means for reducing the pressure and a platen on which the workpiece is mounted. A heating mechanism is located within the platen and the platen is coated with a high emissivity material, which facilitates the radiative heat transfer between the platen and the workpiece. Consequently, the workpiece can be rapidly raised to a specific temperature. This apparatus is particularly applicable to the supporting of a semiconductor wafer within a vacuum system.

Abstract: A system is disclosed for curing epoxy in a fiber optic connector. An oven has a receptacle for receiving the connector with an exposed length of an optical fiber projecting therefrom. A heat conductive sheath is positionable on the connector about the optical fiber for distributing heat from the oven and for protecting the fiber when the connector is inserted into the receptacle. Sensing elements are located in the path of insertion movement of the fiber optic connector and conductive sheath to be actuated thereby in response to the connector being inserted into the receptacle. A micro-controller is coupled between the sensing elements and audible/visual signals. The micro-controller includes a timer to actuate the audible/visual signals after a predetermined period of time within which the heater is energized.

Abstract: An apparatus is described for processing semiconductor wafers for the construction of integrated circuit structures thereon wherein a semiconductor wafer is supported on the upper surface of a uniformly heated susceptor. The apparatus comprises a chamber, a circular susceptor in the chamber for supporting a semiconductor wafer thereon, heating means in the chamber beneath the susceptor, and support means for peripherally supporting the susceptor in the chamber comprising 3-6 spokes which are each connected at one end to a central hub which is coaxial with the axis of the circular susceptor, but spaced therefrom to permit even thermal distribution across the susceptor, and opposite ends of the spokes peripherally supporting the susceptor adjacent the end edges thereof, to permit uniform heating of the susceptor by the heating means and uniform thermal distribution of the heat through the susceptor.

Abstract: The improved zone-melt recrystallization apparatus is comprised of a port system for providing a thermal barrier between the recrystallization chamber and the loader assembly. A bellows system is used to lift a plurality of pins that support a silicon wafer being recrystallized. Flexure supports are designed to constrain the motion of the pins within the desired direction of motion of the wafer.

Abstract: A rectangular cross-section housing is provided for an apparatus generating hot gas to shrink a plastic film. A burner is located close to the upper small end of this housing while an outlet nozzle is provided at the lower small end and the gas flows at an obtuse angle from the burner to the outlet. The burner is flanked by lamellae and a venturi action draws cool air between the lamellae and the burner, additional cool air passing between the lamellae and the vertical housing walls. Cold-air nozzles are provided within the housing as well.

Abstract: A miniaturized forge consisting of a metal body with slots and openings to admit the metal to be heated, along with a bracket for holding a separate fuel tank containing a torch which extends vertically downward through a hole in the metal body. The torch within the forge is able to selectively heat areas of metal objects to a temperature high enough to allow them to be bent into a desired shape.

Abstract: Nozzle structure suitable for bringing heated fluid into contact with a plurality of terminals of a modular electronic component to facilitate attachment of the component to a substrate or removal therefrom. The nozzle structure comprises a conduit forming member engageable with the component and with the substrate to form a heated fluid conduit extending around the periphery of the component, and a heated fluid delivery conduit coupled to the conduit forming member for delivering heated fluid to the heated fluid conduit to effect melting of solder or the like at the terminals of the component.

Abstract: The invention concerns a temperature distribution controlling sample holding adaptor for setting up gradient heat treatment conditions in heat treatment ovens, which has a sample holder for realizing temperature distribution and setting and adjustment units associated therewith, and which enables the production of the free prescribed or desired temperature range by means of heating up, maintaining the heat and cooling down. The adaptor mechanism may be combined with any known heat treatment apparatus which was not manufactured originally for gradient heat treatment purposes and by means of processors or micro-processors which may be connected thereto for controlling adjustment, controlling and recording instruments the apparatus may be operated without supervision even for more complicated treatments.

Abstract: Configuration for temperature treatment of substrates, in particular semiconductor crystal wafers, comprised of a carrier for receiving the substrates to be treated, a frame-like support for receiving the carrier, whereby the frame-like support is connected to a time-controlled compressed air cylinder and can be shifted in axial direction by means of a roller guide, as well as heating devices. The heating devices are connected to a vacuum suction configuration, and includes one, disk-shaped heating plate with a flute type opening on top, to which the substrates contained in carrier are vacuum sucked. The configuration is used for low temperature processes used in conjunction with semiconductor technology, especially photolithographic processes, and eliminates unnecessary reloading or other rearranging procedures.

Abstract: A method of flattening a stack of sheets of material by assembling the stack horizontally in an oven of clamshell like construction and applying pressure to the stack hydraulically from an external pressure source by means of pistons entering the oven from each end.

Abstract: The present invention is a device for bringing integrated circuit devices (22), to be tested at a test site, to a temperature to which the devices (22) will be subjected during operating conditions of equipments in which they will ultimately be installed. The device includes a rack (30) comprising a plurality of rails (32) overlying corresponding tracks (24) down which the integrated circuits (22) move through a magazine (20). The rails (32) are adjustable toward and away from their corresponding tracks (24), and both are heated in order to impart thermal energy to integrated circuit devices (22) passing down the tracks (24). Each track (24) has, proximate a lower end thereof, a singulation assembly (56) which not only isolates a single device (22) to be passed to a test site, but also functions to press the lowermost device (22) in a string passing down the respective track (24) into close engagement with the track (24) in order to effect maximum heat transfer.

Abstract: A portable gas forge. The forge is comprised of a housing having an insulated interior and an opening for insertion of the article to be heated such as a horseshoe or the like. The forge is resistant to blow-out by wind when used in the field and has a specially designed burner connected to the top of the housing. The burner is connected to a source of gas such as an LP gas cylinder. A gas orifice is connected to an enlarged burner pipe having a bell-shaped primary air inlet adjacent the gas orifice. A source of secondary air is located at the exterior pipe connection to the housing to provide an annular air passage through the housing to the burner outlet to obtain maximum flame concentration in the housing and inhibit burn back or back flaming. An internal restrictor adjacent the burner pipe outlet is employed to increase the burner gas velocity and aid in secondary air aspiration and combustion efficiency.

Abstract: A hot-air generator to facilitate execution of work on plastic spectacle frames, having two axial, parallel and opposing hot-air outlets.

Abstract: An apparatus for the heat treatment of a product includes a metallic heat transfer assembly for transmitting heat either directly to the product or to a mould containing the product. The heat transfer assembly comprises a plurality of separate parts which are joined together either permanently or in an operationally separable manner. Each part includes a gas distribution passageway, the passageways together defining a closed loop path for receiving and circulating around the heat transfer assembly hot permanent gas from a hot gas source. One or more heat transfer passageways formed in the heat transfer assembly itself, or between the heat transfer assembly and the mould, communicate with the closed loop path in the heat transfer assembly so as to receive hot gas therefrom and lead this gas to an exhaust outlet to the atmosphere.

Abstract: The present invention relates to apparatus for applying heat to a portion of a pipeline, particularly a pipeline carrying natural gas, for the purpose of curing a heat shrinkable plastic sleeve used to repair leaks in the pipeline wall. The apparatus comprises an elongate manifold 1 for mounting on the pipeline and having an inlet 5 to receive hot gas from a forced draught gas burner 6 and an outlet 8 to discharge the hot gas along the portion of the pipeline. The apparatus also comprises a flexible blanket 2 of a heat insulated material such as illuminated glass wool and having one edge 71 for securing to the manifold 1 so that the blanket 2 can be wrapped around the portion of the pipeline to form therearound a heat shroud having openings 75 and 76 respectively to receive hot gas from the manifold outlet 8 and to discharge the gas after circulation around the wall of the pipeline 26.

Abstract: A soldering device for radiator tanks comprises a large number of burner nozzles disposed along the entire width of and directed to the soldering area. Cooling pipes are provided on burner tables which can be adjusted so that the radiator can be inserted inside the gap formed therebetween. A control means shifts the times for starting and shutting off the supplying of an oxygen-containing gas from the burner ignition and fire extinction times.

Abstract: An adjustable welding furnace includes a gimbal-mounted furnace housing within which a workpiece may be preheated and subsequently welded. A removable cover is mounted over an access opening in the housing for pivotal movement along either of two edges of the opening. A rotatable spit assembly, which may be mounted in any of several positions on the housing, suspends the workpiece within the housing for rotation independent of pivotal movement of the housing. A drawer-mounted heating assembly may be easily removed from the housing for servicing.

Abstract: Several ladles 11-14 for receiving hot metals are preheated by applying a lid 40, 42 to the rim of each ladle and directing an open flame through the lid into the ladle. The hot exhaust gases move back through the lid and through a heat exchanger 35-38 to heat the oncoming combustion air, and the exhaust gases from the ladles being preheated are combined and directed through a lid 41 applied to a ladle at a drying station to dry the ladle.

Abstract: The present invention consists of a forge for heating horseshoes or the like to enable a blacksmith to shape and form metal objects. The forge or oven includes a gas burner which is positioned to maximize the heating capabilities of the oven while utilizing a minimum of gas fuel.

Abstract: Apparatus for turning bottles and the like during exposure to a jet of hot gas or other heat source. Bottles are individually passed by an air cylinder gate and travel to a drive wheel and a spring loaded idler, where they are trapped by a second air cylinder gate. The drive wheel turns the bottle over a predetermined revolution while the bottle face is exposed to heat. The bottle is then permitted to exit by retraction of the second air cylinder gate. A pneumatic assembly controls gate operation, along with mechanical actuation to prevent bottle entrapment in the heating area.

Abstract: A stand and method for disassembling structures, such as automobile radiators, by separation of first and second parts thereof that are joined by a meltable bonding medium such as solder. The disassembly stand is of a simple frame construction that is provided with an adjusting platform for raising, lowering, and supporting the structure to be separated and clamps for freely suspending the structure with its joint to be separated located so as to be acted upon by a room-shaped heating structure, according to a preferred embodiment. In accordance with an aspect of the method, opposed forces are caused to act upon the parts to be separated while the joint by which they are connected is simultaneously heated along substantially the entire length thereof.

Abstract: A heating arrangement is provided for apparatus for producing cylindrical bodies by build-up welding wherein the diameter of the body being produced varies during the build-up welding operation. The heating arrangement is composed of individual heating elements arranged in the region of a sector around the revolving body with the heating elements being controlled both individually and in groups.

Abstract: A heating device, particularly useful for heating the end portions of hollow elongated objects such as thermoplastic hose or tubing, comprises an enclosure for substantially surrounding the end portion of the object, means for substantially immobilizing the end portion within the enclosure and means for directing a stream of heated gas around the inside and outside of the object along the length of the end portion. In a preferred embodiment, the enclosure is an insulated metal circular cylinder having at one end apertures for receiving thermoplastic hose and controlling gas flow. At the other end, the enclosure has an apertured conical member for insertion into the hose to immobilize it in axial alignment with the cylinder.

Abstract: An apparatus for practicing temperature gradient zone melting simultaneously on a plurality of semiconductor bodies comprises a closable work chamber for receiving the bodies for processing; a heat source disposed in the work chamber and comprising a first closure member thereof; a heat sink disposed in the work chamber and comprising a second closure member thereof and means for transferring one or more bodies of semiconductor material to the work chamber for processing and from the work chamber subsequent to processing. The transferring means comprises manipulative means for selectively engaging the semiconductor bodies and supporting the bodies in transit and drive means for moving the manipulative means toward and away from the work chamber and orienting the manipulative means with respect to the semiconductor bodies.

Abstract: An apparatus for practising temperature gradient zone melting simultaneously on a plurality of semiconductor bodies comprises a closable work chamber for receiving the bodies for processing; a heat source disposed in the work chamber and comprising a first closure member thereof; a heat sink disposed in the work chamber and comprising a second closure member thereof and means for transferring one or more bodies of semiconductor material to the work chamber for processing and from the work chamber subsequent to processing. The transferring means comprises manipulative means for selectively engaging the semiconductor bodies and supporting the bodies in transit and drive means for moving the manipulative means toward and away from the work chamber and orienting the manipulative means with respect to the semiconductor bodies.

Abstract: Apparatus and method for local forced heating of an auto body characterized in that a joint build up with plastic solder on the steel plate of an auto body is placed under a hood which locally covers the joint; then a hot air blast is supplied to the hood. The hot air blast is evenly diffused by means of a stream-rectifying plate installed in the hood, and thus the built up plastic solder can be hardened through local forced heating.

Abstract: Disclosed herein is an apparatus for assembling and bonding a pre-cured tread strip to the carcass of a new tire or the casing of a tire to be retreaded wherein the tread is preheated and that heat is utilized to assist in the final bonding of the tread to the carcass. A heated drum is utilized, with the tread being wrapped around the periphery thereof and brought to an elevated temperature following which a roller type transfer mechanism is used to transfer the tread to a tire support and assembly apparatus where a stitcher and locking and sealing ring temporarily secure the tread to the periphery of the carcass with previously applied cushion gum material sandwiched therebetween. A shifting mechanism is then activated to transfer the tire and the tire support and assembly apparatus to a curing chamber where the tread is engaged by a heated belt which, together with the residual heat in the tread, serves to complete bonding of the tread to the carcass.

Abstract: A rotary conveying apparatus comprising a plurality of rails for supporting and conveying cup-shaped cylindrical articles on a cushion of fluid during their translatory movement from the inlet ends to the outlet ends of the rails. The apparatus incorporates a framework on which a plurality of the rails are mounted in longitudinally extending spaced substantially parallel relationship, with the inlet and outlet ends thereof arranged in a circular pattern at equal circumferentially spaced increments therearound. Each of the rails is formed with a plurality of cavities or ports in a supporting surface thereof, through which a fluid such as air is discharged against the surface of an article in a manner to support the article on a cushion of fluid in spaced relationship from the supporting surface.

Abstract: A furnace for practising temperature gradient zone melting on one or more semiconductor bodies comprises a closable work chamber for receiving semiconductor bodies for processing, a radiant heat source which forms a first closure member and a heat sink which forms a second closure member, the closure members defining the work chamber and being mutually separable by, for example, a hydraulic actuator to allow access to the interior of the work chamber. A reflector is disposed between the heat source and heat sink in surrounding relationship to the semiconductor bodies being processed to ensure the maintenance of a uniform temperature gradient within the work chamber. The reflector and the heat sink are liquid cooled for the effective removal of heat therefrom. The heat sink is further provided with a plurality of radiation attenuating cavities to enhance the performance of the heat sink.

Abstract: A machine for opening envelopes by heat process which have been previously treated with chemicals.

Abstract: Deburring of metal articles and parts in a combustion chamber process is accomplished in a machine requiring only a short stroke to open and close the combustion chamber in the processing of a series of articles or parts. Only the cap plate of the combustion chamber is fixed to the upper part of the vertical frame of the machine, it being provided with the inlet for the combustion gases, and the hollow cylinder and bottom plate form a mating unit of the combustion chamber, of which a number may be provided for sequential operation, which may travel into the work position and out of it on conveyor rails. Compression to seal the parts of the combustion chamber together during combustion processing is provided by a hydraulic or pneumatic piston drive mounted on the bottom portion of the frame to bear against the bottom plate of the particular interchangeable combustion chamber unit that is located in the work position.

Abstract: A portable forge having a burner shield with a combustible gas fitting at the top center thereof and an oxygen fitting in a side portion thereof coupled to an oxidizer ring tube with a plurality of oxidizer orifices disposed in the inner portion thereof for directing oxygen in a downward direction therefrom. An inner burner tube surrounds the gas jet orifice or fitting and terminates at the oxidizer ring tube. Disposed directly beneath the burner tube is a mixing chamber terminating in a venturi flare directly beneath the oxidizer ring tube. The mixing chamber terminates in a bottom portion within a top refractory pan which is spatially disposed over a base refractory pan which holds base slab, which in turn, carries a work piece being heated. The burner shield, together with the top refractory pan and the hardware therein, is hingedly attached to the base refractory pan and spatially disposed through a heat shield and top support member.