Abstract: Apparatus, systems and methods for refining molten glass include a fining chamber having a refractory floor and a sidewall structure that may include a refractory liner, and includes an inlet transition region having increasing width from initial to a final width, and depth decreasing from an initial to final depth. The floor includes a raised curb having width equal to final width of the inlet transition region, curb length less than the length of the inlet transition region, and curb height forming a shallowest depth portion of the fining chamber. The raised curb separates the fining chamber into the inlet transition region and a primary fining region, the primary fining region defined by the refractory floor and sidewall structure. The primary fining region has a constant depth greater than the shallowest depth but less than the depth of the inlet transition region.

Abstract: The invention provides an apparatus for manufacturing good quality single-crystal silicon carbide stably without formation of cracks and the like, which apparatus comprises: at least a crucible for accommodating silicon carbide feedstock powder and seed crystal; heat insulation material installed around the crucible; and a heating device for heating the crucible, wherein the outer profile of the crucible includes at least one region of narrower diameter than a vertically adjacent region, insulation material is also installed in the space left by the diameter difference, and thickness of the insulation material at the narrower diameter region is greater than that of the insulation material at the vertically adjacent region. The apparatus for manufacturing single-crystal silicon carbide enables precise control of the temperature gradient inside the crucible, thereby enabling manufacture of good quality single-crystal silicon carbide.

Abstract: An anneal module for annealing semiconductor material wafers and similar substrates reduces particle contamination and oxygen ingress while providing uniform heating including for 500° C. processes. The anneal module may include a process chamber formed in a metal body having internal cooling lines. A hot plate has a pedestal supported on a thermal choke on the body. A gas distributor in the lid over the hot plate flows gas uniformly over the wafer. A transfer mechanism moves a hoop to shift the wafer between the hot plate and a cold plate.

Abstract: A vacuum oven or vacuum furnace is disclosed having a heat distribution sleeve that conforms to the shape of an interior heating chamber. The heat distribution sleeve may be of generally annular shape, like a ring, and located in a substantially regularly spaced and offset relationship from a heating element located within walls adjacent the interior heating chamber. The heat distribution sleeve includes a thermal conductive material which absorbs and re-radiates heat emitted from the heating element, thereby providing more consistent and regular radiation fields for heating treating a work piece that is loaded on a work holding tray and, upon the vacuum oven being in an operational position, the work piece is located within the furnace chamber.

Abstract: The invention relates to a dental firing or press furnace (10) that enables the production of at least one dental restoration part (62). The dental firing or press furnace is provided with a firing space (12) that is heatable with the aid of a heating device (22), preferably, a resistance heating device. A heat-conducting element (50) having a specific thermal conductivity of at least 100 W/mK is arranged on the floor of the firing space (12).

Abstract: Improved workpiece-carrier in the form of a high-temperature-grating 10 assembled from mutually engaging elements consisting of carbon-fiber-reinforced carbon-composite-board-strips comprising comb-shaped elements, having a frame surrounding a horizontal grating as well as at least one workpiece-support (40) which is inert in relation to the supported workpiece and provides a workpiece-support-area (50) at a distance above the grating (3O)7 said work-piece-support (40) being arranged within at least one enclosing cut-out-section of at least one element wherein furthermore said elements comprise at least one element having interlocking cut-out-sections in alternating arrangement, at least one auxiliary element, said workpiece-support (40) is a single-piece part of high temperature ceramic of rod-shaped elongation being arranged parallel to the plane of said grating (30) and being an integral part of the grating by being enclosed beneath the workpiece-support-area (50) by cut-out-sections of a multitude of cros

Abstract: A glass molding system and a method of making glass articles using the glass molding system are disclosed. The glass molding system includes an indexing table, a plurality of enclosures arranged along the indexing table, and a plurality of stations defined on the indexing table such that each of the stations is selectively indexable with any one of the enclosures. At least one radiant heater is arranged in at least one of the enclosures. A radiation reflector surface and a radiation emitter body are arranged in the at least one of the enclosures. The radiation emitter body is between the at least one radiant heater and the radiation reflector surface and has a first surface in opposing relation to the at least one radiant heater and a second surface in opposing relation to the radiation reflector surface.

Abstract: A substrate heat treatment apparatus includes a heat-treating plate having a flat upper surface, support devices formed of a heat-resistant resin for contacting and supporting a substrate, a seal device disposed annularly for rendering gastight a space formed between the substrate and heat-treating plate, and exhaust bores for exhausting gas from the space. The support devices are formed of resin, and the upper surface of the heat-treating plate is made flat, whereby a reduced difference in the rate of heat transfer occurs between contact parts and non-contact parts on the surface of the substrate. Consequently, the substrate is heat-treated effectively while suppressing variations in heat history over the surface of the substrate.

Abstract: A vacuum oven or vacuum furnace is disclosed having a heat distribution sleeve that conforms to the shape of an interior heating chamber. The heat distribution sleeve may be of generally annular shape, like a ring, and located in a substantially regularly spaced and offset relationship from a heating element located within walls adjacent the interior heating chamber. The heat distribution sleeve includes a thermal conductive material which absorbs and re-radiates heat emitted from the heating element, thereby providing more consistent and regular radiation fields for heating treating a work piece that is loaded on a work holding tray and, upon the vacuum oven being in an operational position, the work piece is located within the furnace chamber.

Abstract: A vertical boat for heat treatment includes a plurality of supporting columns, a pair of plate members coupled to both ends of each supporting column. In each of the supporting columns a plurality of supporting parts for horizontally supporting substrates to be treated are formed and an auxiliary supporting member to place each of the substrates to be treated is removably attached to each of the plurality of supporting parts. The auxiliary supporting member is adjusted for each supporting part with respect to the inclination of a surface for placing the substrates to be treated depending on the shape of each supporting part by processing a surface for attaching to the supporting part, or by interposing a spacer between the supporting part and the auxiliary supporting member is provided.

Abstract: A furnace comprises a cage holding and supporting an insulation pack comprising one or more base boards, one or more top boards and a plurality of side boards each of rigid carbon fiber based insulation material, the one or more base boards, one or more top boards, and plurality of side boards defining a cavity between them. A flexible carbon felt is disposed between the side boards and the cage.

Abstract: A description is given of a heat treatment apparatus, such as a preheater or calciner (1) for heat treating cement raw materials, said heat treatment apparatus comprising a heat treatment compartment being defined by a metal casing (5), which may have on its inner side layers of refractory lining material (3) and insulation material (4).

Abstract: A conveyor oven is provided. The oven housing has a substantially rectangular box frame, clad with a top wall and side walls downwardly depending from the top wall, and a bottom wall connecting the side walls, all defining an interior baking chamber. The baking chamber is heated by a heat source in excess of 700° F. An endless conveyor transports food items to be baked through the baking chamber. The oven has an intermediate panel ceiling assembly disposed within the baking chamber. The assembly has a plurality of ceiling panel holders mounted above the conveyor and spaced below the top wall, each ceiling panel holder substantially spanning the width of the baking chamber. At least one ceiling panel is held within each ceiling panel holder, which is exposed on both sides to the baking chamber for absorbing and distributing heat in the baking chamber.

Abstract: The present invention is a vertical boat for heat treatment having an auxiliary supporting member removably attached to each of supporting parts of a boat body, the auxiliary supporting member on which a substrate to be treated is to be placed, in which the auxiliary supporting member has a guiding member attached to the supporting part and a substrate supporting plate on which the substrate to be treated is to be placed, a hole is formed on an upper surface of the guiding member, the substrate supporting plate is inserted and fitted into the hole of the guiding member so as to be fixed, a height position of a placing surface for the substrate to be treated is higher than a height position of the upper surface of the guiding member, the substrate supporting plate is composed of silicon carbide and the guiding member is composed of quartz.

Abstract: The present invention relates to a multi-zone furnace for heating and tempering reactors and pipes in devices. The multi-zone furnace according to the invention is modularly constructed, wherein it is e.g. possible to efficiently heat or cool the furnace or also individual zones of the furnace. Furthermore, exchangeable cassettes provide the advantage that the reactors and the components, which are connected to the reactors, are particularly well accessible, wherein reconverting work is facilitated.

Abstract: In a heat treatment device including a heating chamber having a heating plate heating a semiconductor wafer, a cooling plate cooling the wafer heated by the heating chamber, and a transporting device transporting the wafer into and from the heating chamber, the cooling plate is provided with a coolant passage, a plurality of projections carrying the wafer with a space between the wafer and the surface of the cooling plate, and suction holes neighboring to the respective projections and connected to a suction device.

Abstract: The invention relates to a tempering chamber for tempering electronic components, in particular, IC's, with a circulating device (15) with a number of carrier elements (18) running in a circle and two support devices arranged on opposite sides of the carrier elements (18) are provided within a housing (14), wherein the carrier elements (18) are mounted on said support elements such that the alignment of the carrier elements (18) is unaltered on circulation.

Abstract: A heat shield plate for a substrate annealing apparatus is provided with a horizontally supported flat-plate-like substrate 1, a heater 5 positioned above the substrate to heat the upper surface of the substrate with radiation heat, and a heat shield plate 10 horizontally movable between a shielding position where the substrate is shielded from heater and an open position out of the shielding position. The heat shield plate 10 is composed of a structural member 12 made of a low thermal expansion material (carbon composite material) which is hardly deformed due to a temperature difference in the shielding position, and a heat insulating member 14 which covers the upper surface of the structural member and keeps the surface at an allowable temperature or below.

Abstract: An apparatus for processing substrates is disclosed. In one embodiment, the apparatus includes a housing and a plurality of stacked cell structures in the housing. An actuator is adapted to move the plurality of stacked cell structures inside of the housing while substrates in the stacked cell structures are being heated.

Abstract: A firing container for silicon nitride ceramics, which is a hermetically sealed container having a gas inlet and a gas outlet, characterized in that the interior of the hermetically sealed container is partitioned by a gas supply chamber partition plate into a gas supply chamber communicating with the gas inlet, and a firing chamber to accommodate an object to be heat-treated and communicating with the gas outlet, and the gas supply chamber partition plate has vent holes selectively formed in the vicinity of its periphery.

Abstract: A baking apparatus for manufacturing a semiconductor device remarkably enhances the uniformity of the CD (Critical Dimension) of a wafer by creating a uniform temperature distribution. The apparatus includes a processing having an open upper part, a hot plate disposed in the chamber and on which a wafer is to be mounted, a cover covering the upper part of the chamber; and a thin film made of material having a low emissivity extending over the inner surface of the cover. The inventive structure prevents the emission of heat to the outside so that the temperature within the processing chamber can be rapidly stabilized.

Abstract: A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.

Abstract: When a movement of a film-like printing body is stopped for a longer time than the normal time because of generation of trouble or the like, heat of hot plates for full heating is prevented from being transmitted to the film-like printing body. All of the hot plates (3, 4, 5, 6, 7, 8) for preheating and full heating are moved downward, and a warp inhibiting body (27) is moved upward. Further, a shutter (34) for shutting off heat is inserted between the film-like printing body (2) and the full heating hot plates (6, 7). Further, at this time, a cold blast is blown to the shutter (34) for shutting off the heat.

Abstract: A fixture (30) adapted to permit the heated exchange of a liner (14) from an operating vertical furnace (10). The fixture is adapted to secure to the base of the liner (14) to both unlock and lower the heated liner, such as a silicon carbide liner, at an controlled rate. The fixture is also adapted to elevate a new liner into the operating vertical furnace at a controlled rate to control the rate of heating of the liner as it is inserted into the operating vertical furnace. The fixture includes an inner ring (34), a low-friction Teflon® ring (36), and an outer ring (38) permitting the rotation of the inner ring within the outer ring. Advantageously, the low friction ring comprises a flanged portion and a vertical portion allowing rotation of the inner ring within the outer ring even when elevated at extreme temperatures exceeding 500° C.

Abstract: A reflow apparatus includes at least one heating unit. Each of the at least one heating unit includes an air blower for circulating air; a partition for defining an air circulating path; at least a first slit heater and a second slit heater for heating a workpiece with the circulating air, the workpiece having a first surface and a second surface; and a furnace housing for accommodating the workpiece. The air blower includes a first fan for blowing the air toward the first surface of the workpiece, a second fan for blowing the air toward the second surface of the workpiece, and a motor for rotating the first fan and the second fan. The first fan and the second fan are provided in correspondence with the at least the first slit heater and the second slit heater.

Abstract: A support apparatus for minimizing gravitational stress in semiconductor wafers, and particularly silicon wafers, during thermal processing. The support apparatus comprises two concentric circular support structures disposed on a common support fixture. The two concentric circular support structures, located generally at between 10 and 70% and 70 and 100% and preferably at 35 and 82.3% of the semiconductor wafer radius, can be either solid rings or a plurality of spaced support points spaced apart from each other in a substantially uniform manner. Further, the support structures can have segments removed to facilitate wafer loading and unloading. In order to withstand the elevated temperatures encountered during semiconductor wafer processing, the support apparatus, including the concentric circular support structures and support fixture can be fabricated from refractory materials, such as silicon carbide, quartz and graphite.

Abstract: An apparatus for thermally processing a wafer at an elevated temperature, in which a processing position is bounded at least on one side by a housing part which, in use, is at an elevated temperature, the apparatus being provided with measuring means for determining the position of a wafer in the processing position before and/or during processing, the measuring means being provided with at least one signal processor and at least one signal conductor, the or each signal processor being located at a distance from the processing position in an area of lower temperature, the signal conductor extending through the housing part being at an elevated temperature and extending from a measuring point in or near the processing position to the signal processor for transmitting to the signal processor contactlessly obtained measuring signals, the at least one signal conductor, at least the part extending through the housing part being at an elevated temperature, being heat resistant.

Abstract: An apparatus and a method for manufacturing a semiconductor device can provide a good quality film growth in a highly clean reaction atmosphere unaffected by contamination from a furnace opening portion. A reverse-diffusion preventing body 8 is provided between a furnace opening flange 7 and a boat susceptor 19 so that a substrate processing space 20 is isolated from a furnace opening portion space 21 to thereby prevent reverse-diffusion of a contaminant which occurs at a furnace opening portion B, to the substrate processing space 20. At a furnace opening flange 7, a furnace opening exhausting tube 15 is provided which constitutes a furnace opening system for exhausting the space 21 independently of the space 20 so that the space 21 is exhausted while being purged by supplying a purge gas into the space 21, to thereby remove a contaminant from the space 21.

Abstract: A heating furnace of convection type is provided for improving rising characteristics at an operation start-up time to stabilize conditions within the heating furnace in a shorter time and maintaining a uniform temperature in the furnace. The heating furnace comprises a conveyer unit for supporting an article to be heated and conveying the article through a heating chamber of a furnace body having an article inlet and outlet, a heating source provided in at least one of side and top portions of the furnace body such that the heating source is exposed to the interior of the heating chamber, an exhaust port formed in a lower portion of the heating chamber at a position displaced a predetermined distance from the heating source in the longitudinal direction of the furnace, the exhaust port being positioned below a lower end of the heated article, and an air inlet port associated with the heating source and provided below the exhaust port.

Abstract: This invention is directed to a method for carrying out combustion in a furnace having porous walls with a large surface area comprising providing a combustion zone containing an atmosphere of furnace gases. A low velocity oxidant stream is injected through at least one oxidant injection side of the porous walls into the combustion zone and mixing furnace gases with the oxidant stream in a mixing zone within the combustion zone to produce an oxidant mixture. A fuel stream is injected through at least one fuel injection side adjacent to the oxidant injection side in the combustion zone. The oxidant mixture is mixed with the fuel stream to create a fuel-oxidant mixture.

Abstract: A modular furnace is fabricated from at least one module having a frame, a removable cover mounted to the frame, exterior cover panels on the frame, and an insulated case fastened to the interior of the module. A conveyor assembly extends through the module. A plurality of process zones, such as heating and cooling zones, are disposed within the module. Field replaceable universal blower assemblies are associated with each process zone. The motor shaft in each blower assembly is provided with a sealed bearing in the motor housing. Insulation within each module is held in place by gas permeable fabric covering large vent openings in cover panels to allow oxygen to diffuse out of the insulation rapidly upon start up.

Abstract: A flexible, relatively lightweight workpiece support tray includes a plurality of spacers juxtaposed between a plurality of lateral I-beams, the I-beams being held together through a plurality of rods. Each of the lateral I-beams has a recess for receiving a tab on each side of the spacers. Each end of the rods is provided with a split ring welded thereon to removably retain the assembly together. A pair of shoes is located on the bottom intended side of the tray, and a puller/pusher bar is attached to each end of the shoe for engaging the drive mechanism of the furnace. The invention uses articulating attachments, including includes a slide connector and T-connector spot welded into place, for joining one tray to another to obtain a floating feature.

Abstract: When an oxidation process for semiconductor wafers is carried out by a batch type furnace, the uniformity of the thickness of a film is intended to be improved so as to be capable of carrying out a low temperature process. In a system for feeding a mixed gas of hydrogen gas and water vapor into a reaction vessel to carry out a so-called wet oxidation, a ventilation resistance material is provided in an outside passage of a double-pipe passage for heating gas in an external combustion system, and a mixed gas of hydrogen gas and hydrogen chloride gas is passed through the ventilation resistance material to be heated to a process temperature or higher by means of the heater of the combustion system to previously produce a very small amount of water vapor to carry out a dry oxidation. When dinitrogen oxide gas is used for producing a nitrogen containing silicon oxide film, dinitrogen oxide gas is passed through the outside passage to be previously activated.

Abstract: A jig comprises: a main body; a retainer for retaining a block in which at least one row of sections to be sliders is aligned; a middle load application section coupled to a portion of the retainer located in the middle of the length thereof; end load application sections coupled to portions of the retainer near ends of the length thereof; middle couplers located between the middle load application section and each of the end load application sections, respectively, for coupling the main body to the retainer; and end couplers for coupling the main body to the ends of the length of the retainer. The length between the middle of the retainer and each of the ends thereof is greater than the length between the middle of the retainer and each of the end load application sections.

Abstract: The present invention provides a wafer heating device which can improve uniformity of a temperature distribution within a surface area of a wafer, with a relatively simple structure. A wafer is supported on a susceptor of annular shape. A first heater of disc shape is disposed below the wafer, and a second heater of annular shape is disposed to surround the first heater. Radiation thermometers are arranged at a ceiling portion of a reaction chamber. The first radiation thermometer measures a temperature of a central area of the wafer, the second radiation thermometer measures a temperature of a peripheral area of the wafer, and the third radiation thermometer measures a temperature of the susceptor. The first heater and the second heater are controlled by independent closed loops. When a wafer is set on the susceptor, a power of the second heater is controlled by using a value measured by the second radiation thermometer as a feedback signal.

Abstract: A tube for use in a thermal processing furnace. The tube comprises an elongated cylindrical tube having an inner surface with a plurality of dimples disposed thereon. In one preferred version of the invention, the dimples are formed as an integral part of the inner surface of the cylindrical tube. In another aspect of the invention, the dimpled furnace tube is incorporated into a thermal processing furnace. In this aspect of the invention, the furnace includes a furnace tube having an inner surface describing an elongated cylindrical heated chamber for receiving and processing a plurality of axially aligned spaced apart semiconductor wafers. The inner surface has a plurality of dimples disposed thereon. The furnace further includes an inlet for introducing reactant and/or inert gases into one end of the cylindrical chamber to flow axially within the chamber by the wafers and an outlet for removing the gases from the cylindrical chamber.

Abstract: An oven which has a floor, a side wall extending upwardly therefrom to define a combustion chamber, and a top having an opening for combustion gases, a fuel support member mounted in a lower part of the combustion chamber, the fuel support member having a raised central portion with a downwardly and outwardly sloping top surface extending therefrom, and means for supplying fuel to the fuel support member. The oven includes an arrangement for providing primary air to the fuel on the fuel support member and for providing secondary air to an upper portion of the combustion chamber, the secondary air being arranged to impart a cyclonic motion to the combustion gases.

Abstract: An apparatus for baking resists on semiconductor wafers, which is capable of preventing cold air from entering the interior of the baking chamber while a baking process is carried out, by controlling the temperature of ambient air surrounding the baking chamber to equal the internal temperature of the baking chamber. This control is achieved by providing a hot air supply unit and nozzles. The hot air supply unit generates hot air heated to a desired temperature and supplies the generated hot air to the nozzles. The nozzles are connected to the hot air supply unit and arranged near the baking chamber. The nozzles inject the hot air onto the outer surface of the baking chamber. The nozzles may be arranged around the entrance of the baking chamber where a wafer to be baked is loaded. In this case, the nozzles inject heated air onto opposite surfaces of the wafer being loaded or unloaded. The baking apparatus may have a configuration including a cooling chamber, a feeding chamber and a baking chamber.

Abstract: The furnace for baking carbonaceous blocks comprises, along the longitudinal X direction of the furnace, a series of sections, each section comprising, in the transverse Y direction, hollow walls (3) through which a heating gas flow comprising combustion gas or a cooling air flow circulates, alternating with pits containing carbonaceous blocks to be baked, each of the said hollow walls (3) in a section being in communication with a wall in an upstream section and/or a wall in a downstream section, so as to form a conduit through which the said gas flow circulates, each of the said walls of a section comprising two vertical lateral partitions (38) in the X-Z plane, and elements in the transverse Y direction for deflecting the said gas flow passing through the said wall and maintaining a constant spacing between the said lateral partitions (38), and characterized in that each wall (3) comprises a means of maintaining, over at least one third of the length L of said wall, a gas flow of rate D uniformly distribut

Abstract: A refractory brick and system of bricks for constructing flue walls of a ring furnace. The brick and the bricks of the system have opposed sides and upper and lower surfaces when disposed in a vertical wall structure, with one of the surfaces having at least one crosswise groove while the other surface has a corresponding crosswise tongue for seating in the groove of an adjacent brick, the tongues and grooves terminating short of the ends or sides of the brick when the bricks are disposed in a vertical wall structure. The crosswise tongues and grooves have rounded configurations sized to mate with bricks having the same tongue and groove configurations when a plurality of such bricks are stacked one upon the other in constructing a vertical wall.

Abstract: A heating chamber for maintaining processed foods warm for extended periods while not sacrificing food quality or causing a secular change in the chamber's insulating member.

Abstract: In an apparatus for the heat treatment of ophthalmic lenses, especially contact lenses, which comprises an approximately cylindrical housing of closed design having an inlet opening and an outlet opening, transport device for transporting the ophthalmic lenses located inside molds along an open transport path, which is arranged inside the housing and connects the inlet and the outlet opening, and heating device arranged inside the housing, the open transport path inside the housing is of an essentially spiral shape, and the heating device are arranged essentially above and below the transport path.

Abstract: An apparatus and method for providing a selected atmosphere at and within an opening to the interior volume of a furnace. Two or more paralleled diffusers adjacent to the furnace opening laminarly emit different fluids and provide a multilayer fluid curtain over the opening. The curtain has a composite modified Froude number from 0.05 to 10, and a thickness at emission of at least 5% of its extent in the flow direction. Partially covering the outside of the curtain is an optional, substantially flat, outer shield with an aperture coinciding with the furnace opening, which reduces the necessary flow rates of fluids. Optional side shields around the sides of the curtain also reduce the necessary fluid flow. A preferred diffuser comprises a porous tube in a housing with an outlet directed to emit fluid across the furnace opening. The outlet is covered with a screen to disperse the fluid flow and to protect the porous tube.

Abstract: An insulation structure such as a cover provides desirable heat insulation for a heated metal container such as a ladle. The insulation structure is assembled in a manner affording ease of subsequent repair in high-wear areas of ceramic fiber insulation. The ceramic fiber insulation is at least partly in bundled form and the bundles are generally positioned so that fiber blankets are oriented in different directions in the structure, yet the fiber is all in snug fit and achieves highly efficient insulation.

Abstract: An improved wall construction system for refractory furnaces is disclosed. The system includes an outer support structure into which are incorporated a plurality of connecting pin receiving sleeves or apertures. The system further includes a plurality of regularly-shaped bricks which have engaging members and receiving cavities on the ends of the bricks and on the upper and lower surfaces of the bricks. The engaging members and receiving cavities are adapted to interlock the bricks relatively to each other to preclude lateral movement. The system further includes a plurality of anchoring members which are adapted to be received between an engaging member and a receiving cavity of adjacent bricks. The anchoring members further extend out from the bricks and include a connecting pin shaped and sized to engage within the apertures in this first support structure in order to anchor the brick wall system to the outer support system in use.

Abstract: Disclosed is a baffle apparatus for insertion into a semiconductor wafer processing furnace to diffuse processing gases that are injected into the furnace by an injector nozzle. The baffle apparatus comprises:a diffuser plate assembly having an upper end and a lower end, the diffuser plate assembly having at least one diffuser plate against which injected gases are to be forced; andthe lower end of the diffuser plate assembly being sized and shaped to engage with and be supported by an elongated wafer paddle.

Abstract: An apparatus for supporting a workpiece has an enclosure, a means for reducing the pressure and a platen on which the workpiece is mounted. A heating mechanism is located within the platen and the platen is coated with a high emissivity material, which facilitates the radiative heat transfer between the platen and the workpiece. Consequently, the workpiece can be rapidly raised to a specific temperature. This apparatus is particularly applicable to the supporting of a semiconductor wafer within a vacuum system.

Abstract: A hermetic package for an electronic device is manufactured by providing a green glass ceramic body with a green via to produce a workpiece. The workpiece is sintered at a temperature at or above 500.degree. C., while compressing the workpiece at a pressure at or above 100 pounds per square inch, so as to obtain a hermetic package. The green via comprises a mixture of copper and a glass ceramic material with a sufficient volume of glass to produce a hermetic package, yet with sufficient copper to have a suitable electrical conductivity.The hermetic package thus produced comprises a sintered glass ceramic body having an electrically conductive sintered via which is hermetically bonded to the glass ceramic body and which comprises a mixture of an electrically conductive material and a glass ceramic material. The electrically conductive material forms at most 50 volume percent of the via.The workpeice may be sintered in a sintering fixture having a frame and a compensating insert.

Abstract: The present invention relates to a metal-ceramic composite for use in a high temperature and a abrasion-resisting member such as a supporting member of a heating furnace having a construction, in which ceramic particles having superior abrasion resistance and heat resistance are dispersed in a metallic matrix having superior toughness or ceramic blocks are buried in a metallic surface, whereby the characteristics of a ceramic and a metal are simultaneously utilized. A metal-ceramic composite superior in physical characteristic, such as abrasion resistance and heat resistance, and a method of producing the same are provided.

Abstract: The invention relates to a device for cooling of the furnace chamber (4) in a hot isostatic press by means of devices (7, 8) for circulation of a coolant in the furnace chamber (4), the coolant having a temperature which is lower, but not considerably lower, than the temperature of the articles.