Article Or Template Follower Positions Heating Element Relative To Article Patents (Class 432/33)
  • Patent number: 6219937
    Abstract: Elliptically shaped reheater conduits extend downward into a portion of a flow path that extends through a lower chamber interior space of a kiln chamber. Each of the reheater conduits has opposite ends, defines a length that extends between the opposite ends and is perpendicular to the portion of the flow path that extends through the lower chamber interior space, defines a first cross-dimension that is perpendicular to the length and parallel to the portion of the flow path, and defines a second cross-dimension that is perpendicular to both the length and the portion of the flow path. The second cross-dimension is less than the first cross-dimension. Each of the reheater conduits defines outlets positioned along the length of the reheater conduit. Each reheater conduit defines a pair of vertices between which its second cross-dimension is defined, and the outlets are proximate the vertices.
    Type: Grant
    Filed: March 30, 2000
    Date of Patent: April 24, 2001
    Inventors: George R. Culp, Robert T. Nagel
  • Patent number: 5816797
    Abstract: A method for preparing a thermoplastic material, with dry heat, for use in patient fixation. The method includes generating heat to a threshold temperature and transferring the heat to the thermoplastic material by a heat conductive path. Once the thermoplastic material has become pliable, it is molded into a cast for fixation purposes. The heat may be generated by a device having a housing and a member movable attached to the housing. The device also includes a heating element for providing a heat conductive path to the member.
    Type: Grant
    Filed: July 19, 1996
    Date of Patent: October 6, 1998
    Assignee: S&S X-Ray Products, Inc.
    Inventor: Harold Shoenfeld
  • Patent number: 5009590
    Abstract: A plurality of semiconductor chips are sequentially mounted on a rotary table, heated on the rotary table for a predetermined time, and ejected from the rotary table. The semiconductor chips ejected from the rotary table are fed to a bonding apparatus. The semiconductor chips are heated while the rotary table is stationary and are held to the rotary table by a vacuum chuck. The position of a semiconductor chip is adjusted before the semiconductor chip is ejected from the rotary table.
    Type: Grant
    Filed: January 18, 1990
    Date of Patent: April 23, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Tadashi Mitarai, Makoto Kanda
  • Patent number: 4653202
    Abstract: A movable dryer for lumber products comprising a housing able to be displaced on rails secured to a slab and provided with a first roller bearing on the ground. A first motor is mounted on the housing and actuates a lifting jack which imparts a vertical movement to the housing. A second motor is mounted on the housing and actuates the first roller. A second roller assembly bears on the rails and is integral with the lifting jack. Provision is made for a fan for circulating the air through the housing and a heating device for supplying the required thermic operating gradient to the dryer. A control is provided for controlling the aforesaid dryer operations, thus enabling the dryer to be moved from a first resting location to a second one.
    Type: Grant
    Filed: February 5, 1986
    Date of Patent: March 31, 1987
    Assignee: Cat'hild
    Inventor: Francois More-Chevalier
  • Patent number: 4531909
    Abstract: There is provided a handling system for IC devices having a guide stage comprising a bank portion in which both sides of a IC device to be tested are held at a position other than a portion where terminals of the IC device project and a vacuum suction pore which suctorially sticks to the underside of the IC device at the midpoint of the bank portion.There is also provided a handling system for IC devices wherein multiple bank portions are provided on the stage, one half of which is used for carrying IC devices and the remaining half of which is used for discharging IC devices.
    Type: Grant
    Filed: November 4, 1983
    Date of Patent: July 30, 1985
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventor: Osamu Takeshita