Abstract: This invention relates to a combustion device for feeding hydrogen gas and oxygen gas into a combustion vessel, while heating the same, to generate water vapor. The combustion device comprises a hydrogen gas injection nozzle for feeding hydrogen gas into the combustion vessel, and an oxygen gas injection nozzles for feeding oxygen gas into the combustion vessel. The oxygen nozzles are projected further upward in the combustion vessel beyond the forward end of the hydrogen gas injection nozzle, and opened at a plurality of positions, whereby to diffuse oxygen widely around. The combustion device of this structure can feed a large amount of hydrogen gas for the combustion, whereby a large amount of water vapor can be generated without enlarging the combustion vessel, and troubles, such as the devitrification of the forward ends of the nozzles, abnormal heating in the combustion vessel.

Abstract: The present invention relates to a thermal processing method wherein a cylindrical process tube that has at one end an entrance/exit is provided at the other end thereof with a heat source, and thermal processing is performed on a workpiece which has been brought in from the entrance/exit of the process tube to a prescribed position therein. This thermal processing method and an apparatus therefor is characterized in that, when the workpiece is moved to the prescribed position, it is first moved to a proximity position that is closer to the heat source than the prescribed position, then it is returned therefrom to the prescribed position.

Abstract: An exhaust system for use with a high temperature furnace used to perform oxidation and/or annealing operations of the type used in semiconductor fabrication. The exhaust system is designed to permit the furnace to be used with a controlled environment chamber surrounding the entry to the process chamber of the furnace. The exhaust system allows a relatively high velocity flow of exhaust gas from the process chamber through the exhaust system to occur when a positive pressure (e.g., annealing) operations are performed. Such high velocity flow prevents (a) backstreaming and (b) the accumulation of non-uniform concentrations of exhaust gases in the exhaust system, thereby permitting the accurate monitoring of the concentration of a selected gas in the exhaust system. Based on such monitoring, the opening of the door to the process chamber of the furnace may be prevented when the concentration of the selected gas exceeds a predetermined level.

Abstract: A pusher which pushes up semiconductor wafers has wafer fixing grooves to which they are fixed. Wafer detecting sensors which detect whether the semiconductor wafers are present are positioned in side walls of the wafer fixing grooves. The pusher is composed of an grounded aluminum base material and a resin coat formed on the base material. The surface of the aluminum base material is alumite-treated. The resin coat has a thickness of approximately 20 .mu.m. The resin coat is made of Teflon.

Abstract: A treatment system is disclosed, which has a treatment apparatus for performing a predetermined treatment for a planar workpiece contained in a carrier, and an first air-tight carrier storage chamber for storing the carrier. The treatment apparatus may also have an air-tight second carrier storage chamber. An inert gas supply and an exhaust means are connected to each of the treatment apparatus, the first carrier storage chamber, and the second carrier storage chamber. A valve device is provided for the inert gas supply and exhaust means.

Abstract: A forced cooling apparatus for a heat treatment apparatus comprising a heat treatment furnace having a process tube with one end open at an furnace opening and another end closed at an furnace top portion; and a heater portion which covers the process tube, and wherein cooling of the heat treatment furnace is performed by forced cooling by flowing air into a gap formed between the heater portion and the process tube and which extends to the furnace top portion.

Abstract: A heat-treating apparatus comprises a heat-treating portion which performs a required heat treating to a plural number of objects to be treated mounted on a heat-treating boat, a vacuum exhaust system which creates a vacuum inside the heat-treating portion, a load lock chamber which is connected so as to be freely openable and closable with respect to the heat-treating portion, which is filled therein with an inert gas and which is for transporting an object to be treated into and out of the heat-treating portion, and a residual treating gas exhaust system which is connected to the load lock chamber.

Abstract: A method and an apparatus for heat treating in a heat treating apparatus having a heating chamber to be introduced with predetermined gas, a heater disposed around the heating chamber, and jigs disposed in the heating chamber for supporting wafers of a plurality of substrates to be treated in parallel with each other, wherein in order to make the temperature distribution of the wafers of the substrates to be treated in the radial direction uniform in the heat treatment, the jigs are formed to determine the sizes and the shape thereof in predetermined ranges having a gradient according to the heat treating method having a predetermined shape determining procedure so that the jigs are formed in ring-shaped trays (i.e. support-ring) for holding at the peripheries the substrates to be treated and the thickness of the tray is constant or such that the outer peripheral side thereof is thicker than the inner peripheral side thereof.

Abstract: A wafers transferring method in the heat treatment apparatus of the vertical type comprising providing a boat loading/unloading chamber under a process tube, providing an elevator in the boat loading/unloading chamber, providing a wafer loading/unloading chamber communicated with the boat loading/unloading chamber, providing a robot in the wafer loading/unloading chamber, mounting a boat on the elevator, loading wafers one by one into the boat from the bottom to the top by the robot, while lowering the boat every pitch, heat-processing the wafers in the boat in the process tube, and unloading the wafers one by one from the boat from the top to the bottom by the robot, while lifting the boat every pitch.

Abstract: A heat-treating apparatus comprises a heat portion which performs a required heat treating to a plural number of objects to be treated mounted on a heat-treating boat, a vacuum exhaust system which creates a vacuum inside the heat-treating portion, a load lock chamber which is connected so as to be freely openable and closable with respect to the heat-treating portion, which is filled therein with an inert gas and which is for transporting an object to be treated into and out of the heat-treating portion, and a residual treating gas exhaust system which is connected to the load lock chamber.

Abstract: A tube furnace used for high-temperature processing of semiconductor wafers or the like employs features to improve the gas flow. One feature is reducing, or essentially eliminating, regions of gas recirculation in the outer annular region inherently present in a horizontal hot-wall atmospheric oxidation reactor equipped with a tubular cantilever for holding semiconductor wafers. The annular region is effectively isolated from the rest of the reactor by a solid circular quartz ring or barrier formed on the inner wall of the furnace tube, acting as a physical barrier against gas penetration inside the outer annulus.

Abstract: A forced cooling apparatus for a heat treatment apparatus comprising a heat treatment furnace having a process tube with one end open at an furnace opening and another end closed at an furnace top portion; and a heater, portion which covers the process tube, and wherein cooling of the heat treatment furnace is performed by forced cooling by flowing air into a gap formed between the heater portion and the process tube and which extends to the furnace top portion.

Abstract: A tube furnace used for high-temperature processing of semiconductor wafers or the like employs features to improve the gas flow. A primary feature of this invention is improving the plug flow characteristics of the furnace by preventing the undesirable elongation of the gas jet entering the reaction system through the injector nozzle. This elongated gas jet induces unwanted turbulence within the system and causes premature and incomplete mixing of reactant gases in the longitudinal direction. Improvement in plug flow characteristics is attained by use of a quartz baffle at the entrance region of the reactor located a distance from the gas inlet. The shape and location of the baffle are such that it acts as a physical barrier against the elongated gas jet and confines the turbulence in the initial fill chamber created by the entrance region of the reactor and the baffle.

Abstract: A vertical heat treatment apparatus includes a casing, a vertical heat treatment furnace provided in the casing, a substrate holding unit mounted in the casing for holding substrates to be heat-treated in the vertical heat treatment furnace, a loading/unloading unit having a wafer boat for supporting the substrates, the loading/unloading unit being adapted to put the substrates in and take the same out of the vertical heat treatment furnace, and a transportation robot for moving the substrates between the substrate holding unit and the wafer boat. The vertical heat treatment apparatus further includes a clean air supplying unit for supplying clean air sideways to the wafers supported by the wafer boat when the loading/unloading unit is at an unloading position, a and duct for introducing air from the outside of the apparatus. The clean air supplying unit is provided with an air filter disposed opposed to the wafer boat.

Abstract: When ceramic building materials are fired in a roller hearth kiln, they are stacked in a plurality of layers, and allowed to reside in the kiln for a time of at least three hours.

Abstract: An impurity furnace is disclosed, which includes: an atmoscan tube 1, a gas inlet 20, a processor tube 2, a door flange 60 and a discharge tube 70.A pressure gage 80 is installed at a side of the door flange 60, for measuring the internal pressure of the atmoscan tube 1 and transmitting the measured value thereof in the form of electrical signals. A microcomputer 3 connected to pressure gage compares the measured value of the pressure gage with a preset reference value, and generates control signals in order to control the opening degree of a butterfly valve 90. The butterfly valve is connected to the microcomputer 3, the opening degree thereof being controlled by the value controlling the signals from the microcomputer 3. The discharge tube extends from the interior of the atmoscan tube to the butterfly valve.

Abstract: A thermal treating apparatus includes a reaction tube having an opening end and storing an object to be treated, an annular manifold arranged at the opening end and having an inlet for supplying a gas to the reaction tube and an outlet for exhausting the gas from the reaction tube, and a cover arranged on the opening end of the manifold. The surfaces of the annular manifold and the cover exposed to the inside of the reaction tube are covered by a material which is not corroded by the gas supplied to the reaction tube.

Abstract: Materials to be calcined are introduced through an outer entrance into a front chamber while keeping an inner entrance closed. The outer entrance is then closed, the inner entrance is opened, and the materials are advanced into a calcining furnace through the inner entrance and are calcined therein. The calcined materials are then advanced into a rear chamber through an inner exit while an outer exit is kept closed. The inner exit then is closed, the outer exit is opened, and the calcined materials are carried out of the rear chamber through the outer exit. The calcining apparatus includes a tubular calcining furnace. A feed pipe and an exhaust pipe for reaction gases are attached to both ends of the furnace. The apparatus also includes a front chamber and a rear chamber, each having an inner entrance/exit and an outer entrance/exit. The front chamber and the rear chamber are also attached to the exhaust pipe.

Abstract: A semiconductor wafer-processing apparatus has a plurality of support members provided respectively for the processing units of a processing apparatus, and designed for supporting wafer receptacles each containing semiconductor wafers, and receptacle-inserting/extracting mechanism for inserting a wafer receptacle from the support members into the processing units, and for extracting the wafer receptacle from the processing units back to the support members. Receptacle-transporting mechanism is provided, operated independently of the receptacle inserting/extracting mechanism, for transporting the wafer receptacle between each support member and a predetermined position.

Abstract: A tube furnace used for high-temperature processing of semiconductor wafers or the like employs a cone-like shape for the gas inlet or nozzle where the reactant or insert gas enters the furnace tube. This conical nozzle produces a gas flow of faster velocities, following the flow streamlines, and avoids or minimizes recirculating gas cells. The amount of gas used in purging a tube with this configuration is reduced, and the time needed for thorough purging is also reduced. Greater process control, and enhanced process reproducibility, are also possible because of the reduction in overlap of process steps permitted by the faster purging. This feature of faster purging can, in addition, reduce the infiltration of ambient air which occurs during any processing step.

Abstract: A wafer boats supporting wafers is loaded into and unloaded from a reaction tube with a lid therebelow in a vertical heat treatment apparatus, while holding the wafer boat vertical with respect to the lid. An arm is provided in a space below the reaction tube, for transferring wafer boats along a path, while holding the wafer boats vertical and in a substantially horizontal plane. Three stations are formed in the path. At the first station, unprocessed wafers are mounted on a first wafer boat located, while wafers mounted on a first wafer boat is being heat-treated in said reaction tube. Then, the first wafer boat is transferred from the first station to the third station, and is held at the third station. While the first wafer boat is held at the third station, the second wafer boat is lowered to the second station to unload the second wafer boat from the reaction tube, and then is transferred to the first station.

Abstract: A strap binding a plurality of articles together is automatically cut and removed by gripping the strap between two counter-rotating rollers and cutting the strap by using an oscillating cutting blade. The two counter-rotating rollers are then operated to advance the cut end of the strap into a cylindrical recess of a collecting device to cause the strap to be coiled up within the recess. The coiled strap which is of a thermo-fusable material is then heated locally to cause adhesion between the adjacent turns. The coiled strap which is now in a stable, coiled condition, is then ejected from the apparatus.

Abstract: A ceramic coating for a subminiature fuse includes sodium silicate and silicon dioxide applied over a subminiature fuse wire in slurry form. The coating gives the fuse arc quenching properties.

Abstract: A plurality of semiconductor chips are sequentially mounted on a rotary table, heated on the rotary table for a predetermined time, and ejected from the rotary table. The semiconductor chips ejected from the rotary table are fed to a bonding apparatus. The semiconductor chips are heated while the rotary table is stationary and are held to the rotary table by a vacuum chuck. The position of a semiconductor chip is adjusted before the semiconductor chip is ejected from the rotary table.

Abstract: Semiconductor wafers within a supporting vertical wafer tower are positioned within a vertical process chamber through a lower gate valve fixed to a supporting framework. The gate valve is sealed to a similar gate valve at the upper end of a movable load lock on the framework, within which the wafers are subjected to pre-treatment and post-treatment processes. Two load locks are alternately used in conjunction with the process chamber and a wafer loading station on the framework. In addition, a cleaning element is movably mounted on the framework for periodically maintaining the interior surfaces of the process tube within the process chamber.

Abstract: A vertical type heat-treatment apparatus of the invention has an adjusting mechanism capable of setting the flow rate of clean air flowing out from a first clean room to a second clean room to be a predetermined value. With this arrangement, the apparatus can be reduced in size and can prevent impurities from adhering to objects to be treated, thereby improving the productivity.

Abstract: A method of heat-processing semiconductor wafers comprising forming a purge tube which encloses the plural wafers by supporting a boat, on which the plural wafers are mounted, by a carrier arm to define a space on the upper side of the wafers while defining another space on the lower side of the wafers when the boat is to be loaded into and unloaded from a heat process furnace by the moving carrier arm or either when the boat is to be loaded into the heat process furnace or when it is to be unloaded from the heat process furnace, moving the carrier arm to communicate the purge tube with the heat process furnace, supplying nitrogen gas into both of the purge tube and the heat process furnace, keeping them connected to each other, pre-heating or cooling the wafers to a predetermined temperature range, and loading the purge tube into the heat process furnace or unloading the purge tube from the heat process furnace.

Abstract: According to this invention, a boat carried by an elevator is put on a boat supporting unit installed at a boat delivery position and capable of moving up and down and then, the boat is delivered from the boat supporting unit to transfer means for a heat-treating furnace. Therefore, boats can be transferred by the common elevator to the boat delivery positions at heat-treating furnace arranged in multiple stages. Even when heat-treating furnaces of different types are installed in multiple stages, boats can be transferred to those furnaces by using the common elevator. As a result, when boats to be sent to different types of furnaces arrive at the work position, for example, boats can be delivered to the furnaces with extremely high efficiency and by simple devices.

Abstract: A heat-treating apparatus comprises a heat-treating furnace which include a process tube arranged so as to set its longitudinal direction vertically and having inlet and exhaust ports for a reaction gas, a heater arranged around the process tube, a capping member for capping an opening for allowing an heat-treating object to be loaded therethrough, which is formed in the lower end of the process tube, a case for covering a portion between the process tube and the capping member, and an exhaust nozzle, coupled to the the exhaust port formed in the process tube, for introducing the exhaust waste gas to the outside of the heat-treating apparatus. An exhaust nozzle is arranged in the case so as to introduce the waste gas leaking from between the process tube and the capping member to the outside of the heat-treating apparatus, thereby preventing the leaked gas from being diffused around the heat-treating apparatus.

Abstract: This invention relates to an apparatus and method for retaining the configuration of an aperture formed through a coil when the coil is supported on a saddle. The saddle has a pair of spaced apart upstanding legs. The apparatus includes a first and a second member, with the second member having a length sufficient to span the legs of the saddle. A pair of arms are pivotably attached to the first member and the arms are joined to the second member by a pair of links. The links enable the arms to move between a first position in which the arms are spaced inward and apart from the perimeter of the aperture when the second member is not in contact with the legs of the saddle and a second position in which the arms cooperate with the first member to support the weight of the coil when the second member is in contact with the legs of the saddle. The apparatus is particularly useful for supporting a coil during a heat treatment operation.

Abstract: Reciprocal furnace for heating metallic parts to a predetermined temperature has a horizontally reciprocal hearth. The hearth includes a multi-layer firebrick base on which is carried a ceramic fixture adapted to receive the metal parts to be heated in the furnace. The ceramic fixture has a plurality of parallel slots which are longitudinally spaced apart in a direction corresponding to the reciprocal movement of the hearth. The hearth is supported at its underside by a reciprocal drive mechanism and is moved incrementally by a drive motor to advance each slot of the fixture in sequence to a predetermined position at which a part is inserted therein by the reciprocal feed mechanism. After all the slots have been sequentially loaded, the hearth is retracted by the reciprocal drive mechanism to its initial position at which the part, first inserted, is removed and another part is inserted in the same slot. The loading and unloading cycle is repeated continuously.

Abstract: A wafer carrying apparatus comprises a heat treatment plate for heat treating a wafer, the treatment plate having a plurality of through-holes spaced apart from each other at a prescribed distance. A plurality of pins are disposed to protrude from and to be retractable below the main surface of the heat treatment plate, through the through-holes. The tips of pins are kept at the same height and a pair of spaced elongated members, for example wires, whose relative spacing and position are changeable are effective for carrying and placing the wafer onto and removing the wafer from atop the pins.

Abstract: A process for preparing a heat-resistant composite body, comprising forming silicon carbide crystal powder into a molded product, sintering the molded product in a non-oxidizing atmosphere, and thereafter filling with metallic silicon the inside of permeable voids of said porous body obtained by sintering. Powder having an average particle diameter of 5 .mu.m or less is used as said silicon carbide crystals to form it into secondary particles having an average particle diameter of from 40 to 150 .mu.m and such a particle size distribution that 60% by weight or more of particles are included in .+-.20% of the average particle diameter. This is followed by pressure molding to form a molded product using a molding pressure such that said granular secondary particles collapse at their surface areas to mutually bond there and at the same time the insides thereof remain uncollapsed, and also the molded product may have a bulk specific density of from 1.1 to 2.0 g/cm.sup.3.

Abstract: A compact to be sintered is moved vertically through a zone in which it is heated locally above its sintering temperature. The body is supported at both its top and bottom ends so that the area being sintered at a given time is not exposed to stress due to the weight of the body. Apparatus includes an oven casing having inductive heating means about a sintering zone therein, a lower lifting system on which the compact is supported, and an upper pulling system for lifting the top of the compact.

Abstract: In a heating furnace for forming films on semiconductor substrates (1), holding means (2, 4) for holding semiconductor substrates (1) are provided with projections (3, 5) for holding at least part of bottom faces of the semiconductor substrates (1) horizontally with predetermined spacing between the projections.

Abstract: An intermittent flames, heated bed type furnace and a method for heating steel plate. The furnace and method for heating solve problems inherent in conventional furnaces, namely, consuming too much energy, having low efficiency, and providing a heat which is unstable and non-uniform in quality. The invention includes a modified furnace with a special heated bed, the furnace having a wide or square body to replace the conventional rectangular type of furnace, thus enlarging its loading volume. To improve product quality, a combined or continuous operational heating sequence is substituted for the conventional intermittent or batch heating mode, thus raising labor productivity. The overall effectiveness obtained by this invention has increased from 1 to 3 times the productivity of a conventional intermittent flame furnace, while decreasing energy consumption by 30 to 70 percent. Deflection of the size of the steel plate or end is only a fraction of that specified in conventional standards.

Abstract: An apparatus for baking treatment of semiconductor wafers comprises a furnace portion and a conveyor portion. The furnace portion has a baking chamber in which is installed a turntable on which baking cassettes are supported during baking treatment and a mechanism for circulating hot air through the baking chamber. The conveyor portion has a conveyor mechanism which moves cassettes for transporting wafers along a path from an entrance to an exit of the conveyor portion, a transferring mechanism which can transfer wafers from a cassette for transporting wafers to a baking cassette and vice versa, and a cassette insertion and removal mechanism for inserting and removing a baking cassette from the baking chamber of the furnace portion and mounting it on and removing it from the turntable.

Abstract: A wafer softlanding system and cooperative door assembly are disclosed for gently and reliably loading and unloading a batch of wafers onto and off of the floor of a processing furnace tube. The disclosed softlanding system is coupled to a wafer receiving paddle and is operable to both linearly move the paddle as a whole in Z either upwardly or downwardly and to selectively rotatably move the paddle so that it tilts about an axis as it is moved linearly up and down. A door assembly is disclosed that includes a resiliently mounted furnace closure that is operative to provide a self-seating action at the mouth of the processing furnace tube. The door assembly includes in one embodiment a vacuum door closure and in another embodiment an atmospheric process door closure. In both embodiments, the closure members are readily releasable to provide for each of interchangeability, maintenance, and differential door size accommodation.

Abstract: A method and apparatus for drying gelatin in the manufacture of hard shell gelatin capsules. Pins on pin bars are dipped into the liquid gelatin and the pins are then irradiated with microwave energy until the gelatin dries. Thereafter, the pins are gradually cooled to ambient temperature and the gelatin capsule halves are then stripped from the pins in the conventional fashion.

Abstract: An apparatus for pack cooling flat stock to be retrofitted to a standard cooling bed. The apparatus includes collecting means having a plurality of stacker arms mounted for movement with respect to the stationary notch bars of the cooling bed between a first, retracted position, in which the arms underlie the notches in the stationary notch bars to permit uninterrupted transport of bar stock across the bed, and a second, lifting position in which the arms can lift a flat bar to a height sufficiently above the uppermost travel of the moving notch bars to permit a successive flat bar being transported across the cooling bed to be received in the notch of the stationary bar just vacated by the flat bar lifted by the stacker arms. Upon the return of the stacker arms to their first position, the flat bar held thereon will be placed on top of the newly-introduced flat bar to form a stack, resulting in a retarded cooling rate for the flat bars in the stack.

Abstract: A horizontal furnace for processing semiconductor devices having a suspension cantilever which supports workpieces in the furnace tube to achieve particle or dust-free operation while still allowing the loading and unloading of workpieces to be heat-treated. The furnace tube consists of a heating chamber, a connecting chamber and a supporting chamber vertically connected to each other. The chambers correspond to an accommodating portion, a connecting portion and a supporting portion of the cantilever. The supporting chamber is kept at lower temperature than that of the heating chamber during heat processing to prevent deformation or creeping of the suspension cantilever.

Abstract: A vertical furnace for heat-treating a semiconductor is disclosed which is capable of effectively and safely accomplishing the heat-treating of a semiconductor. The vertical furnace includes a furnace section which is open at the lower end thereof to allow a boat for supporting a semiconductor thereon to be introduced and removed through the lower open end with respect to the furnace section. Also, a vertical furnace is disclosed which is adapted to effectively prevent a semiconductor from being polluted by dust in an operation space.

Abstract: A method of operating a controlled atmosphere furnace. To prevent the entry of oxygen into the controlled atmosphere in the chamber of the furnace, which has a furnace door for the receipt and removal of parts by means of a feeding and removal device, the device is designed to seal a vestibule located immediately in front of the furnace door when the device approaches the furnace door. The oxygen-containing ambient air thus trapped in the vestibule is then removed therefrom. The furnace door is opened, and the feeding and removal device, while still sealing the vestibule from the ambient air, then moves into the furnace chamber for feeding or removing the part which is to be heat treated.

Abstract: A hollow lavatory setter (10, 10', 10", 10'") of recrystallized silicon carbide has a continuous wall of predetermined cross sectional size and shape including an outer wall portion (14, 14', 14", 14'") spaced from a bowl engaging inner wall portion (16, 16', 16", 16'") adjoining, extending around and defining the general configuration of a bowl receiving opening (18, 18', 18", 18'") and the peripheral mounting rim portion (R', R'") including a continuous mounting under surface of a rimless lavatory (L', L'"). Spaced upper (24, 24', 24", 24'") and lower (26, 26', 26", 26'") wall portions extend between the inner and outer wall portions and of which the upper wall (24, 24', 24", 24'") surface is adapted to supportingly engage and maintain the continuous mounting under surface of the peripheral mounting rim portion (R, R'") in a single plane during firing in a kiln and suitable for mounting on a counter top thereafter.

Abstract: A heat treatment apparatus is disclosed, which includes a tube device having a tube axis in the horizontal direction for receiving therein an object to be treated so as to treat the same by heat, a holding member for holding thereon a plurality of objects to be treated, first and second supporting devices located at one end outside of the tube device, a first coupling member for coupling the first supporting device with the holding member, a first operating member for moving the holding member in the horizontal direction, a second coupling member attached to the second supporting device for holding a holding portion of the holding member by shaft-rotation, and a second operating member for moving the holding member in the horizontal and vertical directions.

Abstract: A method for thermal treatment of horizontal wire rings with convective heat transfer by means of circulated furnace gases, characterized in that said wire rings, particularly for thermal treatment above temperatures of 650.degree. C. are acted upon in the resting state from two sides, from the top and the bottom, with a directed flow of furnace gases in order to generate a turbulent flow condition in the center of said ring. As a result of this method, it is proper to connect wire rings for uniform thermal treatment. An apparatus for carrying out the treatment is also disclosed.

Abstract: Appropriately spaced aligning pins are engaged with respectively corresponding portions of each of plural saggers disposed on a pallet. The pallet and aligning pins are then moved relative to one another so as to accurately and substantially simultaneously space apart the plural saggers on the pallet prior to firing.

Abstract: Apparatus and method for closing bottom-entry slab furnaces in which a door is pivotably connected to the slab elevator by a horizontally arranged hinge. The door is provided with a cam follower that cooperates with a cam apparatus to controllably swing the door between closed and open positions as the door is moved vertically past the cam apparatus.

Abstract: A reheating furnace for use in a hot rolling line including a heating furnace which is positioned between a continuous casting apparatus and a rolling apparatus rolling workpieces at a higher speed than they are cast by the casting process, the furnace serving as a heating and buffer zone. The reheating furnace is longitudinally divided into two heating sections which are changed over so as to receive workpieces for heating and the workpieces are charged into one of the two sections after the other of the two sections has been filled up. The furnace is operated to collectively forward the workpieces heated up to predetermined rolling temperatures to the rolling apparatus for efficient rolling.

Abstract: Disclosed is a preformed ceramic base useful in firing an open-ended ceramic shell mold having a mold base prior to metal casting. The ceramic firing base includes a working surface having a majority of flat surface portions for supporting the mold base during firing and one or more groove-like surface portions which define gas circulation passages from the outside atmosphere into the open mold bottom when the mold base is placed in supported relation on the flat surface portions. The ceramic firing base thereby enables firing of a green shell mold while maintaining mold base flatness and circulation of furnace gas into the mold cavity to minimize mold hot spots. Also disclosed is a preformed ceramic firing cap to be used in conjunction with the ceramic firing base, the firing cap being adapted to cover the open top end of the shell mold to prevent foreign particulate from entering the mold.