Abstract: A field separable ordnance stepover bracket connects abutting ordnance transfer fuse cables across the interstage junction of a multistage missile system using a plug and a receptacle. The plug receives a first set of ordnance transfer cables that terminate in percussion devices; and fits with the receptacle which receives a second set of similar ordnance transfer fuse cables. For maintenance, the plug is simply unplugged from the receptacle to allow access to the interior of the missile when the interstage junction is opened. For flight interstage separation, the fast burning ordnance transfer fuse cables ignite the percussion charges which are fixed in proximity to a linear shaped charge that circumscribes a flight separation junction. The percussion charges ignite the linear shaped charge which detonates to separate the stages of the missile.

Abstract: An electrical connector 6 comprises, an insulative housing block 7 containing multiple, spaced apart, conductive electrical contacts 9 for connection with corresponding conductors 3 of electrical wiring 2, and for disconnect coupling with corresponding multiple electrical terminals 14 arranged in an array, the housing block 7 includes at least one recess 16 without an electrical contact therein, said recess 16 is open for pluggable receipt of a corresponding said electrical terminal 14, a flexible lanyard 18 extends in a loop 19, said loop 19 is anchored to said housing block 7, and said loop 19 extends into said recess 16 and is anchored therein.

Abstract: The present invention provides a lead wire for a medical electrode. The lead wire has a female snap connector at one end. Adjacent to the female snap connector is a male snap connector which is secured to the lead wire by means of a tether. The tether is preferably removably mounted on the lead wire and is most preferably adapted to slide along its length. The male snap connector is moved into proximity of the female connector. The male and female snap connectors are then aligned on opposite sides of a tab portion of a tab-type electrode and are then brought into contact and connected together through the tab to establish both a mechanical and an electrical connection with the tab of the electrode.

Abstract: An electrical coupling assembly is disclosed having a receptacle portion attached to an electrical connector element and releasably attached to a housing, affixed to the opposite electrical connector portion, by engagement of a latching ball on the housing with a latching detent formed on the receptacle. Axial movement of an operating sleeve, with respect to the housing facilitates the coupling and decoupling of the housing and the receptacle. The operating sleeve is spring biased to assume a position with respect to the housing retaining the coupling portions together. A force exerted on a lanyard attached to the sleeve axially moves the sleeve with respect to the housing to decouple the coupling elements. A lanyard guide ring is attached to the housing and has an opening through which the lanyard passes such that the portion of the lanyard extending between the guide ring and the operating sleeve extends in a generally axial direction.

Abstract: A dry film for forming a solder mask includes a cover sheet, a photoimageable composition layer which is curable to form a solder mask and a top coat interposed between the cover sheet and the photoimageable composition layer which is selectively adherent to the photoimageable composition layer. The dry film is applied to a surface of a printed circuit board with a minor portion of the area of the photoimageable composition layer tacked to the printed circuit board. The cover sheet is peeled away. With heat and vacuum, the photoimageable composition layer is laminated to the irregular surface of the printed circuit board, conforming the photoimageable composition layer to the contours thereof and leaving the top coat as a protective covering over the photoimageable composition layer. The photoimageable composition layer is exposed to patterned actinic radiation, developed and cured to form a hard, permanent solder mask.