For Dual Inline Coupling Part, E.g., Dip Patents (Class 439/264)
  • Patent number: 11721939
    Abstract: Systems, methods, devices, and connectors are described herein for a modular patient monitoring medical device. A new generation of physiological measurement devices, such as Intelligent Patient Front End Devices (IPFE) can provide updated algorithms, features, and software updates for parameter measurement devices without corresponding releases of a new version of host monitor software. IPFEs, together with patient sensors, comprise a complete physiological patient parameter measurement delivery system. A number and a type of parameter measurement devices can be configured to meet varied and changing clinical needs. Remote access to versions, logs, self-tests, settings, history, and/or measurements via the Internet to one or more parameter measurement devices can provide a unified service approach. The connector is configured to electrically connect any two or more devices and provides an electrical connection that can be simply physically or tactually confirmed.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: August 8, 2023
    Inventors: Peter A. Lund, Andrew T. Provencher, Taylor Scott George, John C. Magill
  • Patent number: 10498083
    Abstract: According to one embodiment, there are contact pins, each of which is provided in a contact pin arrangement recess by corresponding to an arrangement position of a lead line of an IC, and changes a position in a vertical direction, depending on presence or absence of contact with the lead line. There are detection pins, each of which is inserted in a through-hole formed in a protruding portion of a cover by corresponding to an arrangement position of each contact pin, and moves up and down, depending on a position of the contact pin. A relative position of an upper surface of each detection pin relative to an upper surface of the cover differs between a first occasion where the contact pin is not in contact with the lead line and a second occasion where the contact pin is in contact with the lead line.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: December 3, 2019
    Assignee: Toshiba Memory Corporation
    Inventor: Hisashige Furusawa
  • Patent number: 10044124
    Abstract: In a contact terminal, a first touch portion and a second touch portion of a movable piece and a first touch portion and a second touch portion of a movable piece bite into and thus pinch a spherical surface of a bump of a semiconductor device. In this state, when an electrode surface of the semiconductor device is warped upward during a test and the bump is about to be moved up, an inclined surface of a fixing portion of the movable piece and an inclined surface of a fixing portion of the movable piece fix the spherical surface of the bump.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: August 7, 2018
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Hideki Sagano, Hideki Sato
  • Patent number: 10033119
    Abstract: A connecting terminal for connecting at least two electrical conductors to one another, wherein the connecting terminal has at least two separate housing parts which are mechanically connected to one another and each have a conductor insertion opening for at least one electrical conductor which is to be connected on opposite housing sides, wherein there is a first spring-force clamping connection for making electrical contact with a first electrical conductor in a first housing part of the at least two separate housing parts, and there is a second spring-force clamping connection for making electrical contact with the second electrical conductor in the second housing part of the at least two separate housing parts. A method for fitting a connecting terminal for connecting at least two electrical conductors is also provided.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: July 24, 2018
    Assignee: WAGO Verwaltungsgesellschaft mbH
    Inventor: Hans-Josef Koellmann
  • Patent number: 9972926
    Abstract: An electric component socket in which a pressing member is not brought into contact with the tip end of the a contact pin when the socket is pressed by the pressing member in a state where an electric component is not housed in the socket. The electric component socket is provided with a movable plate supported so as to move vertically, a floating plate that is provided above the movable plate and houses the electric component, and a movable spacer that protrudes upward from an upper surface of the movable plate. The electric component socket is configured so that the movable plate is thereby moved downward, thereby enabling the regulating section of the movable plate to move the contact pin downward when the movable spacer is moved downward.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: May 15, 2018
    Assignee: ENPLAS CORPORATION
    Inventor: Yuki Ueyama
  • Patent number: 9882302
    Abstract: An enclosure for an AC to DC adapter has a continuous and apparently seamless exterior surface. The enclosure includes a housing and a cap that are joined by a pair of weld joints. One weld is formed on an interior portion of the enclosure providing strength and one weld joint is formed on the exterior surface providing a seamless appearance for the enclosure.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: January 30, 2018
    Assignee: APPLE INC.
    Inventors: Alexander M. Kwan, Cesar Lozano Villarreal, Siri Amrit Ramos, Xuyang Zhang, Peter A. Dvorak
  • Patent number: 9608385
    Abstract: A connection structure of an electronic component and terminal metal fittings includes a relay in which a plurality of terminals are projected from a relay body having a rectangular parallelepiped shape, terminal metal fittings that are fitted in the respective terminals, and a holding member in which the relay and the terminal metal fittings are accommodated. The holding member has a component body accommodating portion that accommodates the relay body, terminal accommodating portions each accommodating the distal end portion of corresponding one of the terminals and corresponding one of the terminal metal fittings, a groove portion that positions an erroneous-insertion prevention projecting portion therein when the relay is inserted in a normal orientation, and a contact portion that is brought into contact with the erroneous-insertion prevention projecting portion when the relay is inserted in an erroneous orientation.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: March 28, 2017
    Assignee: Yazaki Corporation
    Inventor: Yukihiro Kawamura
  • Patent number: 9470717
    Abstract: The invention relates to a cable interface (1) for operatively connecting a plurality of coaxial cables (11). A main body (2) has a first side face and an opposing second side face (3, 4) with a plurality of blind holes (5) arranged in a pattern in the first side face (3). An internal conductor opening (7) is formed at the bottom (6) of each blind hole (5) and arranged substantially coaxial with the blind hole (5), which is likewise coated with an electrically conductive material and is used for operatively connecting an internal conductor (17) of the coaxial cable (11). The blind holes (5) cooperate with at least one first bore (8), which extends from the second side face (4) into the main body (2) and is coated with an electrically conductive material.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: October 18, 2016
    Assignee: Huber+Suhner AG
    Inventor: Adjan Kretz
  • Patent number: 8970243
    Abstract: A test carrier 10A comprises: a base board 21A which holds a die 90; and a cover board 31A which is laid over the base board 21A so as to cover the die 90. The test carrier 10A comprises a seal member 24 which is interposed between the base board 21A and the cover board 31A and which surrounds the die 90.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: March 3, 2015
    Assignee: Advantest Corporation
    Inventors: Yoshinari Kogure, Takashi Fujisaki, Kiyoto Nakamura
  • Patent number: 8961209
    Abstract: To provide a technique by which an accumulated tolerance caused by the arrangement of terminal fittings is eliminated to improve the workability in a multipole cell-voltage detection connector. When all of receptacle terminals (94) are inserted into receptacle insertion groove parts (22), each of the receptacle terminals (94) is buckled at a bending hole (97) and a mark-off part (98) formed as a boundary of a receptacle root part (95) and a receptacle front part (96). Because the receptacle insertion groove parts (22) are formed in a state where there is substantially no tolerance, the terminal pitch tolerance correction housing (10) is fitted to receptacle units (90), and the receptacle terminals (94) (receptacle front parts (96)) protruded from the receptacle insertion groove parts (22) toward a bottom inner surface (15) are corrected to a state where there is no tolerance.
    Type: Grant
    Filed: September 26, 2011
    Date of Patent: February 24, 2015
    Assignees: Yazaki Corporation, Honda Motor Co., Ltd.
    Inventors: Masaki Kobayashi, Kimiharu Mizusaki, Yoshiyuki Kobayashi, Toshiaki Ariyoshi
  • Patent number: 8690597
    Abstract: A floating or compliant plate test socket device and method is disclosed. Three primary components, a fixed frame (20) receives a floating or compliant plate (22), sit together atop a housing (24) which contains contact pins used for the electrical test of the DUT (device under test). In fixed plate (20) are bearings for reducing friction when the floating plate is driven downward by the DUT inserter. Embedded in sidewalls (40) are a plurality of vertical raceways (46) which receive bearings (48). The raceways are borings, which have gap in the boring, in the fixed plate sidewalls (40) with the boring center spaced from the sidewall sufficiently that part of the bore removes part of the sidewall but allows the ball bearings to partially protrude from the gap formed in the incomplete semicircular boarding without the bearings being able to freely escape.
    Type: Grant
    Filed: April 26, 2012
    Date of Patent: April 8, 2014
    Assignee: Johnstech International Corporation
    Inventor: Joel N. Erdman
  • Patent number: 8226442
    Abstract: An electronic module adapted to be removably, operably connected to an electronic device. The electronic module includes a housing; at least one electronic component in the housing; and a plurality of electrical contact areas. The housing has a general electronic card shape with relatively large top and bottom sides and relatively thin side edges between the top and bottom sides. The plurality of electrical contact areas are located on a first one of the side edges. The electrical contact areas are connected to the at least one electronic component such that, when the electronic module is operably connected to the electronic device, the electrical contact areas on the first side edge are adapted to electrically couple the at least one electronic component to the electronic device along the first side edge.
    Type: Grant
    Filed: March 2, 2007
    Date of Patent: July 24, 2012
    Assignee: Nokia Corporation
    Inventors: Matti Uusimaki, Timo T. Laitinen
  • Patent number: 8083539
    Abstract: A connector includes a female connector for accommodating a cylindrical and deformable female terminal provided at an end of a cable, a male connector for accommodating a male terminal configured to be inserted into the female terminal, a fastening member provided slidably around an outer periphery of the female terminal, and configured to tighten the female terminal to fasten the male terminal when inserted into the female terminal, and a slide mechanism for sliding the fastening member, which is provided in the female connector.
    Type: Grant
    Filed: March 3, 2010
    Date of Patent: December 27, 2011
    Assignee: Hitachi Cable, Ltd.
    Inventors: Sachio Suzuki, Hideaki Takehara, Kunihiro Fukuda, Yuta Kataoka
  • Patent number: 8021177
    Abstract: A burn-in socket includes a base, a sliding plate mounted to the base, a number of contacts, and an actuator mounted on the base. The contact each has a base portion secured to the base and a pair of arms extending through the pin holes of the sliding plate. The actuator includes a frame and a number of actuating portion extending downwardly from the frame for driving the sliding plate to slide on the base in a first direction. The actuator includes a number of pushing portions contacting with the sliding plate and driving the sliding plate to move in a second direction opposite to said first direction.
    Type: Grant
    Filed: June 8, 2010
    Date of Patent: September 20, 2011
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Ming-Yue Chen, Zhen-Qi Yang
  • Patent number: 7963790
    Abstract: The current invention teaches a new and novel electrical connector which utilizes a cover with complimentary lower curved engagement aids to ensure the accurate engagement and disengagement of a plurality of data and electrical connections. The electrical connector further allows the one-handed engagement and disengagement of the connector while reducing the lateral forces required and reducing the corresponding stress on the conductor wires.
    Type: Grant
    Filed: October 15, 2009
    Date of Patent: June 21, 2011
    Inventor: John T. Winter, Jr.
  • Patent number: 7874859
    Abstract: An electric connection box which is electrically connected to electrical equipments of an automobile via wire harnesses is installed at a center cluster provided at a central portion of an instrument panel of the automobile. A plurality of switches for controlling the electrical equipments are provided at a front portion of a connection box body of the electric connection box. Operating portions of the switches are exposed to form part of a design surface (front surface) of the center cluster.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: January 25, 2011
    Assignee: Yazaki Corporation
    Inventor: Kaoru Suzuki
  • Patent number: 7833036
    Abstract: An electrically connecting apparatus comprises a base member provided with slots penetrating in the plate thickness direction, contacts disposed within the slots so as to be able to contact electrodes of a device under test on the base member and for connecting the electrodes to an electric circuit of a tester, and an elastic member. The contacts has a fixed piece to be fixedly held on the base member within the slots for connection with the electric circuit, and a movable piece disposed within the slots for electrical connection with the fixed piece. In the fixed piece, a guide face for guiding the movable piece toward a contact position permitting the movable piece and the electrodes to contact is formed, and the movable piece is supported slidably on the guide face so as to receive elastic biasing force toward the contact position by the elastic member.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: November 16, 2010
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventor: Eichi Osato
  • Patent number: 7771220
    Abstract: An embodiment of an electrical connecting apparatus comprises an electrical insulating plate, an elastic plate made of an electrical insulating material arranged on the electrical insulating plate, a sheet-like conductive plate arranged on the elastic plate, and first and second contacts. The conductive plate comprises a hole area having at least one first hole portion allowing the probe tip portion of the first contact to abut to the conductive plate and a plurality of second hole portions not allowing the probe tip portions of the second contacts to abut thereon regardless of whether or not overdriving acts on the contacts.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: August 10, 2010
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Eichi Osato, Yoshihito Goto, Mitsuhiro Abe
  • Patent number: 7731507
    Abstract: An electric connector is disclosed to include an electrically insulative housing, which has solder ball receiving portions, terminals respectively mounted in the housing corresponding to the solder ball receiving portions, each terminal having an endpiece, which defines with the sidewall of each of the solder ball receiving portions a respective receiving chamber, and solder balls respectively movably accommodated in the receiving chambers defined by the endpieces of the terminals and the sidewalls of the solder ball receiving portions.
    Type: Grant
    Filed: March 17, 2006
    Date of Patent: June 8, 2010
    Assignee: Lotes Co., Ltd.
    Inventor: Ted Ju
  • Publication number: 20100003843
    Abstract: A SMT/DIP type connector structure having at least three rows of terminals is provided. The connector structure mainly includes a printed circuit board and a connector having at least a first row of terminals, a second row of terminals and a third row of terminals. The printed circuit board is disposed centrally with respect to the connector. The first row and second row of terminals are respectively mounted to top and bottom board sides of the printed circuit board by using SMT. The third row and further rows of terminals can be mounted to the top or bottom board side of the printed circuit board selectively by using SMT or DIP. This structure can increase the speed of mounting the connector to the printed circuit board and significantly reduce the overall height of the resulted product.
    Type: Application
    Filed: January 23, 2009
    Publication date: January 7, 2010
    Inventor: Harry YEH
  • Patent number: 7618277
    Abstract: A cover member 34 is moved upward when a semiconductor device 26 disposed in a positioning member 44 is held by an absorption pad 24 to pinch an electrode portion 26a of the semiconductor device 26 with movable contact portions 46M and 46F of a contact terminal 46ai.
    Type: Grant
    Filed: August 29, 2005
    Date of Patent: November 17, 2009
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Masaru Sato
  • Patent number: 7374441
    Abstract: An apparatus and method for installing an electrical support structure, such as a printed circuit board or card in a computerized device, are disclosed. In at least some embodiments, the apparatus includes a connector assembly that includes a first structure having a first guiding surface, a second structure having a second guiding surface, a third structure having at least one additional guiding surface that interfaces the other guiding surfaces, and an electrically conductive component supported by at least one of the structures. Movement of the first structure in relation to the second structure in a first direction causes additional movement of the third structure in a second direction due to interaction among the guiding surfaces. Further, at least a portion of the component moves, in response to the additional movement, to or away from a first position at which the component is capable of establishing an electrical connection.
    Type: Grant
    Filed: September 15, 2006
    Date of Patent: May 20, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Brandon Rubenstein
  • Publication number: 20080093929
    Abstract: A reliable power supply solution for a telecommunications site provides a combined primary and backup source of electrical power. One system of the power supply solution includes one or more microturbine generators operable to produce AC electrical power as well as one or more rectifiers operable convert the AC electrical power from the one or more microturbine generators to DC electrical power for supply to a DC bus. A transfer switch is electrically coupled between one or more microturbine generators and the one or more rectifiers, for selecting between the AC electrical power of the microturbine generators and incoming AC electrical power to be supplied to the rectifiers. Additionally, one or more proton exchange membranes are provided in the system for producing DC electrical power. The aforementioned power generation and supply components are coupled with the DC bus for supplying DC electrical power to telecommunications equipment coupled with the DC bus.
    Type: Application
    Filed: December 6, 2006
    Publication date: April 24, 2008
    Applicant: SPRINT COMMUNICATIONS COMPANY L.P.
    Inventors: JERRY MEYERS, LARRY L. JOHNSON
  • Patent number: 7361029
    Abstract: An IC socket assembly includes an IC socket, constituted by: a plurality of electrical contacts; an IC package mounting surface; an insulative socket housing for holding the plurality of electrical contacts at the IC package mounting surface; and an urging member for urging an IC package, which is mounted on the IC package mounting surface, toward the plurality of electrical contacts so as to establish electrical connections therewith; and the IC package. The IC package has a frame member provided about the periphery of a main body thereof.
    Type: Grant
    Filed: March 10, 2006
    Date of Patent: April 22, 2008
    Assignee: Tyco Electronics AMP K.K
    Inventor: Shinichi Hashimoto
  • Publication number: 20070281528
    Abstract: Pressing device for the relative axial movement of two parts, which are arranged coaxially with respect to one another and are moveable relative to one another only by means of a high pressing power, such as for example collet chucks or sleeves, into corresponding bores of tool or collet chuck holders. The device has an outer housing which coaxially surrounds the parts which are to be pressed and which can be swung open along an axial plane. Half-inserts can be inserted into said outer housing, which half-inserts comprise in each case two fixed plates with engagement edges for the engagement on one of the parts which are to be pressed, and an axially moveable pressure plate with an engagement edge for the engagement on the second part which is to be pressed.
    Type: Application
    Filed: June 1, 2007
    Publication date: December 6, 2007
    Inventors: Martin Bronnimann, David Gerber, Ernst Gerber, Peter Tester
  • Publication number: 20070173097
    Abstract: A socket for an electrical tester is disclosed. The socket includes a first contact board being arranged at a bottom side of a test object, and a second contact board being arranged at a top side of the test object. The first contact board includes a first contact member and a first conductive connection member, wherein the first contact member is electrically connected to a bottom connection terminal formed on the bottom side of the test object, and the first conductive connection member is isolated from the test object. The second contact board includes a second contact member, wherein the second contact member is electrically connected to the first conductive connection member and a top connection terminal formed on a top side of the test object, respectively. Therefore, the socket can have a simple configuration for providing the test current.
    Type: Application
    Filed: January 23, 2007
    Publication date: July 26, 2007
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Woo-Seop Kim
  • Patent number: 7248481
    Abstract: Circuit board and system with multi-portion sockets, and signal methods practiced thereon are described herein.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: July 24, 2007
    Assignee: Intel Corporation
    Inventor: Mark B. Trobough
  • Patent number: 7202019
    Abstract: A photothermographic imaging material having a support; a photosensitive layer containing photosensitive silver halide particles on one face of the support; and a non-photosensitive layer provided on a side of the support where the photosensitive layer is provided. At least one of the photosensitive layer and the non-photosensitive layer contains an organic silver salt, a reducing agent, a compound represented by the Formula (1) and a compound represented by the Formula (2a).
    Type: Grant
    Filed: October 15, 2003
    Date of Patent: April 10, 2007
    Assignee: Konica Minolta Holdings, Inc.
    Inventors: Yasushi Usagawa, Narito Goto, Takeshi Habu
  • Patent number: 7180031
    Abstract: A power connection apparatus of a vehicle is provided that includes a pair of substantially flat electrical conductor strips each having a first end and a second end. The first ends are adapted to be electrically coupled to integrated heater conductors in an automobile glazing. A film forms a protective coating over an intermediate section of the pair of electrical conductor strips. The film insulates and maintains a spaced relationship between the pair of substantially flat electrical conductors. A pair of wires is electrically coupled to the second ends. A first protective overmold seal is formed over the second ends of the pair of substantially flat electrical conductor strips for sealing the electric coupling of the second ends of electrical conductor strips and the wires.
    Type: Grant
    Filed: September 19, 2005
    Date of Patent: February 20, 2007
    Assignee: Automotive Components Holdings, LLC
    Inventors: Joseph M. Loibl, Marcus Tanksley, Larry Agius, Robert W. Hatcher, Thomas M. Cleary
  • Patent number: 7170165
    Abstract: An assembly includes a circuit board with a ball grid array device attached to a first side of the circuit board. A brace surrounding the ball grid array device has a series of mounting holes and a series of members extending between the mounting holes. The brace is removably secured to the first side of the circuit board at the mounting holes.
    Type: Grant
    Filed: February 2, 2005
    Date of Patent: January 30, 2007
    Assignee: Agilent Technologies, Inc.
    Inventors: Thomas E. Berto, Anirudh N. Vaze
  • Patent number: 7121860
    Abstract: A socket for removably mounting an electronic device and which has utility for testing of the electronic device. The socket includes pinch-style support contacts which establish a reference seating plane for an IC package. The pinch-style support contacts each include a stationary contact arm, a movable contact arm, and a terminal portion. The stationary contact arm and the movable contact arm each include a contact surface configured to contact a terminal of the IC package. The stationary contact arm additionally includes an IC package support surface and extends beyond the height of the movable contact arm. A method of supporting and electrically connecting the socket and IC package is also disclosed.
    Type: Grant
    Filed: September 2, 2004
    Date of Patent: October 17, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Daniel P. Cram, Amos J. Stutzman
  • Patent number: 7104825
    Abstract: A socket assembly for accommodating an IC chip or package (IC) provided with a socket body having a generally rectangular configuration. A plurality of flat plate-like contact pins are arranged forming rows in parallel with each other so as to form rows along four sides of the socket body, respectively. Each contact pin has a base portion and an arm which extends curved upward from the base portion. An upward contact portion for coming into contact with a terminal of an IC is formed on one end of the base portion of the contact pin, and a connecting portion for the connection to the printed circuit board is formed on the other end of the base portion. Four sliders are arranged along the four sides of the socket body, respectively.
    Type: Grant
    Filed: July 13, 2004
    Date of Patent: September 12, 2006
    Assignee: Enplas Corporation
    Inventor: Yasushi Kajiwara
  • Patent number: 7044764
    Abstract: A PGA socket having structure that permits the slide plate to be kept center-aligned while moving on the base housing, thus assuring that reliable electric connections be established between the PGA lead pins and the terminals of the socket. The PGA socket includes a base housing and a slide plate, the slide plate being movable between a first, or lead pin inserting position, in which the lead pins of the pin grid array package can be inserted in the through holes and the terminal mounts and a second, or locking position, in which the lead pins are applied to the terminals in the terminal mounts. The PGA socket includes at least one resilient piece on either the base housing or the slide plate and that other of the base housing or slide plate has an engagement means for receiving the at least one resilient piece.
    Type: Grant
    Filed: July 22, 2002
    Date of Patent: May 16, 2006
    Assignee: Molex Incorporated
    Inventor: Toshihisa Hirata
  • Patent number: 7035112
    Abstract: An automatic switch includes a main body having connector ports provided thereon, more than one or two sets of cable-connected connectors directly extended from the main body, and a circuit board provided in the main body and electrically connected to the sets of cable-connected connectors via signal cables. The main body has an integral enclosure formed through multiple times of injection molding to include a circuit-protecting layer for enclosing the circuit board, an outer case enclosing the circuit-protecting layer, and an anti-slipping layer coating an outer surface of the outer case.
    Type: Grant
    Filed: July 8, 2002
    Date of Patent: April 25, 2006
    Assignee: ATEN International Co., Ltd.
    Inventor: Kevin Chen
  • Patent number: 6979217
    Abstract: An electrical connector includes terminal pieces mounted respectively in mounting holes in a substrate. Each terminal piece has an intermediate portion having a first part connected to a connecting end portion exposed from the respective mounting hole, and a second part connected to a contact end portion opposite to the connecting end portion. A protecting block is disposed adjacent to the substrate, is formed with through holes for permitting extension of the terminal pieces therethrough, respectively, and is operable so as to move from a first position, where the contact end portion of each terminal piece is received in the respective through hole, to a second position, where the contact end portion and the second part of the intermediate portion of each terminal piece are disposed outwardly of the respective through hole and are exposed from the protecting block. A biasing unit biases the protecting block to the first position.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: December 27, 2005
    Assignee: Advanced Connection Technology Inc.
    Inventor: Eric Wang
  • Patent number: 6965246
    Abstract: A burn-in socket assembly (1) includes a base (10) receiving an IC and a number of contacts, a slider member (20) mounted onto the base and capable of moving along the base, a pair of actuation members (30) assembled onto the base, and a cover (40) assembled onto the actuation members and capable of moving up and down. The base forms a pair of receiving elements (141) on front and end sides respectively. Each receiving element includes a body portion (142), a pair of spaced top portion (143) each having slits (144) extending therethrough and an aperture (145) extending therethrough. A sensor is received in the aperture to provide signals to a controller during being operated at high temperature. The controller can reliably control the temperature of the whole assembly in light of the signals from the sensor, thereby avoiding damage of the IC by exorbitant temperature.
    Type: Grant
    Filed: April 16, 2004
    Date of Patent: November 15, 2005
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Andrew D Gattuso, Sung-Pei Hou, Hsiu-Yuan Hsu, Yao-Chi Huang
  • Patent number: 6948963
    Abstract: The connector is capable of securing a cord to an outlet, of securing extension cords, and/or of securing an extension cord to the cord of a power tool. The device may have a female receptacle and a male plug, only a female receptacle, or only a male plug. The female receptacle may have a screw-style plunger, a sleeve-style plunger, or other means for applying pressure against the sleeves holding the prongs that are plugged into the receptacle. The male plug can use a sleeve-style plunger or other means to apply pressure against at least one of the prongs, causing the plug to be clamped into a receptacle. The female receptacle and male plug of the device can be separated by a cord to create an extension cord. The female receptacle or male plug could also be placed on the cords of a tool or appliance. A plurality of female receptacles could be used in a single unit to create a power strip having locking receptacles.
    Type: Grant
    Filed: November 12, 2003
    Date of Patent: September 27, 2005
    Assignee: Burton Technologies LLC
    Inventor: John E Burton
  • Patent number: 6884087
    Abstract: A socket including multiple contact areas socket contacts is provided. The multiple contact areas enable the placement of components, such as capacitors, resistors, diodes and the like between the socket and a substrate.
    Type: Grant
    Filed: September 24, 2003
    Date of Patent: April 26, 2005
    Assignee: Intel Corporation
    Inventors: Damion Searls, Thomas Morgan, Weston Roth
  • Patent number: 6872083
    Abstract: The IC socket for electrical parts comprises a base plate, a tab film on the base plate on which an IC package is mounted and a pressing jig on the tab film for pressing the IC package toward the tab film. The tab film comprises an electrode pattern to be electrically connected with the IC package and a plate-like connecting electrode to be electrically connected with the base plate. To the base plate, contact pins are arranged. An upper end contact portion of the contact pin is protruded from an upper surface of the base plate for abutting on the connecting electrode. The pressing jig, tab film and base plate are detachably fixed by a bolt and nut and in this state the tab film is pressed by the pressing jig body so that the connecting electrode of the tab film elastically abuts on the upper end contact portion of the contact pin.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: March 29, 2005
    Assignee: Enplas Corporation
    Inventor: Hokuto Kanesashi
  • Patent number: 6832919
    Abstract: An LGA socket (1) includes a slab like insulative housing (11), a reinforcing plate (12) attached on an exterior surface of the housing, and a clip (14) and a lever (15). The clip and the lever are respectively mounted on two opposite ends of the housing to fasten an LGA package. The lever includes a driver portion (151), a driven portion (152) adjoining the driver portion, and a baffle (124) extending from a side of the reinforcing plate. The baffle prevents the lever from breaking away from the housing. After the LGA package is positioned on the housing, the rigidity of the housing is improved with the reinforcing plate made of rigid material being equipped on the housing. Steady electrical connection between the contacts pads of the LGA package and respective contacts of the housing is ensured.
    Type: Grant
    Filed: August 22, 2003
    Date of Patent: December 21, 2004
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hao-Yun Ma, Ming-Lun Szu
  • Publication number: 20040248448
    Abstract: A contact test set for use in testing integrated circuits. The set includes a housing having oppositely-facing surfaces and one or more slots extending through the housing between the surfaces. A first surface, during use of the test set, is approached by an integrated circuit to be tested, and a second surface is proximate the load board at a test site. A contact is received in a slot, each contact having a first end engagable by a lead of the integrated circuit device. A second end of each contact is in engagement with a corresponding terminal. Each contact is movable between a first orientation, unengaged by a corresponding lead of an IC and a second orientation in which the IC is engaged by the corresponding lead of an IC and urged into its slot. An elastomer biases the contact to its first orientation. The contact, when moved between its first and second orientations, does not slide across a terminal of the load board.
    Type: Application
    Filed: April 22, 2004
    Publication date: December 9, 2004
    Inventor: Mathew L. Gilk
  • Patent number: 6811410
    Abstract: An integrated circuit socket with capacitors and shunts is disclosed. According to one embodiment of the invention, a socket is divided into a shunt area, a socket pin area, and a land side capacitor area. The shunt area may contain a variable number of power shunts, ground shunts, and capacitors. The capacitors are connected across, and serve to decouple, power shunts and ground shunts. The shunts are to supply an electrical current from the capacitors to an integrated circuit device. The socket pin area may be surrounded by a metal fence serving as to lessen electromagnetic interference and as a ground and/or signal reference. The fence may be divided into sub-areas each comprising a coaxial differential signal pin opening pair. In alternate designs, an elongated power bar may serve as a power or ground shunt and may be used with several capacitors.
    Type: Grant
    Filed: May 28, 2002
    Date of Patent: November 2, 2004
    Assignee: Intel Corporation
    Inventors: David G. Figueroa, Yuan-Liang Li
  • Patent number: 6793512
    Abstract: A rib is provided in a partition wall of a contact deviation member, so that when movable contact pieces in one contact terminal is apart from each other, the relative position of the movable contact piece in the one contact terminal is restricted to a movable contact piece in another contact terminal adjacent to the former pair.
    Type: Grant
    Filed: August 9, 2002
    Date of Patent: September 21, 2004
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Shunji Abe, Yuki Kudo
  • Patent number: 6793505
    Abstract: A socket may comprise an array of first contacts and a set of second contacts having a greater conductive cross-sectional area than the first contacts. The set of second contacts may also have a greater conductive area efficiency than the array of first contacts, with conductive area efficiency defined as a total conductive cross-sectional area divided by a total occupied area. The array of first contacts may electrically couple signal pads of a land grid array (LGA) component with a plurality of signal lines in a printed circuit board (PCB). The set of second contacts may electrically couple power delivery land pads of the LGA component with power and ground planes of the PCB.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: September 21, 2004
    Assignee: Intel Corporation
    Inventors: Terrance J. Dishongh, Weston C. Roth, Damion T. Searls
  • Patent number: 6790064
    Abstract: A socket assembly for accommodating an IC chip or package (IC) provided with a socket body having a generally rectangular configuration. A plurality of flat plate-like contact pins are arranged forming rows in parallel with each other so as to form rows along four sides of the socket body, respectively. Each contact pin has a base portion and an arm which extends curved upward from the base portion. An upward contact portion for coming into contact with a terminal of an IC is formed on one end of the base portion of the contact pin, and a connecting portion for the connection to the printed circuit board is formed on the other end of the base portion. Four sliders are arranged along the four sides of the socket body, respectively.
    Type: Grant
    Filed: May 31, 2001
    Date of Patent: September 14, 2004
    Assignee: Enplas Corporation
    Inventor: Yasushi Kajiwara
  • Patent number: 6755668
    Abstract: A socket assembly configured to be reflow soldered to a circuit board comprising a perimeter frame having a central open area surrounded by perimeter walls. The socket assembly may be configured to be surface mounted on a circuit board, wherein at least one of the perimeter walls includes a post extending downward therefrom. The socket assembly also comprises a base fit into the open area of the perimeter frame. The base is separate and distinct from the socket frame. The base has a post hole therein positioned to mate with the post. Additionally, the socket assembly comprises contacts held by the base, and solder balls provided on a bottom of the base. The solder balls engage the contacts and, prior to, and after, soldering, extend beyond a bottom of the socket frame.
    Type: Grant
    Filed: November 20, 2002
    Date of Patent: June 29, 2004
    Assignee: Tyco Electronics Corporation
    Inventors: Charles Dudley Copper, Craig Maurice Campbell
  • Patent number: 6743039
    Abstract: A ball grid array connector having an insulative housing with a plurality of contacts in electrical connection with corresponding solder balls that protrude from a surface of the housing. The solder balls form a soldering region for attachment to a circuit board. The housing has a center of gravity biased from a center of the soldering region, and a positional compensation member is attached to the housing and the circuit board. The positional compensation member prevents the housing from becoming inclined with respect to the circuit board when the solder balls are attached to the circuit board and prevents the housing from becoming inclined with respect to an electronic part when the electronic part is mounted to the housing on a side opposite from the circuit board.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: June 1, 2004
    Assignee: Tyco Electronics EC K.K.
    Inventors: Hiroshi Shirai, Akira Kubo
  • Patent number: 6722911
    Abstract: An electrical connector for electrically connecting an electronic package such as a central processing unit with a circuit substrate such as a printed circuit board. The electrical connector includes an insulative base (1), and a cover (2) slidably attached on the base. The cover includes a pair of opposite retention flanges (22). A pair of sliding slots (222) is defined in the flanges, and a pair of locating recesses (221) is defined in the flanges respectively adjacent the sliding slots. The base includes a pair of opposite sliding rails (1222), and a pair of locating protrusions (1221) formed respectively adjacent the sliding rails. When the cover is attached to the base, the sliding slots guide and receive the sliding rails therein, and the locating recesses retainingly receive the locating protrusions therein.
    Type: Grant
    Filed: October 7, 2002
    Date of Patent: April 20, 2004
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Hui Ye
  • Patent number: 6669498
    Abstract: A ZIF socket (1) includes a base (2) having a number of terminals (5) received therein, a movable cover (3), and a cam mechanism (4) assembled on the cover and the base. The cam mechanism includes a cam (41) and a base ring (42) attached to cam. The cam includes a driving section (411) engaging with the cover, a rotating section (412) engaging with the base, and a riveting section (413) extending from the rotating section. The riveting section has a bottom riveting surface (415) on a bottommost side and a V-shaped groove (416) defined in the bottom riveting surface. During riveting, the riveting section deforms more predictably under the riveting pressure, increasing the reliability of the riveted cam mechanism.
    Type: Grant
    Filed: September 4, 2002
    Date of Patent: December 30, 2003
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Masao Okita, Min Huang
  • Patent number: 6609923
    Abstract: A semiconductor device-socket is provided, in which the amount of the movement of a contact deviation member 32 is restricted by a protrusion 22P such that a predetermined gap CL1 is formed between a partition wall 32W and a movable contact portion 24A1, and a predetermined gap CL2 is also formed between an outer peripheral surface of the partition wall 32W and a movable contact portion 24A2.
    Type: Grant
    Filed: June 26, 2002
    Date of Patent: August 26, 2003
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Masaru Sato, Hiroyuki Kitada