Abstract: The present disclosure relates to a device for carrying a chip, and a device and a method for testing a chip. The device for carrying a chip is configured to fasten chips of different sizes, and includes a support box and a plurality of first elastic snap rings. The support box is configured to carry a chip. A first connection terminal of the first elastic snap ring is provided on a first inner side wall of the support box, a second connection terminal of the first elastic snap ring is suspended, and is configured to be in contact with the chip and provide a pressure in a first direction for the chip because an elastic body of the first elastic snap ring is in an elastically compressed state.

Abstract: A first hold-down includes a hold-down elastic piece supported like a cantilever beam by a reinforcing plate part. The hold-down elastic piece includes an elastic piece body extending from the reinforcing plate part, and a curve contact part formed at an end of the elastic piece body and projecting toward a CPU board beyond a CPU board opposed surface. A housing is formed in such a way that the curve contact part does not come into contact with the housing when the curve contact part no longer projects toward the CPU board beyond the CPU board opposed surface as a result of the curve contact part being elastically displaced toward an input-output board.

Abstract: A system and method of implementing an adaptable graphics board comprising the adaptable graphics board including a graphics processor, graphics memory, and a reconfigurable I/O module interface are having a plurality of electrical contacts, a dual compression connector having a first array of compressible electrical spring contacts on a first side and a second array of compressible electrical spring contacts on a second side operatively coupled to the first side via a dual compression connector printed circuit board layer, the first side of the dual compression connector operatively coupled to the reconfigurable I/O module interface of the adaptable graphics board, and a reconfigurable I/O module board having external display data ports disposed along an edge, wherein the reconfigurable I/O module board is operatively coupled to the adaptable graphics board via the second side of the dual compression connector.

Abstract: A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.

Abstract: An IC socket (11) comprises contact pins (14) disposed in the socket body (13) to be disjunctive to terminals of the IC package (12), an opening and closing body (19A,19B) rotatably provided in the socket body (13), the opening and closing body (19A,19B) having a pressing member (23a,23b) for pressing a top surface of the IC package (12) accommodated on an accommodating surface portion (16d) of the socket body (13); and an operating member (20) for opening and closing the opening and closing body (19A,19B) disposed up and down movably with respect to the socket body (13). A first opening and closing body (19A) having a heat sink (23a) for pressing an entire of the top surface of the IC package (12) and a second opening and closing body (19B) having a block (23b) for pressing the heat sink (23a) are disposed at different positions mutually.

Abstract: An electrical connector assembly having a housing and a terminal alignment and protection plate. A mating surface of the housing has terminal alignment member receiving channels. The terminal alignment member receiving channels have first retention projections and second retention projections which extend into the terminal alignment member receiving channels. Rigid support members extend from a first surface of the terminal alignment and protection plate in a direction away from a second surface. The support members extend perpendicular to a planar portion of the terminal alignment and protection plate. The support members have flexible support beams which extend between the support members. The flexible support beams extend essentially parallel to the planar portion of the terminal alignment and protection plate.

Abstract: An electrical connector for connection between the CPU and the PCB includes an insulative housing, an insulative plate below the housing and a plurality of contacts retained to the housing and the plate. The housing forms a receiving cavity for receiving the CPU, and the plate forms a mounting face confronting the PCB. Each contact includes an upper part and a lower part discrete and independent from each other. The upper part includes an upward resilient arm extending into the receiving cavity for mechanically and electrically connecting to the CPU, and a bottom connecting section. The lower part includes a downward resilient arm extending toward the PCB for mechanically and electrically connecting to the PCB, and a top connecting section. The bottom connecting section and the top connecting section are mechanically and electrically connected to each other.

Abstract: Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system. There is exemplarily provided a fixing device for mounting the double-sided heat sink on a carrier.

Abstract: The present embodiment relates to a camera module comprising a front body, a lens, a rear body, a first substrate, an image sensor, a second substrate, a connector and a cover, wherein the cover includes a bottom plate having a hole in which the connector is to be disposed, side plates extending from the bottom plate, and pressing unit disposed at the bottom plate and elastically supporting the connector, the connector includes a first surface facing the inner surface of the bottom plate of the cover, and a second surface extending from the first surface and disposed in the hole, and the pressing unit includes a first pressing part for pressing the first surface of the connector, and a second pressing part for pressing the second surface of the connector.

Abstract: An example device in accordance with an aspect of the present disclosure includes a base to be mounted to a system board. A wicking region at the base is to wick adhesive into the wicking region to seal the base to the system board.

Abstract: An electrical connector comprises a bottom assembly extending in a first direction, a first contact assembly, a first substrate assembly, a second contact assembly, a second substrate assembly, a third contact assembly, a top assembly and a plurality of conductive vias. The bottom assembly, the first contact assembly, the first substrate assembly, the second contact assembly, the second substrate assembly, the third contact assembly, and the top assembly are arranged in a second direction. The plurality of conductive vias extends in the second direction to penetrate the bottom assembly, the first substrate assembly, the second substrate assembly, and the top assembly. Each of the contact member of the first contact assembly, the second contact assembly, and the third contact assembly are of a letter V shape.

Abstract: A testing apparatus includes a pressing device and a chip carrying device. The chip carrying device includes a circuit board and a plurality of electrically connecting units. Each electrically connecting unit includes a main body disposed on the circuit board to form an accommodating slot, a lift structure, a supporting structure, an elastic assembly sandwiched between the lift structure and the supporting structure, and a plurality of probe assemblies, the latter four of which are arranged in the accommodating slot. The lift structure has a chip receiving slot for receiving a chip. When the chip receiving slot receives the chip and the lift structure is not pressed, the probe assemblies are not connected to the chip. When the chip receiving slot receives the chip and the lift structure is pressed by the pressing device to move toward the accommodating slot, the probe assemblies are connected to the chip.

Abstract: Disclosed is a testing device. The testing device includes a testing socket configured to support a plurality of probes, a testing-circuit substrate which includes a contact point to contact the probe, a slider which makes the testing socket be coupled to and separated from the testing-circuit substrate, and a slider operator which includes a main body arranged on the testing socket, and a slider pressing portion up/down-movably supported on the main body and moving down from the main body toward the slider so that the slider can slide along a surface direction of the testing socket.

Abstract: A probe pin includes a first contact part and a second contact part; a middle part located between the first contact part and the second contact part; a first flexible part configured to move the first contact part relative to the middle part in the first arrangement direction; and a movable part configured to move the second contact part relative to the middle part in a direction intersecting with the first arrangement direction.

Abstract: An electrical connector assembly includes an insulative housing, a first cover pivotally assembled to the housing, a second cover pivotally assembled to the first cover, and a fan support secured upon the second cover. A plurality of contacts are disposed in the housing. A heat sink is associated with the second cover. A pair of fans are located by two opposite lateral sides of the heat sink and fixed to the fan support so as to induce an air flow along the slots defined between fins of the heat sink in a transverse direction.

Abstract: An electrical connector includes a stiffener, a rail frame pivotally mounted to one end of the stiffener, a carrier frame assembled to the rail frame in a sliding manner, and a load plate pivotally mounted to the end of the stiffener outside of the rail frame. The carrier frame includes latches to retain the CPU thereon. The rail frame includes a pair of opposite sliding channels extending in the front-to-back direction, along which the carrier frame is moveable. A front transverse bar is located in front of the sliding channels and above the sliding channels in the vertical direction.

Abstract: The present disclosure relates to a test socket for a chip, which comprises: a recess for receiving the chip and two push mechanisms. The recess is surrounded by four sections. The two push mechanisms are respectively arranged at two adjacent sections. Each of the two push mechanisms comprises: a push button, wherein a bottom of the push button is connected to a vertical elastic member; a pusher cooperated with the push button, wherein one end of the pusher extends into the recess and the opposite end of the pusher is connected to a lateral elastic member. When the push button is upwardly pushed by the vertical elastic member, a top of the push button protrudes from a top surface of the section and the pusher will be engaged with the push button. When the push button is pressed and moves downwardly, the lateral elastic member pushes the pusher to move toward the recess.

Abstract: A plurality of contact are received within the corresponding passageways of the insulative housing of an electrical connector, respectively. Each contact has juxtaposed first body and second body angled with each other via a connecting section linked therebetween. A resilient contacting section extends upwardly from the first body. The bottom portion of the second body forms sideward spaced first blade and second blade with a slit therebetween, wherein a soldering tail further extends from the first blade, and the second blade is sideward farther from the first body than the first blade is. The bottom edge of the first body is lower than the bottom edge of the connecting sections o as to form another slit between the first body and the second body under the connection section.

Abstract: Various interconnect assemblies are disclosed. The interconnect assembly can include an insert having a hook protrusion that fits into a slot of a receiving region. The hook protrusion can have a curved surface that helps the hook protrusion slide into a slot as the insert is rocked toward the receiving region to seat the insert in the receiving region. The receiving region can have a latch that snaps over a key portion of the insert to keep the insert seated in the receiving region.

Abstract: Disclosed is a socket device for testing an IC, the socket device including: a base on which an integrated circuit (IC) is mounted; a contact module having multiple contacts; a floating hinge block elastically supported on a side of the base in a vertical direction; a lid configured to rotate with the floating hinge block and having a pressing portion on a bottom surface thereof; a floating latch elastically supported on a side of the base to be parallel to the floating hinge block such that the lid is fixed; a first camshaft installed by penetrating the base and the floating hinge block and adjusting a height of the floating hinge block; a second camshaft installed by penetrating the base and the floating latch and adjusting a height of the floating latch; a lever; a handle; and a link connected to the lever and the handle respectively to rotate independently.

Abstract: A surveillance camera system includes a camera portion; a base portion supporting the camera portion to be rotatable, and including a main circuit board; a flexible printed circuit board (FPCB) connecting the camera portion to the main circuit board, and including a first end portion connected to the camera portion, a second end portion connected to the main circuit board, and a conductive line extension portion disposed between the first end portion and the second end portion, wherein a plurality of slits are arranged in the conductive line extension portion; and a first binding member and a second binding member respectively surrounding a part of the conductive line extension portion and being spaced apart from each other.

Abstract: An electrical connector includes a body, having a bottom wall and first and second side walls extending upward from the bottom wall. The bottom wall is provided with an accommodating hole, and a first supporting portion extending upward from the bottom wall to support a chip module. Multiple terminals are correspondingly accommodated in the body. One of the terminals is accommodated in the accommodating hole. A first protruding block and a second protruding block are respectively connected to the first and second side walls and extend toward each other, and each has an arc-shaped surface. The first supporting portion is connected to the first protruding block. The first supporting portion and the accommodating hole are located at two opposite sides of the first protruding block. An extending line of the second protruding block in an extending direction thereof passes above the accommodating hole.

Abstract: For electrically connecting an integrated circuit under test to a test circuit board, a test signals conduction device includes a contact member and a spring member. The contact member has a main portion, a contact portion and an extension portion. When the contact portion is pressed by the integrated circuit, the contact portion and the extension portion rotate about the main portion in a first direction, thereby causing the spring member to deform and switch to an energy storing state from a normal state. When the integrated circuit board is moved away from the contact portion, the spring member returns from the energy storing state to the normal state and causes the extension portion and the contact portion to rotate in a second direction.

Abstract: An electrical connector assembly for connecting a CPU to a printed circuit board, includes an insulative housing, a fixing device and a retainer. The fixing device is located by one end side, and the retainer is used to load the CPU into the housing. The fixing device includes a stationary part and a moveable insertion part wherein the retainer with the CPU therein is retained to the insertion part to commonly rotate about the stationary part for positioning the retainer with the CPU therein within the housing.

Abstract: An electronic control unit having a housing containing a circuit board. The housing includes a base and a cover between which the circuit board is located, and the unit being characterized in that the base and the cover are connected to one another via interference fit interengagement around at least a major part of a peripheral edge of the cover.

Abstract: A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components.

Abstract: An atomtronic (e.g., ultra-cold-matter physics or ion-trap) system includes a vacuum-cell structure, an integrated-circuit package with a pin-grid array, and a socket for interfacing the integrated-circuit package with external control and monitoring systems. After pins of the pin-grid array are inserted into holes of plates in the socket, the plates are moved in opposite directions so that contacts within the holes clamp in place the pins, providing electrical connections. The in-place clamping avoids stress at the seal between the integrated circuit package and the vacuum cell structure; thus, stress that could otherwise compromise the vacuum seal is avoided so as to yield a more reliable vacuum.

Abstract: An electrical connector used for bearing a chip module includes an insulating body, terminals arranged in the insulating body, a carrying member, for carrying the chip module to the insulating body, disposed at one side of the insulating body and contacting with the terminals, a pressing plate for pressing the carrying member or the chip module, and an elastic member having at least two limiting portions. The pressing plate and the carrying member are separately disposed at two adjacent sides on the periphery of the insulating body. The two limiting portions define a pivoting space, and the carrying member is pivotally connected to the pivoting space. The elastic member and the carrying member are disposed at the same side of the insulating body, the elastic member has a buffer portion, and the buffer portion abuts against the carrying member and is disposed between the insulating body and the carrying member.

Abstract: A pressing member is used for downwardly pressing on a chip module. The pressing member has a main body and a central opening going through the main body. The main body has an upper surface and a lower surface opposite to the upper surface. The central opening is provided for a part portion of the chip module going through. The pressing member has a pressing portion protrudes upwardly from the upper surface and provided for an external device pressing downwardly on to make the main body press downwardly on the chip module so as to prevent the chip module from warping.

Abstract: An electronic controller having a housing, and a lower sub-assembly connected to a housing through the use of a laser weld, eliminating the use of a gasket and fasteners. The laser weld provides a sealed connection between the housing and the lower sub-assembly, preventing debris, moisture, oils, ATF, and chemicals from entering the housing, which protects the electrical components located inside the housing. The elimination of the gasket and fasteners also reduces the cost of the electronic controller. Depending upon the application, the electrical components may be mounted directly to the lower sub-assembly, or the electrical components may be mounted on a metal core. The metal core is used to provide heat dissipation and function as an electrical conductor. The lower sub-assembly may either be overmolded around the metal core, or the metal core may be attached to the lower sub-assembly after the lower sub-assembly has been formed.

Abstract: An optical unit may include a movable module holding an optical element having an optical axis; a fixed body comprising; a support mechanism swingably supporting the movable module; a drive mechanism structured to swing the movable module; and a flexible circuit board connected with the movable module and fixed body. The flexible circuit board may include a leading-out part extending from the movable module on a first side of the optical axis; a first extended part extending from the leading-out part to a second side of the optical axis; a first curved part which is curved from a tip end side of the first extended part toward a rear side; a second extended part extending from the first curved part toward the first side; and a fixed part of the second extended part connected with the fixed body on the first side of optical axis.

Abstract: An electrical connector used for carrying a chip module includes an insulating body having terminals arranged in the insulating body and used for contacting the chip module, a carrying member used for carrying the chip module to the insulating body, a pressing plate used for pressing the carrying member or the chip module, and a positioning member pivoted to the carrying member through a pivoting device. The pivoting device includes a pivoting shaft and at least one elastic portion. The elastic portion includes a first elastic section and at least two limiting portions being elastic and enclosing a pivoting space. The pivoting shaft is pivoted to the pivoting space. When the electrical connector is opened, the first elastic section springs back to remove the chip module from the insulating body without damaging the terminals, so as to align and contact the chip module with the terminals without tool.

Abstract: Examples herein relate to printed circuit assemblies (PCA's). In one example, a PCA comprises a printed circuit board (PCB) having an elongated cut-out, the cut-out defining a first and a second opposite elongated edges on the PCB, a movable bracket having a standoff established on a surface of the movable bracket, the movable bracket connecting to the first and the second opposite elongated edges and a platform connector established on the PCB.

Abstract: An electrical connector connecting with a chip module includes a base with a receiving space and a cover covering on the base. The cover includes a first edge, a second edge, a third edge and a fourth edge. The four edges connect with each other to form four engaging portions, and a rectangular opening surrounded therein. The first edge is pivotally connected to the base. The cover includes an extending portion extending from the second edge. The cover includes four pressing portions located at four inner corners of the cover.

Abstract: An IC socket includes: a socket main body having an accommodating part for accommodating an IC package; a socket cover having a one-side end portion pivotally supported by the socket main body, and the other-side end portion which is located opposite to the one-side end portion and lockable to the socket main body; and a heat dissipating member mounted on the socket cover and caused to press the IC package. The socket cover includes a metal plate extending from the one-side end portion to the other-side end portion so that the thickness direction of the metal plate is parallel to the direction in which the socket cover faces the accommodating part when the other-side end portion is locked to the socket main body. The metal plate has a depression formed by bending the metal plate.

Abstract: A package for a multi-chip module includes a top cold plate and a bottom plate whose perimeters are in thermal communication so the plates together completely encase the module except for a connector passing through the bottom plate. The cold plate has copper tubing pressed into a groove formed in a serpentine pattern. The perimeter of the cold plate has thermal conduction fins which mate with thermal conduction slots in the perimeter of the bottom plate. Thermal interface material is disposed in gaps between the plates and chips on the module, the gaps having dimensions controlled by support ribs of plates which abut the module substrate. The cold plate is used on the hottest side of the module, e.g., the side having computationally-intensive chips such as ASICs. A densely packed array of these packages can be used in a central electronic complex drawer with a shared coolant circulation system.

Abstract: A thermoelectric cooling module includes a first circuit board, a second circuit board, first conducting members, second conducting members and TED chips. The first circuit board includes first circuit regions, each having a first conducting layer and first penetrating holes; the second circuit board includes second circuit regions, each having a second conducting layer and second penetrating holes; each first conducting member is passed and fixed into each respective first penetrating hole; each second conducting member is passed and fixed into each respective second penetrating hole; each TED chip is clamped between the first circuit board and the second circuit board, and each first conducting member has an end attached to the TED chip and the other end attached to the first conducting layer, and each second conducting member has an end attached to the TED chip and the other end attached to the second conducting layer.

Abstract: A socket for electrical component capable of pressing and fixing an electrical component. A pressing part includes a first cam rotatably supported by the body part, and a second cam supported by the first cam. An elevating part includes a cam locking part provided on a rotational orbit of the second cam. A tip of the second cam is formed such that the tip of the second cam passes over the cam locking part when the elevating part is moved down by making the tip of the second cam abut against the elevating part and rotate, and the tip of the second cam is locked by the cam locking part so as to prevent the rotation when an attempt is made to perform the rotation in the opposite direction. The rotation in the opposite direction is enabled by moving the second cam in the radial direction of the rotation.

Abstract: An electrical connector for electrically connecting to a chip module. The chip module includes a base plate and a protruding portion projecting upward from the base plate. The electrical connector includes a socket for bearing the chip module, a fixing plate located above the base plate, and a load plate covering the chip module and the fixing plate. The load plate is provided with a first urging portion directly pressing the protruding portion downward, and a second urging portion pressing against the fixing plate downward, so that the fixing plate presses the base plate downward, thereby pressing the chip module downward and electrically connecting the chip module to the socket.

Abstract: An adaptor structure includes a main adaptor, a first sub-adaptor, a second sub-adaptor and a first driving mechanism. The main adaptor is over a socket. The main adaptor has an opening. The first sub-adaptor is movably received in the opening of the main adaptor in a first direction. The first sub-adaptor is configured to support a first side surface of the semiconductor package. The second sub-adaptor is movably received in the opening of the main adaptor in the first direction and a second direction. The second sub-adaptor faces the first sub-adaptor to support a second side surface of the semiconductor package. The first driving mechanism is configured to move the second sub-adaptor in the second direction. Thus, the adaptor structure can guide the semiconductor packages having different sizes to the socket.

Abstract: A land grid array (LGA) socket apparatus includes an LGA socket, with two guide rails provided respectively on the inner sides of two opposite side walls of the socket. The height of the top surface of each guide rail from the socket's bottom is greater than the height of socket terminals from the socket's bottom. The length of each guide rail is smaller than the length of the sidewall's inner side. The guide rails support at least two protrusions provided at corners at opposite sides of an integrated circuit chip assembly when the assembly is slid into the socket from a side. The guide rails, when the assembly is slid to the end of the guide rail, enable the at least two protrusions to fall into the gaps between the ends of the guide rail and the respective socket end walls to install the assembly in the socket.

Abstract: An electrical connector assembly comprises a first connector, and a second connector mounted onto the first connector, a frame surrounding the connectors, a locking member, and a lever assemble the locking member to the frame. The locking member has a main body pivoting to the frame, a supporting portion being seated by the lever and a pushing portion. The main body locks the second connector, a user can press the lever to make the locking member to rotate, then to release the second connector, and upwardly push the second connector to apart the second connector from the first connector.

Abstract: The present invention provides a test socket adaptable for testing different Integrated Circuit (IC) pad size during an IC testing. The test socket comprising a molded socket having an inner space and a plurality of through-apertures disposed on its surface; and a plurality of contact elements disposed within the inner space of the molded socket, each contact element has a pin contact edge and a pin-end; wherein each pin contact edge extends through the through-apertures of the molded socket; wherein each pin contact edge provides a linear surface area for contact with the DUT's lead; and wherein each pin contact edge provides a large contact area for various DUT's lead size.

Abstract: An electronic device comprises a circuit substrate (5), and a moulded interconnect device (4) incorporating integral legs (8) to mount the interconnect device upon the substrate, the legs spacing at least one of the legs carrying a conducting track (20, 21, 22) to provide an electrical interconnection between the interconnect device and the substrate. The substrate (5) may comprise another moulded interconnect device and may be mounted upon a processor (3) and may include an electromagnetic shield (30) on its lower surface.

Abstract: Various apparatus and methods of electrically connecting a packaged integrated circuit to a circuit board are disclosed. In one aspect, an apparatus includes a first frame to be mounted on the circuit board and having a first end. An insulating housing is adapted to be mounted on the circuit board and positioned in the first frame. A second frame is pivotally coupled to the first frame. The second frame includes two spaced-apart rail members and a cross member coupled to and between the rail members opposite the first end of the second frame. The rail members are operable to receive the packaged integrated circuit. The second frame has at least one engagement member to engage a first portion of the insulating housing when the second frame is pivoted toward the insulating housing. A third frame is pivotally coupled to the first frame to apply force to the packaged integrated circuit.

Abstract: A test interposer includes an interposer layer configured to receive a test socket, and a stiffening layer attached to the interposer layer so that the interposer layer is kept in an unalterable shape.

Abstract: A lead frame assembly having a lead frame made of a single layer, a housing substantially surrounding the lead frame, and a plurality of leads formed as part of the lead frame. The lead frame assembly also includes a plurality of interfaces, allowing various devices to interact with the lead frame, such as sensors, thermistors, solenoids, engine controllers, or electronic control units, or the like. The interfaces may be formed as part of the lead frame, oriented in different directions, and may be located in different planes, making the lead frame assembly suitable for applications with different packaging requirements. The interfaces may be a plurality of connectors, where one of the connectors has multiple rows of pins which are in communication with the rest of the connectors, facilitating the communication between the connector and various devices.

Abstract: An electrical connector includes a base with a number of contacts, a cover pivotally mounted to the base, a pair of supporting components for mating with the cover and a pair of rail brackets for mating with the base. Each supporting component is pivotal between an opening status and a closed status relative to the base. The base is slidable relative to the rail brackets along a front-to-back direction. The cover and the pair of supporting components are mateable with each other in condition that one of the cover and the pair of supporting components pivots clockwise while a remaining one of the cover and the pair of supporting components pivots anticlockwise.

Abstract: A socket is electrically connected to a test carrier. The test carrier includes a film-shaped first member on which at least one internal terminal, which contacts at least one electrode of an electronic device, is provided; and at least one external terminal which is electrically connected to the internal terminal. The socket includes: at least one contactor which contacts the external terminal; and a first pusher which pushes a portion of the first member where the internal terminal is provided and a portion of the first member surrounding the internal terminal. The first pusher includes: a bag member which has a sealed space within the bag member; and a fluid which is housed in the sealed space.

Abstract: In one embodiment, a biasing device is actuated using an actuator which is aligned with the biasing device along an alignment axis. A first frame is thereby biased toward a second frame along the alignment axis to bias an integrated circuit package toward a socket. The actuator also latches the first and second frames together and biased towards each other with the integrated circuit package and the socket biased toward each other. Other aspects and features are also described.