Abstract: An interface arrangement for connecting at least one control device to a plurality of field instruments, includes: a carrier board having a plurality of signal channels, and a connector designed for electrical and mechanical connection to a second, complementary connector of a signal processing device, being arranged between a first and a second connecting device of each signal channel. Each signal channel has an electrical interface which is designed for releasable connection of respective surge protection modules, each interface electrically connected to an electrical resistor and to a surge arrester which is arranged at least partially on and/or in the carrier board and is designed for arresting surge voltages and/or surge currents which may occur.

Abstract: A surge suppression system provides surge protection both locally within the radio station building were the power plant and telecommunication equipment are located and remotely next to the radios and antennas located outside of the building on the communication tower. An external surge suppression unit provides a waterproof enclosure for both surge suppression devices and fiber optic connectors. A rack mountable surge suppression unit provides local in-line surge suppression protection for the electrical equipment located in the communication station. A unique surge suppression tray is hot swappable so that multiple surge suppression devices can be replaced at the same time without disrupting radio operation. Pluggable surge suppression modules can be used in both the external surge suppression unit and the rack mountable surge suppression unit.

Abstract: A signal test device includes a metal housing, a circuit board, a protection housing, and a number of fasteners. The circuit board is received in the metal housing. A number of sub-miniature-A (SMA) connectors are mounted to a first side of the circuit board. Each SMA connector includes a base body connected to the circuit board, and a connection head connected to the base body and extending out of the metal housing. An interface is mounted to a second side of the circuit board and extending out of the metal housing. The protection housing is mounted to the second end of the circuit board and is received in the metal housing. The first fasteners extend through and fastened to the base bodies and the circuit board. Opposite ends of each first fastener abut against top and bottom of the inner surface of the metal housing.

Abstract: A testing unit including a substrate, a plurality of vias located in the substrate, a plurality of pin traces having a height and a width and each extending from a respective via towards an edge of the substrate, a plurality of end traces having a height and a width with each end trace extending from an end of a respective pin trace towards the edge of the substrate, a plurality of branch traces having a height and a width and each extending from a side of a respective pin trace, a plurality of traces extending from the end of a respective end trace, branch trace or pin trace to the edge of the substrate, where each end trace is adjacent to a respective branch trace, each end trace is adjacent to a respective branch trace on one side and a pin trace on the opposite side, and each pin trace is adjacent to another pin trace on one side.

Abstract: A test device includes a load module, an input module, an output module, a switching module, and a control module. The load module includes a light electrical load and a heavy electrical load. The input module includes at least one input connector switchably connected to the light load and the heavy load. The output module includes at least one output connector switchably connected to one of the at least one input connector. The switching module is configured to switch a connection between the input connector and the load module, and the connection between the at least one output connector and the at least one input connector. The control module is configured to control the switching module to switch the connections.

Abstract: A connection apparatus used to connect a connector to a test apparatus includes a main board, a first connector, and a number of second connectors. The main board includes a number of pins arrayed a 9*10 matrix, the nine lines defined as A-I, the ten rows defined as 1-10. The second connectors are respectively connected to the pins A5, B5, D5, E5, G5, H5, B6, C6, E6, F6, H6, and I6 of the main board. The pins of main board in the 1-6 rows, the 3-8 rows and the 5-10 rows are respectively connected to the connector to be tested by the first connector. Signal transmission of the connector is input to the circuit board and output to the test apparatus by the second connectors.

Abstract: A system for actuating portable electronic devices includes a power supply circuit for providing an electric potential, a regulating circuit connected to the power supply circuit for regulating the electric potential provided by the power supply circuit, and an actuating circuit connected to the power supply circuit via the regulating circuit. The actuating circuit creating pulse signals to control the regulating circuit and the power supply circuit to create an actuating electric potential, which actuates portable electronic devices connected to the system.

Abstract: A test adaptor for performing turnaround testing on a T1 board that has a plurality of jack receptacles disposed therein. The test adaptor is comprised of a bracket, a plurality of openings, and a plurality of test plugs. The bracket has a length and a width complimentary to the length and the width of an end of a T1 board. The plurality of openings disposed in the bracket are spaced apart from each other by predetermined distances that are complimentary to the spacing between the plurality of jack receptacles disposed in the T1 board. The plurality of test plugs are mounted within the plurality of openings in the bracket such that the plurality of test plugs can be engaged with the plurality of jack receptacles substantially simultaneously and with a single mechanical step.

Abstract: A patch panel includes a plurality of signal input terminals, an output module having a plurality of signal output terminals and at least one standby signal output terminal, and a plurality of adapter elements each having a base portion and a slide portion slidably mounted on the base portion. The base portion includes a first contact connected to a corresponding signal output terminal and at least one standby contact connected to the at least one standby signal output terminal. The slide portion includes a second contact connected to a corresponding signal input terminal. The second contact selectively electrically contacts the corresponding first contact or the at least one standby contact by sliding of the slide portion from an initial position to another position.

Abstract: Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates.

Abstract: A device and method for creating an electrical contact region between an electrical contact shoe and a stud is provided. The stud includes a flange having a contact face facing a threaded shank. A welding portion extending from the flange faces opposite to the contact face. The welding portion is stud welded to a metal sheet having a thickness of 0.6 mm or less. A cap nut made of a plastic material is fastened to the stud, the plastic material permitting self-locking. To prevent deformation of the metal sheet, a maximum torque of 4 Nm is applied to the cap nut. The cap nut serves a first function of sealing against paint penetration into the electrical contact region and a second function of creating electrical contact between the contact shoe and the stud.

Abstract: A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed by depositing conductive material, followed by coupling wires within the openings and performing another plating process by depositing more conductive material. The interconnect structure is completed by first removing the masking material and sacrificial substrate. Ends of the wires are coupled opposite now-formed contact structures to a board. To complete the socket, a support device is coupled to the board to hold a tested integrated circuit.

Abstract: Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates.

Abstract: The support member assembly (1) is formed by laminating a plurality of plastic layered assemblies (6) each incorporated with a reinforcing plate (3) and integrally joining them by heating. Holder holes (2) are formed in the parts of the assembly corresponding to the openings (3a) of the reinforcing plates (3). The reinforcing member increases the overall mechanical strength of the support member assembly. Furthermore, because a number of reinforcing plates can be layered and each reinforcing plate may be provided with a small thickness, the working of the strips of the reinforcing plates between adjacent openings can be achieved without any difficulty, and the manufacturing cost of such a support member assembly can be reduced. When each plastic layered assembly comprises plastic material formed by impregnating non-woven fabric with thermosetting resin, the drilling of holder holes for receiving electroconductive contact members can be more favorably and economically performed.

Abstract: A transparent base supports two or more socket boards side-by-side. Binding posts are arrayed on the longer side of one rectangular socket board. Turning the assembly over allows the user to see how the sockets are connected to the busbars on the backsides of the side-by-side socket boards.

Abstract: The present invention provides an optical interconnection device whereby arrays of fibers or waveguides arranged in a given orientation at an input side are rearranged in a three-dimensional rearrangement area within the device and exit at an output side arranged in a different orientation from the input side. Distinct arrays are created at the output side via manual or automated placement based on a roadmap.

Abstract: A pass-thru electrical connector assembly is an integral part of a barrier wall which separates a harsh environment from a controlled environment. A connector body having a staged position and a locked position on the barrier wall has a flange which extends radially outward from one end of an axial projecting portion. Via rotation of the connector body from the staged position to the locked position, the projecting portion of the connector body moves axially forward through a hole of the barrier wall as a ring seal is preferably axially compressed between the flange and one side of the barrier wall. Axial movement of the connector body is achieved via a plurality of locking lugs which protrude radially outward from and are spaced circumferentially about the projecting portion of the connector body. The lugs are aligned circumferentially with a plurality of slots spaced about and communicating with the hole of the barrier wall when the connector body is in the staged position.

Abstract: A panel for mounting telecommunications equipment has an insulating body and a grounding strip to provide ground connection to the telecommunications equipment. The grounding strip has a panel portion for mounting the grounding strip to the insulating body and a mounting portion bending away from the insulating body and having one or more mounting holes for mounting the panel to external structure to enable the panel to be mounted to the external structure without requiring spacers to prevent overstress to the insulating material. In one implementation, the panel is a protector panel for receiving five-pin plug-in protectors that provide electrical isolation between multi-wire cabling and telephones and other types of telecommunications equipment.

Abstract: An assembly for use in a building entrance protector. The assembly includes a circuit board and surge protector modules. A surge protector panel is mounted to the circuit board, wherein the surge protector panel is adapted to receive the surge protector modules. A first connector port and a second connector port are both coupled to the circuit board. Electrical pathways extend between the first connector port and the second connector port that extend through the surge protector modules on the surge protector panel. Outside plant wiring entering the building entrance protector is electrically interconnected with the assembly via a first connector that engages the first connector port. Similarly, customer premises wiring that enters the building entrance protector is electrically interconnected the assembly via a second connector that engages the second connector port.

Abstract: A network interface device (37, 37a) for use with a communication system. The communication system includes a plurality of interconnect elements (39) coupled to incoming and outgoing lines (41, 47). The network interface device is selectively and individually coupled to selected ones of said interconnect elements to test incoming lines of the communication system. The network interface device includes a first connector (34) for coupling a shared test device (53) thereto, or the shared test device itself. A second connector (38) is coupled to the first connector, for example, by a cable (36) and is used for selectively and individually coupling to a selected one of the plurality of interconnect elements. The network interface device is normally disconnected from the communication circuit and is a passive element until it is connected to the interconnect element. Use of the second connector will interrupt circuitry between contacts (43, 45) in the selected interconnect element.

Abstract: A cross-connect bus for plugging engagement with a cross-connect panel having a plurality of rows of projecting insulation displacement connectors.

Abstract: A network termination equipment for connecting telecommunications apparatus to a telecommunications network has operative elements to perform terminal functions. The termination may perform line diagnostic functions, remote telemetry functions. Alternative front plates are connectable to intermediate plate to configure the termination equipment to perform the different functions necessary for additional services or to control access to the network to authorized users only.

Abstract: The invention relates to making temporary, pressure connections between electronic components and, more particularly, to techniques for performing test and burn-in procedures on semiconductor devices prior to their packaging, preferably prior to the individual semiconductor devices being singulated from a semiconductor wafer.

Abstract: A press locking connector for the antenna of a mobile-phone, the connector is more suitably connected to the antenna of a car and a mobile-phone and is formed a sheet member having at the upper portion thereof a collar with a diameter size coincident with that of the shaft of the antenna, the collar has an opening of suitable size; a hook is provided beside and at a slightly lower portion from the collar, a plug contact device is inserted in a through hole near the bottom of the sheet member, so that the collar opening can be aligned with the antenna and is clamped by a force exerted forwardly from behind on the shaft of the mobile-phone, the hook will snap hook into a recess provided on the top of the mobile-phone, the plug contact device is connected to a socket contact on the mobile-phone by a force exerted in one single direction.

Abstract: A cross-connect bus for plugging engagement with a cross-connect panel having a plurality of rows of projecting insulation displacement connectors includes first and second rectilinear axially extending resilient spring wire contact elements having outer end portions supported in fixed positions and in coaxial alignment with each other by spaced apart receptacles defined by a common support base. The inner end portions of the contact elements are supported in cantilever position by the outer end portions and have overlapping free ends biased into electrical contacting engagement with each other. Plugging elements cooperate with the support base to disable, monitor or test circuits completed by the cross-connect bus without removing the bus from plugging engagement with an associated cross-connect panel.

Abstract: A pivoting beam or lever is used to open and close burn-in and test sockets which employ laterally moving cammed plates to form electrical contact between electrical contact fingers within the socket and terminals depending from an electronic device package. The pivoting beam is oriented and adapted for operation by vertically applied forces so that opening and closing the socket is easily automatible using the pick and place equipment conventionally used to insert and remove electronic device packages from open top sockets.

Abstract: The described embodiments of the disclosed invention provide a semiconductor devices, test apparatus for the semiconductor devices and a method for testing the semiconductor devices. The semiconductor devices may have many different types of pin counts and configurations. Each semiconductor device includes standardized test circuitry. The necessary pins to operate the test circuitry are included in a standardized position on the semiconductor devices relative to the positioning of the semiconductor devices in the test apparatus. Thus a single test apparatus may be utilized to test semiconductor devices having a wide range of pin configurations.

Abstract: Low tortuosity porous polymer sheets (25 to 2000 pores per square millimeter) with metal plated in the pores so as to project beyond sheet surfaces provide uniaxial electrical interconnects. A first "flash" layer of metal is electrolessly plated in the pores and the "flash" coating of metal is then removed from the sheet surface to isolate the pores electrically from one another. Further plating is then applied only to the already plated pore surfaces to fill the pores and/or project beyond the sheet surface. Solder may fill the plated pores. Polymer layers may be removed from the sheets to expose the metal in the pores. The articles are useful in making electrical connections to the contact pads of microcircuits during testing and assembly into electronic devices.

Abstract: A terminal block having a front face and a rear face is provided. An array of counterbores are formed in the terminal block which extend between the faces and define abutment surfaces therein. The counterbores are positioned so that the portion of greater diameter is adjacent the rear face. The counterbores are adapted to receive terminal contacts via the rear face so that the female end of the terminal contacts rest near the front face. Grooves are formed in the rear face which connect selected counterbores. The selected counterbores received one type of terminal contact having a male end of reduced length. A face plate having apertures formed therein is removably secured to the rear face. The apertures are aligned with only the counterbores receiving another type of terminal contact having a male end which extends beyond the rear face to allow the male ends to pass. Ground wires are passed along the grooves and contact the male end of the one type terminal contacts.

Abstract: A method and apparatus for electrically connecting circuitry on a printed circuit board having a plurality of circuit regions, with each circuit region having components operatively associated with input and output signal lines that are electrically isolated from the signal lines of adjacent circuit regions. The input and output signal lines of a particular circuit region are arranged in a closely spaced pattern aligned with a corresponding pattern of traces on an adjacent circuit region. A plurality of connector members are selectively attached to the printed circuit board to provide signal communication among the regions. Each connector member has closely spaced conductive bars which are exposed to contact the signal lines. The conductive bars have a length and a pitch such that the bars place parallel trace patterns in electrical communication when pressed in place.

Abstract: A channelized jackfield comprising a housing having therein a linear array of juxtaposed channels wherein respective assemblies of aligned printed circuit boards and connecting slab-like modules are slidably inserted edgewise from the front of the housing. Each of the assemblies includes an inverted L-shaped bracket of dielectric material having a vertical leg latchingly secured to a front edge portion of the printed circuit board and provided with a plurality of spaced notches through which respective terminal lugs extend insulatingly from the printed circuit board and externally of the housing. Also, each of the L-shaped brackets has a leg disposed substantially orthogonal to the vertical leg and carries on its upper surface a guide groove for slidably receiving the connecting module and guiding it into mating engagement with an aligned connector attached to the front edge portion of the printed circuit board.

Abstract: A test probe for a surface mounted leadless chip carrier is disclosed. The probed includes specially designed connector pins which allow size reductions in the probe. A thermoplastic housing provides spring action to ensure good mechanical and electrical contact between the pins and the contact strips of a leadless chip carrier. Other features include flexible wires molded into the housing and two different types of pins alternately placed in the housing. These features allow fabrication of a smaller and simpler test probe.

Abstract: A connector for mounting on a vertical main frame has an elongate body portion containing a protector field and an elongate jumper field extending along one side. The connector is mounted on the frame member by a bracket which mounts the connector so that the body portion extends at an angle to the plane of the main frame. With an appropriate angle, a useful space is provided between connectors, for access, while removal and replacement of protector modules, and entire connectors, is readily available. One particularly appropriate angle is about 53.degree., while another is about 70.degree., although these can vary. A test field can also extend along one side, adjacent to the jumper field.

Abstract: For a semiconductor device including a bipolar transistor, the emitter, a heavily doped base region surrounding the emitter, and base and collector contact regions, (the collector including a buried layer at an epitaxial layer/substrate interface of the semiconductor body), are formed by employing, on the epitaxial layer, layers of first and second resists, each resist layer comprising an impurity barrier, the second resist being attacked by an etchant relatively inactive with the first resist, by first or second photolithographic steps, of a sequence of only three photolithographic steps, forming three apertures in a first resist layer, to expose the subsequent emitter and two contact regions, then before each, or the, remaining photolithographic step of the sequence, providing a second resist layer, and exposing selectively, and coarsely through the second resist, the subsequent emitter, and either the collector contact region by the third photolithographic step, or the base contact region by the second pho