Abstract: An electrical component having at least one cable element, at least one solder joint, at least one hotmelt element and at least one substrate element, a method of manufacturing such an electrical component, and a tool for manufacturing the electrical component. The cable element is connected with the substrate element by the solder joint. The at least one solder joint is not embedded in the hotmelt element. Preferably, the solder joint is free from the hotmelt material of the hotmelt element. Wherein a flow of hotmelt material is stopped before it reaches the solder joint. A hotmelt cavity for forming the hotmelt element from hotmelt material is separated from a substrate cavity adapted to receive the substrate element by a compressible solder sealing.