Abstract: A method for processing a target object includes arranging a first electrode and a second electrode for supporting the target object in parallel to each other in a processing chamber and processing the target object supported by the second electrode by using a plasma of a processing gas supplied into the processing chamber, the plasma being generated between the first electrode and the second electrode by applying a high frequency power between the first electrode and the second electrode. The target object includes an organic film and a photoresist layer formed on the organic film. The processing gas contains H2 gas, and the organic film is etched by a plasma containing H2 by using the photoresist layer as a mask while applying a negative DC voltage to the first electrode.

Abstract: A low profile surface mount electrical connector is provided for connecting an electronic component such as an IC card on a planar surface of a printed circuit board which includes circuit traces thereon. The connector includes a generally flat insulating housing overmolded about a plurality of stamped and formed electrical terminals. The housing has a bottom surface. Each terminal includes a generally planar surface mount portion projecting from the housing generally coplanar with the bottom surface thereof for electrical connection to a circuit trace on the planar surface of the printed circuit board. Each terminal includes a contact arm portion folded back over the surface mount portion for electrical connection to the electronic component.