Abstract: An elongated hollow housing is made of a conductive material. The housing includes an opened first end for receiving the male terminal and a second end connected to the power supply. A first contactor made of a conductive material is located in the housing. The first contactor contacts the male terminal received into the housing. A second contactor made of a conductive material is located in the housing at a position closer to the first end than the first contactor is. The second contactor contacts the male terminal when the male terminal is inserted into the housing. The second contactor is deformed to separate from the male terminal after the male terminal is separated from the first contactor when the male terminal is removed from the housing.

Abstract: A resin sealed IC has a plurality of external terminals. A metal thin film made of a Sn-Bi alloy is formed in direct contact with the surface of a base member of each external terminal. A Bi content in the Sn-Bi alloy layer is within a range of 0.5 to 6.0 wt %. Further, the Sn-Bi alloy layer has a single-layer plating structure, and the film thickness is within a range of 10 to 25 MIC.

Abstract: A method of tinning one or more electrical terminals by hot solder dipping is disclosed herein. The process generally involves placing a solder resistant material in a through hole formed in an electrical terminal, and then dipping at least a portion of the terminal into a hot solder. The solder resistant material may include, for example, a titanium or stainless steel wire, and the solder may be a tin-lead solder such as Sn63.

Abstract: An electrically connecting terminal structure made of a metal sheet with unified thickness and including a first terminal section and a second terminal section. The second terminal section is bent from a lateral side of front end of the first terminal section and integrally axially extends therefrom. In a space defined by X axis, Y axis and Z axis, the thickness of the first terminal section parallel to X-Z plane is equal to the width of the second terminal section parallel to X-Y plane. Moreover, the thickness of the second terminal section parallel to X-Z plane is larger than the width of the second terminal section parallel to X-Y plane so that the second terminal section can meet the specification and a manufacturer can choose a thinner sheet material to manufacture the connecting terminal meeting the specification so as to reduce cost for the material.

Abstract: An arrangement for transmitting electrical signals and/or energy between units mobile relative to each other, by means of galvanic contacts and a sliding-contact arrangement in particular. The inventive device excels itself by the provisions that at least one of said contacts comprises a basic material having a high mechanical stability, into which a second material is embedded which presents good electrical characteristics with respect to the transmission of electrical signals and/or energy, and that said second material is so distributed in said basic material that at least one further contact, which contacts this contact, is in contact with said second material along the major part of the trajectory of the movement.

Abstract: Described is a sputtering target assembly of high purity copper diffusion bonded to a precipitation hardened aluminum alloy backing plate via an intermediate layer of a CuCr alloy and in which the copper contains a micro alloy addition of at least one of Ag, Su, Te, In, Mg, B, Bi, Sb and/or P. Also disclosed is a method that includes preparation of a master alloy for addition to high purity copper and fabricating, heat treating and diffusion bonding processes to produce a sputtering target assembly with a stable fine-grained target microstructure.

Abstract: An electrically conductive metal tape for manufacturing electrical contact components and a plug connector made of it. The metal tape has a base material made of copper or a copper alloy having a metallic coating, applied by molten technology, made of a tin-silver alloy containing a silver proportion between 1% and 3.8% by weight. The silver content in the coating preferably lies between 1.2% by weight and 2.5% by weight. Especially positive properties with respect to the adhesiveness between base material and metal coating are achieved by the silver proportion in the coating. At the same time, the temperature stability and sliding properties are improved. Furthermore, a stable contact resistance is ensured.

Abstract: An electrically conductive metal tape for manufacturing electrical contact components, in particular plug connectors, having a base material made of a copper alloy having nickel proportions between 1.0 and 4.0% by weight, silicon proportions of 0.08 to 1.0% by weight, tin proportions between 0.02 and 1.0% by weight, zinc proportions of 0.01 to 2.0% by weight, zirconium proportions of 0.005 to 0.2% by weight and silver proportions between 0.02 to 0.5% by weight, the coating consisting of a tin-silver alloy having a silver proportion between 1.0 and 3.8% by weight. Particularly positive properties are displayed by a metal tape whose base material is made of a copper alloy having proportions of nickel between 1.4 and 1.7% by weight, silicon from 0.2 to 0.35% by weight, tin between 0.02 and 0.3% by weight, as well as zinc from 0.01 to 0.3% by weight.

Abstract: A connection component including a flexible substrate having a top surface and a bottom surface, a layer of a compliant, dielectric material overlying the top surface of the substrate, the compliant material layer having a top surface remote from the substrate, an array of flexible, conductive leads having first ends attached to terminals accessible at the second surface of the substrate and second ends adjacent the top surface of the compliant layer, wherein each the lead comprises a core of a first conductive material surrounded by a layer of a second conductive material, the second conductive material having a greater yield strength than the first conductive material.

Abstract: An electrically conductive metal strip for the production of electrical contact components, in particular plug connectors, having a core strip made of a copper material and a metal facing, made of a copper-nickel-zinc alloy (nickel silver), roll-bonded clad on at least one side. The core strip possesses an electrical conductivity of at least 20 m&OHgr;/mm2. The combination of copper material and nickel silver as the metal facing yields a metal strip with high electrical conductivity whose mechanical surface properties correspond to those of nickel silver.

Abstract: A composite material and a method of making a composite material is disclosed. The composite comprises a core of a precipitation hardenable metal having a coefficient of thermal expansion less than 9 parts per million/° C. in the temperature range of 20° C. to 100° C. The core material is clad with a transition metal or transition metal alloy cladding layer covering at least one surface of the core.

Abstract: One embodiment of an electrical contact has a copper alloy substrate and a hard underlayer plating such as nickel. The underlayer is coated with a thin, liquid barrier film coating. The substance that forms the coating is one of the proprietary materials that are described in military specifications MIL-C-81309E, and MIL-L-87177A, Amendment 1. The military specifications generally describe classes of ultra-thin film, water-displacing, corrosion preventive compounds that may be applied by dipping, brushing, or from gas-pressurized containers. The mating surfaces of both mating contacts (i.e., male and female) are provided with the coating. The coatings provide excellent corrosion protection for both contacts despite physical contact therebetween.

Abstract: The present invention is directed to electrical contacts that comprise spaced electrically conductive particles embedded and bonded into the surface of conductors in which the particles have been kinetically sprayed onto the conductors with sufficient energy to form direct mechanical bonds between the particles and the conductors in a pre-selected location and particle number density that promotes high surface-to-surface contact and reduced contact resistance between the conductors.

Abstract: An interposer includes a substrate having opposing surfaces. Conductive terminals are disposed on both surfaces, and conductive terminals on one surface are electrically connected to conductive terminals on the opposing surface. Elongate, springable, conducive interconnect elements are fixed to conductive terminals on both surfaces.

Abstract: A composite material and a method of making a composite material is disclosed. The composite comprises a core of a precipitation hardenable metal having a coefficient of thermal expansion less than 9 parts per million/° C. in the temperature range of 20° C. to 100° C. The core material is clad with a transition metal or transition metal alloy cladding layer covering at least one surface of the core.

Abstract: A stud bump structure for electrical interconnection between a pair of members includes a base portion, and a stem portion. The base portion is affixed to a pad or trace in one of the pair of members to be interconnected (such as an integrated circuit chip), and the stem end is configured to contact a metal pad on the other member (such as a printed circuit board) to complete the interconnect. According to the invention, the stem end is truncated to form a transverse plane, and the stem is more compliant than the base. Also, a method for forming a stud bump on a contact surface, includes forming a bump base portion on the surface, drawing out a generally conical tail from a top of the base, and truncating the tail to form a stem portion having a planar transverse top surface and having a length from the top of the base portion to the top surface. In some embodiments the tail portion, at least, of the stud bump is formed using a wire bonding tool.

Abstract: One embodiment of an electrical contact has a copper alloy substrate and a hard underlayer plating such as nickel. The underlayer is coated with a thin, liquid barrier film coating. The substance that forms the coating is one of the proprietary materials that are described in military specifications MIL-C-81309E, and MIL-L-87177A, Amendment 1. The military specifications generally describe classes of ultra-thin film, water-displacing, corrosion preventive compounds that may be applied by dipping, brushing, or from gas-pressurized containers. The mating surfaces of both mating contacts (i.e., male and female) are provided with the coating. The coatings provide excellent corrosion protection for both contacts despite physical contact therebetween.

Abstract: A plated material for connectors, having superior insertion and withdrawal properties, comprises an intermediate layer consisting of Ni alloy plating having a Vickers hardness of 450 to 750 Hv and a thickness of 0.3 to 2 &mgr;m provided on a base metal consisting of Cu or Cu alloy, a reflowed Sn or Sn alloy plated surface layer provided thereon, and an alloy layer consisting primarily of Sn—Ni and having a thickness of 0.05 to 2 &mgr;m formed by diffusion between the intermediate layer and the surface layer, in which average grain size of said Sn—Ni compound is 0.05 to 1 &mgr;m.

Abstract: An electrical interconnect is configured to provide an electrical connection between a first point and a second point. The interconnect includes a specular reflection layer adjacent a conductor layer. The conductor is configured to conduct electrons between the first and second points and the planar specular reflection layer confines the electrons to the conductor through specular reflection. This reduces electrical resistance of the electrical interconnect measured in a direction parallel with the specular reflection layer.

Abstract: Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

Abstract: An electronic assembly comprising an electronic substrate and a plurality of conductive interconnection elements. The substrate has a first side having a plurality of terminals. Each interconnection element has a base secured to a respective one of the terminals, a contact region distant from the electronic substrate, and an elongate freestanding section which can bend when pressure is applied to the contact region.

Abstract: A tin-nickel alloy containing not less than 75 wt % and less than 100 wt % of tin with the balance of nickel. The alloy is used, for example, for formation of a surface treatment layer of an electronic component which is to be soldered onto a substrate with the use of the surface mount technology. The surface treatment layer preferably has a thickness of not less than 0.1 &mgr;m and less than 0.5 &mgr;m. The electronic component preferably further includes a nickel deposit layer as an underlying layer interposed between a base of the component and the surface treatment layer.

Abstract: A method of coating a metal part that is to be soldered, in particular a part of an electrical connector for high frequency signals, in which method a layer of white bronze is applied to said part. The layer of white bronze is initially covered in a fine layer of palladium, and then in a fine layer of gold.

Abstract: Bar composed of an aluminum section with which copper contact jumpers are brought into intimate contact at the end or at regular intervals.The flanges of jumpers 20 have silver plated areas A on their internal surface, for example in the form of strips 24 transverse to the length of the bar and silver plated areas B on their external surface located between the areas A and the web of the jumper. The internal silver plated areas contribute to welding the jumper to the section and the external areas are used for making contact with junction devices or fish plates.

Abstract: The electrical contact device establishes electrical contact with a tubular electrical port that opens through an edge surface of a composite structure. The electrical contact device includes a contact pad having opposed inner and outer surfaces. The outer surface is formed of an electrically conductive material, while the inner surface is formed of an insulating material. The electrical contact device also includes an electrically conductive pin attached to and extending outwardly from the electrical contact pad such that the pin is in electrical contact with the outer surface of the pad. Upon insertion within a tubular electrical port, the pin serves to establish electrical contact between the tubular electrical port and the conductive outer surface of the contact pad, while the insulative inner surface serves to insulate the electrical contact device from the composite structure.

Abstract: A one-piece electrical terminal (10) includes a strip (44) of conductive metal material having a contact portion (14) and a terminating portion (16). The contact portion (14) is fabricated of a relatively soft metal drawn into a shaped contact (18). The terminating portion (16) is integral with the contact portion (14) and is fabricated of a relatively hard tempered metal formed into a spring arm (16) supporting the contact (18).

Abstract: Nesting electrical connectors comprising a substrate and a silver-nickel-carbon electrodeposit atop the substrate. The electrodeposit is at least about 0.5 micrometers thick, and comprises about 10 to about 25 atomic percent nickel which is dispersed as a discontinuous phase throughout a continuous phase of the silver and has a Scherrer grain size less than about 5 nanometers. The carbon comprises about 5 to about 15 atomic percent of the deposit and has a non-crystalline graphite structure.

Abstract: A coated Cu alloy having a high hardness surface which contains intermetallic compounds consisting essentially of Cu and Sn is produced by coating the surface of a Cu alloy with Sn and heat treating the coated Cu alloy to form on the surface thereof a high hardness coating containing Cu--Sn intermetallic compound(s). The coated Cu alloy has improved resistance to abrasion and corrosion and good workability, which permits producing terminal connectors therefrom. The Cu alloy which is coated with Sn consists essentially of 0.01-15 wt % Ni, 0.1-10 wt % Sn, 0.005-0.5 wt % P, and optionally 0.01-40 wt % in total of one or two or more elements selected from the group consisting of Fe, Co, Zn, Ti, Mg, Zr, Ca, Si, Mn, Cd, Al, Pb, Be, Te, In, Ag, B, Y, La, Cr, Ce and Au, with the balance being Cu and incidental impurities.

Abstract: An electrical conductor has a copper base substrate coated with a tin base coating layer. To inhibit the diffusion of copper from the substrate into the coating layer and the consequential formation of a brittle tin/copper intermetallic, a barrier layer is interposed between the substrate and the coating layer. This barrier layer contains from 10% to 70%, by weight, of nickel and is preferably predominantly comprised of copper. In one embodiment, an intermetallic layer selected from the group (Cu--Ni).sub.3 Sn, (Cu--Ni).sub.6 Sn.sub.5, Cu.sub.3 Sn, Cu.sub.6 Sn.sub.5 is disposed between the barrier layer and the tin base coating layer.

Abstract: A female electrical connector element for connecting a wire lead to a male contact pin has a first end which is crimped to the wire lead and a second end in the form of a socket. The socket includes a cantilevered contact floor and a separate spring contact in opposed relation to the cantilevered contact floor. The male contact pin is inserted between the spring biased contact surface and the cantilevered contact floor to establish an electrical connection. In accordance with the method of fabricating the connector, the cantilevered contact floor is supported sequentially by a series of forming surfaces at a bight portion thereof while the contact floor is being bent through 180.degree.. The side flanges of the female component are then folded over the contact for making an enclosure for defining the socket that retains the unitary spring contact.

Abstract: A cylindrical heating coil element repair member for joining the two ends of a broken electric heating coil element wire wherein the broken wire ends are inserted, respectively, into apertures formed in each end of the cylindrical repair member until they make contact with the solid central portion of the repair member and where the end portions with wire ends therein are crimped onto each wire end to retain them therein to provide electrical continuity through the repaired wire.

Abstract: The present invention concerns a crimp contact used for connecting electrical wires. The said crimp contact is of the type consisting of a strip of electrically conductive material, for example copper, crimped to form a substantially square shape, with rounded corners and edges. According to the present invention, the electrically conductive base material is backed with a layer of soldering material, for example tin, in various shapes and size. In addition, solder flux may be advantageously placed between the soldering material and the electrically conductive base.

Abstract: A cordless electrical appliance includes a male pin connector which engages vertically with a female socket connector mounted in a base for the appliance. The contacts are arranged such that one of the line or neutral connections makes last and breaks first. This connection includes a silver, copper backed contact mounted on a leaf spring with a corresponding male pin being made of copper and having a thin silver plating at least in a region of contact with the copper backed contact.

Abstract: A contact device for an electrical component, particularly a connector, comprising at least one contact element, said contact element having a first contact portion located within said component and second contact portion projecting downwardly beyond said component and adapted to be connected to a conductor, in particular a conductor of a printed circuit board, by soldering, wherein the first contact portion consists of a resilient metallic material and the second contact portion consists of a shape memory alloy, the alloy having a transformation temperature which is significantly higher than the operation temperature of the contact device, the contact device being located or oriented such that it deforms towards said conductor above said transformation temperature.

Abstract: There is provided a terminal especially adapted for use with an electrically heatable catalytic converter having a stud, a portion of said stud being coated with a thin layer of refractory metal oxide, and a sleeve having an interference fit with said coated portion of said stud, said stud adapted to be welded at its proximal end to one side of a resistance circuit. There is also provided an electrically heatable catalytic converter including such terminal.

Abstract: An electrical interconnector for interconnecting two circuit members wherein the interconnector comprises a dielectric member and at least one conductive element. The conductive element includes a base portion retained within the dielectric and at least one projecting helical portion for engaging a conductor of one of the circuit members. Preferably, dendritic elements (e.g., palladium) are formed on the terminal ends of the helical portions for providing debris removal. The form of connection between the helical portion and the conductor is of the non-wiping type. An electrical assembly including this interconnector is also described.

Abstract: A contact member according to the invention effectively controls the production of sparks even at a high current, has a simple structure and is appropriate for use as a small contact brush as in a micromotor. A method of manufacturing a strip material for producing the contact member, the strip material being provided with a surface metal layer having a desired configuration which can be easily manufactured continuously, precisely and in large quantities with a high yield of contact members. Each of the contact members comprises a metal base plate and a sintered metal layer formed on a surface of the metal base plate. The contact member is cut from the strip material, which is manufactured by first printing a metal paste on desired positions on a metal base strip and then sintering the metal paste. The sintered metal layer is firmly joined to the metal base strip by diffusion bonding.

Abstract: Noble plated tungsten corona wire for copy machine or xerography technology machines and method of securing terminal connectors to the ends of the noble plated tungsten corona wire. The terminal or crimping tab have compound radii to provide for a solid-state diffusion weld and to prevent stress at a junction of the wire and the terminal or the crimping tab.

Abstract: There is provided a terminal especially adapted for use with an electrically heatable catalytic converter having a stud, a portion of said stud being coated with a thin layer of a ceramic, and a sleeve having an interference fit with said coated portion, said stud adapted to be welded at its inner end to one side of a resistance circuit. There is also provided an electrically heatable catalytic converter including such a terminal.

Abstract: A card reader (2) especially for use in connecting gold plated pads on a subscribers identity module card (4) to respective tin plated pads on a printed circuit board (6) in a car telephone handset, comprises an insulating frame (8) having spigots (26) for fixing it to the circuit board 96), and a metal cover (12). A bar (22) spanning the frame (8) supports contact elements (10) molded thereinto. Each contact element (10) has a 10 contact spring (40) provided with a bowed, gold plated contact surface (5) near its free end for engaging a respective gold plated pad on the card (4), and intermediate its ends, an oppositely bowed, tin plated, contact surface (44) for engaging a respective tin plated pad on the circuit board 96). With the card (4) resting on a ledge (18) in the frame (8), the metal cover (12) is latched to the frame (8) to force the contact surfaces (44 and 50) against their respective pads.

Abstract: An article of manufacture, for example a conductor for an electrical wire or cable, is provided with a refractory coating preferably formed from a refractory metal or semi-metal oxide or nitride and preferably deposited on the surface of the article by a vacuum deposition process such as a sputter ion plating method. Adhesion of the refractory coating, especially at high temperatures may be improved, and migration of the substrate metal through the coating may be suppressed by varying the stoichiometry of the coating through its thickness and/or by the provision of a metallic or refractory intermediate layer. The articles are particularly suitable for use in circuit and signal integrity cables.The vacuum deposited refractory layer may constitute the sole refractory, or additional refractory layers may be deposited by other methods e.g. a sol-gel method.

Abstract: An electrical terminal pin is provided with a pin tip for insertion into a mating electrical female terminal, a hole in a printed circuit board or the like. The pin has an electrically conductive core plated with an electrically conductive layer. The pin tip is formed of a generally rounded pyramidal configuration defining four slightly curved convex sides joined at four edges converging at a pin end. Two opposite sides of the pin tip are non-plated. The other two opposite sides of the pin tip are plated with the conductive layer. Portions of the conductive plating layer overlap the edges of the pin tip in a smooth or rounded configuration to eliminate any sharpness thereof and to provide additional plated areas over the exposed core material. The pin tip is formed by a cutting and coining operation to form the configuration of the tip and to coin the overlapping portions of the conductive plating layer over the sharp edges of the pin tip.

Abstract: A relatively flat, rectangular multipin connector has a terminal end to each pin adapted to receive the stripped end of a wire to be soldered thereto. Both surfaces of the pin may be arcuate in cross-section, one surface being concave and adapted to receive a wire to be soldered thereto. The convex surface has a covering of a thin layer of ferromagnetic material having an effective Curie temperature above the fusion temperature of the solder to be employed. A sleeve of heat shrinkable material has an interior ring of solder and is positioned over the region of contact between the wire and terminal end of the pin and has fusible plastic at each end. Each wire is placed on an individual pin and successively clamped in place, each between a different pair of jaws.

Abstract: An improved omega connector for electrically coupling components of a multicomponent electronic assembly comprises first and second flat end sections each formed of nonporous copper plate adapted for solder bonding to components, and an intermediate loop section formed of interwoven copper fibers extending between the end sections to provide a continous electrically conductive network therebetween. The fibers in the loop section carry a solder nonwettable coating to avoid interference with bonding operations to attach the end section to the components. Preferably, the loop section is composed of nickel-clad copper fibers. The fibrous loop section exhibits enhanced flexibility to reduce stresses attributed to shifting of the components during operation and thereby extend the useful life of the assembly.

Abstract: A lightweight, substantially corrosion-proof, conductive wire and terminal assembly (10) comprising a wire (12) laid on and welded to a terminal pad (18) at or near the end (16) of the wire. The wire (12) has an electrically conductive core (24) having a cylindrical surface. The cylindrical surface is substantially completely enveloped in a sheath of noble metal plating (26, 28). The terminal pad (18) has a noble metal surface where it is welded to the cylindrical surface of the wire (12), so the joint (22) formed by the weld is substantially sheathed in a noble metal, and thus is substantially as corrosion-proof as the noble metal sheath (26, 28) and terminal pad (18). The wire (12) is preferably covered with insulation (30) except at its end (16), which may be stripped.

Abstract: Copper based alloys, e.g. CuNiSnSi are processed by annealing followed by a high level of cold work area reduction then a recrystallization step which is followed by a low level of cold work prior to spinodal aging. The resultant material is isotropically formable while maintaining high yield strength.

Abstract: A method of making electrical contacts (10) for either tin or gold-plating without changing the overall dimensional shape of the contact (10) has been disclosed. The method includes the step of providing a given spring rate for a pair of cantilever beams (26) by cutting the beam (26) to a predetermined width without changing the length thereof.

Abstract: The present disclosure sets forth a unique contact structure for a separable electrical connector for carrying relatively high levels of current at high frequency in a high temperature environment. The contact utilizes a high loading spring design which permits a relatively low resistance and low inductance contact element. The contact element takes either of two forms. One form being a multiple wire spring formed in an open helical pattern and the other being a number of c-shaped contact elements arranged in concentric circles on a thin disk.

Abstract: A band-shaped and/or filamentary material, having a phosphorus containing metal and/or metal alloy inner layer such as phosphor bronze, deoxidized copper or other similar phosphorus containing material, and a lead alloy outer layer, particularly a lead-tin alloy, wherein the phosphorus content of the inner layer is between 0.03 and 0.13 weight percent. In the preferred embodiment, the amount of phosphorus in the inner layer is between 0.05 and 0.06 weight percent. Electrical conductors and electronic components of this band-shaped and/or filamentary material are also disclosed.

Abstract: A cordless electrical appliance includes a male pin connector which engages vertically with a female socket connector mounted in a base for the appliance. The contacts are arranged such that one of the line or neutral connections makes last and breaks first. This connection includes a silver, copper backed contact mounted on a leaf spring with a corresponding male pin being made of copper and having a thin silver plating at least in a region of contact with the copper backed contact.