Abstract: A polishing tool with a carrier comprising a polishing surface on which a polishing paste is applied at least in some areas, wherein the polishing surface consists of a nonwoven fabric, the polishing paste is in a solid state at room temperature and is applied on the polishing surface to be covered in an amount of 0.08 g/cm2 to 0.30 g/cm2.

Abstract: A method for dispensing solid compound pastes for surface treatment to a machining tool comprises the steps of providing a solid compound paste for surface treatment that contains abrasives, softening at least a partial amount of the solid compound paste by supplying thermal energy, feeding the softened solid compound paste to a dosing device by means of a conveyor device that is adapted for abrasive media, and applying the softened solid compound paste to a machining tool by means of the dosing device.

Abstract: An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.

Abstract: A lapping tool for localized optical polishing of a workpiece, the tool having a flexible working surface and being characterized by means for selectively varying the pressure applied, in use, on the workpiece by different regions of the tool working surface whereby to vary the effective area of contact with the workpiece. A method of optical polishing and optical workpiece using a lapping tool whose maximum working surface area is substantially smaller than the workpiece, comprising determining the path to be travelled by the tool across the workpiece, and determining the pressure and effective area of contact of the tool on the workpiece, in order to achieve the next stage of polishing, and then driving the tool over that path while dynamically varying the said applied pressure and effective contact area.

Abstract: A work W is rotated on a lower grinding wheel 13 provided on a work support base 11. Both surfaces of the work W are simultaneously subjected to grinding process by an upper grinding wheel 24 provided on a grinding shaft 22 of a grinding head 21 and the lower grinding wheel 13. The work W is applied with a pressure force of a primary load through the grinding shaft 22 by a piston rod 36 of a primary pneumatic cylinder 35 which is operated by a first air pressure. The work W is also applied with a pressure force of a secondary load through a lever member 43 by a piston rod 46 of the secondary pneumatic cylinder 45 which is operated by a second air pressure higher than the first air pressure. By adjusting the second air pressure, the pressure force is controlled.

Abstract: A polishing machine includes a platform assembly mounted within three support columns. The platform assembly includes fluidically pressurized bladders for urging the upper polish plate toward and away from the lower polish plate. In one embodiment a movable support column is suspended from an overlying frame. The support column is engaged with the upper polish plate so as to selectively raise and lower the platform assembly. In another embodiment, the platform is raised and lowered by threaded shafts so as to engage and thereby displace the upper polish plate.

Abstract: The invention provides a novel cutting tool used in wood working, which has a sufficiently thick cutting edge allowing stable cutting of a veneer from a log as well as an apparatus for and a method of grinding the cutting edge to have a favorable shape and a relatively large angle. The apparatus of the invention includes a table which an elongated cutting tool extending along a longitudinal axis of the table is mounted on, a fixing element for pressing the cutting tool upright against an upright plate, and a carriage which is reciprocatingly movable along the longitudinal axis of the table. The carriage is provided with a pair of grinding wheels which are respectively movable into and out of endwise grinding contact with an upper surface and a lower surface of the cutting edge of the upright cutting tool at desirable angles.