Abstract: An attachment for a mobile handling device is configured for processing walls or ceilings. The attachment comprises a mounting unit that is arranged to be supported at a mounting interface of the handling device, a processing head that is arranged to be equipped with at least one tool for material-removing processing or smoothing processing, and a compensation arrangement that is arranged between the mounting unit and the processing head and that defines a longitudinal axis. The mounting unit provides at least two pivot positions for the attachment that are offset from one another. The processing head is movable relative to the mounting unit in a longitudinal direction along the longitudinal axis. The compensation arrangement is configured to provide a defined contact pressure force for the processing head in a defined operating range along the longitudinal axis towards the surface to be processed.

Abstract: A device that makes it possible to make the movements of moving platforms safer and relates more particularly to a linear actuator that can be used in a hexapod positioner supporting a load is provided. The actuator is actuated by electric control and comprises at least one hydraulic damper positioned on the actuator such that the forces generated by damping in the event of extreme breakdown are experienced only by the load and are distributed such as to limit force and acceleration peaks.

Abstract: Described is an apparatus for robot-aided grinding, comprising the following: a manipulator, a linear actuator, and a grinding machine which includes a rotating grinding tool and is connected to the manipulator via the linear actuator. The apparatus further comprises a protective cover that partially surrounds the rotating grinding tool, the rotating grinding tool protruding from the protective cover at least on a first side. An adjusting mechanism is provided which connects the protective cover to the grinding machine and is designed to adjust the position of the protective cover in relation to the grinding machine.

Abstract: A machine tool comprises first and second support arms, and a rigid structure which couples the first support arm to the second support arm. A first rotary drive is operable to rotate the first support arm and the rigid structure relative to each other about a first rotational reference axis, and a second rotary drive is operable to rotate the second support arm and the rigid structure relative to each other about a second rotational reference axis, wherein the first and second rotational reference axes are parallel and spaced apart by a fixed distance. A control arrangement is configured to control the first and second rotary drives such that a workpiece mount carried by the second support arm follows a predetermined path relative to a tool mount carried by the first support arm in a plane perpendicular to the rotational reference axes.

Abstract: An air cylinder that changes the posture of an automatic wet sanding unit main body having sandpaper mounted thereon is provided with a guide rod, and an outer circumferential surface of the guide rod has grooves that extend along a shaft centerline of the guide rod and have an arc-shaped cross-section. Balls are interposed between a bottom of each groove and an inner surface of a bush that is provided inside the air cylinder. Thus, it is possible to make two objects compatible with each other: to achieve high-accuracy automatic wet sanding by enhancing the adaptability of the sandpaper to the shape of a painted surface through a reduction of the diameter of the piston rod; and to enhance the durability of the automatic wet sanding apparatus.

Abstract: Embodiments of the present invention provide a polishing ring assembly suitable for polishing an electrostatic chuck and method of using the same. In one embodiment, the polishing ring assembly has a retaining ring assembly and an electrostatic chuck fixture. The retaining ring assembly includes an inner diameter and a top surface, a plurality of outer drive rings wherein the plurality of outer drive rings are placed on the top surface of the ceramic retaining ring. The electrostatic chuck fixture includes an electrostatic chuck drive plate adjacent to the inner diameter of in the ceramic retaining ring. The electrostatic chuck drive plate has a lock to secure retaining ring assembly with the electrostatic chuck fixture without transferring the weight from one assembly over to the other through the locking mechanism.

Abstract: A grinding machine including an electric drive with a drive wheel, wherein the electric drive is arranged on a base unit of the grinding machine, a grinding spindle unit constructed as a grinding arm arranged removable on the base unit and which includes a grinding tool and a gear element which transmits the rotational movement of the drive wheel to the grinding tool. To facilitate the change of the grinding arm, the gear element includes: a driver which is supported on the grinding spindle unit and which is directly or indirectly in rotary union with the grinding tool, two guide wheels which are supported on the grinding spindle unit and a belt which is guided around the driver and the guide wheels, wherein in the mounted state of the grinding spindle unit at the base unit the drive wheel contacts the belt between the two guide wheels and hereby drives the same.

Abstract: A method of monitoring the health of an aircraft propeller whilst the propeller is in operation, the propeller having a plurality of blades extending radially outwardly from a central axis extending through the propeller and a propeller drive shaft, is provided. The method includes obtaining measurements representative of strain in the propeller drive shaft using multiple primary strain sensors, each primary strain sensor providing respective measurements representative of strain. The primary strain sensors are located around a circumference of the drive shaft of the propeller, and each strain sensor is located such that it crosses a plane defined by the radial direction of a blade and the central axis, the plane being bounded by the central axis. A corresponding propeller health monitoring system, an aircraft propeller comprising the system and an aircraft comprising the propeller are also provided.

Abstract: Disclosed is a device for removing tool joint edge burrs from a cap opening of a wheel. The cap opening of the wheel is an opening configured to mount a decorative cap of the wheel. The tool joint edge burrs are formed inside the cap opening of the wheel during machining the wheel and are a circular edge inside the cap opening. The device includes a cutter system which is configured to remove the tool joint edge burrs from the cap opening of the wheel by a first cutting edge and a second cutting edge of the cutter system.

Abstract: A device for removing tool joint edge burrs on a cap slot edge and an outer rim of a vehicle wheel includes a vehicle wheel positioning system and a cutter system. The vehicle wheel positioning system is used to make a rotating center of a cap seam allowance superposed with that of the cutter system. The cutter system includes a pyramid cutter and four blades, the pyramid cutter is used to remove burrs on the cap slot edge of the vehicle wheel, and the four blades are used to remove burrs on the outer rim of the vehicle wheel.

Abstract: A chipping robot has a chipping gun attached to the end of a multi-axis robotic manipulator mounted on a powered, movable, platform that can be raised and lowered to access the underside of structures that may be substantial distances above the ground, for example, the underside of an elevated highway. The entire assembly is maneuverable under the work area and the platform may raised to access the concrete. Once the work area is in reach of the arm, the device is able to use numerous tools to complete essential steps of chipping portions of the concrete.

Abstract: Grinding apparatus includes plural chuck tables disposed on a turntable, a first grinding unit and a second grinding unit that execute infeed grinding of a wafer, and a first grinding feed unit and a second grinding feed unit that execute grinding feed of them. Each grinding feed unit has a pair of guides parallel to the grinding feed direction and a ball screw. The grinding area of each grinding unit has a circular arc shape in which one end exists at the outer circumference of the wafer and the other end exists at the center of the wafer.

Abstract: Disclosed herein is a pump of an integrated brake system. The pump includes a motor, a gear unit which converts a rotating force of the motor into linear reciprocating movement, a piston assembly which is connected to the gear unit and reciprocates based on power conversion of the gear unit, a piston housing which accommodates the piston assembly, and a fixed rod fixedly disposed in the piston housing in a longitudinal direction. Here, the piston assembly includes a coupling groove formed therein, into which the fixed rod is inserted.

Abstract: A skate blade sharpening system used to sharpen the blades of ice skates. The skate sharpener can include a housing that includes an elongated slot for receiving the blade of an ice skate for sharpening, and clamp jaws for retaining the skate. The housing can include at least one slot cover to engage the skate blade. Engagement of the skate blade can be sensed by a controller to enable sharpening operations to proceed. The skate blade sharpening system can automatically operate a grinding wheel and move the rotating grinding wheel back and forth along the lower face of the skate blade a desired number of times to sharpen the skate blade.

Abstract: A polishing apparatus including a membrane including a pressure chamber and being configured to hold a wafer; a polishing portion including a polish pad contacting a polish surface of the wafer when polishing the wafer; a monitoring portion monitoring a state of inflation of the pressure chamber; and a controller controlling polishing of the wafer by the polishing portion based on a result of monitoring by the monitoring portion.

Abstract: An object of the present invention is to improve the capability of lifting a substrate with the polishing performance of the substrate maintained. A polishing apparatus 100 includes a polishing table 110 to which a polishing pad 108 for polishing a substrate 102 is attached, a liquid feeding section configured to feed a liquid 109 to a polishing surface of the polishing pad 108, a top ring 116 configured to suck and convey the substrate 102 from the polishing surface, the substrate 102 being disposed on the polishing surface via the liquid 109 fed by the liquid feeding section, and a control section configured to inject a fluid (N2) into an internal area 109a of the liquid 109 interposed between the substrate 102 and the polishing pad 108.

Abstract: A device for finish-machining of the optically effective surfaces of, in particular, spectacle lenses has a spindle shaft, which has a tool mount section and which is mounted in a spindle housing to be rotatable about a workpiece rotational axis (A). An electric rotary drive has a rotor and a stator by which the spindle shaft operatively connected with the rotor is drivable to rotate about the tool rotational axis. An adjusting device axially displaces the tool mount section with respect to the spindle housing in the direction of the tool rotational axis (linear movement Z). The rotor and the stator are arranged coaxially with the spindle shaft, wherein at least the rotor together with the spindle shaft is axially displaceable with respect to the spindle housing in the direction of the tool rotational axis by the adjusting device.

Abstract: Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.

Abstract: To prepare a surface with a surface preparation device, an apparatus including a mount, a platform, and a suspension system is utilized. The mount supports and positions the surface preparation device. The platform moves the apparatus. The suspension system is disposed between the mount and the platform and controls an amount of force pressing the mount towards the surface. The suspension system and mount are operable to position the surface preparation device in contact with the surface.

Abstract: A chemical mechanical planarization (CMP) system is provided. The system includes a polishing surface and a platen disposed along an underside of the polishing surface. A retaining ring surrounds the platen. The retaining ring includes a lower annular sleeve and an upper annular sleeve moveably disposed over the lower annular sleeve. A method for reducing a consumption of compressed dry air (CDA) during a chemical mechanical planarization (CMP) operation is also described.

Abstract: A balancing method and apparatus is used for dynamically balancing an out of balance condition in a rotating body caused by resistance forces acting tangentially to the body. A device having a rotatable component and automatic or dynamic balancing includes a housing, a shaft rotatably mounted in the housing, the shaft supporting the component near one end of the shaft, at least one counterweight fixedly mounted on the shaft and at least one automatically adjusting balancer mounted on the shaft. The automatically adjusting balancer includes one or more compensating masses contained to move about a path relative to the shaft to compensate for variable imbalanced forces acting on the component.

Abstract: Disclosed herein is a holding device, which includes a volumetrically controllable material and a volume controller in operable communication with that material. The volume controller is configured to subject the material to a condition that causes a physical change in volume of the material without a change in mass of the material. The volumetric change causes the holding power. Further disclosed herein is a method for creating a lower than atmospheric pressure between a volumetrically controllable fixed mass material and a separate object. The method includes introducing to the material an increase condition calculated to volumetrically increase the material without changing the mass of the material. The separate object is then brought to contact the material following which a decrease condition calculated to volumetrically decrease the material without changing the mass of the material is introduced to the material.

Abstract: A kiln tire grinder for grinding an out-of-round kiln tire comprising a grinding belt head assembly having a rotatable grinding belt and an x-y positioning table for positioning the rotating grinding belt assembly against a kiln tire. The rotating grinding belt assembly includes a drive assembly for rotating the grinding belt and a frame assembly for urging the grinding belt against the out-of-round kiln tire. The operator adjusts the rotating grinding belt head assembly against the out-of-round tire and then engages a drive motor which rotates the grinding belt. The rotating grinding belt is then urged against the kiln tire with a pressure that is adjustably controlled.

Abstract: The present invention relates to methods and apparatus that allow for chemical mechanical polishing using a flexible pad and variable fluid flow for variable polishing.

Abstract: An apparatus and a method for polishing a row bar including magnetic head sliders. A lapping surface plate is rotatable, and a housing is movable above the lapping surface plate. A jig is secured to the housing for holding the row bar. The jig is formed by an elongated rigid member having a plurality of holes and an elongated elastic member fixed to the rigid member. An air cylinder presses the whole row bar, and a pressing devices individually presses portions of the elastic member corresponding to magnetic head sliders of the row bar through the holes of the rigid member. A portion of the elastic member is deformed to press a portion of the row bar in response to a change in the measured resistance of ELG resistance elements in the row bar.

Abstract: This invention relates to apparatus and methods for z-axis control and collision detection and recovery for waterjet and abrasive-jet cutting systems. In one embodiment, an apparatus includes a linear rail, a slide member coupleable to a cutting head and slideably coupled to the linear rail, at least one actuator having a first end coupled to the slide member and a second end fixed with respect to the linear rail, a position sensor, and a controller. The actuator provides an adjustable support force that supports the weight of the cutting head, allowing the cutting head to be controllably positioned at a desired height above the workpiece. The actuator may include a pneumatic cylinder, or alternately, a linear motor.

Abstract: An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.

Abstract: An automatic feed system 10 is provided for advancing a hydraulically powered work head into a workpiece being cut. A hydraulic fluid powered work head motor 40 drives a diamond drill cutting tool 46 or other cutting tool to cut the workpiece, such as concrete G. Hydraulic pressure in an inlet line 42 feeding hydraulic fluid to the work head motor 40 is monitored to detect when high torque and hence high wearing forces are experienced by the diamond cutting tool 46. A feed motor 30 or other advance is provided to feed the diamond cutting tool 46 into the workpiece. A valve 50 is provided which is pressure sensitive and controls the feed rate of the feed motor 30 in response to pressure in the inlet line 42 delivering hydraulic fluid to the work head motor 40. In this way, a feed rate of the bit 46 or other cutting tool into the workpiece is reduced when high stress conditions exist on the cutting surface of the diamond drill cutting tool 46 or other cutting tool.

Abstract: The invention relates to a method for grinding convex running surfaces and exact outside diameters on undulated workpieces. In a clamping, a first convex running surface is ground on a discoid partial section of an undulated workpiece during a first grinding operation while using a first grinding wheel that comprises at least one concave lateral surface. A second grinding wheel is used to grind a desired outside diameter on the discoid partial section as well as on other partial sections of the undulated workpiece during a second grinding operation.

Abstract: The grinding machine comprises a grinding head with a rotary abrasive tool, carried by a chassis equipped, at its ends, with rollers for running and guiding on the rail that is to be ground. A balancing assembly, resting on the other rail of the track, is mounted to pivot on the chassis, also provided with an orientable maneuvering arm. To rotate the grinding tool, an internal combustion engine is fixed to a support articulated to the balancing assembly, the horizontal output shaft of the engine being connected by a transmission assembly to the grinding head. The machine makes it possible to grind the profile of the head of the rail through an angle of 180° while at the same time avoiding excessive inclination of the engine.

Abstract: An apparatus for polishing a wafer includes a polishing station having a platen on which a polishing pad is installed, a polishing head having a membrane that contacts a surface of the wafer, the membrane securing the wafer and pressuring the wafer against the polishing pad, wherein the polishing station includes a transfer stage for loading the wafer on or unloading the wafer from the polishing head, and wherein the transfer stage includes a pedestal on which the wafer is placed and a fluid supply part for supplying a fluid into a boundary region between the wafer and the membrane to reduce a surface tension between the wafer and the membrane. Preferably, the apparatus further includes a stopper for preventing the wafer placed on the pedestal from being lifted up along with the membrane when the wafer is unloaded from the polishing head onto the pedestal.

Abstract: A retaining ring is provided. The retaining ring includes a lower annular sleeve having a base. The base has an inner sidewall and an outer sidewall extending therefrom. The lower annular sleeve has at least one hole defined therein. An upper annular sleeve is moveably disposed over the lower annular sleeve. The upper annular sleeve has a top, that has at least one hole defined therein. The top has an inner sidewall and an outer sidewall extending therefrom. A method for reducing a consumption of compressed dry air (CDA) during a chemical mechanical planarization (CMP) operation is also described.

Abstract: A polishing pad conditioning apparatus in a chemical mechanical polishing apparatus, wherein the conditioning apparatus includes a conditioning plate which maintains a predetermined relative velocity with respect to the polishing pad, extends from a center region near a rotation center of the polishing pad to a peripheral region near an edge of the polishing pad, and has a polishing portion with polishing particles embedded into its bottom surface, a force generating portion for applying a force to the conditioning plate so that the conditioning plate presses against the polishing pad with pressure that varies according to position on the polishing pad, and conditions the polishing pad by relative linear velocity and pressure with respect to the polishing pad, and a supporting portion for supporting the force generating portion. Therefore, fast and uniform conditioning of a polishing pad can be achieved.

Abstract: An arrangement of grinding modules in a track grinder wherein a radial mismatch in narrow track bend radii can be considered in an exact manner without occurrence of constraining forces, enabling reprofiling to be reproduced in a simple manner. The arrangement provides a grinding tool with five degrees of freedom. Each grinding module is accommodated in an at least approximately vertical manner with a frame and in an at least horizontally manner on the frame with a holder. A housing in the holder is pivotably arranged around a shaft that is at least approximately parallel to the track to be ground. The grinding tool in the housing can be adjusted in a rectangular manner in relation to the track to be ground.

Abstract: A polishing tool includes a polish pad, a bladder, a fluid, and a flux guide. A bladder containing fluid supports the polishing pad that is positioned adjacent to a surface to be polished. Flux guides positioned along a portion of the bladder direct a field or a magnetic flux to selected locations of the bladder. The method of polishing a surface adjusts the field or the magnetic flux emanating from the flux guides which changes the mechanical properties of the fluid. By adjusting the magnitude of the field or level of magnetic flux flowing from the flux guides independent pressure adjustments occur at selected locations of the bladder that control the polishing profile of the surface.

Abstract: A dresser unit including a dresser 20 and a driving shaft 21 for rotationally driving the dresser 20 is operatively mounted to a dresser supporting mechanism so that the dresser unit can be moved up and down freely with respect to the dresser supporting mechanism, wherein a piston-cylinder mechanism 40 is installed between the dresser unit and the dresser supporting mechanism for pushing up the dresser unit by an upward force of fluid pressure, and a fluid at a predetermined pressure level is supplied to the piston-cylinder mechanism 40 from a compressed air source 67 via a pressure control unit 65, the compression force applied to a turntable 10 by the dresser is precisely controlled and adjusted based on a balance between the own weight of the dresser unit and the upward force exerted by the piston-cylinder mechanism 40.

Abstract: An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.

Abstract: A pad conditioning assembly includes a conditioner head with an end effector movable into contact with a polishing pad,a plurality of downwardly-projecting movable conditioning elements disposed at a bottom of the end effector; and a compliant backing member disposed above and adjacent the conditioning elements, wherein forces applied by the compliant backing member are transferred to the movable conditioning elements to move the conditioning elements. In one aspect, a pressurization circuit applies a pressure from a pressure source to the compliant backing member to flex the compliant backing member against the movable conditioning elements.

Abstract: The polishing machine for stone materials comprises: a conveyor belt for the slabs or strips to be polished, a beam made to oscillate on at least two transverse, fixed frames above the said conveyor, at least one oscillating mechanism, a number of polishing heads, aligned on the said beam and oscillating with it, a device for detecting the shape and/or dimensions of the slabs or strips, positioned upstream of the working area, a process and control calculator for the polishing machine, and has, positioned parallel to the said first beam a second beam, also equipped with a number of polishing heads aligned transversely with the polishing heads of the said first beam, and made to oscillate synchronously with it, by means of adjustable coupling devices, that enable the distance between the rows of polishing heads on the said first beam and second beam to be varied.

Abstract: This invention relates to apparatus and methods for collision detection and recovery for waterjet and abrasive-jet cutting systems. In one embodiment, an apparatus includes a first mount member coupleable to a controllably positionable mounting portion of the cutting system, and a second mount member coupleable to the cutting head and disengageably or movably coupled to the first mount member. Embodiments of the inventions may also have a sensing circuit having at least one first conductive element disposed on the first mount member and at least one second conductive element disposed on the second mount member. In the event of a collision between the cutting head and an obstruction, the second mount member disengages from or moves with respect to the first mount member to prevent breakage of the cutting head. This movement causes the first and second conductive elements to touch, signaling a collision and shutting down one or more internal systems.

Abstract: An ultra high pressure abrasive waterjet cutting apparatus for cutting nuclear reactor structural components is described. The cutting apparatus includes an ultra high pressure abrasive waterjet (UHP) cutting nozzle, movably coupled to a single axis manipulator, and a collection hood. The manipulator and the collection hood are coupled to a support frame and are configured to be positioned inside adjacent openings of a nuclear reactor top guide or core plate so that the cutting nozzle is in alignment with the collection hood. The manipulator includes a linear frame, a nozzle support plate movably coupled to the linear frame, and a motor operatively coupled to the nozzle support plate. The collection hood includes an elongate collection chamber having an elongate opening located so that the opening is in alignment with the cutting nozzle.

Abstract: A polishing head for polishing machines, in particular for polishing optical surfaces, has a polishing plate that is connected to a rotationally drivable drive shaft. The polishing plate is articulated to, and rotates with, the drive shaft. A ball hexagonal socket joint provides the articulated connection. Rotating by means of the articulated connection, the polishing plate can follow the surface of the workpiece to be processed, so that the polishing covering on the polishing plate always rests on a maximally large area on the surface of the workpiece.

Abstract: A flange connection is adapted for interconnecting a rotary spindle and a substantially ring-formed member in such a manner that the ring-formed member is well centered about the axis of the spindle. The spindle has a surface which is well centered about the axis of the spindle and the ring-formed member has an axially projecting sleeve-shaped flange. The flange has in its inner envelope surface an annular bulge that is arranged to enclose and engage the spindle surface centered about the spindle axis.

Abstract: A grinder pressing device, wherein either the bottom part of a cylinder main body (10) of an air cylinder (1) in a vertical posture or a piston rod (11) is fixed to a fixed plate (2) and the other one is fixed to a movable plate (3) disposed under the fixed plate (2), either a guide table (G2) or a guide (G1) is mounted on the movable table (3) and the other one is mounted on the outer peripheral surface of the cylinder main body (20) and the guide plate (G2) is guided on the guide (G1) in a vertical direction under the rolling frictional condition through balls and, in the air cylinder (1), a coefficient of friction between the outer peripheral walls of a piston (12) and the piston rod (11) and the structural wall of the cylinder main body (10) is set lower by a metal seal so as to support the piston rod (11) by a ball bush movably in forward and backward directions over an extensive distance, a grinder (G) being mounted on the movable plate (3) and air pressures in upper and lower cylinder chambers (13 and

Abstract: This invention relates to apparatus and methods for z-axis control and collision detection and recovery for waterjet and abrasive-jet cutting systems. In one embodiment, an apparatus includes a linear rail, a slide member coupleable to a cutting head and slideably coupled to the linear rail, at least one actuator having a first end coupled to the slide member and a second end fixed with respect to the linear rail, a position sensor, and a controller. The actuator provides an adjustable support force that supports the weight of the cutting head, allowing the cutting head to be controllably positioned at a desired height above the workpiece. The actuator may include a pneumatic cylinder, or alternately, a linear motor.

Abstract: The present invention relates to an improved spindle unit. The spindle unit includes a body, an external shaft placed into the body and rotating on bearings relative to the body, and an internal shaft placed into the external shaft and coupled thereto. The spindle unit further includes front and rear static journal bearings and a thrust bearing between the external and internal shafts. Flow control valves are provided which have their outlets connected to recesses communicating with the rear and front journal bearings. Operation of the valves in response to measured parameters controls the position of the internal shaft relative to the rotation axis of the external shaft. This is accomplished by controlling the flow of fluid to recesses associated with the front and rear journal bearings. By controlling the position of the internal shaft, one can insure that a workpiece attached to the internal shaft is automatically centered.

Abstract: A lapping tool for localized optical polishing of a workpiece, the tool having a flexible working surface and being characterized by means for selectively varying the pressure applied, in use, on the workpiece by different regions of the tool working surface whereby to vary the effective area of contact with the workpiece. A method of optical polishing and optical workpiece using a lapping tool whose maximum working surface area is substantially smaller than the workpiece, comprising determining the path to be travelled by the tool across the workpiece, and determining the pressure and effective area of contact of the tool on the workpiece, in order to achieve the next stage of polishing, and then driving the tool over that path while dynamically varying the said applied pressure and effective contact area.

Abstract: A polishing tool includes a polish pad, a bladder, a fluid, and a flux guide. A bladder containing fluid supports the polishing pad that is positioned adjacent to a surface to be polished. Flux guides positioned along a portion of the bladder direct a field or a magnetic flux to selected locations of the bladder. The method of polishing a surface adjusts the field or the magnetic flux emanating from the flux guides which changes the mechanical properties of the fluid. By adjusting the magnitude of the field or level of magnetic flux flowing from the flux guides independent pressure adjustments occur at selected locations of the bladder that control the polishing profile of the surface.

Abstract: Grinding machine (1) comprising a first wheelhead (4) for machining flat surfaces and a second wheelhead (10) for machining workpieces (3) such as broaches. The first wheelhead (4) is slidably mounted on a vertical column (6) and has a slide (7) on its underside. The second wheelhead (10) is rotatable about its own axis and is slidably mounted on said slide (7). When the first wheelhead (4) is in its working position, the second wheelhead (10) is placed away from the workpiece (3) on the slide (7) in its rest position (A), and, when the second wheelhead (10) is in its working position (B), said second wheelhead (10) is placed next to the workpiece (3), angularly oriented in order to carry out the helical machining.

Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.