Rotary Work Holder Patents (Class 451/285)
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Patent number: 11955395Abstract: A semiconductor device and method of including peripheral devices into a package is disclosed. In one example, a peripheral device includes a passive device such as a capacitor or an inductor. Examples are shown that include a peripheral device that is substantially the same thickness as a die or a die assembly. Examples are further shown that use this configuration in a fan out process to form semiconductor devices.Type: GrantFiled: June 30, 2022Date of Patent: April 9, 2024Assignee: Intel CorporationInventors: Lizabeth Keser, Bernd Waidhas, Thomas Ort, Thomas Wagner
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Patent number: 11916353Abstract: Electronic device comprising a support substrate having a mounting face and an electronic chip having a rear face bonded on the mounting face by a volume of adhesive, wherein the support substrate comprises a plurality of wedging elements projecting from the mounting face so as to hold the chip bearing on contact areas of the wedging elements in a position substantially parallel to the mounting face of the support substrate.Type: GrantFiled: April 13, 2021Date of Patent: February 27, 2024Assignee: STMICROELECTRONICS (GRENOBLE 2) SASInventors: Fabien Quercia, Jean-Michel Riviere
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Patent number: 11642753Abstract: A polishing-pad laminated structure which allows for easy alignment of a through-hole of a polishing pad with a sensor head installed in a polishing table is disclosed. The polishing-pad laminated structure includes a polishing pad and a release sheet. The polishing pad has a through-hole located at a position corresponding to a position of a sensor head disposed in the polishing table. The release sheet covers an adhesive surface of the polishing pad. The release sheet is divided into at least a first release sheet and a second release sheet. The first release sheet has a surface area smaller than a surface area of the second release sheet.Type: GrantFiled: May 30, 2019Date of Patent: May 9, 2023Assignee: EBARA CORPORATIONInventors: Toshikazu Nomura, Masaki Kinoshita, Nobuyuki Takahashi, Suguru Sakugawa, Takashi Kishi
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Patent number: 11562924Abstract: A superstrate for planarizing a substrate. The superstrate includes a body having a first side having a contact surface and a second side having a central portion and a peripheral portion surrounding the central portion. The peripheral portion includes a recessed region.Type: GrantFiled: January 31, 2020Date of Patent: January 24, 2023Assignee: Canon Kabushiki KaishaInventors: Seth J. Bamesberger, Ozkan Ozturk, Christopher Ellis Jones, Se-Hyuk Im
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Patent number: 11453097Abstract: A substrate polishing apparatus is disclosed that includes a polishing platform having two or more zones, each zone adapted to receive a different slurry component. A substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects.Type: GrantFiled: November 21, 2019Date of Patent: September 27, 2022Assignee: Applied Materials, Inc.Inventors: Rajeev Bajaj, Thomas H. Osterheld, Hung Chen, Terrance Y. Lee
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Patent number: 11426892Abstract: The invention concerns a device and a method for guiding a blade at a cutting end face of a guide tube by means of magnetic force in order to bring a cutting spacing between the blade and the cutting end face as close as possible. The magnetic force may be applied to the blade only towards the end of a cutting process of a slice, i.e. near a blade outlet side of a guide tube cross-section of the guide tube.Type: GrantFiled: December 17, 2019Date of Patent: August 30, 2022Assignee: TVI ENTWICKLUNG & PRODUKTION GMBHInventor: Thomas Völkl
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Patent number: 11331764Abstract: A polishing device includes a polishing table comprising a polishing surface, a top ring configured to press a polishing target surface against the polishing surface and comprising a plurality of pressing portions configured to independently apply a pressing force to a plurality of areas of the wafer, and a controller configured to store a first pressing portion effect rate for a first pressing portion of the plurality of pressing portions in a storage unit, the first pressing portion effect rate being a change in polishing amount of the polishing target surface for a change in pressing force applied by the first pressing portion and control the pressing force applied by the first pressing portion based on the first pressing portion effect rate and a polishing profile of the polishing target surface.Type: GrantFiled: June 20, 2019Date of Patent: May 17, 2022Assignee: EBARA CORPORATIONInventor: Akira Nakamura
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Patent number: 11331770Abstract: An omni-directional conditioner device includes a carrier that includes a holding part for holding and rotating an object for polishing purpose; a conditioner disposed around the carrier; and a transmission mechanism connected with the carrier on one side and the conditioner on the other side, the transmission mechanism including at least one directional adjustment unit that controls the rotational direction of the conditioner. When the directional adjustment unit is set in one position, the carrier and the conditioner rotate in a same direction, and when the directional adjustment unit is set in another position, the carrier and the conditioner rotate in opposite directions.Type: GrantFiled: February 21, 2019Date of Patent: May 17, 2022Assignee: NATIONAL TSING HUA UNIVERSITYInventors: Dongliang Daniel Sheu, Yi-Hung Lin
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Patent number: 11325223Abstract: A carrier head for a chemical mechanical polishing apparatus includes a carrier body, an outer membrane assembly, an annular segmented chuck, and an inner membrane assembly. The outer membrane assembly is supported from the carrier body and defines a first plurality of independently pressurizable outer chambers. The annular segmented chuck supported below the outer membrane assembly, and includes a plurality of concentric rings that are independently vertically movable by respective pressurizable chambers of the outer membrane assembly. At least two of the rings having passages therethrough to suction-chuck a substrate to the chuck. The inner membrane assembly is supported from the carrier body and is surrounded by an innermost ring of the plurality of concentric rings of the chuck. The inner membrane assembly defines a second plurality of independently pressurizable inner chambers and has a lower surface to contact the substrate.Type: GrantFiled: November 19, 2019Date of Patent: May 10, 2022Assignee: Applied Materials, Inc.Inventors: Steven M. Zuniga, Jay Gurusamy
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Patent number: 11328965Abstract: In an embodiment, a system includes: a pad comprising a first side and a second side opposite the first side, wherein the first side is configured to receive a wafer during chemical mechanical planarization (CMP), and a platen adjacent the pad along the second side, wherein the platen comprises a suction opening that interfaces with the second side; a pump configured to produce suction at the suction opening to adhere the second side to the platen; and a sensor configured to collect sensor data characterizing a uniformity of adherence between the pad and the platen, wherein the pump is configured to produce the suction at the suction opening based on the sensor data.Type: GrantFiled: July 22, 2019Date of Patent: May 10, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yu-Hsiang Chao, Chi-Ping Lei
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Patent number: 11305399Abstract: Provided is a jig for assisting the dismounting and mounting of a top ring. One embodiment provides a jig for mounting/dismounting at least a part of the top ring for holding a substrate. The jig comprises a movable plate for supporting at least a part of the top ring, which is in a dismounted state, a plurality of posts for positioning the jig at a predetermined position relative to the top ring, the plurality of posts being configured to be engaged with the top ring, and a drive mechanism for moving the movable plate in a direction toward and away from the top ring.Type: GrantFiled: August 2, 2019Date of Patent: April 19, 2022Assignee: EBARA CORPORATIONInventors: Kenichi Kobayashi, Asagi Matsugu, Makoto Kashiwagi, Manao Hoshina
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Patent number: 11264232Abstract: Methods for cleaning integrated circuit (IC) wafers after undergoing planarization processes (for example, chemical mechanical polishing processes) and associated cleaning units and/or planarization units are disclosed herein. An exemplary method includes configuring outlet areas of spray nozzles to deliver a cleaning solution to optimal locations of the IC wafer and delivering the cleaning solution via the spray nozzles having the configured outlet areas to the IC wafer. Each of the outlet areas is configured to achieve a particular velocity of the cleaning solution exiting the outlet area, such that the cleaning solution reaches a particular location of the IC wafer depending on the particular velocity. In some implementations, the cleaning solution enters inlet areas of the spray nozzles at the same flow rate and the cleaning solution exits the outlet areas of the spray nozzles at different velocities.Type: GrantFiled: May 1, 2018Date of Patent: March 1, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTDInventors: Chien-Ping Lee, Hui-Chi Huang
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Patent number: 11241770Abstract: A support base supports a plate-shaped workpiece. The support base includes a flat plate-shaped box member having a support face for supporting a workpiece and a placement face that is a face on the opposite side to the support face and is placed on a holding face of a chuck table, a temperature measurement unit accommodated in the box member, and a battery accommodated in the box member and serving as a power supply for the temperature measurement unit. The temperature measurement unit includes a temperature measuring instrument that measures a temperature at the support face, and a recording unit that records the temperature measured by the temperature measuring instrument.Type: GrantFiled: January 14, 2019Date of Patent: February 8, 2022Assignee: DISCO CORPORATIONInventor: Sakae Matsuzaki
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Patent number: 11173579Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.Type: GrantFiled: June 25, 2018Date of Patent: November 16, 2021Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Mario David Silvetti, Yin Yuan, Samuel Chu-Chiang Hsu, Huanbo Zhang, Gautam Shashank Dandavate
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Patent number: 11094554Abstract: A method for forming a semiconductor device structure is provided. The method includes providing a wafer over a polishing platen. The wafer includes a metal layer and a dielectric layer. The metal layer covers the dielectric layer and fills an opening of the dielectric layer. The method also includes polishing the wafer using a first operation to thin down the metal layer. The first operation has a first polishing selectivity of the metal layer to the dielectric layer. The method further includes polishing the wafer using a second operation to further thin down the metal layer until the dielectric layer is exposed. The second operation has a second polishing selectivity of the metal layer to the dielectric layer. The second polishing selectivity is different from the first polishing selectivity. The first operation and the second operation are performed in-situ on the polishing platen.Type: GrantFiled: March 31, 2017Date of Patent: August 17, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Shih-Ho Lin, Jen-Chieh Lai, Jheng-Si Su, Zhi-Sheng Hsu, Po-Ting Huang
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Patent number: 10919094Abstract: Cutting machining is performed on a workpiece by making a cutting tool travel relative to the workpiece while rotating the cutting tool such that a peripheral speed of the cutting tool becomes equal to or more than a cutting speed of the cutting tool, while an outer peripheral surface and an end surface of the cutting tool function as a rake surface and a relief surface, respectively.Type: GrantFiled: June 3, 2019Date of Patent: February 16, 2021Assignee: JTEKT CORPORATIONInventors: Takayuki Azuma, Yoshihiko Yamada, Kenji Hamada, Masahiro Kiji, Hiroshi Watanabe
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Patent number: 10864612Abstract: A polishing pad includes a first region having a first geometric property and a first material property. The polishing pad further includes a second region having a second geometric property and a second material property, wherein the second region is closer to an edge of the polishing pad than the first region. The first geometric property is different from the second geometric property; or the first material property is different from the second material property.Type: GrantFiled: July 12, 2017Date of Patent: December 15, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: ChunHung Chen, Jung-Yu Li, Sheng-Chen Wang, Shih-Sian Huang
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Patent number: 10857646Abstract: An apparatus for chemical-mechanical polishing is provided, including: a plurality of polishing sections spaced apart from one another, each polishing section including: a bracket, a carrier head and a platen, the carrier head being disposed on the bracket and configured to move between a polishing position and a conveying position, in which when the carrier head is located at the polishing position, the carrier head is located above the platen; and a conveying assembly, the conveying assembly including: a rotating plate and a plurality of loading and unloading tables, the plurality of loading and unloading tables being spaced apart from one another, disposed on the rotating plate and configured to rotate along with the rotating plate, in which when the carrier head is located at the conveying position, the carrier head is corresponding to one of the plurality of loading and unloading tables.Type: GrantFiled: January 3, 2017Date of Patent: December 8, 2020Assignees: TSINGHUA UNIVERSITY, HWATSING TECHNOLOGY CO., LTD.Inventors: Zhenjie Xu, Jian Wang, Xiangyu Chen, Tongqing Wang, Kun Li, Xinchun Lu
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Patent number: 10854473Abstract: A polishing method capable of polishing a substrate, such as a wafer, with low running costs is disclosed. A polishing method includes: rotating a substrate while holding a back-side surface of the substrate with a vacuum suction stage; rotating a polishing head holding a plurality of polishing tools; and polishing a front-side surface of the substrate by pressing the plurality of polishing tools, which are rotating, against the front-side surface of the substrate. The front-side surface is a surface on which interconnect patterns are to be formed.Type: GrantFiled: March 1, 2018Date of Patent: December 1, 2020Assignee: EBARA CORPORATIONInventors: Yu Ishii, Kenya Ito, Keisuke Uchiyama, Masayuki Nakanishi
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Patent number: 10843307Abstract: A method includes depositing a slurry onto a polishing pad of a chemical mechanical polishing (CMP) station. A workpiece is polished and polishing by-products and slurry are removed from the polishing pad by a vacuum head. A CMP apparatus includes a polishing pad configured to rotate during a CMP process. The apparatus also includes a slurry dispenser configured to deposit a slurry onto a polishing surface of the polishing pad. The apparatus further includes a momentum vacuum assembly including a slotted opening facing the polishing surface of the polishing pad. The apparatus also includes a first suction line coupled to an upper portion of the momentum vacuum assembly and leading to a first vacuum source, the first suction line configured to transport polishing products which have been removed from the polishing pad through the slotted opening.Type: GrantFiled: November 9, 2018Date of Patent: November 24, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Chen Wei, Chih-Yuan Yang, Shih-Ho Lin, Jen Chieh Lai, Szu-Cheng Wang, Chun-Jui Chu
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Patent number: 10722998Abstract: The present invention provides a wafer polishing pad, the wafer polishing pad includes a polishing material layer, a plurality of recesses are formed on the top surface of the polishing material layer, and a warning element disposed within the polishing material layer, the warning element and the polishing material layer have different colors. The feature of the invention is that forming a warning element in the polishing material layer, when the visible state of the warning element is changed, for example, when the warning element appears, disappears or changes the shapes, it means that the wafer polishing pad needs to be replaced. In this way, the user can confirm the destroying situation of the wafer polishing pad easily, and also improving the manufacturing process efficiency.Type: GrantFiled: September 28, 2017Date of Patent: July 28, 2020Assignee: UNITED MICROELECTRONICS CORP.Inventors: Li-Chieh Hsu, Fu-Shou Tsai, Kun-Ju Li, Po-Cheng Huang, Chun-Liang Liu
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Patent number: 10699980Abstract: A semiconductor device and method of including peripheral devices into a package is disclosed. In one example, a peripheral device includes a passive device such as a capacitor or an inductor. Examples are shown that include a peripheral device that is substantially the same thickness as a die or a die assembly. Examples are further shown that use this configuration in a fan out process to form semiconductor devices.Type: GrantFiled: March 28, 2018Date of Patent: June 30, 2020Assignee: Intel IP CorporationInventors: Lizabeth Keser, Bernd Waidhas, Thomas Ort, Thomas Wagner
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Patent number: 10668394Abstract: A system may include an inflatable assembly having a plurality of members. The system may also include a plurality of sensors disposed at a plurality of positions inside or around the inflatable assembly, such that the plurality of sensors may acquire data related to a shape of the inflatable assembly. The system also includes one or more valves, each configured to direct a fluid into a corresponding member of the plurality of members of the inflatable assembly. The system also includes a processor that adjusts positions of the one or more valves to cause the fluid to be directed into the corresponding member of the plurality of members of the inflatable assembly based on the data and a desired shape of the inflatable assembly.Type: GrantFiled: June 10, 2019Date of Patent: June 2, 2020Assignee: Universal City Studios LLCInventors: Robert Cortelyou, Ross Osterman, Justin Schwartz, Amanda Zielkowski, Caitlin A. Correll, Darrin Hughes, Anisha Vyas
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Patent number: 10661408Abstract: A stopper includes a head portion sized and configured to be coupled to an upper platen of a chemical-mechanical planarization system and a stopper leg sized and configured to direct a flow of liquid slurry applied to an upper planar surface of the upper platen substantially away from a lower surface of the upper platen.Type: GrantFiled: January 29, 2018Date of Patent: May 26, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yu-Feng Han, Cheng-Yi Huang, Fang-Chi Chien, Chen-shih Chung, Sheng-Tai Peng
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Patent number: 10661410Abstract: A method for measuring a template includes: preparing a measurement wafer and measuring a thickness of the measurement wafer; mounting the template on a reference plane; housing the measurement wafer in the concave portion of the template; measuring heights of the annular member and the measurement wafer from the reference plane in a state where a load is applied to the annular member of the template and the measurement wafer by using a pressing jig; and calculating a depth of the concave portion of the template in the state where the load is applied by using the pressing jig from the measured thickness of the measurement wafer and the heights of the annular member and the measurement wafer. Consequently, it is possible to measure the depth of the concave portion of the template in a state closer to a state during polishing than that realized by a conventional measuring method.Type: GrantFiled: September 20, 2016Date of Patent: May 26, 2020Assignee: SHIN-ETSU HANDOTAI CO., LTD.Inventor: Michito Sato
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Patent number: 10607870Abstract: Embodiments of substrate carriers which enable active/passive bonding and de-bonding of a substrate are provided herein. In some embodiments, a substrate carrier for holding a substrate comprises a disk formed of a porous material, the disk being formed symmetrically about a central axis and defining a substantially planar upper surface. In some embodiments, the porous material is silicon carbide and the substrate carrier includes a semi-porous surface coating formed atop the upper surface of the disk.Type: GrantFiled: October 12, 2016Date of Patent: March 31, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Jen Sern Lew, Sriskantharajah Thirunavukarasu
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Patent number: 10580823Abstract: A wafer level packaging method includes the following steps. A first wafer is bonded over a second wafer. A first grinding process on the first wafer is performed, to remove an upper chamfered edge of the first wafer and reduce a thickness of the first wafer. A trimming process is performed on the first wafer, to remove a lower chamfered edge of the first wafer to form a trimmed first wafer. A second grinding process is performed on the trimmed first wafer, to reduce a thickness of the trimmed first wafer.Type: GrantFiled: May 3, 2017Date of Patent: March 3, 2020Assignee: United Microelectronics Corp.Inventors: Sheng Zhang, Wen-Bo Ding, Zhi-Rui Sheng, Chien-En Hsu, Chien-Kee Pang
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Patent number: 10576606Abstract: A platen rotation apparatus includes a rotator assembly coupled with a platen. The rotator assembly operates in a first mode to increase a rotational kinetic energy of the platen based on an electrical energy input, and, in a second mode, to decrease the rotational kinetic energy of the platen and generate an electrical energy output based on the decreased rotational kinetic energy of the platen. An energy storage device electrically coupled with the rotator assembly provides the electrical energy input when the rotator assembly is in the first mode and receives the electrical energy output when the rotator assembly is in the second mode.Type: GrantFiled: June 19, 2017Date of Patent: March 3, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Bruce Cho, Chia-Ying Tien, Huang-Chu Ko
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Patent number: 10537973Abstract: A method of fabricating a polishing pad using an additive manufacturing system includes receiving data indicative of a desired shape of the polishing pad to be fabricated by droplet ejection. The desired shape defines a profile including a polishing surface and one or more grooves on the polishing pad. Data indicative of a modified pattern of dispensing feed material is generated to at least partially compensate for distortions of the profile caused by the additive manufacturing system, and a plurality of layers of the feed material are dispensed by droplet ejection in accordance to the modified pattern.Type: GrantFiled: March 9, 2017Date of Patent: January 21, 2020Assignee: Applied Materials, Inc.Inventors: Mayu Felicia Yamamura, Jason Garcheung Fung, Daniel Redfield, Rajeev Bajaj, Hou T. Ng
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Patent number: 10471598Abstract: A robotic platform is configured to transport a cup. The robotic platform includes a rack housing that has a top side and a bottom side. The top side has a plurality of cup slots configured to accommodate the cup. At least one drop detection sensor and at least one obstacle avoidance sensor are mechanically coupled to the rack housing. An integrated circuit is electrically coupled to a battery, the at least one drop detection sensor, and the at least one obstacle avoidance sensor, a first geared motor and a second geared motor. The geared motors are attached to wheels. The integrated circuit is programmed to determine if a sensor has a data above set point, and then executing a move path.Type: GrantFiled: June 12, 2017Date of Patent: November 12, 2019Inventor: Eric Fragola
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Patent number: 10418259Abstract: A tape film lamination apparatus may include a housing, a substrate holder disposed in the housing and positioned to receive a substrate, a film holder disposed on the housing and positioned to support a tape film, and an air removal unit connected to a portion of the housing below the film holder to remove and/or exhaust air from the housing resulting to attach the tape film to the substrate.Type: GrantFiled: October 27, 2016Date of Patent: September 17, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Youngmin Kim, JaeYong Park, Kunho Song, Byung-Joo Jo
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Patent number: 10405166Abstract: Provided is a disclosure for embodiments for a brush with communication capabilities, which is configured to clean a surface of, for example, a semiconductor wafer, as well as an offline brush conditioning system and a CMP system that can communicate with the brush.Type: GrantFiled: August 29, 2018Date of Patent: September 3, 2019Assignee: Illinois Tool Works Inc.Inventors: Bradley Scott Withers, Corey Alan Hughes, Erik Scott Nelson, Steven Kenneth Christie, Brent Allan Best
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Patent number: 10403505Abstract: A method and an apparatus for processing a peripheral portion of a substrate, such as a wafer, are disclosed. The substrate processing method includes: holding a substrate on a substrate stage; rotating the substrate stage and the substrate about an axis of the substrate stage; directing a laser beam to an edge portion of the rotating substrate to form an annular crack in the substrate; and pressing a polishing tool against the edge portion of the rotating substrate to form a stepped recess in a peripheral portion of the substrate.Type: GrantFiled: September 11, 2017Date of Patent: September 3, 2019Assignee: EBARA CORPORATIONInventors: Kenya Ito, Masaya Seki, Kenichi Kobayashi, Michiyoshi Yamashita
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Patent number: 10357867Abstract: A polishing system includes a wafer support that holds a wafer, the wafer having a first diameter. The polishing system further includes a first polishing pad that polishes a first region of the wafer, the first polishing pad having a second diameter greater than the first diameter. The polishing system further includes an auxiliary polishing system comprising at least one second polishing pad that polishes a second region of the wafer, wherein the second polishing pad has a third diameter less than the first diameter, and the wafer support is configured to support the wafer during use of the first polishing pad and the auxiliary polishing system.Type: GrantFiled: July 18, 2017Date of Patent: July 23, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shih-Chi Lin, Kun-Tai Wu, You-Hua Chou, Chih-Tsung Lee, Min Hao Hong, Chih-Jen Wu, Chen-Ming Huang, Soon-Kang Huang, Chin-Hsiang Chang, Chih-Yuan Yang
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Patent number: 10328546Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.Type: GrantFiled: April 27, 2017Date of Patent: June 25, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Akihiro Kubo, Masahiro Fukuda, Taro Yamamoto, Kenji Yada, Masashi Enomoto, Noboru Nakashima
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Patent number: 10322492Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein the contact area is about 15-40% of a plan area of the bottom surface.Type: GrantFiled: July 24, 2017Date of Patent: June 18, 2019Assignee: Applied Materials, Inc.Inventors: Andrew J. Nagengast, Christopher Heung-Gyun Lee, Thomas Li, Anand N. Iyer, Jie Diao, Huanbo Zhang, Erik S. Rondum, Wei-Cheng Lee, Jeonghoon Oh
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Patent number: 10315286Abstract: A system includes a CMP carrier that includes a resilient flexible membrane upon which a wafer is mounted, at least three ports for supplying air to the resilient flexible membrane to pneumatically pushing on the wafer through pressure applied throughout the surface area of the resilient flexible membrane to have more uniform pressure. Each port provides pressure to different components of the carrier to adjust pressure or vary pressure during processing of the wafer. Further, the system includes a processor and software program for implementing the CMP carrier with existing CMP machines. The software application converts the air pressure applied to the carrier into units that allow the CMP machine to receive expected data and operate in accordance with the existing commands.Type: GrantFiled: June 7, 2017Date of Patent: June 11, 2019Assignee: AXUS TECHNOLOGI, LLCInventors: Daniel R. Trojan, Richard Ciszek, Clifford Daniel
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Patent number: 10301739Abstract: An electroplating apparatus that promotes uniform electroplating on the substrates having thin seed layers includes a convex anisotropic high resistance ionic current source (AHRICS), such as an electrolyte-permeable resistive domed plate. The AHRICS is positioned in close proximity of the substrate, so that a distance from the central portion of the AHRICS to the substrate is smaller than the distance from the edge portion of the AHRICS to the substrate. The apparatus further includes a plating chamber configured to hold the electrolyte and an anode. The apparatus further includes a substrate holder configured to hold the substrate. In some embodiments, the apparatus further includes a secondary (thief) cathode configured to divert ionic current from the near-edge region of the substrate.Type: GrantFiled: May 1, 2017Date of Patent: May 28, 2019Assignee: Lam Research CorporationInventor: Zhian He
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Patent number: 10201887Abstract: A polishing pad is provided. The polishing pad includes a base layer, a top layer, and multiple grooves. The top layer is located over the base layer and has a polishing surface and a bottom surface opposite to each other. The bottom surface is connected to the base layer. The grooves are formed on the bottom surface of the top layer.Type: GrantFiled: March 30, 2017Date of Patent: February 12, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chih-Hung Chen, Kei-Wei Chen
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Patent number: 10195714Abstract: Provided is a polishing pad which is capable of providing a high flatness to a polishing workpiece and suppressing the formation of scratches, and a method therefor. The polishing pad comprises a foamed urethane sheet on the surface which includes closed cells and open cells and which satisfies the following requirements: (1) an open cell ratio is 20-80 vol % where the total volume of closed cells and open cells is taken as 100 vol %, (2) the ratio [tan ? (wet/dry) ratio] of a loss factor tan ? in a water-absorption state to that in a dry state is 1.3-1.7, the loss factors being measured according to JIS K7244-4 with an initial load of 20 g at a measuring frequency of 1 Hz at a temperature of 26° C. in a tensile mode over a strain range from 0.01 to 0.1%, and (3) the Shore DO hardness according to ASTM D2240 is 60-80.Type: GrantFiled: March 17, 2015Date of Patent: February 5, 2019Assignee: FUJIBO HOLDINGS, INC.Inventors: Kouki Itoyama, Daisuke Takahashi
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Patent number: 10189143Abstract: A polishing pad for a chemical-mechanical polishing apparatus includes a first support layer and a polishing layer. The polishing layer is present on the first support layer. The polishing layer has a top surface that faces away from the first support layer and at least one first cavity that is buried at least beneath the top surface of the polishing layer.Type: GrantFiled: May 18, 2016Date of Patent: January 29, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Chi-Hao Huang, Hsuan-Pang Liu, Yuan-Chun Sie, Pinyen Lin, Cheng-Chung Chien
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Patent number: 10160091Abstract: An apparatus for performing chemical mechanical polish on a wafer includes a polishing head that includes a retaining ring. The polishing head is configured to hold the wafer in the retaining ring. The retaining ring includes a first ring having a first hardness, and a second ring encircled by the first ring, wherein the second ring has a second hardness smaller than the first hardness.Type: GrantFiled: November 16, 2015Date of Patent: December 25, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Te-Chien Hou, Ching-Hong Jiang, Kuo-Yin Lin, Ming-Shiuan She, Shen-Nan Lee, Teng-Chun Tsai, Yung-Cheng Lu
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Patent number: 10155297Abstract: To provide improved planarization, techniques in accordance with this disclosure include a CMP station that includes a support plate having a plurality of apertures. An aperture of the plurality of apertures has a first opening and a second opening connected by a slot. Other systems and methods are also disclosed.Type: GrantFiled: July 8, 2016Date of Patent: December 18, 2018Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Jerry Chen, Chunhung Chen
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Patent number: 10131030Abstract: A buffing apparatus for buffing a substrate is provided. The apparatus includes: a buff table for holding the substrate, the buff table being rotatable; a buff head to which a buff pad for buffing the substrate is attachable, the buff head being rotatable and movable in a direction approaching the buff table and a direction away from the buff table, and an internal supply line for supplying process liquid for the buffing to the substrate being formed inside the buff head; and an external nozzle provided separately through the internal supply line in order to supply the process liquid to the substrate.Type: GrantFiled: October 9, 2015Date of Patent: November 20, 2018Assignee: EBARA CORPORATIONInventors: Kuniaki Yamaguchi, Itsuki Kobata, Toshio Mizuno
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Patent number: 10092992Abstract: A polishing apparatus which can allow easy replacement of a retainer ring and can allow the retainer ring to be secured to a drive ring without causing deformation of the retainer ring is disclosed. The polishing head includes a head body having a substrate contact surface, a drive ring coupled to the head body, and a retainer ring surrounding the substrate contact surface and coupled to the drive ring. A first screw thread is formed on the drive ring, a second screw thread, which engages with the first screw thread, is formed on the retainer ring. The second screw thread extends in a circumferential direction of the retainer ring.Type: GrantFiled: May 24, 2016Date of Patent: October 9, 2018Assignee: EBARA CORPORATIONInventors: Hozumi Yasuda, Makoto Fukushima, Osamu Nabeya
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Patent number: 10068811Abstract: A gettering property evaluating method for a wafer includes: a gettering layer forming step of polishing a back surface opposite to a front surface of a semiconductor wafer by use of a polishing wheel to form polishing marks on the back surface and to form a gettering layer inside the semiconductor wafer and beneath the polishing marks; an imaging step of imaging at least a unit region of the back surface formed with the polishing marks by imaging means; a counting step of counting the number of the polishing marks having a width of 10 to 500 nm present in the unit region imaged; and a comparing step of comparing the number of the polishing marks counted by the counting step with a predetermined value to determine whether or not the counted number is not less than the predetermined value.Type: GrantFiled: May 12, 2017Date of Patent: September 4, 2018Assignee: Disco CorporationInventors: Naoya Sukegawa, Ryohei Yokota, Naruto Fuwa
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Patent number: 10035239Abstract: A polishing apparatus which can allow easy replacement of a retainer ring and can allow the retainer ring to be secured to a drive ring without causing deformation of the retainer ring is disclosed. The polishing head includes a head body having a substrate contact surface, a drive ring coupled to the head body, and a retainer ring surrounding the substrate contact surface and coupled to the drive ring. A first screw thread is formed on the drive ring, a second screw thread, which engages with the first screw thread, is formed on the retainer ring. The second screw thread extends in a circumferential direction of the retainer ring.Type: GrantFiled: May 24, 2016Date of Patent: July 31, 2018Assignee: EBARA CORPORATIONInventors: Hozumi Yasuda, Makoto Fukushima, Osamu Nabeya
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Patent number: 9984942Abstract: A method for equalizing the thickness variation of a substrate stack which is comprised of a product substrate and a carrier substrate and which is connected in particular by means of an interconnect layer, by local application of local thickness peaks by means of an application apparatus which has at least one application unit. Furthermore this invention relates to a corresponding device.Type: GrantFiled: March 31, 2015Date of Patent: May 29, 2018Assignee: EV Group E. Thallner GmbHInventors: Jurgen Burggraf, Friedrich Paul Lindner
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Patent number: 9960071Abstract: A polishing apparatus according to an embodiment includes a first polishing part, a second polishing part, and an annular part. The second polishing part includes a mounting surface for a semiconductor substrate, and rubs the semiconductor substrate mounted on the mounting surface while pressing the semiconductor substrate against the first polishing part. The annular part includes a support part provided in the second polishing part, and a plurality of convex portions that project from the support part toward the first polishing part, are arranged in a circumferential direction around the mounting surface while being supported by the support part, and are movable in a radial direction of the semiconductor substrate.Type: GrantFiled: January 28, 2016Date of Patent: May 1, 2018Assignee: TOSHIBA MEMORY CORPORATIONInventors: Takayuki Nakayama, Masayoshi Adachi
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Patent number: 9931729Abstract: Polishing pads with grooved foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a pattern of grooves disposed therein. A continuous polishing surface layer is attached to the pattern of grooves of the foundation layer. In another example, a polishing pad for polishing a substrate includes a foundation layer with a surface having a pattern of protrusions disposed thereon. Each protrusion has a top surface and sidewalls. A non-continuous polishing surface layer is attached to the foundation layer and includes discrete portions. Each discrete portion is attached to the top surface of a corresponding one of the protrusions of the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a grooved foundation layer are also described.Type: GrantFiled: June 1, 2015Date of Patent: April 3, 2018Assignee: Cabot Microelectronics CorporationInventors: Paul Andre Lefevre, William C. Allison, Diane Scott, James P. LaCasse