Abstract: A sand-belt finishing machine having a sand-belt replacement mechanism includes a support rack, a first roller, a second roller, an upright rod, an elastic member, a sand belt, and a pull lever. When the upright rod is moved by the pull lever to compress the elastic member, the distance between the first roller and the second roller is shortened. When the upright rod is released by the pull lever, the upright rod is returned to its original position by the elastic member, so that the distance between the first roller and the second roller is increased. Thus, the sand belt can be mounted on and detached from the first roller and the second roller rapidly, easily and conveniently, thereby facilitating the user replacing the sand belt.

Abstract: A method for cleaning a magnetic head using a cleaning tape comprising a substrate and a cleaning layer, wherein the cleaning tape has a stiffness of 2 or less in a width direction, and the magnetic head has trenches substantially parallel to a sliding direction of the cleaning tape.

Abstract: A method of manufacturing a magnetic stamper/imprinter for use in patterning of magnetic recording media by means of a contact printing process, comprising sequential steps of: (a) providing a stamper/imprinter comprising a body of a magnetic material having an imprinting surface including a topographical pattern corresponding to a pattern to be formed in the surface of a magnetic or magneto-optical (MO) recording medium and comprising a patterned plurality of spaced-apart recesses with a plurality of non-recessed areas therebetween, said imprinting surface including a plurality of defects comprising surface blemishes and stains, magnetic particles, and non-magnetic particles; (b) initially removing the surface blemishes, stains, and magnetic particles; and (c) then removing or rendering the non-magnetic particles benign to the contact printing process.

Abstract: A polishing head assembly for retaining an object that is subject to polishing with a polishing pad is disclosed. The polishing head assembly comprises a head retainer assembly movably coupled to a wafer carrier head. The head retainer assembly includes a gimbal post and a load suspension plate. The gimbal post and the load suspension plate are operable to transfer a loading force to the wafer carrier head during polishing. The gimbal post also provides gimballing to optimize the position of the object in parallel with the polishing pad. In addition, the load suspension plate provides distribution of the loading force to optimize the flatness of the object during polishing.

Abstract: An adjusting device for the sanding drum of a double-drum sander is installed between the opposite ends of the rear grinding drum and the machine frame of a sander for adjusting a rear sanding drum to a most suitable height to match with the size number of the emery of the front sanding drum of the sander so as to carry out abrading with excellent effect.

Abstract: An apparatus for reducing non-uniform stretch of a belt used in the CMP system is disclosed. The belt that may be used with the apparatus extends between a first roller and a second roller to define a belt loop with an inner surface and an outer surface to be used for CMP. The apparatus includes a compensating roller that has a first end and a second end where the first end and second end extends a width of the belt. The first end and the second end have a first diameter. The center of the roller has a second diameter that is less than the first diameter. The compensating roller has a symmetrically tapered shape that extends between each of the first end and second end to the center. The compensating roller is positioned inside of the belt loop, and is applied to the inner surface of the belt loop to reduce non-uniform stretch of the belt.

Abstract: A rotary sanding machine includes a driven wheel coupled to a transmission shaft which is driven by a motor so as to actuate an emery coated belt for sanding. A barrier wall is disposed to hold back dust flying during sanding action to permit the dust to fall into a dust passageway in a dust collecting member. An impeller is mounted in a blower casing, and is coupled to an impeller driving shaft which is rotated with the transmission shaft by means of an endless drive transmission member such that the dust falling in the dust passageway can be drawn into the blower casing for discharge through a discharge port.

Abstract: A polishing head for polishing the end surface of a semiconductor wafer has a driver roller, a driving motor for rotating it, a pair of upper and lower follower rollers one above the other parallel to and horizontally separated from the driver roller and an endless polishing belt around these rollers. As the driving motor causes the polishing belt to run around the rollers, the semiconductor wafer is pushed against the polishing belt between the upper and lower follower rollers. A pair of upper and lower tension-controlling rollers are provided for controlling the tension in the polishing belt between the two follower rollers. At least one of these tension-controlling rollers is movable vertically. A polisher is formed with such a polishing head, a holder for holding and rotating the wafer and an attaching device for attaching the polishing head to the polisher.

Abstract: An endless belt for a belt type polishing machine comprises a support fabric and a polymer layer of relatively low hardness. The polymer layer is formed with drainage grooves. The support fabric may comprise a non woven or woven material, or a membrane with oriented reinforcing yarns. A further version comprises a spiral-link fabric supporting a woven or non woven layer carrying the polymer layer. The polymer layer may be a double layer, the upper of which is either harder or softer than the lower layer.

Abstract: A polishing assembly for use in a linear chemical mechanical polishing apparatus and a method for forming such assembly are described. In the polishing assembly, a plurality of polishing pads are adhesively joined to a top surface of a continuous belt. Each of the plurality of polishing pads is provided with a leading edge which has a lower lip and a trailing edge which has an upper lip. The upper lip of the trailing edge of a first polishing pad covers the lower lip of the leading edge of a second polishing pad when the pads are adhesively bonded to the continuous belt such that the first pad leads the second pad in the direction of rotation for the continuous belt such that the upper lip protects the lower lip to prevent delamination of the pads. The tight seam made possible by the present invention novel tapered joint further prevents water absorption or penetration and therefore prolongs the lifetime of the polishing pads.

Abstract: A sand-belt finishing machine having a reciprocal movement mechanism includes a main body, a swingable support rack, a finishing device, and an eccentric device. Thus, the eccentric unit of the eccentric device produces a driving force to pull and push the first roller of the finishing device, so that the first roller is oscillated successively and produces a vibration or shock force on the sand belt of the finishing device, so as to remove and clear the powder chips attached on the surface of the sand belt.

Abstract: A sand-belt finishing machine having a sand-belt replacement mechanism includes a support rack, a first roller, a second roller, an upright rod, an elastic member, a sand belt, and a pull lever. When the upright rod is moved by the pull lever to compress the elastic member, the distance between the first roller and the second roller is shortened. When the upright rod is released by the pull lever, the upright rod is returned to its original position by the elastic member, so that the distance between the first roller and the second roller is increased.

Abstract: An endless belt for a belt type polishing machine comprises a support fabric and a polymer layer of relatively low hardness. The polymer layer is formed with drainage grooves. The support fabric may comprise a non woven or woven material, or a membrane with oriented reinforcing yarns. A further version comprises a spiral-link fabric supporting a woven or non woven layer carrying the polymer layer. The polymer layer may be a double layer, the upper of which is either harder or softer than the lower layer.

Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a polishing sheet that is wider than the substrate extending between two reels, a drive mechanism to advance the polishing sheet, and a chucking mechanism to intermittently secure the polishing sheet to the platen. The platen can have a platen base that is adaptable to receive either a circular platen top or a rectangular platen top.

Abstract: A linear polishing apparatus for polishing a semiconductor substrate including a novel polishing belt arrangement with at least two polishing belts forming a continuous loop. Each belt having an outside polishing surface and an inside smooth surface. The belts are spaced alongside each other sharing a common axis at each end. The belts are looped around a pair of rollers making up a driver roller at one end and a driven roller at the other end. A platen member interposes each belt and is placed between the pairs of rollers. The platen provides a polishing plane and supporting surface for the polishing belts. The polishing plane includes a plurality of holes communicating with an elongated plenum chamber underlying the plane. The chamber supplies a compressed gas to impart an upward pressure against the polishing belts. The driver rollers are coupled to separate motors to independently drive and control at least said two of the polishing belts.

Abstract: The methods and systems described provide for an in-situ endpoint detection for material removal processes such as chemical mechanical polishing (CMP) performed on a workpiece. In a preferred embodiment, an optical detection system is used to detect endpoint during the removal of planar conductive layers using CMP. An optically transparent polishing belt provides endpoint detection through any spot on the polishing belt. Once endpoint is detected, a signal can be used to terminate or alter a CMP process that has been previously initiated.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.

Abstract: A thermal head lapping apparatus includes a pallet for holding at least one thermal head, a transport device for transporting the thermal head held on the pallet successively to a specified processing position, and a lapping device for forcing a lapping material being moved onto the thermal head that has been transported to said processing position. As a result, the apparatus is capable of advantageously performing lapping treatment with a good efficiency on surfaces to be coated with protective layers or the formed protective layers in a process of fabricating a thermal head, thereby improving the production efficiency of the thermal head and fabricating with a good productivity the suitably lapped thermal head of high quality that ensures high quality image recording.

Abstract: An apparatus for polishing a workpiece includes a workpiece holder configured to hold the workpiece, a polishing member configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen having a plurality of pressure zones configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller coupled to the platen and configured to selectively adjust the pressure zones.

Abstract: A method of polishing a plurality of layers on a surface of a semiconductor wafer includes polishing a first layer using a polishing solution on a first portion of polishing pad and polishing another layer using a polishing solution on another portion of polishing pad. The polishing solution used for each layer is preferably suited to polish its respective layer. The different portions of polishing pad, likewise, are preferably suited to polish a corresponding wafer layer. The different portions of polishing pad may be located on the same pad or on different pads.

Abstract: A processing tool is used to carry out a fixed-abrasive grinding process on a surface of a silicon work-piece. The processing tool includes abrasive grains made up silica grains. A primary average grain size of the silica grains is desirably 0.8 nm to 10 &mgr;m.

Abstract: Chamfer processing is carried out by making plate material W end faces come in contact with rotating grinding belts. The grinding surfaces of the opposing side by side grinding belts are on the centerline in the thickness direction of the plate material. The center point is considered the pivot point as seen from the plate material end faces and in distance is smaller than the thickness of the plate material. Pivot motion of the plate material is carried out in the rotating direction of grinding belts. This chamfer processing method and device enables chamfer in a small curvature radius without applying a heavy tension load on grinding belts, and performs uniform deep chamfer processing of multiple plate material simultaneously.

Abstract: A belt wiper that can be used in a linear belt-type chemical mechanical planarization (CMP) system to maintain a belt pad is provided. The belt wiper mitigates disturbances within a detection region important to a belt pad steering system. Also, the belt wiper mitigates the obscuring of optical components important to operation of an endpoint detection system. Thus, the belt wiper, by wiping the underside of the belt pad will preserve the functionality of both the belt pad steering system and the endpoint detection system.

Abstract: Generally, a method and apparatus for cleaning a backside of a web of polishing material. In one embodiment, the apparatus includes a platen having a support surface adapted to support the backside the web and a web cleaner disposed on the platen and adjacent the backside of the web. A method for cleaning a web of polishing material is also provided. In one embodiment, the method includes the steps of supporting a portion of the web of polishing media on a platen, advancing a portion of the web onto the platen, and cleaning the unrolled portion of the web.

Abstract: A belt for polishing a workpiece such as a semiconductor wafer in a chemical mechanical polishing system includes a polymeric layer forming an endless loop and having a polishing surface on one side of the endless loop. The belt is manufactured by molding a polymeric material such as urethane in a cylindrical mold. The belt is thus made from a single layer, reducing weight, size, cost and maintenance requirements.

Abstract: A novel system of removing scratches and damages from the saddle shaped outer surface of an inner race for a constant velocity axle joint of a car is comprised of an “O”-ring shaped sandpaper comprised of a flexible ring and an abrasive surface developed by adhering powders of abrasive materials such as aluminum oxide, ceramic aluminum oxide, aluminum zirconia, zirconia and silicon carbide to the outer surface of the flexible ring. The “O”-ring shaped surface of the sand paper of this invention fits the saddle shape of the outer surface of the inner race for constant velocity axle joint of a car. The sandpaper of this invention is mounted on a conventional belt sander equipped with three concave grooved belt wheels. The method of this invention enables even grinding and polishing of the saddle shaped outer surface of the inner race, which was impossible by the prior arts.

Abstract: A polishing bar is provided with a plurality of backings that are carried via blocks of impact absorbent material on a bar of greater stiffness. Each backing is shaped with two surfaces at an angle to each other. A polishing tape is disposed over the angled surfaces of each backing. The portion of the polishing tape over the forward surface of the backing is employed to polish the angled edge of the top wafer of a rotating bonded wafer pair.

Abstract: An optical window structure is disclosed. The optical window structure includes a support layer that has a reinforcement layer and a cushioning layer. In addition, the optical windows structure has a polishing pad which is attached to a top surface of the support layer. Furthermore, the optical window structure has an optical window opening and a shaped optical window. The shaped optical window at least partially protrudes into the optical window opening in the support layer and the polishing pad during operation.

Abstract: Described is a method and apparatus for producing bi-directional linear polishing that uses a flexible pad. In one aspect, a horizontal drive assembly moves a horizontal slide member that is horizontally moveable over rails attached to a single casting. Openings within the casting exist for the inclusion of the supply spool, the receive spool and the pad path rollers. A drive assembly translates the rotational movement of a motor into the horizontal bi-directional linear movement of the horizontal slide member. With the polishing pad properly locked in position, preferably being attached between a supply spool and the receive spool, horizontal bi-directional linear movement of the horizontal slide member creates a corresponding horizontal bi-directional linear movement of a portion of the polishing pad.

Abstract: A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections in a serially linked manner, where the polishing pad sections are characterized by at least two different material removal rate profiles. The polishing pad is designed by determining a wafer polishing profile for each of a group of polishing pads where each polishing pad has a unique groove configuration, determining a combination of polishing pad segments, each of the segments constructed with one of the unique groove configurations, that will combine to achieve an improved uniformity in the polishing profile, and manufacturing a polishing pad having pad sections corresponding to the analytically determined pad sections.

Abstract: A support belt to be used with a polishing belt. The support belt includes an interior layer made of a polymer, wherein said interior layer has a first free end and a second free end that abut one another but are not attached to one another so as to form a first seam and an adhesive placed on an exterior surface of the interior layer. An exterior layer made of a polymer and attached to the adhesive, wherein the exterior layer has a first free end and a second free end that abut one another but are not attached to one another so as to form a second seam.

Abstract: Polishing pads, planarizing machines and methods for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays or other microelectronic substrate assemblies. One planarizing machine of the invention is a web-format machine having a planarizing table to support a portion of the polishing pad in a planarizing zone, at least one roller to hold another portion of the polishing pad, and a carrier assembly for handling a microelectronic substrate assembly. A web-format polishing pad used with this machine can include a body having a planarizing medium, an elongated first side edge, and an elongated second side edge opposite the first side edge. The body has a length sufficient to extend across the planarizing zone and wrap around the roller.

Abstract: In a method for determining an endpoint in a chemical mechanical planarization (CMP) operation, the concentration of an oxidizing agent in the slurry byproduct generated during the CMP operation is monitored. The endpoint of the CMP operation is determined based on the concentration of the oxidizing agent in the slurry byproduct. The concentration of the oxidizing agent in the slurry byproduct may be monitored by diverting the slurry byproduct from a surface of a polishing pad, and measuring an optical property of the slurry byproduct diverted from the surface of the polishing pad. A CMP system configured to implement the method for determining an endpoint also is described.

Abstract: A method of producing a chemical mechanical planarization (CMP) polishing belt structure is disclosed that includes forming a strip of substantially rigid material into a support belt having an interior surface and an exterior surface. At least a portion of the exterior surface of the support belt is altered to form a plurality of gripping members integral with the exterior surface of the support belt. An interior surface of a seamless CMP belt is applied to the exterior surface of the support belt such that the plurality of gripping members engage the interior surface of the seamless CMP belt in a non-slip grip.

Abstract: A polishing cloth is adhered to a polishing belt including a window opening for end-point detection. A transparent film, including a liner, that transmits end-point detection light is adhered to a portion of the polishing cloth corresponding to the window opening of the polishing belt. Another liner is adhered via an adhesion layer to the adhesion surface of the polishing cloth at area other than the portion corresponding to the window opening. The polishing cloth includes the transparent film that transmits the end-point detection light at the portion corresponding to the window opening of the polishing belt so that an end point of the surface of the object to be polished can be detected through the transparent film. This prevents slurry to leak inside the belt compared to the conventional technology.

Abstract: The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

Abstract: A polishing pad (for example, polishing pad 305) for use in polarization of a semiconductor wafer (for example, semiconductor wafer 420), the polishing pad 305 featuring a plurality of different polishing surfaces, depending upon the direction of the movement of the polishing pad 305. The polishing pad 305 may take the form of a polishing disc or a polishing belt. The polarization of the semiconductor wafer 420 can then take place at a fewer number of polishing stations, thereby reducing the amount of time needed and reducing the probability of damage to the semiconductor wafer 420.

Abstract: A chemical mechanical polishing (CMP) apparatus is provided. The CMP apparatus includes a first roller situated at a first point and a second roller situated at a second point. The first point is separate from the second point. Also included in the apparatus is a polishing pad strip having a first end secured to the first roller and a second end secured to the second roller. The first roller and the second roller are configured to reciprocate so that the polishing pad strip oscillates at least partially between the first point and the second point.

Abstract: Generally, a method and apparatus for retaining polishing material is provided. In one embodiment, the apparatus includes a platen having a top surface, a plurality of channels and one or more vacuum ports. The top surface is adapted to support the polishing material. The plurality of channels are formed in a polishing area of the top surface. The vacuum ports are disposed in the platen and at least one port is in communication with at least one of the channels. Upon application of a vacuum to the ports, the channels remove fluids under the polishing material while securing the polishing material to the top surface.

Abstract: A lens (L) with an aspheric surface (10) is held by a vacuum lens holder (12). A lap wall (42) is moved towards the lens surface (10) while in a plastic state. A polishing fabric (PF) is positioned between the lens surface (10) and the lap wall (42) before they are moved together. Fluid pressure in a chamber (44) behind the lap wall (42) is used to move the lap wall (42) and the polishing fabric (PF) against the lens surface (10). This causes the lap wall (42) to take a shape corresponding to the shape of the lens surface (10). Then, the lap wall material (42) is caused or allowed to become a solid. When the lap wall (42) is solid, the polishing fabric (PF) is caused to move relative to the lens (L) and the lap (32). The lap wall (42) holds the polishing fabric (PF) against the lens surface (10) while the polishing fabric (PF) moves across the lens surface (10) and polishes it.

Abstract: The present invention describes a chemical mechanical polishing apparatus and method that uses a portion of a polishing pad that is disposed under tension between a supply spool and a receive spool, with a motor providing the tension to either the supply spool or the receive spool and the other spool being locked during processing. If a new section of the polishing pad is needed, the same motor that provided the tension is used to advance the polishing pad a determined amount. Further, during processing, a feedback mechanism is used to ensure that the tension of the polishing pad is consistently maintained.

Abstract: A substrate polishing scheme (apparatus and method) is described according to which a polishing surface of a polishing sheet is driven in a generally linear direction by a drive mechanism, a surface of a substrate is held against the polishing surface of the polishing sheet by a polishing head, and the substrate is probed through the polishing sheet by a monitoring system.

Abstract: A rollers' position moving device for a sand belt machine includes a conveyor in the machine, a sand belt, and plural rollers moving the sand belt. The rollers are deposited across on the conveyor. Further, a first wheel and a second wheel are pivotally connected with one side of each roller, and the first and the second wheel have different diameters so as to rotate with different speeds. The rotating speed disparity of the two wheels can make the two wheels move laterally right and left within a preset distance because of an inner projection surface of the two wheels. Then the rollers are rotated and moved laterally right and left by one of the wheels so that sand grinding of the rollers rotating and moving laterally right and left at the same time can grind a work being ground smooth and glossy.

Abstract: An material having a polyester fabric base layer, at least one metal layer coated on at least one of two opposite sides of the polyester fabric base layer by chemical plating, and at least one outer abrasive layer of diamond powder or cubic boron nitride bonded to the at least one metal layer by electroplating.

Abstract: A tubular workpiece notching machine usable for general grinding operations has a worktable (1) whose base plate (10) is pivotally mounted to the frame (6) of the notching machine around a pivotal orthogonal axis (Y-Y) in such a manner that the worktable (1) is movable from a first working position in which the machine vice (2) co-operates with the shaping pulley (3) in recessing ends of tubular workpiece by grinding, to a second working position in which the shaping pulley (3) is used for generally grinding a workpiece. Connecting means are provided for removably anchoring the base plate (10) of the worktable (1) to the frame (6) in the first working position.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated polishing pad that is moved over a platen either between or during the planarization cycles, and a support pad that is moved along with the polishing pad. The support pad can be an elongated member that extends between a supply roller and a take-up roller, or can include a continuous member that extends around the spaced apart rollers. The platen can also be movable along with the support pad and can be supported by fluid jets, rollers, or a rotating bladder. Cleaning devices and/or milling devices can treat the surfaces of the polishing pad, the support pad and/or the platen to reduce the likelihood for contaminants to become caught between these components as they engage with each other.

Abstract: Worktable for an apparatus for grinding recesses A worktable for an apparatus for grinding recesses, having on a frame (3) a pair of pulleys carrying a grinding belt (2), is provided with a sole control member (19) to approach and move apart said workpiece vice (20) with respect to said shaping pulley (1) of said pair of pulleys.

Abstract: A web-format polishing pad for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies, and methods for making and using such a web-format pad. In one aspect of the invention, a web-format polishing pad for planarizing a microelectronic substrate is made by slicing a cylindrical body of pad material along a cutting line that is at least substantially parallel to a longitudinal centerline of the body and at a radial depth inward from an exterior surface of the body. For example, a web of pad material can be sliced from the body by rotating the cylindrical body about the longitudinal centerline and pressing a cutting element against the rotating cylindrical body along the cutting line. The cutting element can be a knife with a sharp edge positioned at the cutting line and a face extending along a tangent of the cylindrical body.

Abstract: An apparatus for rounding off edges of openings in a work piece, such as internal openings or cut outs in steel plates. The apparatus includes a belt grinding machine having a continuous grinding belt running over several belt guiding rollers which are provided on a support frame. Two of the rollers are provided on a cradle, that is pivotally supported in the support frame. The grinding belt is, between the rollers on the cradle, disposed for rectilinear working of the work piece, and a device is arranged for operating the cradle in a pendulum like movement about the pivotal support during a grinding operation.

Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a generally linear polishing sheet having an exposed portion extending over a top surface of the platen for polishing the substrate, and a drive mechanism to incrementally advance the polishing sheet in a linear direction across a top surface of the platen by a fixed distance each time the polishing sheet is incremented. The polishing sheet is releasably secured to the platen to rotate with the platen, and it has a width greater than a diameter of the substrate.