Abstract: A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing.

Abstract: The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes a grinding unit configured to remove a predetermined amount of material from the edge when in an aligned position. The grinding unit applies a predetermined force normal to the edge. An air bearing slide system is coupled to the grinding unit. The air bearing slide system is configured to slide along a predetermined axis on a thin film of pressurized air that provides a zero friction load bearing interface. A linear actuation motor is coupled to the air bearing slide system. The linear actuation motor is configured to control the movement of the air bearing slide system such that the grinding unit is moved from a non-aligned position to the aligned position.

Abstract: A wafer processing method of processing a wafer having an epitaxial film formed on the front side. The wafer processing method includes a holding step of holding the wafer on a holding table having a holding surface for holding the wafer and a rotational axis extending perpendicularly to the holding surface and passing through the center of the holding surface, and a removing step of pressing a grinding member on a ridge portion formed along the peripheral edge of the wafer held on the holding table and rotating the holding table about the rotational axis, thereby removing the ridge portion.

Abstract: The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes a grinding unit configured to remove a predetermined amount of material from the edge when in an aligned position. The grinding unit applies a predetermined force normal to the edge. An air bearing slide system is coupled to the grinding unit. The air bearing slide system is configured to slide along a predetermined axis on a thin film of pressurized air that provides a zero friction load bearing interface. A linear actuation motor is coupled to the air bearing slide system. The linear actuation motor is configured to control the movement of the air bearing slide system such that the grinding unit is moved from a non-aligned position to the aligned position.

Abstract: A strengthened glass sheet or article having an edge profile that provides improved edge strength, particularly when the strengthened glass sheet is subjected to a four point bend test, and a method of making a glass sheet having such an edge. The edge is formed by cutting or other separation methods and then ground to a predetermined profile such as a pencil or bullet profile, a bull nose profile, or the like. In some embodiments, the edge is polished and/or etched following grinding to reduce flaw size.

Abstract: A method of finishing glass sheets includes forming a stack comprising alternating layers of unfinished glass sheets and spacer pads. The stack is such that there is no physical contact between any two adjacent unfinished glass sheets and outer edges of the spacer pads are recessed relative to outer edges of the unfinished glass sheets. The stack is secured by clamping the unfinished glass sheets and spacer pads together and then supported on a working surface. The unfinished glass sheets of the stack are finished simultaneously while the stack is supported on the working surface. After the finishing, the stack comprises alternating layers of finished glass sheets and spacer pads.

Abstract: An embodiment of the invention relates to a method and an apparatus for the automatic edge grinding of glass sheets under clean room conditions, comprising the following: a) a multi-axis robot at a gripper arm thereof carries a suction frame having a plurality of suction units for receiving a glass sheet, b) a grinding unit having at least one rotatable grinding wheel that is supported in a stationary manner is installed in the usable pivot range of the gripper arm of the robot, c) the ground product occurring during operation of the grinding unit is extracted by an extraction system, d) the degree of wear and the state of the grinding wheel are monitored by a calibration device in conjunction with a detection device, and a computer program for carrying out the method.

Abstract: A method is provided for reformulating a chemical mechanical planarization (CMP) slurry for use in conjunction with a CMP tool having an active cycle during which the tool is being used to planarize a substrate, and a rinse cycle during which the tool is being rinsed. The method comprises (a) receiving a feed stream from the CMP tool, at least a portion of the feed stream comprising abrasive particles disposed in a liquid medium; (b) during at least a portion of the rinse cycle, sending the feedstream received from the CMP tool to a first location; and (c) during at least a portion of the active cycle, sending the feedstream received from the CMP tool to a second location where the feedstream undergoes processing to reformulate the slurry.

Abstract: A silicon carbide single-crystal substrate includes a first surface, a second surface opposite to the first surface, and a peripheral edge portion sandwiched between the first surface and the second surface. A plurality of grinding traces are formed in a surface of the peripheral edge portion. A chamfer width as a distance from an outermost peripheral end portion of the peripheral edge portion to one of the plurality of grinding traces which is located on an innermost peripheral side of the peripheral edge portion in a direction parallel to the first surface is not less than 50 ?m and not more than 400 ?m. Thereby, a silicon carbide single-crystal substrate capable of suppressing occurrence of a crack, and a method for manufacturing the same can be provided.

Abstract: A glass-plate working machine 1 is arranged such that while a cutting head 9 for forming a cut line on a glass plate 5 and a grinding head 10 for grinding a peripheral edge of the glass plate 5 bend-broken along the cut line are being moved simultaneously in parallel under numerical control, the cutting head 9 and the grinding head 10 respectively having angle control motors 46 and 49 are synchronously subjected to angular control about axes 39 perpendicular to the surface of the glass plate 5, and the cutting head 9 and the grinding head 10 are moved such that the orientation of a cutter wheel 52 is adjusted to a processing line, and the press contacting direction of a grinding wheel 64 of the grinding head 10 is kept in a normal direction with respect to a processing line of an edge of the glass plate 5.

Abstract: A glass edge finishing system, a belt assembly and a method are described herein for finishing an edge of a glass sheet. The glass edge finishing system comprises: (a) a base; and (b) one or more belt assemblies located on the base, where each belt assembly includes: (i) a support frame; (ii) a motor; (iii) a pair of pulleys rotatably mounted on the support frame and driven by the motor; (iv) a belt engaged to and driven by the pair of pulleys, where the belt contacts and finishes the edge of the glass sheet; (v) a belt cleaning device that removes glass debris from the belt as the belt moves past the belt cleaning device; and (vi) a cleaning containment enclosure within which there is located the belt cleaning device, where the cleaning containment enclosure contains the glass debris removed from the belt by the belt cleaning device.

Abstract: A method for manufacturing an externally circular precursor lens that is processed into a rim-shaped lens includes inputting processing data to specify the shape of the rim-shaped lens, and processing a material block based on the processing data so as to manufacture a precursor lens. An elliptical virtual rim surrounding the precursor lens manufactured at that time is imaginarily set, and is processed based on the processing data up to that range, and, outside the virtual rim, an amount of sag is changed to secure the edge thickness of the precursor lens. This method for manufacturing a precursor lens for a rim-shaped lens reduces an excessive load imposed on a processing tool during processing, allows the precursor lens to be processed into a rim-shaped lens while satisfactorily maintaining its edge thickness without the lack of the edge of the precursor lens, and results in a thin lens.

Abstract: A method capable of quickly polishing an angular portion formed by a grinded back surface and a circumferential surface of a substrate without causing damages on the thin substrate is provided. The method includes rotating the substrate about its center, and pressing a polishing tape against the angular portion formed by the back surface and the circumferential surface of the substrate to polish the angular portion.

Abstract: The present invention relates to a TiO2-containing quartz glass substrate for an imprint mold having a main surface and a side surface, in which the side surface has an arithmetic average roughness (Ra) of 1 nm or less, and the side surface has a root mean square (MSFR_rms) of concaves and convexes in the wavelength region of from 10 ?m to 1 mm being 10 nm or less.

Abstract: A polishing machine for lenses with at least one first polishing spindle having a polishing axis (K) and a tool holder disposed on the first polishing spindle for a first polishing disc designed as a tool, further comprising at least one first workpiece spindle having a rotary axis (C) and a workpiece holder disposed on the first workpiece spindle for a lens, wherein the workpiece holder and the tool holder are disposed so as to be movable in translation in the direction of a telescoping axis (Z) disposed parallel to the polishing axis (K) and in the direction of a translation axis (X) disposed at right angles to the rotary axis (C).

Abstract: A polishing apparatus for polishing an end edge of a work piece by bringing a bristle tip of a polishing brush into contact with the end edge of the work piece as the bristle tip passes the end edge of the work piece includes a support plate having a through hole into which the polishing brush is inserted and a suppression portion that is provided at the support plate and suppresses a deformation of the bristle tip of the polishing brush when the work piece is polished.

Abstract: Certain example embodiments of this invention relate to techniques for edge deleting coatings supported by coated articles while a temporary protective coating is applied thereto. More particularly, a stationary, enlarged, and higher powered aspirator is connected to flexible tubing, which itself has an enlarged diameter, that has a nozzle located proximate to a grinding wheel on an edge deletion unit is provided in connection with an edge deletion table. Advantageously, the edge deletion table and aspirator of certain example embodiments are capable of performing edge deletion and removal of a temporary protective coating substantially simultaneously (e.g., from a common area of interest), during which process the debris produced when edge deletion is performed is controlled and removed from the substrate of interest.

Abstract: A glass treatment apparatus, in one example, can include a fluid dispensing device configured to dispense a substantially laminar flow of a fluid film. In another example, a shroud substantially circumscribes an outer peripheral surface of a working wheel. The shroud includes a slot configured to receive an edge portion of a glass sheet. Methods of treating glass, in one example, include the step of dispensing a substantially laminar flow of a fluid film along a fluid plane to subsequently land on a first side of a glass sheet. In further examples, a fluid is passed over an inner surface of a shroud to carry away machined particles from a glass sheet. In still further examples, an outer peripheral surface of a working wheel is impacted with a fluid stream to clean the working wheel from glass particles generated when machining an edge of the glass sheet.

Abstract: A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon. A second polishing tape is pressed against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.

Abstract: A substrate processing apparatus having a polishing unit for polishing a periphery of a substrate. The substrate processing apparatus includes: a polishing unit configured to polish a periphery of a substrate; an imaging module configured to take an image of the periphery of the substrate polished by the polishing unit; and an image processing section configured to inspect a polished state of the substrate based on the image taken by the imaging module. The imaging module is configured to take the image of the periphery of the substrate when the polishing unit is not polishing the periphery of the substrate.

Abstract: The corners of a sheet of glass travelling in a longitudinal direction are ground by a corner bevelling assembly having a fixed frame; a movable frame; a grinding wheel; a supporting arm supporting the grinding wheel and fitted to the movable frame; and an actuating device interposed between the fixed frame and the movable frame, and having a first powered guide-slide assembly for moving the movable frame in a direction parallel to a longitudinal travelling direction of the sheet, and a second powered guide-slide assembly for moving the movable frame with respect to the fixed frame in a transverse direction perpendicular to the longitudinal direction; the corner bevelling assembly also having a reference locator which, in use, is positioned against a longitudinal lateral surface, parallel to the longitudinal direction, of the sheet; a relative-motion assembly for enabling movement, parallel to the transverse direction, of the reference locator with respect to the supporting arm; and a device for detecting the

Abstract: The corners of a sheet of glass travelling in a longitudinal direction are ground by a grinding assembly having a fixed frame; a movable frame; a grinding wheel; a supporting arm supporting the grinding wheel and fitted to the movable frame; and an actuating device interposed between the fixed frame and the movable frame, and having a first powered guide-slide assembly for moving the movable frame in a direction parallel to a longitudinal travelling direction of the sheet, and a second powered guide-slide assembly for moving the movable frame with respect to the fixed frame in a direction perpendicular to the longitudinal direction; the grinding assembly also having a locator fixed to the supporting arm and defining a stop to keep the sheet at a distance from the grinding wheel; and a compensating device interposed between the supporting arm and the movable frame, and having a third guide-slide assembly and a flexible controlled-damping device.

Abstract: A method for finishing an edge of a glass sheet comprising a first grinding step and a second polishing step using different abrasive wheels. The method results in consistent finished edge quality and improved edge quality in term of sub-surface damage (SSD). The method can be advantageously utilized to finish the edges of a thin glass substrate for use as substrates of display devices, such as LCD displays and the like.

Abstract: Methods of finishing an edge of a glass sheet comprise the step of machining the edge of the glass sheet into a predetermined cross-sectional profile along a plane taken transverse to the edge of the glass sheet with an initial average edge strength ESi. The methods also include the step of finishing the edge with at least one finishing member, such as an endless belt, without substantially changing a shape of the predetermined cross-sectional profile. In one example, a wet slurry including an abrasive can be applied to at least one of a finishing member and the edge of the glass sheet. After finishing the edge, example finished average edge strengths ESf can be at least about 250 MPa. In addition or alternatively, in another example, the ratio ESf/ESi can be within a range of from about 1.6 to about 5.6.

Abstract: The invention aims at providing a method for manufacturing a glass substrate for a magnetic disc capable of eliminating undulations of an outer peripheral end face of a glass substrate in a short processing time, and obtaining high roundness. In a method for manufacturing a disc-like glass substrate for a magnetic disc, the method includes a forming step of pressing a rotating grindstone against an outer peripheral end face while the glass substrate is rotated, thereby forming an outer peripheral end. In the forming step, processing is performed using a first condition (S106) on which first undulations are formed and a second condition (S108) on which second undulations having a different wavelength from the first undulations are formed.

Abstract: An automatic machine and an automatic method for grinding the perimetric edge of rectangular or nonrectangular of glass sheets arranged substantially vertically, comprising at least one conveyor and at least one workhead provided with an abrasive tool for grinding the glass sheet at its edge, following its perimetric profile by way of the relative action of movement of the glass sheet and movement of the at least one workhead. During grinding, the glass sheet is no longer supported and moved by the conveyor but by at least one carriage, to which the glass sheet is coupled by way of at least one sucker.

Abstract: A wafer is polished by a method comprising a slicing step of cutting out a wafer from a single crystal ingot and a step of polishing at least one of both surfaces and an end face of the wafer, wherein the at least one surface and end face of the wafer are simultaneously subjected to a mirror polishing.

Abstract: An eyeglass lens processing apparatus includes: a lens rotation unit rotating a lens; a processing tool rotation unit processing the lens; an axis-to-axis distance changing unit for changing an axis-to-axis distance between the chuck shaft and the processing tool rotation shaft; a lens surface configuration acquiring unit which acquires a front surface curve configuration and a rear surface curve configuration of the lens; a lens outer diameter acquiring unit which acquires an outer diameter of a lens; a calculation unit which calculates a thickness of the lens and calculates a cutting depth of the lens, so that torque applied onto the chuck shaft in rough processing becomes substantially constant, based on the calculated lens thickness and a processing distance from the rotation center of the lens; and a control unit which controls the axis-to-axis distance changing unit in accordance with the calculated cutting depth and for rough processing the lens.

Abstract: The present invention is a wafer production method at least comprising a chamfering step of chamfering a wafer sliced from an ingot using a grindstone for chamfering, and a step of obtaining a product wafer thinner than the chamfered wafer by performing at least one or more than one of the following processes on the chamfered wafer: flattening, etching, and polishing, the method at least comprising a correction step of chamfering a dummy wafer equivalent in thickness to the product wafer, measuring the chamfered dummy wafer for its chamfered shape, and correcting the shape of the grindstone for chamfering based on the measured chamfered shape of the dummy wafer, at least before the chamfering step, thereby chamfering the wafer sliced from the ingot using the grindstone for chamfering having its shape corrected. Thus, it is possible to provide a wafer production method allowing a product wafer with a desired chamfered shape to be obtained in a short period of time.

Abstract: The polishing method of a disk-shaped substrate for polishing an outer circumference 13 of a disk-shaped substrate using slurry is provided with in this sequence: a first polishing process for polishing the outer circumference 13 using an abrasive-grain inclusion brush 50 made of a resin in which polishing abrasive grains are included; and a second polishing process for polishing the outer circumference 13 using a resin brush 60 made of a resin in which the polishing abrasive grains are not included.

Abstract: The invention relates to a machine and process for grinding dies, in which the work axis (CO) of the plate (2.1) in which the die (1) to be machined is anchored is controlled at all the points of its angular movement, allowing the interpolation of the movements of this work axis (CO) with those of an axis of rotation (BO) and with those of respective axes (X and Z), such that the machines has four axes of interpolation, which allows machining dies (1) with their inner or outer diameter rounded or non-rounded and with their transition between these diameters and the side faces constant or variable by means of a single grinding process.

Abstract: Disclosed herein is a wafer polishing device including: an abrasive member driving device adapted to run a belt-like abrasive member in a direction crossing an outer circumferential end-edge of a wafer which is a wafer to be polished while bringing a belt-like abrasive member into contact with outer circumferential end-edge of the wafer, the abrasive member having non-abrasive sections disposed on both sides of an abrasive grain section; and a guide member having two guide surfaces shaped to conform to the outer circumferential end-edge of the wafer, the two guide surface being adapted to press, from rear sides of the non-abrasive sections, the respective non-abrasive sections of the abrasive member run by the abrasive member driving device.

Abstract: A glass edge finishing system, a belt assembly and a method are described herein for finishing an edge of a glass sheet. The glass edge finishing system comprises: (a) a base; and (b) one or more belt assemblies located on the base, where each belt assembly includes: (i) a support frame; (ii) a motor; (iii) a pair of pulleys rotatably mounted on the support frame and driven by the motor; (iv) a belt engaged to and driven by the pair of pulleys, where the belt contacts and finishes the edge of the glass sheet; (v) a belt cleaning device that removes glass debris from the belt as the belt moves past the belt cleaning device; and (vi) a cleaning containment enclosure within which there is located the belt cleaning device, where the cleaning containment enclosure contains the glass debris removed from the belt by the belt cleaning device.

Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Abstract: A substrate treating method includes rotating a substrate in a circumferential direction and polishing a peripheral portion of the substrate by pressing a polishing member to it using a pressing mechanism having a pressing pad. An angle of at least a part of the pressing pad with respect to an axial direction, in which the pressing mechanism makes the pressing pad press the peripheral portion of the substrate, is changed by an angle displacement mechanism which actively displaces the angle so that the polishing is performed depending on a surface to be polished in the peripheral portion.

Abstract: During grinding of mutually parallel edges of glass plates every edge of the glass plate is ground using a grinding tool or two grinding tools disposed one behind the other and cooling agent is directed from a side of the glass plate toward the grinding tool and supplied using a supply line divided via a redirection and separating segment into a plurality of fine streams of cooling agent, and a position of the grinding tool can be adjusted such that at least the position of the grinding tools relative to the assigned edge of the glass plate, which is passing through, is calibrated and the corners of the glass plate are ground to form a chamfer.

Abstract: Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided.

Abstract: An inner peripheral edge of a toroidal glass substrate for a magnetic disk is subjected to mechanical polishing in such a manner that the surface roughness is no greater than 9 nm in terms of Rmax. Then, the inner peripheral edge is subjected to chemical polishing to remove at least 2 ?m of a surface layer. The inner peripheral edge has a non-conventional mirror-finished surface obtained by mechanical polishing. Thus, sufficient ring strength is obtained even when the chemical polishing depth is smaller than in the past. A polishing depth of less than 5 ?m is sufficient.

Abstract: A sensor element having a plate-like shape and extending in a longitudinal direction and having a chamfered portion at an edge between a main surface and a rear-end surface or between a main surface and a side surface of the sensor element. The sensor element includes a solid electrolyte layer, an insulating layer disposed on the solid electrolyte layer and constituting at least part of the main surface, and an electrode pad disposed away from the chamfered portion for connection to an outside circuit. Furthermore, the solid electrolyte layer and the insulating layer are exposed at the chamfered portion. Also disclosed are a gas sensor including the sensor element and a method of manufacturing the sensor element.

Abstract: Chamfer correction is performed to a chamfered portion at least on a front side of a silicon wafer after an incoming inspection. Thereby, a thickness of the chamfered portion on the front side of the wafer is restored, and thus the number of reclamation cycles of the silicon wafer can be increased. In addition, the chamfered portion is not deformed even after reclamation is repeated for a plurality of times.

Abstract: A method of forming a slider includes forming a leading edge blend on a leading edge of the slider. After the leading edge blend is formed, the method further includes forming at least one step feature conformal to the leading edge blend. A slider having an air bearing surface includes a leading edge blend and at least one step feature conformal to the leading edge blend.

Abstract: Methods for edging optical articles comprising two main faces, at least one of which being coated with an outermost layer comprising fixing the optical article to a chuck with a holding pad that adheres to both the optical article and the chuck, wherein the surface of the holding pad contacting the optical comprises an adhesive material; and edging the optical article with an edging device; wherein prior to fixing the optical article to the chuck, at least one temporary layer of an organic material is formed onto said outermost layer of the optical article, the organic material of the temporary layer comprising at least one organic compound having a fluorinated functional moiety and at least one linking functional moiety capable of establishing at least one intermolecular bond or interaction with the adhesive material of the holding pad. Optical articles obtained via these methods.

Abstract: A wafer polishing method, in which the outer circumferential edge of a polishing member is first cut by a cutting tool fixed to a table base, thereby forming the polishing member into a completely round shape and also positioning the polishing member in a Y direction at a Y-directional reference position of the table base. Thereafter, a polishing unit is once lifted in the condition where the table base remains still at the reference position. Thereafter, the table base is horizontally moved toward a column in the Y direction to thereby position the polishing member in the Y direction so that only a peripheral portion of the wafer is polished by the polishing member. At this time, the horizontal travel of the table base is preliminarily obtained from the Y-directional positional relation between the cutting tool and the wafer held on a chuck table and from the width of the peripheral portion to be polished.

Abstract: A surface treatment method can perform coated surface treatment on a cutting edge R and a rake surface, while maintaining a radius of curvature of the cutting edge R and uniformly surface-treating the rake surface. The surface treatment method includes providing an opening chamfered at corners adjacent to an upper surface of the fixture to the fixture for fixing a coated cutting insert; fixing the coated cutting insert inside the opening in such a manner that a rake surface of the coated cutting insert is disposed lower than upper surfaces of the fixture but higher than a lower edge created on the opening of the fixture by the chamfering; and conducting the surface treatment on a cutting edge R and the rake surface of the coated cutting insert.

Abstract: The present invention provides a polishing apparatus and a polishing method capable of calculating outside diameters of rolls of a polishing tape on a polishing-tape supply reel and a polishing-tape recovery reel and capable of calculating a remaining amount of the polishing tape and a consumption of the polishing tape from the outside diameters of the rolls. This polishing apparatus includes a polishing-tape supply reel (46), a polishing head (44), a polishing-tape drawing-out mechanism G1, and a polishing-tape supply and recovery mechanism (45) configured to recover the polishing tape (43) from the polishing-tape supply reel (46) via the polishing head (44).

Abstract: A grinder wheel for a liquid crystal display device and a method of fabricating a liquid crystal display device using the same are provided. Two grinding surfaces are formed in the grinder wheel used for grinding a substrate so that it is possible to improve grinding characteristics, to increase the life of the grinder wheel, and to reduce grinding time. The method includes cutting the substrates attached to each other into a plurality of unit liquid crystal display panels, loading the unit liquid crystal display panel on a grinding table, grinding a predetermined region of the liquid crystal display panel using a grinder wheel including two grinding surfaces of a first grinder surface for primary grinding and a second grinder surface for secondary grinding, and unloading the ground liquid crystal display panel.

Abstract: A wafer polishing apparatus includes a polishing tape extending between two guide rollers, a first surface of the polishing tape contacting a surface of a wafer to be polished, a polishing head including a pusher pad, the pusher pad adapted to push the polishing tape against the surface of the wafer to be polished, a color image sensor adjacent to the polishing tape, the color image sensor being adapted to detect a color image of the polishing tape and to output a signal corresponding to the detected color image, and a controller connected to the color image sensor, the controller being adapted to receive the signal output from the color image sensor and to determine when a color of the color image detected by the color image sensor changes, a change in the color image indicating a polishing end point.

Abstract: The grinding method of a disk-shaped substrate that grinds a disk-shaped substrate including a portion having a hole at the center thereof while rotating the disk-shaped substrate is provided with: grinding an inner circumference of the disk-shaped substrate while an inner circumference grinding device is fed in a radial direction toward an outer circumference of the disk-shaped substrate and grinding the outer circumference of the disk-shaped substrate while an outer circumference grinding device is fed in the radial direction toward the inner circumference of the disk-shaped substrate; and stopping the feedings of the inner circumference grinding device and the outer circumference grinding device at the same time.

Abstract: A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.

Abstract: A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism 3 configured to hold the substrate W horizontally and to rotate the substrate W; and at least one polishing head 30 disposed near the peripheral portion of the substrate. The polishing head 30 has at least one protrusion 51a, 51b extending along a circumferential direction of the substrate W, and the polishing head 30 is configured to press a polishing surface of a polishing tape 23 by the protrusion 51a, 51b against the peripheral portion of the substrate W from above or below.