Abstract: A method of forming a recess in a surface of a substrate includes: providing an abrasive article comprising a structured abrasive member disposed along a peripheral surface of a support member, frictionally contacting the structured abrasive layer with a surface of a substrate, longitudinally advancing the structured abrasive layer relative to the surface of the substrate; and rotating at least one of the abrasive article or the substrate relative to the other around a rotational axis perpendicular to the surface of the substrate such that the structured abrasive layer maintains contact with and abrades the surface of the substrate. The structured abrasive member comprises a structured abrasive layer comprising shaped abrasive composites secured to a backing, wherein the backing is proximate to the support member. The shaped abrasive composites comprise abrasive particles retained in a binder material.

Abstract: A wafer edge trimming tool includes an abrasive tape and a holding module configured to hold the abrasive tape against portions of an edge of a rotating wafer during a wafer edge trimming process.

Abstract: A pressing device (50) for pressing cutting means onto circumferential surfaces (12) of substantially cylindrical workpiece portions (13) during a finishing operation is provided for pressing the cutting means onto a circumferential surface with a pressing force over a contact angle. The pressing device is steplessly adaptable for the machining of workpiece portions of differing diameters that have a diameter difference of at least 0.1 mm.

Abstract: The invention relates to a device for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad contacts the pattern belt, urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.

Abstract: Methods and apparatus are provided for housing a polishing tape adapted to polish a substrate. The invention includes a cassette comprising a body portion; and a head portion, wherein the head portion includes: a pair of guide walls; one or more supply rollers positioned between the guide walls in the head portion; and wherein the guide walls are adapted to guide a polishing tape housed in the body over the one or more supply rollers. Numerous other aspects are provided.

Abstract: A belt sander includes a sand belt unit including an upper roller, a lower roller located under the upper roller and rotated by a propeller shaft of a drive motor, and two auxiliary rollers located at two sides of the lower roller. Each of the two auxiliary rollers and the lower roller are rotated synchronously in the opposite direction. Thus, the workpiece is pressed by the two auxiliary rollers so that the workpiece is moved forward at a constant speed without acceleration during the grinding process of the sand belt, thereby enhancing the grinding effect of the sand belt on the workpiece.

Abstract: An amlodipine maleate pharmaceutical composition is provided with good stability when formulated with a pH within the range of 5.5 to 7, when measured as a 20 wt % aqueous slurry. The stability can also be aided by making the pharmaceutical composition from amlodipine maleate particles having an average particle size of greater than 20 microns, preferably greater than 100 microns.

Abstract: The compositions and dosage forms of the invention are clinically useful as methods for increasing the effectiveness, efficiency and safety of biguanides (metformin) and/or sulfonylureas in the prevention and treatment of insulin resistance and diabetes mellitus, alone or in combination, as a nutrient for humans. The carefully chosen active ingredients of the invention are designed in a modular fashion to prevent and rectify adverse events associated with insulin resistance syndrome and diabetes mellitus, and with the clinical use of biguanides (metformin) and/or the sulfonylureas. These modules are: (1) Mitochondrial Metabolic Group, (2) Plasma and Mitochondrial Membrane Integrity Group, (3) Nocturnal Group and, (4) Insulin Alternative Group. When used in concert with a biguanide, a sulfonylurea or with a combination of both, the invention will broaden the clinical usefulness of these drugs.

Abstract: An asymmetric double-sided substrate scrubber is provided. The asymmetric double-sided substrate scrubber includes a first roller and a second roller. The first roller is constructed from a first material having a first density and the second roller is constructed from a second material having a second density. The second density is designed to be greater than the first density. The first roller is designed to be applied onto a first side of a substrate with a first force and the second roller is designed to be applied onto a second side of the substrate with a second force. The second force is configured to be substantially equivalent to the first force.

Abstract: A rollers' position moving device for a sand belt machine includes a conveyor in the machine, a sand belt, and plural rollers moving the sand belt. The rollers are deposited across on the conveyor. Further, a first wheel and a second wheel are pivotally connected with one side of each roller, and the first and the second wheel have different diameters so as to rotate with different speeds. The rotating speed disparity of the two wheels can make the two wheels move laterally right and left within a preset distance because of an inner projection surface of the two wheels. Then the rollers are rotated and moved laterally right and left by one of the wheels so that sand grinding of the rollers rotating and moving laterally right and left at the same time can grind a work being ground smooth and glossy.

Abstract: A polishing apparatus includes a lapping tape for polishing a surface of a magnetic disc, a tape supply unit for supplying the lapping tape, a varnisher roller for pressing the lapping tape onto the surface of the magnetic disc, and a pressing unit for pressing the lapping tape to the surface of the magnetic disc by way of the varnisher roller. The pressing unit is constituted by a swing lever having the varnisher roller at one end portion, and a balance adjusting unit. The balance adjusting unit sets the pressing force to zero by establishing the balance of the swing lever, and then breaks the balance so as to press the lapping tape to the surface of the magnetic disc by way of the varnisher roller with a desired pressing force.

Abstract: A belt has a polishing pad with one or more polishing pad sections joined to the belt by an adhesive layer. A seam joint is reinforced with caulking material. Edge portions of the seam joint are beveled or dovetailed. Parallel stress relief grooves in the upper surface of the polishing pad prevent delamination of the polishing pad from the belt.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film.

Abstract: A wafer polisher and method for the chemical mechanical planarization of semiconductor wafers. The polisher includes a wafer holder for supporting the semiconductor wafer and a linear polishing assembly having a polishing member positioned to engage the surface of the wafer. The polishing member is movable in a linear direction relative to the wafer surface to uniformly polish the surface of the wafer. A pivotal alignment device may be used to pivotally support one of the wafer holder and the polishing member relative to the other of the wafer holder and the polishing member with the surface of the wafer and the polishing member retained in parallel alignment during operation of the polisher. The polisher optionally includes a conditioning station for conditioning the polishing member.

Abstract: The invention relates to grinding belts and polishing belts, which are particularly suitable for processing enclosed constructions, since they can be re-sealed by simple means and manner after severing to form a ring-shaped endless belt.

Abstract: A metal abrasive belt is used to grind, debur, sand, cut, finish or otherwise abrade a workpiece. The metal abrasive belt includes a continuous metal belt and abrasive particles electroplated onto at least a portion of an outer surface of the continuous metal belt. The abrasive particles are electroplated by electrochemically depositing an electroplating matrix, such as a Nickel matrix, in the presence of abrasive particles, such as diamond or Cubic Boron Nitride particles. The abrasive particles can be electroplated to form selected abrasive and non-abrasive regions on the continuous metal member, for example, by masking selected regions of the continuous metal belt. One embodiment of the metal abrasive belt includes one or more perforations extending through the continuous metal belt. The perforations facilitate cooling and allow swarf to pass through the continuous metal belt while abrading a workpiece.

Abstract: Tooling for applying an abrasive belt on a machine for abrasive belt machining of cylindrical bearing surfaces comprises, for each bearing surface to be machined, an arm and three abrasive belt application shoes a first of which is mounted in a top median position on the arm and the other two of which are mounted in a bottom lateral position on two jaws articulated to the arm and coupled together in such manner that they can be clamped together. The arm carries a first shoe having a concave abrasive belt application surface subtending an angle greater than 90.degree. and less than 180.degree. and a gauge with two opposed and horizontally aligned sensors and each jaw carries a second shoe having a concave abrasive belt application surface subtending an angle slightly less than 90.degree. whereby when clamped around the bearing surface to be machined the three shoes together envelope the bearing surface to be machined over an angle of at least 270.degree.