Roll, Roller, Shaft, Ball, Or Piston Abrading Patents (Class 451/49)
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Patent number: 6616511Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.Type: GrantFiled: June 5, 2001Date of Patent: September 9, 2003Assignee: Hitachi, Ltd.Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
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Patent number: 6609997Abstract: A rotary die cuter for a box making machine has an abrading cylinder mounted for rotation alongside the anvil for engaging and resurfacing the blanket of the anvil on a virtually continuous basis to smooth, level and even the surface of the blanket. This resurfacing occurs during normal operation of the rotary die cutter so no production is lost. The abrading cylinder has a sheet layer of abrasive material spirally wrapped on the surface of the cylinder and bonded thereto with adhesive material on the backside of the sheet layer. The abrading cylinder is movable towards or away from the anvil by a servo motor and gearbox. The position of the abrading cylinder relative to the anvil is determined by an encoder which sends the information to a computer or programmable controller which calculates the changing diameter of the blanket and the amount of speed change that must be imparted to the anvil to compensate for its changing diameter.Type: GrantFiled: December 23, 1999Date of Patent: August 26, 2003Assignee: Sun Automation Inc.Inventors: Louis M. Sardella, Yury Polikov
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Publication number: 20030139120Abstract: A grinding machine rotatably carrying a finish grinding wheel and a super-finish grinding wheel respectively on first and second wheel heads practices a method of grinding workpiece surfaces to super-finish surfaces with micro oil pockets. A surface of a workpiece rotatably carried on the machine is first ground with the finish grinding wheel to a predetermined diameter under the control of a sizing device. The workpiece surface is then ground with the super-finish grinding wheel to a target diameter under the control of a sizing device. The super-finish grinding is performed to the extent that peaks of a section curve representing the roughness of the workpiece surface attained by the finish grinding are removed but bottoms of the surface curve are left to a depth when the target diameter is reached, so that the bottoms so left of the roughness constitute the micro oil pockets.Type: ApplicationFiled: September 26, 2002Publication date: July 24, 2003Applicant: TOYODA KOKI KABUSHIKI KAISHAInventors: Naoki Ito, Mamoru Katsuta, Shinji Soma, Kazuhisa Sugiyama
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Patent number: 6589103Abstract: The invention relates to a device for the finishing treatment of shaft workpieces, in particular crankshafts and camshafts. The device comprises a carrier, at least one jaw for exerting contact pressure on the workpiece, and a linear guide for guiding the jaw. The linear guide is supported by a transverse guide to form a cross guiding system which follows the rotational motion of the workpiece by revolving around its axis of rotation. The transverse guide contains a main carriage guided on the carrier. The main carriage is radially aligned with respect to the axis of rotation of the workpiece. The main carriage has a fork-shaped head facing towards the side of the workpiece. A guide rail for the linear guide is chucked between the between the legs of the fork-like head.Type: GrantFiled: March 1, 2001Date of Patent: July 8, 2003Assignee: Ernst Thielenhaus GmbH & Co. KGInventors: Werner Max Müller, Andreas Thölke
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Patent number: 6582284Abstract: A method of superfinishing the cylindrical surface of a part which is intended to be mounted in circular guides and to be moved in translation along its axis relative to the guides places an abrasive applicator wheel so that its axis is perpendicular to the axis of the part and its lateral surface is pressed against the cylindrical surface. The wheel is driven in rotation about its axis and the part and/or the wheel is driven simultaneously by movement in translation along the axis of the part and rotation about the axis at speeds such that the whole of the cylindrical surface is abrasively machined longitudinally along a helical trace whose successive turns overlap. Applications include steering racks for automobiles, for example.Type: GrantFiled: February 28, 2001Date of Patent: June 24, 2003Assignee: Societe des Procedes et Machines SpecialesInventors: Richard Bonachera, Raymond Millot
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Publication number: 20030109203Abstract: A method of forming a recess in a body having a surface of substantially cylindrical form utilises a grinding wheel having a first axis in the form of a drive axis, and a circumferential surface concave to a second axis that is substantially orthogonal to the first axis. The grinding wheel also includes first and second opposing radial surfaces of substantially planar form. At least a portion of the circumferential surface of the grinding wheel is engaged with an outer surface of the body and the grinding wheel is rotated about the drive axis to cause a region of the body to be ground, thereby to define a recess in the body having a periphery including at least two substantially square corners and at least one pair of substantially parallel facing edges. The method is conveniently used to provide an opening or port of at least partially square or rectangular form in a cylindrical body such as a metering valve.Type: ApplicationFiled: November 25, 2002Publication date: June 12, 2003Inventor: Geoffrey David Bootle
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Patent number: 6572447Abstract: A method of forming a base body for a diamond bit having a tubular carrier body (2, 12) with a bottom (4), and a shank (1, 11) projecting from the bottom (1), with the carrier body (2, 12) and the bottom being produced by a spinning process.Type: GrantFiled: August 21, 2001Date of Patent: June 3, 2003Assignee: Hilti AktiengesellschaftInventors: Günther Veik, Achim Ruf, Christoph Laumen
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Patent number: 6565417Abstract: An apparatus for grinding a glass base material having a core and a clad comprising: a grinding wheel for grinding the clad; a measuring unit for measuring an eccentricity between a center position of the glass base material and a center position of the core at a plurality of positions along a longitudinal direction of the glass base material; a design unit for calculating target diameters substantially continuous throughout the longitudinal direction of the glass base material so that the eccentricity becomes substantially zero for each of the plurality of positions; and a control unit for controlling the grinding wheel to grind the clad so that a diameter of the glass base material to be the target diameter substantially continuous throughout the longitudinal direction of the glass base material based on the target diameters calculated by the design unit.Type: GrantFiled: October 25, 2001Date of Patent: May 20, 2003Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hirofumi Kase, Hiroyuki Koide
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Patent number: 6561882Abstract: A circular or non-circular workpiece is ground in a plurality of grinding steps, including a final finish grinding step. A grinding wheel is caused to effect profile generation movement in synchronism with rotation of the workpiece and in accordance with profile data derived from the target shape of the workpiece. In each grinding step, the grinding wheel is advanced in such a manner that the grinding wheel causes cut-in movement within a predetermined cut-in angle defined on the workpiece. After completion of the final finish grinding step, the grinding wheel is retracted over a predetermined back-off angle defined on the workpiece. The retraction is effected in accordance with composite data obtained through combining the profile data and back-off data. The back-off angle is greater than the cut-in angle employed during the final finish grinding step.Type: GrantFiled: March 19, 2002Date of Patent: May 13, 2003Assignee: Toyoda Koki Kabushiki KaishaInventors: Yoshihiro Mizutani, Masashi Yoritsune, Ryohei Mukai
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Publication number: 20030083000Abstract: The method of preparing cold mill work rolls for forming a surface finish on a metal substrate includes the steps of placing a work roll on a grinder, truing the work roll, roughening the work roll, and performing at least one finishing pass on the work roll. The method may further include the step of sanding the work roll. The finished work roll may be inserted into a cold mill and the metal substrate cold rolled with the work rolls to achieve the desired surface finish.Type: ApplicationFiled: October 9, 2002Publication date: May 1, 2003Inventors: Errol Sambuco, Rich Hesske, John McCulley, Robert Jay Ciszewski
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Patent number: 6547648Abstract: This invention is a process and device for high speed electrolytic in-process dressing (HELID). The device of the present invention may be provided as an add on to an existing grinding machine or may be integrated into a grinding machine as a subsystem. Grinding machines which are subject to the present invention include, but are not limited to, surface, cylindrical, centerless and double-disk grinding machines.Type: GrantFiled: October 13, 2000Date of Patent: April 15, 2003Assignee: Trustees of Stevens Institute of Technology - Graduate School and Research ServicesInventors: Zhenqi Zhu, Xiaoming Liu
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Patent number: 6544108Abstract: A surface finishing apparatus for in-line outer surface polishing of elongate cylindrical metal stock to apply a long scratch finish, including a stock feeder for feeding a length of stock through the finishing apparatus from an infeed downstream to an outfeed position while rotating the stock about its longitudinal axis and a polishing assembly for finish-treating the outer surface of the stock as the stock is fed through the apparatus to apply a long scratch finish thereto. The polishing assembly includes a rotatable finishing wheel having a finish-treating peripheral surface for being applied in an in-line orientation against the outer surface of the stock as the stock is simultaneously fed and rotated through the finishing apparatus.Type: GrantFiled: September 21, 2001Date of Patent: April 8, 2003Inventor: Thomas E. McCoy
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Patent number: 6530148Abstract: The present invention provides a method for sanding heads of buckling beam probes while the probes are disposed within a probe assembly between a lower die and upper die. Sanding provides that all the probes within a probe assembly have the same total length from tip to head. The method calls for contacting the probe tips to a flat fiducial plate such as a glass plate to ensure that the probe tips are coplanar. Then, the heads are sanded to a plane which is parallel with the fiducial plate. Preferably, the heads are sanded by placing the assembly and fiducial plate onto a Z-stage capable of moving in a Z direction. The Z-stage is located under a top surface of a table having a hole directly above the Z-stage. Raising the Z-stage lifts the probe heads to extend above the top surface of the table. Then, an abrasive plate resting on the top surface of the table is rubbed on the heads. Material is removed from the heads until all the probes are the same length.Type: GrantFiled: May 26, 2000Date of Patent: March 11, 2003Assignee: Kulicke and Soffa Investments, Inc.Inventor: January Kister
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Publication number: 20030045215Abstract: A grinding operation is effected by rotating the motor hub in high speed around the central axis thereof, and urging the outer peripheral surface of a grinding wheel rotated in high speed around the central axis against the upper surface of the outwardly extending flange for supporting on its upper surface the lower surface of the central portion of the magnetic disk. The surface of the flange can be worked in high precision. Thus, a compact, large capacity, and reliable hard disk drive apparatus is to be provided by reducing the rotational runout of the magnetic disk incorporated within the hard disk drive apparatus.Type: ApplicationFiled: August 27, 2002Publication date: March 6, 2003Applicant: Minebea Kabushiki-kaishaInventor: Rikuro Obara
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Patent number: 6524169Abstract: Method for manufacturing tubes especially for fuel elements and tubes for construction of fuel rod skeletons made of zirconium-based alloy for nuclear reactors and a tube made thereby. The tubes are ground to a surface roughness of ≦0.2 &mgr;mRa with a belt device of SiC-based belts, so-called “dressed” SiC-based belts with cotton back or SiC-cork belts. The tubes may possibly be polished after grinding with a wheel to a surface roughness <0.25 &mgr;mRa.Type: GrantFiled: October 1, 2001Date of Patent: February 25, 2003Assignee: Sandvik ABInventors: Thomas Andersson, Leif Söderqvist
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Publication number: 20030022602Abstract: A surface finishing apparatus for in-line outer surface polishing of elongate cylindrical metal stock to apply a long scratch finish, including a stock feeder for feeding a length of stock through the finishing apparatus from an infeed downstream to an outfeed position while rotating the stock about its longitudinal axis and a polishing assembly for finish-treating the outer surface of the stock as the stock is fed through the apparatus to apply a long scratch finish thereto. The polishing assembly includes a rotatable finishing wheel having a finish-treating peripheral surface for being applied in an in-line orientation against the outer surface of the stock as the stock is simultaneously fed and rotated through the finishing apparatus.Type: ApplicationFiled: September 21, 2001Publication date: January 30, 2003Inventor: Thomas McCoy
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Patent number: 6511364Abstract: On a grinding machine, a workpiece having eccentric cylindrical portions is rotated around the work spindle axis so that the eccentric cylindrical portions effects a planetary motion. A grinding wheel is reciprocated toward and away from the work spindle axis in synchronism with the planetary motion and is also fed toward the work spindle axis to grind the eccentric cylindrical portion into a target cylindrical profile. Upon completion of a part of the grinding operation, the eccentric cylindrical portion under machining is indexed to a predetermined angular position. A diameter measuring device is moved from its rest position to a measuring position to measure the diameter of the eccentric cylindrical portion.Type: GrantFiled: April 4, 2002Date of Patent: January 28, 2003Assignee: Toyoda Koki Kabushiki KaishaInventors: Masahiro Ido, Kikutoshi Okada
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Patent number: 6508845Abstract: A method and apparatus for precoining a ball grid array (BGA) type package prior to electrical characterization of the package employs a heated pressing plate with a smooth, flat bottom. The heated pressing plate is controllably pressed against a plurality of solder balls attached to a chip scale package. The heated pressing planarizes the tops of the solder balls, thereby evening out height differences among the solder balls. With the height differences evened out, a grounding plate of a test fixture can be applied on the array of solder balls and reliably contact each of the solder balls that are to be grounded, regardless of their initial height differences.Type: GrantFiled: May 22, 2002Date of Patent: January 21, 2003Assignee: Advanced Micro Devices, Inc.Inventor: Eric S. Tosaya
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Publication number: 20030013388Abstract: A method and apparatus for simultaneously inspecting and grinding roll mills which utilizes a transducer assembly which produces a creeping wave propagation in conjunction with a couplant fluid provider and data acquisition circuit which allows the operator to see the crack and imperfections in on the surface of the mill rolls as they are rotated and to grind them off.Type: ApplicationFiled: June 29, 2001Publication date: January 16, 2003Inventor: Jonathan D. Buttram
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Patent number: 6506103Abstract: An ELID centerless grinding apparatus comprising: a blade 2 for horizontally supporting a rotator workpiece 1 and and a regulating wheel 10 driven to rotate around a horizontal shaft center. An outer surface of the workpiece is subjected to ELID grinding by using a conductive grinding wheel 4. An outer peripheral portion of the wheel 10 includes a conductive elastic member 11 and abrasion resisting particles 12. An electrolytic electrode 14 is provided in close vicinity to an outer peripheral surface of the wheel 10. An electrolytic power supply 16 applies an electrolytic voltage between the electrolytic electrode and the wheel. A conductive electrolytic fluid is flow between the electrode and the wheel and the member 11 is removed by the electrolytic dressing to cause the abrasion resisting particles 12 to project, while the particles 12 are brought into contact with the outer peripheral surface of the workpiece 1 to rotate around its shaft center.Type: GrantFiled: July 21, 2000Date of Patent: January 14, 2003Assignee: RikenInventors: Hitoshi Ohmori, Nobuhide Itoh
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Publication number: 20030008601Abstract: A porous, roll-grinding tool has an abrasive surface which is adapted to contact and grind the surface of a roll and configured to a planar polygonal shape having 4 to 20 sides. Using the grinding tool, a roll can be ground within a satisfactory dimensional tolerance, with feed marks crossing the circumferential direction of the roll at a small feed mark pitch inclination angle, so that no streaky printing defects will be produced when the ground roll is used in printing.Type: ApplicationFiled: June 28, 2002Publication date: January 9, 2003Applicant: SHINANO ELECTRIC REFINING CO., LTD.Inventors: Noukou Toyama, Kenichi Kazama
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Patent number: 6503128Abstract: A grinding attachment for use in conjunction with hand-held grinding or drilling power tools such as are commonly found around the house, and method for using this attachment. The purpose of the invention is to allow the homeowner and the like to have greater facility in performing surface sanding, grinding, or finish work on pieces of wood and the like. In particular, the goal is to provide proficiency in working with surfaces that are not planar or otherwise simple. By providing an appropriate compound support against which an abrasive belt or the like is to run as it works the surface, it is possible to have a variety of backing shapes ranging from a strictly planar backing to one that allows the abrasive material to take the shape of whatever piece is being pressed against it. The invention derives its motive power from a coupling to a power tool, typically by the insertion of a drive axle of the attachment into the chuck of a hand drill.Type: GrantFiled: June 7, 2000Date of Patent: January 7, 2003Inventors: William R. Deware, William L. Andrews
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Patent number: 6503127Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.Type: GrantFiled: July 30, 2001Date of Patent: January 7, 2003Assignee: Micron Technology, Inc.Inventor: David R. Hembree
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Publication number: 20020187734Abstract: An improved cam and follower arrangement suitable for actuating, for example, poppet valves of an internal combustion engine and method and apparatus for forming the cam surface. This permits the use of skewed valve axes without using multiple rocker arms for each valve. The shapes are chosen and formed to provide better contact area and permits the cams to be ground with conventional grinding methods and for multi-cylinder engines.Type: ApplicationFiled: June 12, 2002Publication date: December 12, 2002Inventors: Yuji Saiki, Naoki Tsuchida, Mitsuo Tsuchiya
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Patent number: 6485353Abstract: A grinding machine has a wheelhead movable tinder computer control perpendicular to the axis of a composite workpiece, mounted between a headstock and a tailstock, and workrests slidable along front and rear rails. Between the workrests are sandwiched rigid cover-spacers to protect the rails and prevent lateral movement of the workrests. A spring-operated thrust bar may be supported against a fixed dressing wheelhead to clamp the stack of cover-spacers and workrests together, in order to accurately locate and space apart the workrests.Type: GrantFiled: February 20, 2001Date of Patent: November 26, 2002Assignee: UNOVA U.K. LimitedInventors: Michael Laycock, Ian David Locker
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Publication number: 20020168925Abstract: An apparatus is provided for polishing balls that comprises a cradle that is supported for rotation about a first axis. The cradle is shaped to support a spherical object and includes a ball spinner positioned and adapted to spin the spherical object in the cradle about a second axis that is oriented at an angle to the first axis. The apparatus also comprises a first drive operably connected to the cradle for rotating the cradle about the first axis at a first speed of rotation, and a second drive connected to the ball spinner to spin the spherical object about the second axis at a second speed of rotation.Type: ApplicationFiled: July 2, 2002Publication date: November 14, 2002Inventor: Edward O. Klukos
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Patent number: 6468138Abstract: A porous, roll-grinding tool has an abrasive surface which is adapted to contact and grind the surface of a roll and configured to a planar polygonal shape having 4 to 20 sides. Using the grinding tool, a roll can be ground within a satisfactory dimensional tolerance, with feed marks crossing the circumferential direction of the roll at a small feed mark pitch inclination angle, so that no streaky printing defects will be produced when the ground roll is used in printing.Type: GrantFiled: July 1, 1999Date of Patent: October 22, 2002Assignee: Shinano Electric Refining Co., Ltd.Inventors: Noukou Toyama, Kenichi Kazama
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Patent number: 6467150Abstract: In a stepping motor in which a cylindrical magnet 3 which is magnetized in an axial direction is coupled with a rotary shaft and said magnet is clamped with rotor stacks 4, 5 formed by laminating annular magnetic plates the surfaces of which are electrically insulated to form a rotor, and around the outer circumference of the rotor stator cores which are wound with stator coil are disposed, a sleeve 15 is pressed in between the magnet 3 and the rotor stacks 4, 5, and the rotary shaft and interposed therebetween. The cutting operation for the outer diameter during the manufacturing processes is carried out while holding both ends of the sleeve 15, subsequently the rotary shaft is inserted, thereby, regardless of the length of the rotary shaft, the manufacturing processes are carried out to reduce the number of the molds.Type: GrantFiled: July 24, 2000Date of Patent: October 22, 2002Assignee: Minebea Co., Ltd.Inventor: Naoto Tanaka
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Publication number: 20020142708Abstract: A system (10) for polishing a wheel (W) includes a spindle (29) to carry the wheel (W). A motor (31) rotates the spindle (29) to rotate the wheel (W). A cut/buff polishing wheel (42) receives an abrasive compound on its periphery from a spray gun (44) and is positioned so as to sequentially operate upon various portions of the wheel (W). A color/buff polishing wheel (43) receives a polishing compound from a dispenser (46) and applies it to the wheel (W) upon sequentially operating on various portions of the wheel (W). A plurality of systems (10) may be provided in a chamber (11) which has an evacuation housing (21) positioned adjacent thereto to evacuate debris resulting from the polishing of the wheels (W).Type: ApplicationFiled: April 2, 2001Publication date: October 3, 2002Applicant: B & C CorporationInventors: Louis P. Bilinovich,, Isaac Yeboah
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Patent number: 6450865Abstract: A support for supporting a work piece to be machined is provided. The support is for use in a machine adapted to receive fluid from a fluid source. The machine includes a tool for removing material from the work piece. The support includes a body defining a chamber therein and an inlet operably associated with said body. The inlet is in communication with the chamber. The inlet is adapted for communication with the fluid source. The support also includes an outlet operably associated with the body and in communication with the chamber. The outlet is adapted to provide a stream of fluid for supporting the work piece.Type: GrantFiled: May 7, 2001Date of Patent: September 17, 2002Assignee: Xerox CorporationInventors: Grethel K. Mulroy, Thomas L. DiGravio, Steven M. Sippel
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Patent number: 6450861Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.Type: GrantFiled: July 27, 2001Date of Patent: September 17, 2002Assignee: Hitachi, Ltd.Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
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Patent number: 6439974Abstract: The driving device for a circular grinding machine where the workpiece is driven between two stationary centers comprises a driven device allowing a removable attachment of a driver which is adapted to hold and turn the workpiece by means of elastic force. The driver comprises two adjacent, symmetrically disposed annular spring elements whose junction is provided with a through-going opening which forms two prismatic workpiece holders, as well as respective longitudinal openings disposed in the axis of the points of the prismatic workpiece holders which are provided with prismatic ends for receiving respective, correspondingly shaped bolts of the driven device of the circular grinding machine in order to spread apart the spring elements. A driver of this kind offers a reduced weight, on one hand, and a high precision, on the other hand, and it is particularly adapted for grinding small precision parts.Type: GrantFiled: July 6, 1999Date of Patent: August 27, 2002Assignee: Fritz Studer AGInventors: Erwin Roth, Ulrich Muehlematter
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Publication number: 20020115390Abstract: A method for cutting a rare earth alloy using a wire with abrasive grains fixed to a core wire, including the step of cutting the rare earth alloy with the wire traveling in a state that a portion of the rare earth alloy to be cut with the wire is immersed in a coolant containing water as the main component, the coolant having a surface tension at 25° C. in a range of 25 mN/m to 60 mN/m.Type: ApplicationFiled: November 23, 2001Publication date: August 22, 2002Inventors: Sadahiko Kondo, Akira Miyachi, Hazime Ishida
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Publication number: 20020115391Abstract: In centerless grinding there are the in-feed and the through-feed scheme, each having their respective advantages and disadvantages.Type: ApplicationFiled: February 4, 2002Publication date: August 22, 2002Inventors: Yukio Yamaguchi, Mohee Sagae
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Patent number: 6431951Abstract: Upper and lower working rolls 2a, 2b are ground while moving respective grindstone devices 3a, 3b in reverse directions, whereby the region of grinding for the upper working roll 2a and that for the lower working roll 2b are maintained in symmetry with respect to the center of rolls, one on the operating side and the other on the driving side. By this arrangement, it is possible to equalize the coefficients of friction on the operating side and the driving side, and to prevent meandering of the rolling stock 6 as well as drawing (squeezing) or bad product shape due to the meandering from occurring. The timings to start grinding by the grindstone devices 3a, 3b are set to be substantially the same, and the velocities of movement of the grindstone devices 3a, 3b in the axial direction of the working rolls are set to be equal, whereby the difference in frictional coefficient due to grinding in the longitudinal direction of the rolls can stably be kept small.Type: GrantFiled: January 25, 2001Date of Patent: August 13, 2002Assignee: Hitachi, Ltd.Inventors: Mitsuru Onose, Shigeru Mori
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Patent number: 6431963Abstract: A grinder in a tire uniformity machine that receives a tire for testing, the grinder including an arm received in bearings; a grinding head supported on the arm, the grinding head having a rotatable grinding stone and a motor causing the rotation of the grinding stone; and a linear actuator operatively engaging the arm to selectively cause axial movement thereof causing the grindstone to selectively contact the tire.Type: GrantFiled: October 4, 2000Date of Patent: August 13, 2002Inventors: Richard L. Delmoro, Dave Krause, David Poling, Sr.
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Patent number: 6422919Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.Type: GrantFiled: July 19, 2001Date of Patent: July 23, 2002Assignee: Micron Technology, Inc.Inventor: David R. Hembree
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Patent number: 6422923Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.Type: GrantFiled: July 19, 2001Date of Patent: July 23, 2002Assignee: Micron Technology, Inc.Inventor: David R. Hembree
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Patent number: 6419563Abstract: A machining apparatus simultaneously machining at least two portions of one workpiece is disclosed. The machining apparatus includes a worktable unit for rotatably driving workpiece, at least two tool heads each of which supports a tool and moves forward to or away from the workpiece, at least two gauging units measuring a diameter of each portion, and control unit controlling motion of each wheel head individually. The control unit controls motions of the wheel heads in according to signals provided from the gauging units, wherein controls all of tool heads to execute a finish grinding process, controls one tool head corresponding to one portion whose diameter became a required value to back off, and controls all of tool heads to execute a spark-out process after diameters of all of the portions became each required value. Therefore, it can prevent that accuracy of one portion machined by one tool head is deteriorated by effect of machining by another wheel head.Type: GrantFiled: September 29, 2000Date of Patent: July 16, 2002Assignee: Toyoda Koki Kabushiki KaishaInventors: Masahiro Ido, Kenji Matsuba, Yasunari Oda
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Patent number: 6419550Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.Type: GrantFiled: July 19, 2001Date of Patent: July 16, 2002Assignee: Micron Technology, Inc.Inventor: David R. Hembree
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Patent number: 6416399Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member, Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.Type: GrantFiled: July 19, 2001Date of Patent: July 9, 2002Assignee: Micron Technology, Inc.Inventor: David R. Hembree
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Patent number: 6416386Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.Type: GrantFiled: July 5, 2001Date of Patent: July 9, 2002Assignee: Micron Technology, Inc.Inventor: David R. Hembree
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Patent number: 6416396Abstract: A grinding apparatus for grinding away sharp edges on an end of a textile package having an inner edge and a spaced-apart outer edge formed on the end of the package. The apparatus has a base, a first grinding element mounted on the base for movement relative to the textile package and having a grinding surface with an angle oblique to the inner edge of the textile package for being urged against the inner edge of the textile package, and a second grinding element mounted on the base for movement relative to the textile package and having a grinding surface angle with an angle oblique to the outer edge of the textile package for being urged against the outer edge of the textile package. According to one preferred embodiment of the invention, a third grinding element is mounted on the base for movement relative to the textile package. The third grinding element has a grinding surface for engaging and grinding the end of the textile package between the inner and outer edges.Type: GrantFiled: March 1, 2001Date of Patent: July 9, 2002Assignee: Conitex-Sonoco LLCInventor: José A. Ganan
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Patent number: 6416395Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.Type: GrantFiled: November 17, 2000Date of Patent: July 9, 2002Assignee: Micron Technology, Inc.Inventor: David R. Hembree
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Patent number: 6416398Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.Type: GrantFiled: July 17, 2001Date of Patent: July 9, 2002Assignee: Micron Technology, Inc.Inventor: David R. Hembree
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Patent number: 6416397Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.Type: GrantFiled: July 5, 2001Date of Patent: July 9, 2002Assignee: Micron Technology, Inc.Inventor: David R. Hembree
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Patent number: 6416388Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.Type: GrantFiled: July 18, 2001Date of Patent: July 9, 2002Assignee: Micron Technology, Inc.Inventor: David R. Hembree
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Patent number: 6416387Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.Type: GrantFiled: July 17, 2001Date of Patent: July 9, 2002Assignee: Micron Technology, Inc.Inventor: David R. Hembree
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Patent number: 6413873Abstract: A semiconductor substrate processing system for polishing a substrate that generally includes a platen and a web of polishing material disposed thereon. Embodiments of the system include a disposable cartridge for housing the web of polishing material, a shield member disposed proximate the web for preventing contamination of the unused portion of the web, a fluid delivery for fixing and freeing the web from the platen, apparatus for controlling the lateral movement of the web, and an apparatus for providing more linear feet of polishing material per height of a roll.Type: GrantFiled: May 3, 2000Date of Patent: July 2, 2002Assignee: Applied Materials, Inc.Inventors: Shijian Li, John M. White, Lawrence M. Rosenberg, Martin Scales, Ramin Emami, James V. Tietz, Manoocher Birang
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Publication number: 20020054801Abstract: The present invention relates to a method and a device in the chip-removing machining of a work-piece by means of a rotatable tool with a shaft arranged in a headstock. The tool is displaceable in an axial direction both towards and away from the work-piece, and in a plane substantially perpendicular to the arbor. Arranged around a machining point is an enclosure. The enclosure has a first opening that is designed to press tightly against the work-piece around the point to be or being machined. A second opening in the enclosure is made in a wall substantially perpendicular to the shaft. This opening is designed, during machining, to press tightly against a plane plate arranged behind the tool and around the headstock, substantially perpendicular to the arbor, so that during machining there is a substantially enclosed space in the area around the tool and the machining point. The device includes means of delivering cutting fluid to the machining point.Type: ApplicationFiled: November 28, 2001Publication date: May 9, 2002Applicant: Volvo Car CorporationInventors: Klas-Arne Lof, Mats Andersson