Abstract: In accordance with an embodiment, a polishing method includes supplying slurry to a surface of a polishing layer including a polymer, and bringing a polishing object into contact with the polishing layer to polish the polishing object. The polishing layer has a fibrous first substance mixed therein or contains a second substance. The second substance is higher in specific heat and higher in thermal conductivity than the polymer in such a manner that the second substance is surrounded by the polymer.

Abstract: Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Abstract: A tool for the polishing of an optical surface has a base which has an active surface facing the optical surface. An intermediate layer is arranged on the active surface of the base. A polishing agent carrier is arranged on the elastic intermediate layer. The elastic intermediate layer projects radially beyond the active surface of the base and the polishing agent carrier projects radially beyond the elastic intermediate layer.

Abstract: A chemical mechanical polishing pad includes a polishing layer, a recess being formed in a polishing surface of the polishing layer, the polishing layer including a surface layer that forms at least an inner side of the recess, and a ratio (D1/D2) of an average opening ratio D1(%) to an average opening ratio D2(%) being 0.01 to 0.5, the average opening ratio D1 being an average opening ratio of the inner side of the recess when the polishing layer has been immersed in water at 23° C. for 1 hour, and the average opening ratio D2 being an average opening ratio of a cross section of the polishing layer that does not intersect the surface layer when the cross section has been immersed in water at 23° C. for 1 hour.

Abstract: A surface treating device includes an open lofty non-woven layer (1) and a woven layer (2). The non-woven layer and woven layer have facing sides (5, 6) which are adhered to each other. A plurality of abrasive segments (3) is adhered to the woven layer on the side (7) of the woven layer (2) which faces away from the non-woven layer (1). Thus, the abrasive segments are held in a stable manner so as to better withstand the frictional forces exerted thereon during service.

Abstract: An abrasive article includes a substrate comprising an elongated body, a first type of abrasive particle overlying the substrate, a bonding layer overlying the first type of abrasive particle, and a lubricious material overlying or integrated within the bonding layer.

Abstract: Provided is a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad. In one embodiment, the polishing pad comprises a polishing layer produced by applying to the subpad a hardenable fluid. In another embodiment, the subpad is coated with a barrier before coating with the hardenable fluid. In each embodiment, the depth of penetration of the polishing layer and/or barrier is substantially uniform. Also provided is a method of producing a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad.

Abstract: A structure for a backing plate of an abrasive disk is disclosed. The structure includes layers of abrasive resin interspersed with layers of reinforcing fiberglass. The layers are generally disk shaped and cover certain radial intervals of the entire backing plate between the inner diameter and the outer diameter. For example, a radial stress profile plotting the stress along a radial line from inner to outer diameter can be determined. The amount and radial positioning of reinforcing layers (e.g., reinforcing fiberglass) may then be determined. An appropriate amount of reinforcing layers may then be placed within the radial intervals that experience the highest stress.

Abstract: Methods of fabricating polishing pads with end-point detection regions for polishing semiconductor substrates using eddy current end-point detection are described.

Abstract: Abrasive articles comprising a reduction layer configured to reduce noise level when the abrasive articles are in use.

Abstract: The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a plurality of polishing elements (402, 502, 602, 702). The polishing elements (402, 502, 602, 702) are aligned in a vertical direction and having a first and a second end. A plurality of junctions (404, 510, 610, 710) connects the first and second ends of the polishing elements (402, 502, 602, 702) with at least three polishing elements at each of the plurality of junctions (404, 510, 610, 710) for forming a tier. Each tier representing a thickness in the vertical direction between the first and second ends of the polishing elements (402, 502, 602, 702). And an interconnected lattice structure (400, 600) forms from connecting sequential tiers of the plurality of junctions (404, 504) that connect the polishing elements (402, 502, 602, 702).

Abstract: An abrasive disc comprises a disc substrate having a peripheral portion, plural abrasive chips each having an abrasive layer on a metal piece and being arranged in the peripheral portion of the disc substrate with a predetermined space, a suspension plate placed between the disc substrate and abrasive chips, and an elastic sheet placed between the disc substrate and the suspension plate so as to isolate the disc substrate from the suspension plate in order to absorb mechanical shock generated in operation of the abrasive disc. The abrasive chips are fastened to the suspension plate. Each of the abrasive chips has abrasive surfaces including a top abrasive surface and peripheral surfaces and the outer peripheral portion and the inner peripheral portion are declined to the top surface.

Abstract: A polishing tool comprising a support member, and polishing means fixed to the support member. The polishing means is composed of felt having a density of 0.20 g/cm3 or more and a hardness of 30 or more, and abrasive grains dispersed in the felt. A polishing method and apparatus involving pressing the polishing means against a surface of a workpiece to be polished, while rotating the workpiece and also rotating the polishing tool.

Abstract: The invention concerns a sanding element with a succession of overlapping lamellas (3, 4) containing sanding grains (9), characterized in that these lamellas (3, 4) are alternately formed of sanding lamellas (3) and compressible lamellas (4), whereby each sanding lamella (3) rests on a compressible lamella (4).

Abstract: A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt.

Abstract: An abrasive article comprises a porous abrasive member, a nonwoven filter medium, and a porous attachment fabric. A plurality of openings in the porous abrasive member cooperates with the nonwoven filter medium to allow the flow of particles from an outer abrasive surface of the porous abrasive member to the porous attachment fabric. Methods of making and using the abrasive articles are included.

Abstract: The invention concerns a sanding element with a succession of overlapping lamellas (3, 4) containing sanding grains (9), characterised in that these lamellas (3, 4) are alternately formed of sanding lamellas (3) and compressible lamellas (4), whereby each sanding lamella (3) rests on a compressible lamella (4).

Abstract: A sanding block includes a compressible core having at least one pair of sides characterized such that an abrasive material is adhered to said sides substantially along the surface thereof and having a juncture area defined between said two sides which does not have said abrasive material adhered thereto such that the abrasive material does not run continuously about the sides of the core thereby providing the two sides to be readily compressed toward one another. A method of forming the same is also provided.

Abstract: The invention is directed to a polishing pad for use in chemical-mechanical polishing comprising a biodegradable polymer. The biodegradable polymer comprises a repeat unit selected from the group consisting of glycolic acid, lactic acid, hydroxyalkanoic acids, hydroxybutyric acid, hydroxyvaleric acid, caprolactone, p-dioxanone, trimethylene carbonate, butylene succinate, butylene adipate, monosaccharides, dicarboxylic acid anhydrides, enantiomers thereof, and combinations thereof. The invention is further directed to methods of its use.

Abstract: A polishing pad has a working layer provided with an abrasive powder, an attaching layer for attaching a pad to a polishing head of a power tool, and a connection layer which connects the working layer with the attaching layer, the connection layer being located between the working and the attaching layer and having a peripheral region which is thinner and also a central region which is thicker than the peripheral region and therefore has an increased elasticity so that during polishing an elasticity of a central portion of the working layer is increased.

Abstract: A method is described for surface finishing complex and simple surface shapes by abrasion of selected zones of surface, leaving contiguous zones unfinished.

Abstract: The present invention provides a flexible abrasive product comprised of an open cell foam backing, a foraminous barrier coating and a shaped foraminous abrasive coating.

Abstract: A polishing body, e.g., pad (200, 230, 260, 300) or belt (400, 500) having a polishing layer (214, 404) that includes a backmixing region (202, 232, 262, 308, 416, 508) wherein backmixing can occur within a slurry (116) between a wafer (204, 234, 264, 304, 408), or other article, and the polishing layer under certain conditions. The polishing layer includes a first groove configuration (206, 236, 266, 312, 428, 504) within the backmixing region and a second grove configuration (208, 238, 268, 320, 432, 520) outside of the backmixing region that is different from the first groove configuration. The first groove configuration is designed based upon whether or not the presence of spent slurry within the backmixing region is detrimental or beneficial to polishing the wafer.

Abstract: Provided is a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad. In one embodiment, the polishing pad comprises a polishing layer produced by applying to the subpad a hardenable fluid. In another embodiment, the subpad is coated with a barrier before coating with the hardenable fluid. In each embodiment, the depth of penetration of the polishing layer and/or barrier is substantially uniform. Also provided is a method of producing a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad.

Abstract: A spiral wound abrasive belt is formed from an abrasive media including a plurality of webs. The webs of the abrasive media may include coated abrasives joined by splicing media or other suitable joining material. Alternatively, the webs may include individual single or multiple layers that form a coated abrasive simultaneously along with the spiral belt without the use of additional joining material. A method of forming the spiral belt includes draping the abrasive media over a fixed hub at an angle to form the spiral belt while abutting the edges of the outermost web and overlapping the outermost web and adjacent web or webs. Heat and pressure may be applied to the joined edges to form a strong bond along the spiral seam. Another method includes introducing the webs forming the abrasive media at an angle and draping the webs over a fixed hub. The abrasive media may then be passed around an adjustable hub that provides tension in the spiral belt while allowing for different circumferentially sized belts.

Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.

Abstract: A polishing pad includes a polishing layer and an adhesive layer. An adhesive bottom surface of the adhesive layer has an air transmitting pathway to collect air that is expelled from under the adhesive bottom surface, which avoids entrapment of air under the adhesive bottom surface.

Abstract: A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, or may be created by removing a complete vertical section of the pad. The injected polymer forms an integral window with the pad by flowing into the matrix of the pad at the pad/window interface. No additional reinforcement is required to hold the window in place; however, adhesive and/or another impervious layer may be attached behind the window for additional support. In an alternative embodiment, a separate and distinct window-plug is inserted into a cutout section of the pad, and bonded to the pad by one or more binding film layers on the back, non-working surface of the pad.

Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.

Abstract: A wafer retainer includes: a foam layer capable of adsorbing a wafer on a surface thereof in a detachable manner; a first pressure-sensitive adhesive layer formed on a back face of the foam layer; a support formed on a back face of the first pressure-sensitive adhesive layer; a second pressure-sensitive adhesive layer formed on a back face of the support for adhering to a base plate of a polishing machine; and a release sheet releasably attached to the second pressure-sensitive adhesive layer. The second pressure-sensitive adhesive layer includes an adhesive composition. The adhesive composition contains a pressure-sensitive adhesive and a side-chain crystallizable polymer so that the side-chain crystallizable polymer is present in an amount of about 1% to about 30% by weight based on the adhesive composition.

Abstract: A stacked polishing pad includes an upper polishing layer and a lower sub-layer having major faces which are in contact with each other. The polishing layer is substantially impermeable to liquid while the sub-layer is liquid absorbent. The sub-layer has an outer peripheral edge which is sealed to prevent absorption of liquid into the sub-layer through the outer peripheral edge. When the stacked polishing pad is mounted on a platen of a polishing machine, the sub-layer has no exposed surface which can absorb liquid.

Abstract: A polishing cloth includes: a polishing cloth substrate; a first-pressure adhesive layer formed on a back face of the polishing cloth substrate; as support formed on a back face of the first pressure-sensitive adhesive layer; a second pressure-sensitive adhesive layer formed on a back face of the support; and a release sheet releasably attached to the second pressure-sensitive adhesive layer. The second pressure-sensitive adhesive layer includes an adhesive composition. The adhesive composition contains a pressure-sensitive adhesive and a side-chain crystallizable polymer so that the side-china crystallizable polymer is present in an amount of about 1% to about 30% by weight based on the adhesive composition. The side-chain crystallizable polymer includes as a main component thereof an acrylic acid ester and/or methacrylic acid ester which has a straight-chain alkyl group including 16 or more carbon atoms as a side chain.

Abstract: An abrasive pad removably attachable to a driven rotatable shaft and including a plurality of angularly offset abrasive members. Each abrasive member includes an outwardly facing surface having an abrasive disposed thereon. A first abrasive member is partially received within a loop formed by a second abrasive member. Likewise the second abrasive member is partially received within a loop formed by a third abrasive member. Finally, the third abrasive member is partially received within a loop formed by a fourth abrasive member. Each abrasive member is angularly offset from a radially adjacent abrasive member by approximately 45° with each abrasive member lying substantially in a single plane. Also disclosed is a method for forming such an abrasive pad.

Abstract: A composite polishing pad for use in a linear chemical-mechanical polishing apparatus is provided. The pad comprises a hard polishing pad having a polishing surface and an attachment surface opposite the polishing surface, the attachment surface comprising a border comprising an adhesive, the border surrounding a cavity, the cavity being sized and shaped to receive a soft polishing pad. The soft polishing pad is disposed completely in the cavity and completely fills the cavity, and the soft polishing pad has a first side adhered in the cavity of the hard polishing pad, and a second side comprising an adhesive, whereby the attachment surface of the hard polishing pad and the second side of the soft polishing pad are substantially in a common plane. Other composite polishing pads are also provided, as are methods for making composite pads and methods for preventing composite pads from splitting apart into their component pads.

Abstract: A dispenser and method for attaching abrasive sheets to a backup pad. The dispenser conveniently centers on the backup pad an abrasive sheet that is larger than the backup pad. In a preferred embodiment, the dispenser comprises: a holder configured to receive circular abrasive sheets, the holder including a bottom, a top, front portion and a rear portion, wherein the rear portion extends farther from the bottom than the front portion, and wherein the bottom of the holder defines at least a 180 degree arc of a first circle having a first radius; a slider guide extending along the rear of the holder; and a spacer mounted in the guide, wherein the spacer is movable along the guide from a first position within the front portion of the holder to a second position beyond the front portion of the holder, the spacer defining an arc of no more than 180 degrees of a second circle having a second radius smaller than the first radius.

Abstract: A composite polishing pad for use in a linear chemical-mechanical polishing apparatus is provided. The pad comprises a hard polishing pad having a polishing surface and an attachment surface opposite the polishing surface, the attachment surface comprising a border comprising an adhesive, the border surrounding a cavity, the cavity being sized and shaped to receive a soft polishing pad. The soft polishing pad is disposed completely in the cavity and completely fills the cavity, and the soft polishing pad has a first side adhered in the cavity of the hard polishing pad, and a second side comprising an adhesive, whereby the attachment surface of the hard polishing pad and the second side of the soft polishing pad are substantially in a common plane. Other composite polishing pads are also provided, as are methods for making composite pads and methods for preventing composite pads from splitting apart into their component pads.

Abstract: A multi characterized CMP (Chemical Mechanical Polishing) pad structure includes a lower pad and an upper pad. The lower pad includes a lower central soft pad region and a lower peripheral soft pad region formed outwardly of the lower central soft pad region, with both the lower central soft pad region and the lower peripheral soft pad region being located in a same plane of the lower pad. The upper pad is disposed on the lower pad, and includes an upper central hard pad region and an upper peripheral soft pad region formed outwardly of the upper central hard pad region, both the upper central hard pad region and the upper peripheral soft pad region being located in the same plane of the upper pad. The lower peripheral soft pad region has a lower hardness factor relative to the lower central soft pad region, and the upper peripheral soft pad region has substantially the same hardness factor as the lower central soft pad region.

Abstract: A finishing star or spinner abrasive tool is formed of inner and outer packs of square sheets of abrasive cloth or sandpaper with the inner packs angularly offset from the outer packs on the mandrel axis. Each sheet is formed with discontinuous radial slits extending beyond an unslit center section around a center fastener forming the mandrel drive hole. The slits provide surface flexibility while maintaining sheet integrity as it wears to circular form. An optional backing core is provided in the middle of the tool in the form of a cloth-sisal quilt acting as a cushion backing for the sheets, and which may retain coolant or compound during operation. The tool has longer working life with improved flexibility and working characteristics.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing microelectronic substrates. In one embodiment in accordance with the principles of the present invention, a microelectronic substrate is planarized or polished on a planarizing medium having a thin film and a plurality of micro-features on the film. The film may be an incompressible sheet or web substantially impervious to a planarizing solution, and the micro-features may be configured in a selected pattern on the film to restrain fluid flow of the planarizing solution across the surface of the film under the substrate. The micro-features, for example, may be configured in a selected pattern that has a plurality of support points and at least one cavity to entrap a substantially contiguous, uniform distribution of the solution under the substrate during planarization.

Abstract: A patterned polishing pad adapted for use in a wafer polishing machine. The patterned polishing pad has a polishing surface adapted to contact frictionally a semiconductor wafer being polished in a chemical mechanical polishing machine. The polishing surface has a first region and a second region. The first region is adapted to contact frictionally the wafer and achieve a first process effect. The second region is adapted to contact frictionally the wafer and achieve a second process effect. The surface of the second region extends a predetermined protrusion amount above the polishing surface with respect to the surface of the first region.

Abstract: A polishing pad surface having a surface designed for chemical mechanical polishing of a substrate surface is described. The polishing pad surface includes a first area on the surface exposed to and capable of contacting a first amount of the substrate surface during chemical-mechanical polishing and a second area on the surface exposed to and capable of contacting a second amount of the substrate surface during chemical-mechanical polishing, wherein the second amount is larger than the first amount of the substrate surface to produce a more uniformly polished substrate surface.

Abstract: A wafer polisher and method for the chemical mechanical planarization of semiconductor wafers. The polisher includes a wafer holder for supporting the semiconductor wafer and a linear polishing assembly having a polishing member positioned to engage the surface of the wafer. The polishing member is movable in a linear direction relative to the wafer surface to uniformly polish the surface of the wafer. A pivotal alignment device may be used to pivotally support one of the wafer holder and the polishing member relative to the other of the wafer holder and the polishing member with the surface of the wafer and the polishing member retained in parallel alignment during operation of the polisher. The polisher optionally includes a conditioning station for conditioning the polishing member.

Abstract: A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.

Abstract: The polishing device grinds or polishes semiconductor substrates. The device includes a polishing table, into which a measuring device is integrated and a through opening. A polishing cloth covers the polishing table. The polishing cloth has at least one opening formed therein which corresponds to the through opening in the polishing table. The invention also relates to a polishing cloth for use in the polishing device.

Abstract: A flap disc for use with a rotary surface finishing tool, the flap disc includes a backing plate which attaches to and is rotated by the finishing tool. The backing plate has a mounting flange on which a plurality of abrasive flaps are radially disposed. The abrasive flaps are each adhesively attached to the mounting flange and positioned so as to overlap an adjacent flap. Each abrasive flap has a finishing layer which comprises abrasive particles intermixed in a resin binder. Attached to the finishing layer is a substrate which includes a resin binder. In one embodiment of the invention, the substrate is made from fiber material onto which the abrasive particle/resin mixture is adhesively attached. Alternately, the substrate may comprise a non-woven fibrous material onto which the abrasive particle/resin mixture is adhesively bonded. The mounting flange may comprise a plurality of fiberglass plies intermixed in a resin matrix.

Abstract: An abrasive flap brush including a central core, a layer of adhesive disposed on the peripheral surface of the core by a coater, and a plurality of abrasive flaps adhered to the core by the adhesive. The adhesive is uniformly distributed around the core by providing either the core or the adhesive coater with spacing projections that maintain a predetermined minimum distance between the coater and the core when the adhesive is applied. A coater including the spacing projections is also disclosed, as is a method for making an abrasive flap brush.

Abstract: An improved polishing pad is provided comprising a solid uniform polymer sheet having no intrinsic ability to absorb or transport slurry particles having during use a surface texture or pattern which has both large and small flow channels present simultaneously which permit the transport of slurry across the surface of the polishing pad, where said channels are not part of the material structure but are mechanically produced upon the pad surface. In a preferred version of the invention, the pad texture consists of a macrotexture produced prior to use and a microtexture which is produced by abrasion by a multiplicity of small abrasive points at a regular selected interval during the use of the pad.

Abstract: The invention relates to a polishing element for use in a system and apparatus and a method for finishing and polishing a dental composite restorative material in a tooth. The system of the invention uses an elastomeric polymer disc which is impregnated with an abrasive for reduction of the composite, and an element for polishing the composite as well as the dental materials. A method of using the above apparatus in a finishing/polishing system is also provided.