Abstract: A green ball grinding method includes the step of supplying a green ball between a first surface of a first member and a second surface of a second member constituting a grinding apparatus, and the step of grinding the green ball between the first surface and the second surface while the green ball rotates around its own axis and in orbital motion. In the step of grinding the green ball, the step of causing the green ball grinding to proceed while applying load between the green ball and each of the first surface and the second surface, and the step of modifying the rotation axis of the green ball by reducing the load lower than in the step of causing the green ball grinding to proceed are executed alternately.

Abstract: A polishing apparatus for polishing an optical fiber connector is disclosed. The polishing apparatus has a base portion to support a polishing media; and a polishing puck. The polishing puck includes a connector mount, to receive and hold the optical fiber connector secured to a terminal end of an optical fiber, and a polishing gear configured to engage with a ring gear disposed in the base portion such that a fiber tip of optical fiber mounted in the optical connector traces a roulette pattern on the polishing media upon rotational engagement of the polishing gear within the ring gear.

Abstract: This invention relates to a process which may be automated for the manufacture of stone blocks for use as finished landscape stone blocks from quarry stone. The natural stone is quarried from the quarry and split into rectangular blocks, with squared ends and the top and bottom surfaces are ground with a plurality of grooves and ridges of varying heights. The ridges of varying heights are then removed thereby producing a surface having ridges of uniform height and grooves of uniform depth. The blocks may be used to form an architectural wall. The process is also applicable to pavers, steps and coping stones.

Abstract: A method for improving the strength characteristics of orthopedic prostheses, such as femur necks, femoral stems, cotyloid elements, systems of the spinal column, including the step of: starting from a prosthesis made of metal, subjecting the prosthesis to a peening treatment to improve the surface hardness of the prosthesis and eliminate micro-scoring caused by the machining of machine tools, the method further including a subsequent step of performing a surface finishing treatment by vibration finishing.

Abstract: A polishing pad conditioning apparatus includes a laser beam generating unit for providing a laser beam, a fluid delivery system for providing a fluid stream and a vacuum line for removing debris. The laser beam may directly impinge on a surface of a polishing pad thereby creating cutting action, while an atomized fluid stream provides cooling and pad debris along with fluid are removed thru the vacuum line. Alternatively, the laser beam may be combined with the atomized fluid stream in a region above the pad surface to substantially impart part of its energy to the fluid stream, generating high energy droplets which provide “cool” cutting action on the pad surface.

Abstract: A wafer polishing apparatus has a base and a turntable having a polishing pad thereon and mounted on the base for rotation of the turntable and polishing pad relative to the base about an axis perpendicular to the turntable and polishing pad. The polishing pad includes a work surface engageable with a front surface of a wafer for polishing the front surface of the wafer. A drive mechanism is mounted on the base for imparting rotational motion about an axis substantially parallel to the axis of the turntable. A polishing head is connected to the drive mechanism for driving rotation of the polishing head. The polishing head has a pressure plate adapted to hold the wafer for engaging the front surface of the wafer with the work surface of the polishing pad. The pressure plate has a generally planar position and is selectively movable from the planar position to a convex position and to a concave position.

Abstract: A method of forming a slider includes forming a leading edge blend on a leading edge of the slider. After the leading edge blend is formed, the method further includes forming at least one step feature conformal to the leading edge blend. A slider having an air bearing surface includes a leading edge blend and at least one step feature conformal to the leading edge blend.

Abstract: Pinion gears for planetary gear transmissions are hobbed, heat treated, and then ground to get better control of the leads/profiles on all the gear teeth. Then a light shot peening is applied to the tooth flanks to achieve the desired compressive residual stresses on the tooth surface. By applying the process in the controlled manner specified, the surface is not over-cold worked. Next, a chemically assisted isotropic surface treatment is applied over the pinion gears to improve the surface finish on the gear teeth. For low speed applications the surface finish improves the lambda ratio, allowing for a good oil film thickness on the surface of the gear teeth.

Abstract: A grinder wheel for a liquid crystal display device and a method of fabricating a liquid crystal display device using the same are provided. Two grinding surfaces are formed in the grinder wheel used for grinding a substrate so that it is possible to improve grinding characteristics, to increase the life of the grinder wheel, and to reduce grinding time. The method includes cutting the substrates attached to each other into a plurality of unit liquid crystal display panels, loading the unit liquid crystal display panel on a grinding table, grinding a predetermined region of the liquid crystal display panel using a grinder wheel including two grinding surfaces of a first grinder surface for primary grinding and a second grinder surface for secondary grinding, and unloading the ground liquid crystal display panel.

Abstract: A lapping device comprises a mounting surface for coupling at least one non-parted slider row. At least one lever arm is coupled to at least one distal end of the mounting surface. The lever arm comprises a coupling feature at an end of the lever arm for receiving a force-vectoring device. The lever arm also comprises a pivot point opposite the coupling feature of the lever arm wherein the pivot point is beyond a distal end of the non-parted slider row.

Abstract: A micro-concave portion machining method is provided for forming micro-concave portions on an inner circumferential surface of a cylindrical bore form in a workpiece. The micro-concave portion machining method includes performing mirror surface machining and subsequent plastic working on the inner circumferential surface. The plastic working on the inner circumferential surface forms a plurality of recesses with each of the recesses including a micro-concave portion.

Abstract: The present invention provides a method for correcting a semi-conductive belt, the semi-conductive belt including a resin and a conductive substance, the method having grinding a geometrically defective part of the semi-conductive belt to flatten the geometrically defective part.

Abstract: A processing method includes the steps of elastically deforming a jig together with a work, the jig having been mounted on a work, compressing the work against a polishing surface, and moving the work and the polishing surface relative to each other.

Abstract: Grinding machine with a machine bed, with a tool carriage that is linearly movable on the machine bed in a Y-axis, with a tool spindle, which is mounted in the tool carriage so as to rotate around an X-axis that is perpendicular to the Y-axis, and which can be rotationally driven, with an X-carriage that is linearly movable on the machine bed in the X-axis, with a Z-carriage that is linearly movable on the X-carriage with a Z-axis that is perpendicular to the X-axis and the Y-axis, and with a work piece jig, which is arranged on the Z-carriage so as to pivot around a B-axis, which is parallel to the Y-axis, and which is capable of rotating around its A-axis, which is perpendicular to the B-axis.

Abstract: A method of processing a wafer having a device area in which a plurality of devise are formed and a peripheral excess area surrounding the device area on the front surface, comprising an annular groove forming step for forming an annular groove having a predetermined depth and a predetermined width at the boundary between the device area and the peripheral excess area in the rear surface of the wafer by positioning a cutting blade at the boundary; and a reinforcement forming step for grinding an area corresponding to the device area on the rear surface of the wafer in which the annular groove has been formed, to reduce the thickness of the device area to a predetermined thickness and allowing an area corresponding to the peripheral excess area on the rear surface of the wafer to be left behind to form an annular reinforcement.

Abstract: A semiconductor wafer which is generally circular, and which has on its face an annular surplus region present in an outer peripheral edge portion of the face, and a circular device region surrounded by the surplus region, the device region having many semiconductor devices disposed therein. A circular concavity is formed in the back of the semiconductor wafer in correspondence with the device region, and the device region is relatively thin, while the surplus region is relatively thick.

Abstract: A head slider having an air inlet end and an air outlet end includes a rail having a flat air bearing surface for generating floating force when the disk rotates, the rail being disposed on a disk-facing surface; and an electromagnetic transducer disposed near the air outlet end where the rail is positioned. The head slider has a cavity on the air outlet end near the electromagnetic transducer.

Abstract: The present invention relates to a method for grinding of cam profiles on a camshaft (1), having an inner shaft (5) and an outer shaft (4) arranged coaxially one inside the other and mounted to rotate with respect to one another. The camshaft (1) additionally has first and second cams (2, 3) that can rotate with respect to one another over a limited circumferential angle about the camshaft axis (6), the first cams (2) of which are fixedly connected to the inner shaft (5) and the second cams (3) of which are fixedly connected to the outer shaft (4). It is essential to this invention that during and/or after the grinding operation a fluid is forced under pressure into the outer shaft (4), thereby preventing penetration of grinding dust into the interspace (8) between the first cams (2) and the outer shaft (4) or flushing out any grinding dust that has already penetrated.

Abstract: A laser processing method for forming a deteriorated layer, which has been once molten and then re-solidified, in the inside of a wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along a dividing line formed on the wafer, comprising: a protective tape affixing step for affixing a protective tape having gas permeability to one side of the wafer; a wafer holding step for holding the wafer having the protective tape affixed thereto on the chuck table of a laser beam machine in such a manner that the surface side onto which the protective tape has been affixed comes into contact with the chuck table; and a laser beam application step for applying a pulse laser beam capable of passing through the wafer from the other surface side of the wafer held on the chuck table with its focusing point set to a position near the one surface of the wafer to form the deteriorated layer exposed to the one surface along the dividing line in the inside of the wafer.

Abstract: A method and apparatus for processing a periphery of a lens includes holding the lens to be processed, providing at least one edge processing system, disposing the at least one edge processing system and the periphery of the lens proximal one another in a processing position, dry edging the periphery of the lens with the at least one edge processing system to a predetermined configuration, and cooling the periphery of the lens during the edging step with a cooling medium other than a liquid.

Abstract: A micro-concave portion machining method is provided for forming micro-concave portions on an inner circumferential surface of a cylindrical bore form in a workpiece. The micro-concave portion machining method includes performing mirror surface machining and subsequent plastic working on the inner circumferential surface. The plastic working on the inner circumferential surface forms a plurality of recesses with each of the recesses including a micro-concave portion.

Abstract: A method of producing a die coater structured with at least two bars so as to form a pocket section to extend a coating liquid in a coating width direction, a coating liquid supply port to supply a coating liquid to the pocket section, and a slit section to discharge a coating liquid from the pocket section to a material to be coated, wherein at least a part of a surface of the two bars coming in contact with a coating liquid is covered with a fluorine-based resin, the method comprises steps of: a preheating step of conducting a preheating process for a bar with a preheating temperature higher than a baking temperature in a baking process in a covering step of a fluorine-based resin; a grinding step of grinding the bar subjected to the preliminary heating process; and the covering process of covering a part of a surface of the bar with a fluorine-based resin so as to form a covered section, wherein the surface of the bar was subjected to the grinding step and comes in contact with a coating liquid.

Abstract: A surface to be polished of a large part is polished by projecting and colliding an abrasive comprising abrasive grains and an elastic petrochemical high polymer material having the specific gravity of 0.5 to 1.8 g/cm3 and elasticity of 10 to 200 ckg/cm2 or an elastic natural material, to the surface to be polished of the large part at a speed of 600 m to 3800 m per minute and by a volume of 5 to 300 cc/cm2·sec per unit area, and sliding the abrasive.

Abstract: A wafer processing method for dividing a wafer having optical devices that are formed in a plurality of areas sectioned by dividing lines formed in a lattice pattern on the front surface, along the dividing lines, comprising a laser beam application step of applying a laser beam capable of passing through the wafer along the dividing lines to form deteriorated layers having a predetermined depth from the back surface of the wafer; a protective sheet affixing step of affixing a protective sheet to the front surface of the wafer having the deteriorated layers formed therein; a dividing step of dividing the wafer having the protective sheet affixed to the front surface along the deteriorated layers; and a grinding step of grinding the back surface of the wafer divided along the deteriorated layers in a state of the protective sheet being affixed to the wafer, to remove the deteriorated layers.

Abstract: A wafer processing method for dividing a wafer having optical devices that are formed in a plurality of areas sectioned by dividing lines formed in a lattice pattern on the front surface, along the dividing lines, which comprises a laser beam application step of applying a laser beam to the wafer along the dividing lines from the side of the back surface thereof to form grooves having a predetermined depth in the back surface; a protective sheet affixing step of affixing a protective sheet to the front surface of the wafer having the grooves in the back surface; a dividing step of dividing the wafer having the protective sheet affixed to the front surface along the grooves; and a grinding step of grinding the back surface of the wafer divided along the grooves in a state of the protective sheet being affixed to the wafer, to remove the grooves.

Abstract: A separator plate useful in a wet-type multiplate clutch is provided on a friction surface thereof with elongated asperities extending with regularity in a predetermined direction. Peak portions of the elongated asperities, said peak portions being to project toward a counterpart member when the separator plate is assembled in the wet-type multiplate clutch, have been removed to form elongated plateaus. The separator plate can be manufactured by fixedly mounting a blank for the separator plate on a work support, forming elongated asperities with regularity in a predetermined direction on one of opposite surfaces of the blank by a grinding wheel, and then removing peak portions of the elongated asperities, said peak portions being to project toward a counterpart member when the separator plate is assembled in the wet-type multiplate clutch, to form elongated plateaus.

Abstract: A new technical advancement in the field of precision aluminum optics permits high quality optical polishing of aluminum monolith, which, in the field of optics, offers numerous benefits because of its machinability, lightweight, and low cost. This invention combines diamond turning and conventional polishing along with india ink, a newly adopted material, for the polishing to accomplish a significant improvement in surface precision of aluminum monolith for optical purposes. This invention guarantees the precise optical polishing of typical bare aluminum monolith to surface roughness of less than about 30 angstroms rms and preferably about 5 angstroms rms while maintaining a surface figure accuracy in terms of surface figure error of not more than one-fifteenth of wave peak-to-valley.

Abstract: A method of surface-treating a reactor member for effectively removing a Cr-deficient layer and a work-hardened layer considered to be a cause of stress-corrosion cracking (SCC) under low-stress conditions. The method of surface-treating a reactor member which is worked by bending (step 1) and then processed by a heat treatment (step 2), in which a work-hardened layer is formed by the bending, and in which a Cr-deficient layer is formed due to an oxide film attached by the heat treatment, uses at least one of: acid wash; grinding; electrolytic polishing; electro-discharge machining; surface cutting; surface deoxidation and softening; wet blasting; laser machining; or surface plating (step 3) to remove the work-hardened layer and the Cr-deficient layer from the reactor member or to prevent contact of the work-hardened layer and the Cr-deficient layer of the reactor member with a primary coolant.

Abstract: A method is provided for producing a matrix array ultrasonic transducer having an integrated interconnection assembly. A piezoelectric member, formed by a plurality of individual elemental transducers arranged in M×N matrix configuration, is provided and an interconnect interface device is joined to the rear face of the piezoelectric member. A plurality of printed circuits are then attached to the interconnect device so as to enable the resultant transducer array to be electrically connected to an external cable. The interconnect device is formed by an insulator member having dimensions in accordance with those of the piezoelectric member. A drilling operation is performed on the insulator member to form a corresponding array of through holes. The insulator member is then metallized and a resin used to provide filling of the through holes. Grooves are formed in at least one face of the insulator for receiving the printed circuits.

Abstract: A gas turbine component blank is shaped by clamping the gas turbine component blank into a fixture that accurately positions the gas turbine component blank in three dimensions. The positioning is accomplished against stops accurately machined into a base of the fixture, by first supporting the gas turbine component blank on one set of stops that prevents movement in the direction perpendicular to a plane of the base, and then operating a movable clamp to force the gas turbine component blank against other sets of stops that limit the movement of the gas turbine component blank in directions lying in the base plane. The clamp has a compound movement that simultaneously forces the gas turbine component blank against stops that prevent movement in orthogonal directions lying in the base plane. The gas turbine component blank is thereafter shaped, preferably by grinding the sides of the root precursor of the gas turbine component blank.

Abstract: A ultra fine particle film forming apparatus is provided which is capable of forming a ultra fine particle film which has ultra fine particles sufficiently bonded together, sufficient density, flat surface and uniform density. A planarized ultra fine particle film forming method for forming a planarized ultra fine particle film from a deposited film of ultra fine particles formed by supplying the ultra fine particles to a substrate, the method comprising one or more of a planarizing step of planarizing a surface of the deposited film of the ultra fine particles supplied to the substrate.

Abstract: Siding boards for clapboard boarding are used in a clapboard boarding structure in which lower side portions of upper siding boards are overlapped frontward of upper side portions of lower siding boards for installing a plurality of siding boards to a framework of a building. The siding boards are ceramic type siding boards with vertical joint grooves being formed on designed surfaces. Lower edges of the lower side portions of the siding boards are formed at different heights with the boundaries of the vertical joint grooves. Rear surface stepped portions that have been obtained by notching the rear surface are formed at the lower side portions. Upper end portions of the rear surface stepped portions are formed in a substantially straight line in lateral directions.

Abstract: To provide an apparatus that may impart a complicated bend deformation to an object to be machined such as a ceramic bar elongated in one direction or the like, and may reduce the non-uniformity in machining amount of the object to be machined upon the machining work of the object to be machined, specifically a correcting mechanism for deforming the object to be machined together with a jig holding the object to be machined is provided in a machining apparatus. The correcting mechanism includes a base, a plurality of levers provided at first ends with pins, a shaft fixed to the base for rotatably supporting the levers, and a plurality of correcting drive means coupled to second ends of said levers for pivoting the levers to the shaft to thereby pivoting the pins.

Abstract: A jig comprises: a main body; a retainer for retaining a block in which at least one row of sections to be sliders is aligned; a middle load application section coupled to a portion of the retainer located in the middle of the length thereof; end load application sections coupled to portions of the retainer near ends of the length thereof; middle couplers located between the middle load application section and each of the end load application sections, respectively, for coupling the main body to the retainer; and end couplers for coupling the main body to the ends of the length of the retainer. The length between the middle of the retainer and each of the ends thereof is greater than the length between the middle of the retainer and each of the end load application sections.

Abstract: Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.

Abstract: When electric elements are formed on a ceramic bar or the like, the positional displacement of the respective elements occurs due to a division exposing process or the like. An object of the present invention is to provide a device and a method which unify the non-polished portion of the respective elements by conducting polishing while a complicated deformation or the like is given to the ceramic bar. To achieve this object, the ceramic bar or like is held by using a jig, and a plurality of loads are applied to portions of the jig where the ceramic bar or the like is held, to thereby deform the ceramic bar or the like and polish the element in that state. In this situation the load applied points are disposed so as to avoid the boundaries of the division exposure.

Abstract: A method for finishing the surface of a rolling contact component, such as a bearing roller element, a bearing ring or a traction drive rolling element, comprises the steps of: carrying out a cutting operation on the surface, subsequently calendering or burnishing the surface by means of a ball comprising a material harder than the bearing component material whereby the maximum calendering or burnishing pressure exerted on the surface is less than 7 Gpa.

Abstract: Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.

Abstract: Disclosed is a production method of an aluminum support for a lithographic printing plate, capable of stable and low-cost production of an aluminum support for a lithographic printing plate, the support being scarcely subject to generation of treatment unevenness called streaks or grainy unevenness ascribable to the different in the aluminum dissolving rate due to the difference in the orientation of the crystal grain. The aluminum support is produced by surface graining and then polishing an aluminum plate or by polishing an aluminum plate while etching it in an aqueous acid or alkali solution. The aluminum plate may be subjected to polishing and then to anodization or may be subjected to polishing, to surface graining, again to or not to polishing and then to anodization. A production method for producing a high-quality support for a lithographic printing plate, free of local unevenness is also disclosed.

Abstract: A method of surface-treating a reactor member for effectively removing a Cr-deficient layer and a work-hardened layer considered to be a cause of stress-corrosion cracking (SCC) under low-stress conditions. The method of surface-treating a reactor member which is worked by bending (step 1) and then processed by a heat treatment (step 2), in which a work-hardened layer is formed by the bending, and in which a Cr-deficient layer is formed due to an oxide film attached by the heat treatment, uses at least one of: acid wash; grinding; electrolytic polishing; electro-discharge machining; surface cutting; surface deoxidation and softening; wet blasting; laser machining; or surface plating (step 3) to remove the work-hardened layer and the Cr-deficient layer from the reactor member or to prevent contact of the work-hardened layer and the Cr-deficient layer of the reactor member with a primary coolant.

Abstract: A method is provided for making an ultrasonic transducer particularly useful in medical imaging. The transducer includes a transducer body having a major front surface for radiating ultrasonic energy to a propagation medium and is formed by a piezoelectric member having a curved shape including a curved front surface. The curved shape is produced by deforming a planar piezoelectric composite member to produce the desired curvature and retaining the curvature using suction forces. A graded frequency region is created by grinding the curved front surface of the piezoelectric element along a grinding plane. This region is defined by the area of intersection of the grinding plane and the front surface of the curved piezoelectric member and in different implementations of the method, covers all or less than all of the total front surface.

Abstract: In the polishing work for forming a crown shape on a ceramic bar bearing a plurality of conversion units for the magnetic heads, the present invention is to provide a well-controlled satisfactory shape by pressing the ceramic bar, provided with plural grooves perpendicular to the longitudinal direction and on a surface opposed to the polished plane, to a substantially concave polishing plane through an elastic member principally composed of rubber, then measuring the magneto resistivity of an element provided in the conversion unit of the magnetic head, and adjusting the pressure at the crown forming operation by a closed loop control based on the result of such measurement.

Abstract: A method for controlling a polishing characteristic of a polishing pad used in planarization of a substrate. The method preferably includes controlling the temperature of a planarizing surface of the polishing pad so that waste matter accumulations on the planarizing surface soften and/or become more soluble, and/or material comprising the planarizing surface attains approximately its glass transition temperature. The waste matter accumulations and/or a portion of the planarizing surface are in this way softened and more easily removed. The planarizing surface is either heated directly by directing a flow of heated planarizing liquid or heated air to the planarizing surface or indirectly by heating a support surface beneath the polishing pad or by heating the air proximate to the polishing pad.

Abstract: A method of treating a surface of a component formed from a base material is described. The method comprises the steps of bringing the surface into proximity with free running rollers, the surface being moved relative to the free running rollers with a contact force in the range of 5.25 to 20.00 Newtons per mm of roller width, and introducing hard particles between the free running rollers and the surface such that at least some of the hard particles are forced into the base material of the surface by the free running rollers.

Abstract: A method and apparatus for removing marine fouling from underwater substrates such as ships' hulls (10). The method is characterized by the steps of first subjecting marine organisms such as barnacles to an electrical field of sufficent intensity to degrade the adhesive properties of the organisms to the substrate, and thereafter physically removing said organisms with the help of rotating brushes (16) or similar abrasive removal means. The apparatus is characterized in that it includes a remotely operated submarine (12) or other suitable transport means, such as a vehicle with a magnetized caterpillar track, having a forwardly mounted electrode (14) for imparting an electric field to the organisms together with abrasive removal means (16) mounted behind the electrode for removal of the organisms. A power source (18) is provided, having one pole (20) connected to substrate (10) and a second pole connected to electrode (14).

Abstract: A processing jig comprises: a main body to be fixed to a processing apparatus; a retainer that is long in one direction for retaining a bar as an object long in one direction; four couplers for coupling the retainer to the main body; three load application sections, coupled to the retainer, to each of which a load is applied for deforming the retainer; and three arms for coupling the load application sections to the retainer. The retainer has a beam structure that is bent with an application of external force. A bar fixing section to which the bar is fixed is provided at a lower end of the retainer. Both ends of the retainer are not coupled to the main body but left open.

Abstract: The invention concerns a method for the mechanochemical treatment of a material characterised in that to improve said material surface properties by mechanochemical anchoring, such as in particular its adhesive capacity during subsequent assembling, or to improve its use properties by producing composite structure surface coatings, consisting in projecting on said material particles with laminated structure consisting of a core and a coating comprising at least a polymer and optionally a chemical agent, in conditions such that said particles and/or fragments resulting from their fracturing are embedded and/or penetrate into said material. The invention is applicable in dentistry, the biomedical field, motor industry, avionics, printing industries, agro-industry, mechanical industries.

Abstract: A polishing pad is fixed on a polishing platen mounted to be rotatable. An abrasive supply tube supplies an abrasive onto the polishing pad. A substrate holder is mounted to be rotatable above the polishing pad, holds a substrate to be polished and presses the substrate against the polishing pad, thereby polishing the substrate. A dresser is mounted to be rotatable above the polishing pad, and dresses the polishing pad. A torque detector detects the rotation torque of the polishing platen or the rotation torque of the substrate holder. A dresser controller makes the dresser dress the polishing pad if the rotation torque detected by the torque detector is equal to or smaller than a predetermined value.

Abstract: Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks are described. In one aspect, a polishing chuck includes a body dimensioned to hold a work piece, and a multi-positionable, force-bearing surface is positioned on the body. The surface has an undeflected position, and is bi-directionally deflectable away from the undeflected position. A deformable work piece-engaging member is disposed adjacent the force-bearing surface for receiving a work piece thereagainst. The work piece-engaging member is positioned for movement with the force-bearing surface. In another aspect, a yieldable surface is provided on the body and has a central area and a peripheral area outward of the central area. One of the central and peripheral areas is movable, relative to the other of the areas to provide both inwardly and outwardly flexed surface configurations.

Abstract: To provide an apparatus that may impart a complicated bend deformation to an object to be machined such as a ceramic bar elongated in one direction or the like, and may reduce the non-uniformity in machining amount of the object to be machined upon the machining work of the object to be machined, specifically a correcting mechanism for deforming the object to be machined together with a jig holding the object to be machined is provided in a machining apparatus. The correcting mechanism includes a base, a plurality of levers provided at first ends with pins, a shaft fixed to the base for rotatably supporting the levers, and a plurality of correcting drive means coupled to second ends of said levers for pivoting the levers to the shaft to thereby pivoting the pins.