Abstract: A method for polishing the edge of a semiconductor wafer comprises (a) providing a semiconductor wafer which has been polished on its side surfaces and which has a rounded edge; (b) polishing the edge of the wafer by fixing the semiconductor wafer on a centrally rotating chuck, delivering the wafer to a centrally rotating polishing drum, which is inclined with respect to the chuck and to which a polishing pad containing fixedly bonded abrasives is applied, and pressing semiconductor wafer and polishing drum onto one another while a polishing agent solution containing no solids is continuously supplied.

Abstract: Semiconductor wafers are double sided polished by a method of polishing a frontside of the wafer in a first step with a polishing pad with fixed abrasive and simultaneously polishing a backside of the wafer with a polishing pad containing no abrasive, but during which an abrasive polishing agent is introduced between the polishing pad and the backside of the wafer, inverting the wafer, and then in a second step polishing the backside of the wafer with a polishing pad containing fixed abrasive and simultaneously polishing the frontside of the wafer with a polishing pad containing no fixed abrasive, a polishing agent containing abrasive being introduced between the polishing pad and the frontside of the semiconductor wafer.

Abstract: A method of manufacturing a microneedle including forming a plurality of first linear grooves on a substrate in parallel to one another along a first direction using grinding and forming a plurality of second linear grooves on the substrate in parallel to one another in a second direction intersecting the first direction using grinding. At least one of the forming of a plurality of first linear grooves and the forming of a plurality of second linear grooves includes forming first stage grooves using a first dicing blade; and processing the first stage grooves by tracing the first stage grooves using a second dicing blade having a side surface different from that of the first dicing blade to thereby form second stage grooves.

Abstract: A gear grinding tool can be trued and re-profiled. The geometry of the individual profiles in the direction of the tool axis is designed so that at least more than two, preferably all, flanks of the tool are used for rough machining of the work piece flanks, and that during finishing the re-profiled flanks provided only for roughing are set back far enough so that during finishing they do not come into contact with the work piece flanks.

Abstract: A method of polishing transparent armor, preferably to optical clarity. The method can be used on flat or contoured armor, manually or via robotic automation. The method includes using a step-wise progression of diamond, structured abrasive articles.

Abstract: The invention aims at providing a method for manufacturing a glass substrate for a magnetic disc capable of eliminating undulations of an outer peripheral end face of a glass substrate in a short processing time, and obtaining high roundness. In a method for manufacturing a disc-like glass substrate for a magnetic disc, the method includes a forming step of pressing a rotating grindstone against an outer peripheral end face while the glass substrate is rotated, thereby forming an outer peripheral end. In the forming step, processing is performed using a first condition (S106) on which first undulations are formed and a second condition (S108) on which second undulations having a different wavelength from the first undulations are formed.

Abstract: A thinned semiconductor wafer and a method for thinning the semiconductor wafer. A semiconductor wafer is thinned from its backside to form a cavity in a central region of the backside of the semiconductor wafer. Forming the cavity also forms a ring support structure in a peripheral region of the semiconductor wafer. The ring support structure has an inner edge and an outer edge. The inner edge may be beveled or have a stepped shape.

Abstract: A method of manufacturing a microneedle including the steps of forming a plurality of first linear grooves on a substrate in parallel to one another along a first direction using grinding, and forming a plurality of second linear grooves on the substrate in parallel to one another in a second direction intersecting the first direction using grinding.

Abstract: An electronic component manufacturing method that efficiently grinds a cover layer provided on a substrate even when the substrate is warped includes the step of forming first grooves at intervals in a cover layer provided on a substrate by repeating grinding with a rotary blade at a pitch more than a thickness W of the rotary blade. Next, at least portions provided in the cover layer along the first grooves are removed to reduce the thickness of the cover layer by repeating grinding at a pitch equal to or less than the thickness W of the rotary blade.

Abstract: The present invention relates to a grinding machine for grinding a workpiece, in particular cams, with a grinding wheel having a profile with a grinding region running substantially parallel to the axis of rotation of the grinding wheel and at least one profile section which does not run parallel to the axis of rotation of the grinding wheel, a control unit for controlling the grinding process, wherein the control unit is configured in such a manner that, with reference to position information on positions of edges of the workpiece in the direction of the longitudinal axis of the workpiece, the edges of the workpiece are successively deburred or chamfered by the at least one profile section of the grinding wheel during or after the grinding of the workpiece.

Abstract: A sharpening machine generally includes a grinding wheel having a perimeter that is rotatable about a first axis. The sharpening machine includes an adjustment device adapted to be coupled to a structure of the sharpening machine. A shaft is mounted to the adjustment device. The shaft defines a second axis that is generally parallel to the first axis when the adjustment device is coupled to the structure. The shaft is movable along a predetermined feed axis toward the grinding wheel. A carousel is rotatably connected to the shaft of the adjustment device. A contouring tool is rotatably connected to the carousel. The contouring tool has a contour surface. Movement of the shaft of the adjustment device along the feed axis is configured to translate the carousel and move the contouring tool into and out of engagement with the grinding wheel to facilitate dressing of the perimeter of the grinding wheel to a grinding wheel contour.

Abstract: The invention relates to a method, in particular a turning method, for producing a rotationally symmetrical surface on a rotating workpiece (1), wherein a cutting edge (3) is inserted into the workpiece (1) many times. During each insertion (41), a new contour portion (11; 34), also referred to as a groove, is formed. The insertion positions lie so closely together that the resulting contour (7) generated on the workpiece (1) consists exclusively of adjacent residual contours or residual grooves (11?) which have arisen from the new contour portions or grooves (11; 34). Any interim contour portions (24) which have formed between the insertion positions during repositioning of the cutting edge (3) are removed again during the next insertion (41). The resulting rotationally symmetrical surface is twist-free. The method can be implemented using conventional lathes.

Abstract: In order to grind bar-shaped workpieces which have a non-circular cross-section and flat faces which are parallel to each other, two partial operations are performed consecutively. First, the bar-shaped workpiece is rough ground and finished on the faces by way of double-disk face grinding. The bar-shaped workpiece is clamped on the longitudinal sides in the first clamping position thereof, and the bar-shaped workpiece is transported between two clamping jaws, which clamp the workpiece in the second clamping position thereof on the faces. The first clamping position is then released, and the bar-shaped workpiece is rotated by the clamping jaws. A CNC-controlled peripheral grinding step is performed based on CX interpolation principles. This rough grinds and finishes the longitudinal sides of the bar-shaped workpiece. Transport from the first to the second clamping position is effected by a clamping station, which concomitantly forms the holder for the face grinding operation.

Abstract: A grinding method for a wafer having a mark indicating the crystal orientation. The grinding method includes a first grinding step for grinding the upper surface of the wafer by rotating a chuck table holding the wafer thereon, rotating a grinding ring, positioning the grinding ring so that the grinding ring is passed through the center of the wafer, and feeding the grinding ring in a direction perpendicular to the chuck table; a wafer positioning step for positioning the upper surface of an outer circumferential portion of the wafer directly below the locus of rotation of the grinding ring; and a second grinding step for grinding the upper surface of the wafer by first stopping the rotation of the chuck table so that the mark indicating the crystal orientation of the wafer held on the chuck table is pointed in a predetermined direction, next feeding the grinding ring in the direction perpendicular to the chuck table, and next relatively moving the chuck table and the grinding ring in parallel.

Abstract: A technology for remedying a defect in a glass substrate which constitutes a display panel. There is provided a method of remedying a defect in a glass substrate which constitutes a display panel, which method includes performing grinding of glass material, until reaching internal bubble (1b) from surface (1s) of glass substrate (1), with respect to a region where the internal bubble (1b) occurring within the glass substrate (1) is positioned and further also grinding off a glass material position surrounding the internal bubble (1b).

Abstract: A method of surface grinding a Zr-rich bulk amorphous alloy article includes providing a substrate; providing a first surface grinder for rough surface grinding; and providing a second surface grinder for finish surface grinding. During the rough surface grinding, the rotating speed is in the range from 20 r/min to 30 r/min, the grinding time period is from 3 minutes to 12 minutes, and the grinding pressure is from 1 kg/cm2 to 2 kg/cm2, and a first pump circularly conveys a first lubricant to a first rotating abrasive wheel. During the finish surface grinding, the rotating speed is in the range from 30 r/min to 40 r/min, the grinding time period is from 5 minutes to 7 minutes, and the grinding pressure is from 1 kg/cm2 to 2 kg/cm2, and a second pump circularly conveys a second lubricant to a second rotating abrasive wheel.

Abstract: A wafer processing method for processing a wafer (20) having bumps (B) formed on a front surface (21) comprises the steps of: holding on a table (51), a bump region-conforming member (40) that has an outer shape conforming only to a bump region (25) where said bumps are formed in the wafer; forming a resin layer (29) by applying resin around the bump region-conforming member up to a thickness equal to or greater than that of the bump region-conforming member; grinding the bump region-conforming member along with the resin layer to a predetermined thickness; removing the bump region-conforming member from the table to form a concave part (45) in the resin layer; applying a film (11) on the front surface of the wafer; and disposing the wafer in the concave part of the resin layer and holding the wafer on the table so that a back surface (22) of said wafer faces upward. After that, the back surface of the wafer can also be ground.

Abstract: Iron and steel rolls are ground to production quality requirements with a grinding wheel that requires minimal wheel wear compensation, profile error compensation or taper error compensation during the grinding process. The grinding wheel consists essentially of a superabrasive material selected from the group of natural diamond, synthetic diamond, cubic boron nitride, and mixtures thereof, in a bond system, for a grinding wheel with extended wheel life, and which removes minimum amount of stock off the roll to achieve desired roll geometry.

Abstract: To provide a quartz glass tool, for silicon wafer heat treatment, having a transparent grooving face, which is free from the deposition of particles of a transition metal element foreign material derived from glass dust or diamond blade produced by breakdown of acute irregularities based on opening of very small concaves and convexes and microcracks, causes no significant change in dimension also in cleaning with hydrofluoric acid, and can maintain a high degree of cleanness even after use of a long period of time, and to provide a process for producing the same. A quartz glass tool for silicon wafer heat treatment, comprising a wafer mounting member having a grooving face formed by machining, characterized in that the whole grooving face of the wafer mounting member is transparent, the surface roughness is 0.03 to 0.3 ?m in terms of center line average roughness (Ra) and 0.2 to 3.

Abstract: A precision machining method enabling grinding with high accuracy is provided. The method includes a first step of producing an intermediate ground workpiece by roughly grinding a workpiece (a) with a diamond grinding wheel (b), and a second step of producing a final ground workpiece by grinding the intermediate ground workpiece with a grinding wheel for CMG. In the first step, feed of the rotator (6b) and the base (3) is controlled in multiple stages with different feed speeds according to control based on the amount of movement, and in the second step, movement of the rotator (6b) and the base (3) is controlled with a constant pressure or in multiple stages having different constant pressures.

Abstract: A blank and method for the production of dental shaped bodies in machining equipment having at least two tools located in the machining chamber of the machining equipment, including a corpus of tooth restoration material, from which the shaped body can be carved by means of at least one of at least two tools by material removal. The blank exhibits at least two gages, each of which is in the form of a recess, the geometry of which is such that the tool selected for the cutting operation can be recognized by means of at least one of the gages by reference to its outer contour, the at least two gages being disposed on the blank in such a way that they can be simultaneously engaged by the at least tools when the blank is clamped in the machining equipment for carving purposes.

Abstract: A method of manufacturing an integral bladed rotor is disclosed. The method includes calculating a cutting path in an area of a blank between adjacent blade locations to approximate contours of adjacent blades. A cutter is plunged into the area at an initial angle and depth that extends from an outer perimeter to the blank to an inner perimeter of the blank, in one example. The blade roots extend from the inner perimeter, and the blade tips terminate near the outer perimeter. The cutter is plunged into the area at an original angle that, in one example, is different than the initial angle. The cutter is rotated about an axis in a spiral-like fashion as the cutter extends further into the blank, along the cutting path.

Abstract: A tool for use in an abrasive machining process has a body extending along a central longitudinal axis from a first end to a tip end. An abrasive material is located on the tip end. The body has a tip end protuberance. An abrasive material is located on the protuberance. A body lateral surface has, over a radial span of at least 20% of a radius of the protuberance, a continuously concave longitudinal profile diverging tipward.

Abstract: A backside grinding apparatus removes semiconductor material from a surface of a semiconductor wafer. The wafer is mounted to a backing plate. The backside surface undergoes a first grinding operation in a rotational motion to remove excess semiconductor material. The semiconductor wafer is then aligned such that edges of the die are oriented along a reference line. The backside surface undergoes a second grinding operation in a linear direction on a 45-diagonal with respect to the reference line to create linear grind marks which are diagonal to the edges of the die. The linear grind marks are formed by an abrasive surface having at least 4000 mesh count. The second grinding operation removes the radial grind marks produced by the first grinding operation. The linear grind marks oriented diagonal with respect to the reference line increases the strength of the die to resist cracking.

Abstract: A micro-concave portion machining method is provided for forming micro-concave portions on an inner circumferential surface of a cylindrical bore form in a workpiece. The micro-concave portion machining method includes performing mirror surface machining and subsequent plastic working on the inner circumferential surface. The plastic working on the inner circumferential surface forms a plurality of recesses with each of the recesses including a micro-concave portion.

Abstract: A method of manufacturing a disk substrate includes a disk substrate forming step of forming a disk substrate; and an outer chamfering step of chamfering an outer edge of the disk substrate. The outer chamfering step includes chamfering the outer edge by bringing an end surface of a cylindrical-shaped outer chamfering grindstone having a hollow portion on its end into contact with the outer edge such that the hollow portion faces the outer edge while rotating each of the outer chamfering grindstone and the disk substrate.

Abstract: A method of manufacturing a microneedle including the steps of forming a plurality of first linear grooves on a substrate in parallel to one another along a first direction using grinding, and forming a plurality of second linear grooves on the substrate in parallel to one another in a second direction intersecting the first direction using grinding.

Abstract: A blank for use in producing an endodontic instrument using a grinding technique includes a cylindrical portion, and a generally conical portion which is to be machined by the grinding technique to form the active part of the endodontic instrument. The generally conical portion of the blank approximates, and is slightly larger than the envelope of the final shape given to the active part of the endodontic instrument after machining. A method is also provided for producing an endodontic instrument having at least one helical cutting edge using the blank.

Abstract: The invention relates to a grinding center for the simultaneous grinding of multiple main bearings and rod bearings and/or central sections of crankshafts (22). Two rod bearing grinding spindles (14, 15), wherein the first can be displaced only in the Z direction and the second can be minimally displaced only in the X direction, are mounted on a common rod bearing crosslide (11). In the final phase of the grinding, a correction of dimension deviation between the two machined rod bearings is carried out via a separate control of the second rod bearing grinding spindle (15), as a dimension or roundness correction. The deviations are detected by measuring devices.

Abstract: A motorized knife sharpener includes means of for sharpening heavy, medium, and fine blades at angles appropriate to the cutting edges of such blades.

Abstract: T An improved grinding arrangement for grinding a required profile in a body is provided. The arrangement includes a body having at least one channel extending into the body and a grinding wheel adapted to grind the required profile in the side of the channel. In the setup the grinding wheel is arranged so that an axis of rotation of the grinding wheel forms an angle greater than 0° with a radial axis of the channel. A method of grinding a required profile in a body is also provided.

Abstract: Tools providing automatic, smooth shifting between random orbital and rotary motion by simply increasing or decreasing force applied are taught. Exemplar is a finishing tool switchable between grinding rotary action and random orbital sanding action without powering down and without any mechanical manipulation, made possible by having a clutch mechanism affixed directly to the spindle assembly, which also eliminates the need to dissemble the tool in order to change a backup pad, saving time and money. Direct relationship between the clutch and spindle eliminates need for a specialty pad allowing for use of a variety of backup pads, reducing the cost of replacement backup pads and increasing the functionality of the dual-function tool. An additional feature is that the drive head surface is circular and large enough to encompass the device's circular clutch plate, which means that the available friction surface area of the clutch plate is efficiently utilized.

Abstract: The present invention generally relates to an edge deletion module positioned within an automated solar cell fabrication line. The edge deletion module may include a grinding wheel device for removing material from edge regions of a solar cell device and cleaning the edge regions of the solar cell device after removing the material. The edge deletion module may also include an abrasive element, a portion of which is ground as it is periodically, laterally advanced toward the grinding wheel device. A controller is provided for controlling the operation and function of various facets of the module.

Abstract: In an apparatus at a carding machine for grinding a clothing drawn onto a rotating roller, having a carrying device with at least one grinding element, the carrying device is attached to the carding machine. In order to make it possible, by means that are simple in terms of construction and installation, to reduce the preparation time, the grinding device with the at least one grinding element is interchangeable with one of a plurality of cover elements and/or work elements associated with the roller.

Abstract: In a wafer processing method, rough grinding using a first grinding stone is divided into first and second steps. In the first step, a wafer is processed into a concave shape at a first transfer rate with a reinforcing rib area slightly left. Thereafter, as primary rough grinding in the second step, the grinding stone is positioned slightly on the inner circumferential side and the wafer is further processed into the concave portion at a second transfer rate faster than the first transfer rate. Since the first transfer rate is suppressed to a rate not to cause a burst chipping, a burst chipping resulting from the second step fast in the processing rate to ensure productivity will occur at the stepped edge portion on the inside of the reinforcing rib area surface. Thus, the flatness of the reinforcing rib area can be ensured.

Abstract: To facilitate handling of a wafer in processing or carrying of the wafer after the wafer has been reduced in thickness by grinding, the whole back of a wafer is ground to provide the wafer with a predetermined thickness. The wafer surface includes a device region, with a plurality of devices formed therein, and a peripheral surplus region enclosing the device region. After grinding of the whole back surface, a region of the back surface corresponding to the device region on the wafer surface is ground to form a concave portion having a predetermined thickness, so that a ring-like reinforcement portion is formed about a periphery of the concave portion, such that the wafer is easily handled in a subsequent step or in wafer carrying between respective steps.

Abstract: A method for processing a work-piece is disclosed herein. The method includes the step of removing material from a work-piece to a predetermined depth with a tool that changes size. The method also includes the step of passing the tool across the work-piece in one or more passes during the removing step such that a cutting depth into the work-piece changes during a particular pass. Each pass is defined by a pass depth. The method also includes the step of maintaining a substantially constant chip thickness during the removing step. The method also includes the step of selectively maximizing one of a feed rate and a pass depth of material removal at the expense of the other during the removing step to minimize the time of the passing step.

Abstract: A method of manufacturing a microneedle including the steps of forming a plurality of first linear grooves on a substrate in parallel to one another along a first direction using grinding, and forming a plurality of second linear grooves on the substrate in parallel to one another in a second direction intersecting the first direction using grinding.

Abstract: A fixture for grinding machines includes a first base (10), a second base (20) and a driving component (40). The first base defines a first working groove (11) therein. The second base defines a second working groove (21) corresponding to the first working groove therein. The driving component is configured for sliding in the first working groove to remove workpieces from the first base, and sliding in the second working groove to cooperate with the second base to hold workpieces in the second working groove.

Abstract: A method for abrasive material removal that includes the steps of establishing an optimum force profile relating to the force or contact pressure applied by a processing tool on a workpiece. The actual force generated during the metal removal operation is monitored and compared to the optimum force profile. Based on the comparison of the actual force with the optimum force profile machine parameters are adjusted such that the actual force generated follows the established optimum force profile.

Abstract: There is provided an expanding tool used for dividing a wafer on an expanding tape by applying a radial tensile force to the expanding tape. The expanding tool includes a dividing frame having a first opening, an outer expanding ring having a contact portion that can be made contact with the dividing frame, the contact portion being provided at an outer periphery side of the outer expanding ring, and having a second opening smaller than the first opening, and an inner expanding ring having an outer shape smaller than the second opening.

Abstract: The present invention is a static pressure pad for supporting both sides of a raw wafer without contact by a static pressure of a fluid supplied to the both sides of the raw wafer in a double-disc grinding machine for a semiconductor wafer, wherein in patterns of lands to be banks of surrounding pockets formed on a surface side of supporting the raw wafer of the static pressure pad, an outer circumferential land pattern required to support the raw wafer is a concentric circle with respect to a rotation center of the raw wafer, and a land pattern inside the outer circumferential land pattern is a non-concentric circle with respect to the rotation center of the raw wafer and asymmetrical with respect to all the straight lines which bisect the static pressure pad.

Abstract: In a rough grinding step the large quantity of coolant supplied to cool the grinding point enables the flow to pass through a wheel-following air layer and reach the grinding point while the supply of an air jet is stopped during this step. At a fine grinding step, the grinding point can be cooled with a small quantity of coolant in so far it is reliably supplied to the grinding point. This is realized by supplying an air jet to intercept the wheel-following air layer which rotates to follow the grinding wheel, while supplying the coolant in small quantity. Consequently, the coolant is prevented from being scattered by the air jet and suspended in form of mist when supplied in large quantity at the rough grinding step, and the coolant quantity used can be reduced at fine grinding step and minute grinding step.

Abstract: A method and apparatus for cutting a profile in a workpiece, such as a turbine disk, without cracking the parent material which includes providing a grinding wheel having a ceramic grinding surface formed with an optimized grain material and grain spacing to produce large chips that are easily removed from the workpiece, applying the grinding wheel to the workpiece at a predetermined material removal rate, and increasing the material removal rate when the burning point is recognized at the surface of the workpiece by the grinding action of the grinding wheel, and delivering coolant/lubricant to the workpiece during the grinding operation.

Abstract: A wafer grinding method is disclosed, in which only a region, corresponding to a device formation region, of the back side of a wafer is ground in rough grinding conducted first, while the part surrounding the region thus ground is left unground as an annular projected part, to prevent the outer peripheral edge of the wafer from becoming knife edge-like in shape. In the subsequent finish grinding, the annular projected part is ground and, further, the whole area of the back side of the wafer is ground to be flat. Chippings of the outer peripheral edge may be generated only during the finish grinding, whereby the chippings are prevented from occurring or limited to minute ones.

Abstract: Difference between a lens edge circumference and an edged lens circumference is controlled to be always within a prescribed range so that a spectacle lens of a properly finished circumference size can always be supplied.

Abstract: A railway grinding system is capable of grinding a frog, another switch, or another railway section of interest in situ over a precisely defined path that is unaffected by the geometry of the railway section to be ground. The system includes a frame providing the reference path and a grinding machine movable along the reference path. The grinding tool preferably has at least four degrees of freedom with respect to the reference frame. Versatility can be further enhanced by permitting one grinding tool, such as a cup grinder configured to grind a generally horizontal surface of the railway, to be replaced with another grinding tool, such as a flange grinder configured to grind a generally vertical surface of the railway. The frog grinder can perform either single-event reconditioning grinding or periodic maintenance grinding.

Abstract: A method and apparatus for grinding a brake pad forms inclined faces at both ends of the brake pad through a single route of movement and no grinding limit quantity is involved whether boundary lines are parallel with each other or not. The apparatus includes: a fixing portion 11 for fixing a brake pad 3; a rotary whetstone 21 having a rotation axis parallel to a friction face 3a of the brake pad 3, a grinding face of which a distance to the rotation axis increases gradually or in a plurality of steps in one direction of the rotation axis, and another grinding face of which a distance to the rotation axis decreases gradually or in a plurality of steps in the one direction of the rotation axis; and a transporter 10 for moving one of the brake pad and the rotary whetstone in relation to each other in a intersecting direction to the rotation axis.

Abstract: To facilitate handling of a wafer with its thickness reduced by grinding its rear surface, and prevent any protrusions and depressions matching those of the front surface from being formed on its rear surface, the method including the steps of disposing an unevenness absorbing pad between a chuck table and a device region of the wafer for absorbing unevenness of the device region, and causing the wafer held by the chuck table to be rotated and ground, while having a grindstone kept in contact with rear surface of the wafer at center of rotation of the wafer, and out of contact with a portion of its rear surface opposite from the outer excess region, thereby forming a concavity in the portion of the rear surface of the wafer opposite from the device region, and forming an annular reinforcing portion including the outer excess region around the concavity.

Abstract: Polishing tools and associated methods are disclosed. In one aspect, a method of polishing a work piece is provided. Such a method may include providing a polishing tool having asperities on a working surface, where the asperities have a tip-to-tip RA value of less than or equal to about 10 ?m, and the working surface has a surface roughness RA value of less than or equal to about 50 ?m. The method may further include contacting the tips of the asperities against an interface surface of the work piece and moving the tips of the asperities in a direction substantially parallel to the interface surface of the work piece such that the interface surface is polished.