Abstract: The present invention discloses a burr removing apparatus including a base for placing the compact disc on, and a pressing apparatus equipped on the base and corresponding to the inner circle of the compact disc for moving up and down to eliminate a bur at the inner circle of the compact disc. An upper and a lower inhaling apparatus are respectively equipped in the pressing apparatus and the base, and extend respectively to the surfaces of the pressing apparatus and the base. The upper and lower inhaling apparatus have the upper and lower inhaling holes to inhale the bur eliminated. The present invention eliminates and inhales the redundancy before bonding the discs, so the smoothness of the disc can be improved to avoid the bubbles while bonding, and providing a disc with good mechanical properties and weather-resistance.

Abstract: An ironing assembly for use in chemical mechanical planarization (CMP) is provided. The ironing assembly is designed for use over a linear polishing pad which has a plurality of asperities and applied slurry. The ironing assembly includes an ironing disk having a contact surface. The ironing disk is oriented over the linear polishing pad such that the contact surface of the ironing disk can be applied over the surface of the linear polishing pad to at least partially flatten the plurality of asperities before planarizing a semiconductor wafer surface over the linear polishing pad.

Abstract: A retaining ring is configured for use with an apparatus for polishing a substrate. The substrate has upper and lower faces and a perimeter. The apparatus has a movable polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retaining ring has a retaining face for engaging and retaining the substrate against lateral movement and a bottom face for contacting the polishing surface of the polishing pad. The bottom face of the retaining ring extends downward from an inner portion adjacent the retaining face to a lowermost portion radially outboard of the retaining face.

Abstract: A method and apparatus for removing marine fouling from underwater substrates such as ships' hulls (10). The method is characterized by the steps of first subjecting marine organisms such as barnacles to an electrical field of sufficent intensity to degrade the adhesive properties of the organisms to the substrate, and thereafter physically removing said organisms with the help of rotating brushes (16) or similar abrasive removal means. The apparatus is characterized in that it includes a remotely operated submarine (12) or other suitable transport means, such as a vehicle with a magnetized caterpillar track, having a forwardly mounted electrode (14) for imparting an electric field to the organisms together with abrasive removal means (16) mounted behind the electrode for removal of the organisms. A power source (18) is provided, having one pole (20) connected to substrate (10) and a second pole connected to electrode (14).

Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.

Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.