Abstract: A method of removing at least a portion of an interaction layer on an electrode region of a solar substrate is provided. The method includes a step of providing a solar substrate including an absorbing region and an electrode region. The absorbing region including an absorbing layer configured to convert light energy into electrical energy. The electrode region is substantially free of the absorbing layer, and the electrode region includes an interaction layer. The method also includes a step of brushing the electrode region to remove at least a portion of the interaction layer.

Abstract: One or more slider bars are attached to at least one component of a multi-component carrier device. The multi-component carrier device is attached to a lapping arm of a lapping machine and the one or more slider bars attached to the carrier device are lapped. The at least one component of the multi-component carrier device is attached to a grinding/cutting machine. At least one of a grinding operation or a cutting operation is performed on the one or more slider bars.

Abstract: Apparatus for removing remnants of debris from the exterior surface of cores includes an assembly moveable from a position spaced from the exterior surface of the cores to a position adjacent the exterior surface. One or more abrasion belts are looped around rotatable shafts which move the belts to abrade the exterior surface of the cores.

Abstract: A capsule type reconfigurable multifunctional machining apparatus is disclosed. A capsule type reconfigurable multifunctional machining apparatus includes a rotating frame in which a plurality of processing modules may be installed to face an object to be machined disposed in a capsule type body and whose machining position and pose are controlled by rotation, a top frame for rotatably supporting the rotating frame, a bottom frame that is combined with the top frame under the top frame to support the top frame and in which vibration proof members are installed in positions where the bottom frame contacts the top frame, and a stage unit fixedly inserted into the internal center of the top frame to settle the object to be machined so that the height of the settled object to be machined may be controlled and in which an X-Y stage or a rotary stage may be selectively mounted.

Abstract: In a wafer dicing press for reducing time and cost for wafer dicing and for evenly applying a dicing pressure to a whole wafer, a wafer dicing press includes a support unit supporting a first side of a wafer; and a pressurization device applying a pressure, by dispersing the pressure, to a second side of the wafer so that a laser-scribed layer of the wafer operates as a division starting point. Accordingly, the wafer dicing press reduces laser radiation and pressure-application times for dividing a wafer into semiconductor devices. This increased efficiency is achieved without increasing the likelihood of damaging the wafer.

Abstract: A glass-plate working machine 1 is arranged such that while a cutting head 9 for forming a cut line on a glass plate 5 and a grinding head 10 for grinding a peripheral edge of the glass plate 5 bend-broken along the cut line are being moved simultaneously in parallel under numerical control, the cutting head 9 and the grinding head 10 respectively having angle control motors 46 and 49 are synchronously subjected to angular control about axes 39 perpendicular to the surface of the glass plate 5, and the cutting head 9 and the grinding head 10 are moved such that the orientation of a cutter wheel 52 is adjusted to a processing line, and the press contacting direction of a grinding wheel 64 of the grinding head 10 is kept in a normal direction with respect to a processing line of an edge of the glass plate 5.

Abstract: An aspect of the present embodiment, there is provided a method of fabricating a semiconductor device, including grinding a second surface of a wafer, the second surface opposite to a first surface of the wafer being stuck with a surface protection material, forming a protective film on the first surface, irradiating a portion including an outside edge of the wafer with laser light to remove the portion including the outside edge in a state that the wafer is rotating and an irradiation position of the laser light is approaching to a rotation axis of the wafer, an absorption ratio of the wafer to the laser light being higher than an absorption ratio of the surface protection material to the laser light, and removing the protective film.

Abstract: Methods for fabricating a honeycomb extrusion die from a die body include the step of machining extrusion slots with at least one grinding wheel to provide a honeycomb pattern of extrusion slots. In further examples, a plurality of the extrusion slots of the honeycomb pattern of extrusion slots can be machined with a wire electrical discharge machining process after machining the plurality of extrusion slots of the honeycomb pattern of extrusion slots with the grinding wheel.

Abstract: There is provided a cutting and edge-coating removal head for sheets of glass (V) coated by a film (S) to be mounted on cutting benches. The cutting tool (20) is positioned inside the edge-coating removal tool (10), consisting of a diamond-tipped disc, a cup grinder or spark grinder, a pad, a blade, or a brush with steel bristles.

Abstract: A method of cleaving an optical fiber using a disposable abrasive film is disclosed. The method includes preparing an end of an optical fiber by exposing a length of the optical fiber. The exposed optical fiber is brought into contact with a tangential swipe formed of abrasive film to cause the optical fiber to cleave substantially at the location of contact leaving an optical fiber stub with a cleaved end. The optical fiber stub is polished with a polishing film having a coarse grit and may be polished a second time with a polishing film having a fine grit.

Abstract: A glass-plate working machine 1 is arranged such that while a cutting head 9 for forming a cut line on a glass plate 5 and a grinding head 10 for grinding a peripheral edge of the glass plate 5 bend-broken along the cut line are being moved simultaneously in parallel under numerical control, the cutting head 9 and the grinding head 10 respectively having angle control motors 46 and 49 are synchronously subjected to angular control about axes 39 perpendicular to the surface of the glass plate 5, and the cutting head 9 and the grinding head 10 are moved such that the orientation of a cutter wheel 52 is adjusted to a processing line, and the press contacting direction of a grinding wheel 64 of the grinding head 10 is kept in a normal direction with respect to a processing line of an edge of the glass plate 5.

Abstract: A glass-plate working machine 1 is arranged such that while a cutting head 9 for forming a cut line on a glass plate 5 and a grinding head 10 for grinding a peripheral edge of the glass plate 5 bend-broken along the cut line are being moved simultaneously in parallel under numerical control, the cutting head 9 and the grinding head 10 respectively having angle control motors 46 and 49 are synchronously subjected to angular control about axes 39 perpendicular to the surface of the glass plate 5, and the cutting head 9 and the grinding head 10 are moved such that the orientation of a cutter wheel 52 is adjusted to a processing line, and the press contacting direction of a grinding wheel 64 of the grinding head 10 is kept in a normal direction with respect to a processing line of an edge of the glass plate 5.

Abstract: The present invention provides a polishing pad used for planarizing inter layer dielectrics and the like by CMP (chemical mechanical polishing) in the manufacturing process of a semiconductor device, a method of producing the polishing pad and a method of producing a semiconductor device by using the polishing pad. The present invention relates to a semiconductor wafer polishing pad having grooves in a polishing surface and formed from a foamed polyurethane, wherein a processed surface of the groove comprising a side surface and a bottom surface has a surface roughness Ra of not more than 10.

Abstract: A manufacturing method of a slider includes steps of (a) providing a row bar with a plurality of slider elements connecting together, the row bar having an air bearing surface, a back surface opposite the air bearing surface, a bonding surface and a bottom surface opposite the bonding surface; (b) grinding the bottom surface of the row bar; (c) lapping the air bearing surface of the row bar so as to obtain a predetermined requirement, and applying a first magnetic field with a first direction during lapping the air bearing surface, and the first direction being parallel to the air bearing surface and the bonding surface; and (d) cutting the row bar into a plurality of individual sliders. The present invention can maintain a good performance of a magnetic head during the manufacturing process.

Abstract: A sandblasting apparatus includes a processing chamber, a sandblasting nozzle positioned on a top of the processing chamber, a support mechanism, an elevation mechanism, a worktable, and a cutting mechanism. The support mechanism is positioned in the processing chamber and opposite to the sandblasting nozzle. The support mechanism is used for supporting a template with a cutting pattern. The elevation mechanism is positioned on the bottom of the processing chamber. The worktable is located between the support mechanism and the elevation mechanism and configured for supporting a plate for processing and being opposite to the template. The center of worktable defines a through hole matching with the pattern of the template. The cutting mechanism is fixed on the elevation mechanism and faces the through hole. The elevation mechanism drives the cutting mechanism to move toward or away the worktable.

Abstract: An apparatus for manufacturing seeds for polycrystalline silicon manufacture by cutting a silicon rod in an axial direction into at least one plate-like member, and cutting at least one of the silicon plate-like member lengthwise into seeds that are square in cross section, that includes a table which mounts the silicon rod or at least one of the plate-like member, a pair of end-face supporting members which support the silicon rod or at least one of the plate-like member by pressing both end faces thereof in the axial direction, and a cutting blade which cuts the silicon rod or at least one of the plate-like member in the axial direction, in addition the end-face supporting members includes comb-like grooves that allow the cutting blade to pass through.

Abstract: Certain embodiments disclosed herein relate to apparatuses and methods for intricate cuts. In particular, in one embodiment, a cutting apparatus is provided. The cutting apparatus includes a base member and an elongate member extending from the base member. The elongate member includes a tapered region having an abrasive surface. The tapered region defines at least one vertex defining an angle of a desired cutout shape. Additionally, the tapered region is toothless.

Abstract: A rotary stone cutting tool and method for making countertops and the like includes a shank shaped for detachable connection with a rotary drive. A cup-shaped cutting blade is mounted on the outer end of the shank, and has a frusto-conical sidewall and an outer marginal edge with axially protruding cutting teeth. A plurality of cutting pads are embedded in the sidewall and protrude radially outwardly therefrom. The blade is advanced through a stone slab with the sidewall oriented generally perpendicular to the face of the stone slab to cut an arcuate portion of an inside corner with reduced waste.

Abstract: A method for producing a die for molding a ceramic honeycomb structure, which has molding grooves arranged in a lattice pattern and apertures communicating with the molding grooves for supplying a moldable material, wherein the formation of the lattice-patterned grooves by machining is conducted by a first machining operation for forming pluralities of first parallel grooves, and a second machining operation for forming second grooves crossing the first grooves; wherein the first and second machining operations are conducted by at least 2 passes of grinding or cutting using a rotating tool; and wherein the second machining operation is conducted by up-cutting in the second pass or later, and a method for producing a ceramic honeycomb structure using such a die.

Abstract: The disclosure relates to a method and apparatus for the extraoral production of a tooth replacement part, whereby the method comprises providing a base body (300); rotary grinding of the base body; and grinding of the base body. Further, a milling step is possible. The presented method significantly reduces the production times, because it minimizes the time required for milling.

Abstract: A cut section checking/aligning unit simultaneously checks cut sections of unit liquid crystal display panels that are separated from within first and second base substrates and aligns the unit liquid crystal display panels to a reference position. A grinding unit grinds edges of the unit liquid crystal display panels. The cut section checking/aligning unit and the grinding unit are integrated within a grinding device.

Abstract: A method and apparatus for finishing the surface of rubber or synthetic covered rollers (10) is disclosed. As seen in FIG. 3, a rotating hub (16) having a circumferential abrasion band (47) and an adjacent set of rasp blades (20) arranged end-to-end and extending circumferentially about the hub is used to progressively and sequentially removebands of surface material by cutting and then abrading as the hub and roller are rotated and one is moved axially relative to the other.

Abstract: A wood planing machine includes a base adapted to permit a workpiece to be moved thereon in a front-to-rear direction, a plurality guide posts fixed on the base, a mounting seat sleeved movably on the guide posts, a motor disposed on the mounting seat, and a cutting unit disposed on the mounting seat. The cutting unit includes a rough-plane cutter, a fine-plane cutter disposed behind the rough-plane cutter, a first transmission unit interconnecting the motor and the rough-plane cutter to allow the rough-plane cutter to be driven by the motor, and a second transmission unit interconnecting the rough-plane cutter and the fine-plane cutter to allow rotation of the rough-plane cutter to be transferred to the fine-plane cutter.

Abstract: An automatic insulation block milling machine is disclosed. The machine combines a series of operations into a single, automatic, production-line machine. Blocks of rigid insulation material, such as cellular glass blocks, are fed into the automated machine. The blocks are first placed on an automatic programmed moving conveyor belt and are first cut on a pre-determined angle developed from the horizontal and vertical centerline of the block. This cut is made by an angled, vertical band saw mounted with its blade in the center of the moving conveyor, thus producing one angled side on each of the two cut blocks. The remaining three primary sides of the cut blocks are machined to create curved sectional blocks that are used to cover the outer surface of large bore pipe systems or other cylindrical items such as tanks.

Abstract: A planning and polishing machine includes a base, an intermediate base installed with a conveying device for laying a workpiece, and an upper base pivotally fixed with at least a planer and a grinding roller. A driving motor is installed below the conveying device, with its shaft engaged with a first driving wheel and a second driving wheel with different diameters. The first driving wheel and the blade are mounted by a first driving element, and the second driving wheel and the grinding roller are mounted by a second driving element. When the driving motor is turned on to draw the first driving element and the second driving element, the blade and the grinding roller are to be meanwhile driven to rotate in different rotating speeds, enabling the blade to powerfully plane the surface of a wood, achieving a high precision and efficiency of planning and polishing.

Abstract: A device for working of glass panes (1) has a support (5) for the glass panes (1) and a nozzle (2) from which a water jet emerges for cutting the glass panes (1). The nozzle (2) can be moved on a guide (8) parallel to the plane of the support (5). The tool (12) for working of the cut edges of the material plates (1) can likewise be moved on the guide (8) of the nozzle (2) and is preferably mounted on the same carriage (9) which can be moved on the guide (8), as the nozzle (2). This simplifies not only the technical structure of the device, but also shortens the working time, since the glass pane (1) need not be transported to another device for finishing. Moreover, essentially the same control program as for the water jet cutting can be used for finishing.

Abstract: An apparatus and method for fabricating a liquid crystal display panel are disclosed. In case of the single mode that liquid crystal display panels are fabricated with the same size on a large glass substrate, defective unit liquid crystal display panels are kept and discarded not to proceed with a follow-up process. Thus, a material waste is restrained and a yield can be improved. Meanwhile, in case of the multi-mode that liquid crystal display panels are fabricated with difference sizes on a large glass substrate, sub-models are kept, and then after completing the process for the main models, a follow-up process if performed on the sub-models. Thus use efficiency of the glass substrate can be maximized to improve a productivity and a unit cost of the product can be reduced.

Abstract: The present invention provides a hobbing machine. The hobbing machine includes a clamp fixture adapted to retain a gear blank. A motor is operatively connected to the clamp fixture and is configured to rotate the clamp fixture and the gear blank together at a predetermined speed. A rotatable cutter is translatable into engagement with the gear blank and is configured to cut the gear blank and thereby produce a plurality of gear teeth. A de-burring tool is translatable into engagement with the gear blank and is configured to remove burrs from the gear blank as the gear teeth are being cut. A motorized spindle is operatively connected to the de-burring tool, and is configured to power and rotate the de-burring tool at a predefined speed to optimize the removal of the burrs.

Abstract: A sharpener to sharpen the edge of a food slicer blade includes a non-planar abrasive surfaced rotatable disk mounted on a supporting structure. The supporting structure includes one or more surfaces designed to align with at least one of a push bar, thickness control plate and the surface of the food carriage of the food slicer when the abrasive surface of the disk is in contact with the edge of the slicer blade.

Abstract: Methods and systems of fabricating stone products are provided. The method comprises the steps of providing a stone piece, separating the stone piece into a plurality of sawed stone slabs by cutting with at least one saw blade, separating the plurality of sawed stone slabs into split stone slabs by cutting with a plurality of teeth, forming at least one pitched edge on at least one of the faces of the split stone slabs, and colliding the plurality of pitched stone slabs in a container to break the pitched stone slabs into a plurality of stone products having multiple lengths. The collisions include contacting between the pitched stone slabs, contacting between at least one pitched stone slab and the inner surface of the container, or both.

Abstract: A tool assembly which is adapted to perform a cutting operation and also a beveling operation on a pipe. There is a rotary power saw which has rotary drive member to which a saw blade can be mounted. There is a bevel section having a mounting member that connects to the rotary drive member, and a bevel member. There is a locating surface portion around the axis of rotation of the bevel member, and an end lateral locating section and an apex end of the bevel member. The bevel section can be removably connected to the drive member of the power saw.

Abstract: A tool for beveling the end of a pipe is comprised of a hollow, tubular body having a central, longitudinal axis of rotation, an inboard coupling end, and an opposite outboard working end. A plurality of longitudinally spaced, transversely directed latching pin bores of equal size are defined through the wall of the tubular body. A core member is disposed coaxially within the tubular body. The core member includes a beveling cutter head and a longitudinal stem having a radially inwardly directed, circumferential latch position groove. A transversely oriented latching pin is engaged in a selected one of the latching pin bores in the body and with the latch position groove of the core stem. This allows alternative selection of each of the latch position bores for insertion of the latching pin. The particular bore selected determines the longitudinal position of the core stem latch position groove within the body that will be aligned with the latching pin.

Abstract: A combination tool for machining a bore has a tool shaft transmitting a rotational movement and an oscillating movement in an axial direction of a bore to be machined with the tool. A horning tool is arranged on the tool shaft, and a deburring tool is arranged on the tool shaft at an axial spacing to the honing tool in a direction of a longitudinal axis of the tool shaft. The honing tool is configured to move for each honing stroke between a lower position and an upper position wherein a spacing between a lower edge of the honing tool and a lower edge of the deburring tool in the direction of the longitudinal axis of the tool is greater than a spacing of the lower edge of the honing tool to a workpiece surface when the honing tool is in the lower position.

Abstract: A cutter foe making optical lenses has a main member with a connector base and a grinding assembly at an opposite ends thereof. The grinding assembly has two fixed devices having a cutting portion at a distal end thereof respectively and two movable devices having a grinding portion at a distal end thereof respectively. The grinding portions are finer than the cutting portions. An elastic member has opposite ends resting on the main member and the movable device to urge the movable device for movement along an axial orientation of the main member. A key is provided between the movable device and the main member to restrict the movable device from movement, whereby the grinding portion of the movable device is higher than the cutting portions of the fixed devices by the elastic member urging the movable device outward and the key fixing the movable device thereat.

Abstract: A pipe-cutting device comprising a portable support; a device for rotating said pipe relative the support; a cutter associated with said support for cutting the pipe during rotation of the pipe.

Abstract: A tool mounting assembly including a tool support means which includes tool holders adapted for receiving an associated tool and enabling rotation of the associated tool about a rotation axis. The tool mounting assembly further including means for causing relative movement between the tool holders in the direction of the rotation axis so to enable the tool holders to adopt an operative position in which the associated tool is held thereby and the release position in which the associated tool is enabled to be removed from the mounting assembly.

Abstract: An apparatus for processing a lens comprising a rotating tool for chamfering used for chamfering a peripheral portion of a spectacle lens, the apparatus comprising: a holding shaft supporting the lens and a lens-holding unit that rotates the holding shaft and displaces the lens towards the finishing unit based on data describing a shape of a lens frame and a rotation angle of the holding shaft; and a means for positioning in an axial direction that displaces the lens in an axial direction of the holding shaft; wherein the rotating tool for chamfering includes a rotating tool having a hemispherical shape, wherein a chamfering angle, or a chamfering amount, is set in accordance with a displacement in the axial direction of the means for positioning in an axial direction and a displacement of the lens-holding unit.

Abstract: A circular saw includes a worktable, a mounting seat extending upwardly from the worktable for mounting a motor thereon, a blade supporting unit pivotally mounted on the mounting seat at a pivot end so that an opposite free end is turnable to be close to and away from the worktable, and a saw blade shaft mounted rotatably on the blade supporting unit about a blade axis parallel to an output shaft axis of an output shaft of the motor and having a saw blade mounted thereon. The saw blade shaft is coupled to the output shaft by a drive transmitting unit which transmits driving force of the output shaft to the saw blade shaft so as to rotate the saw blade.

Abstract: A numerical control (NC) processor with an onboard grinding unit is disclosed in which a workpiece is first cut in a preselected contour with a Y-axis cutting tool, and then subjected to honing operation intact whereby both the cutting and honing operations can be performed with just a single processor with high-speed, high-acceleration. With the NC processor, the Y-axis cutting tool is mounted on a sliding base above an X-axis table in a way allowed to move back and forth in a Y-axis direction, while a grinding unit is installed in close proximity to the sliding base. A slider moves back and forth in synchronized relation with rotation of a work spindle to first let the Y-axis cutting tool cut the workpiece into a preselected contour, and then cause a buffing material of the grinding unit to grind a work surface of the workpiece into a high-quality surface finish in conformity with a programmed contour while the workpiece remains held intact in a chucking device.

Abstract: A semiconductor device production method and a semiconductor device production apparatus are provided. The semiconductor device production method includes the steps of: sticking a wafer to a stretch tape stretchable by a physical process; dicing the wafer into individual semiconductor chips; stretching the stretch tape by performing the physical process on the stretch tape after the dicing: and grinding the rear surface of the wafer stuck to the stretch tape after the tape stretching.

Abstract: The invention relates to a method for re-profiling the running surface of a rail, preferably the convex portion of the rail head cross-profile of a rail, especially a railway rail, by peripheral milling. The aim of the invention is to obtain a profile that meets the requirements and has few corrugations. To this end, for producing the profile in a single peripheral grinding step, more than five, preferably nine milling tracks are produced that are oriented in parallel to the longitudinal direction of the rail. Optionally, the running surface, preferably the convex portion of the rail head cross-profile including the running surface is ground afterwards.

Abstract: An apparatus for grinding and polishing without visible flaws a variety of different size and shape full-lead crystal workpieces. A conveyor supports the workpieces and runs through the apparatus housing. A workpiece calibrator is located proximate the entrance end of the housing. A plurality of grinders having an abrasive grinding surface within a range of coarseness are located downline of the calibrator. A plurality of polishers are located downline of the grinders. Control means raises and lowers the calibrator, grinders and polishers relative to the belt conveyor and the unfinished surface of the workpiece supported thereon. A method of automatically making a finished full-lead crystal ornament using an automated machine having a housing, conveyor, a plurality of motor-driven grinding heads, and a plurality of motor-driven polishing heads.

Abstract: A method of manufacturing aluminum frames for photomask protective films comprises the step of: providing a square-shaped hollow or solid strut aluminum material, fastening the bottom end of the aluminum material to a base of a machine tool, using a milling cutter to fabricate and form a hollow trough for a selected depth in the aluminum material from the top surface thereof, and using a cutting tool to cut off the aluminum material at the periphery of the hollow trough to form individual aluminum frames for the photomask protective films. The method of the invention uses fewer chucks and screw bolts during machining, and can reduce chuck setup time and simplify machining processes.

Abstract: A rotary die cuter for a box making machine has an abrading cylinder mounted for rotation alongside the anvil for engaging and resurfacing the blanket of the anvil on a virtually continuous basis to smooth, level and even the surface of the blanket. This resurfacing occurs during normal operation of the rotary die cutter so no production is lost. The abrading cylinder has a sheet layer of abrasive material spirally wrapped on the surface of the cylinder and bonded thereto with adhesive material on the backside of the sheet layer. The abrading cylinder is movable towards or away from the anvil by a servo motor and gearbox. The position of the abrading cylinder relative to the anvil is determined by an encoder which sends the information to a computer or programmable controller which calculates the changing diameter of the blanket and the amount of speed change that must be imparted to the anvil to compensate for its changing diameter.

Abstract: A web-format polishing pad for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies, and methods for making and using such a web-format pad. In one aspect of the invention, a web-format polishing pad for planarizing a microelectronic substrate is made by slicing a cylindrical body of pad material along a cutting line that is at least substantially parallel to a longitudinal centerline of the body and at a radial depth inward from an exterior surface of the body. For example, a web of pad material can be sliced from the body by rotating the cylindrical body about the longitudinal centerline and pressing a cutting element against the rotating cylindrical body along the cutting line. The cutting element can be a knife with a sharp edge positioned at the cutting line and a face extending along a tangent of the cylindrical body.

Abstract: A ring cutter that cuts chips with a ring of knives. Two carrier rings enclose a collar of knife packets. Each knife packet includes a knife clamped between a knife carrier a clamping plate with a cutting edge of the knife pointing to the inside of the ring. Fastening screws are threaded through a borehole in the clamping plate and an opening in the knife and are screwed into a threaded borehole in the knife carrier. One of the fastening screws is configured as an alignment pin.

Abstract: A knife ring machining tool for machining chips, with a knife ring comprising a crown of knife packets as well as two carrier rings carrying the packets, which rings are arranged on the ends of the knife packets. Each knife packet includes a knife that is inclined against the radial direction and whose cutting edge faces inward, with a rotor arranged coaxially with the knife ring and surrounded by the latter. The rotor includes a plurality of rotor blades that carry strip-shaped cleaving knives on the outer ends, which knives for their part run parallel to the rotor axis and extend over the width of the rotor. Each cleaving knife is fastened by screws to the associated rotor blade, while each screw connection comprises a wedge element that tapers outward in radial direction in a wedge shape, as viewed in a section vertical to the rotor axis.

Abstract: In one embodiment, the invention is directed toward inline lapping of magnetic tape. The lapping process is performed inline with one or more other magnetic tape manufacturing processes. In this manner, the number of times the magnetic tape is un-spooled and then re-spooled can be reduced. Consequently, the amount of handling of the individual tape pancakes can also be reduced, thus avoiding damage to the edge of the tape, or other damage associated with tape pancake handling.

Abstract: A slicing center includes a first structure (23) to carry out operations (24) necessary for the production of processed slices in trays or packaged, from pieces to be sliced. These operations (24) are controlled and interconnected by a second structure (25) so as to form subgroups (26) consisting of a positioning unit, a slicing unit, a processing unit and a final treatment unit. These subgroups (26) are in turn interconnected by third structure (27) comprising devices for storing and devices for handling and transportation of the slices, thereby to form a chain of transfer in which all the elements are compatible and interconnected.

Abstract: An apparatus for simultaneously machining a plurality of lens blanks to provide a lens surface on each blank corresponding to a selected lens prescription includes a tool support assembly and a lens blank assembly. The tool support assembly movably supports at least one tool. The lens blank support assembly includes a plurality of lens blank retainers for supporting a plurality of lens blanks. The tool support assembly and the lens support assembly move relative to each other such that the tool alternatingly engages each of the plurality of lens blanks for machining an individual lens prescription in a raster-like manner on each of the plurality of lens blanks.