Abstract: A floating non-contact ultrasonic enhanced flexible sub-aperture polishing device and method are disclosed, an X-axis moving platform, a Y-axis moving platform, a Z-axis moving platform and a workpiece swinging platform in linkage control ensure normal lines of a tool and a workpiece are kept at an identical angle to realize sub-aperture processing; the ventilation main shaft acts air pressure on the ball spline's end portion to form an axial thrust to let the tool axially float; a dynamic balance among hydrodynamic pressure, air pressure and dynamic pressure is performed on the polishing liquid by rotation of the flexible tool; a tiny gap between the tool and workpiece is formed by elastic deformation of the flexible tool due to the dynamic pressure; a shearing force for removing materials is generated when the polishing liquid flows through the gap; a cavitation effect in the gap is formed by ultrasonic waves.

Abstract: A magnetic-field-guidance system and methods of finishing a workpiece using a magnetic-field-guidance system are provided. The magnetic-field-guidance system comprises a workpiece holder, one or more tooling magnets each comprising a finishing tip, and one or more flexible bags containing magnetic media. The workpiece holder is configured to (a) be secured to a base and (b) secure a workpiece relative to the base. The flexible bag(s) are configured to be disposed on the opposite side and/or same side of the workpiece relative to the one or more tooling magnets. In collaboration with the tooling magnets, the magnetic media contained with the flexible bag(s) direct a magnetic field which thereby guides a magnetic-abrasive slurry to finish the workpiece using Magnetic Abrasive Finishing (MAF).

Abstract: A hydrodynamically optimized mixer module, to be coupled to a deterministic hydrodynamic tool that allows pulsed polishing of optical surfaces is described. This module allows the supply of abrasive foam or fluid that enters the tool to be interrupted without impairing the operational stability of the polishing process and of said hydrodynamic tool. The mixer module includes at least one interrupter element for switching high-velocity fluids; a first inlet through which air is injected under pressure and in a controlled manner; a second inlet through which a polishing fluid is injected in a controlled manner, said polishing fluid filling a predetermined volume with a hydrodynamically optimized shape and being transferred to a mixing zone where, together with the pressure-injected air, an abrasive foam is produced that is injected into at least one rotational acceleration chamber of the hydrodynamic tool to which the mixer module is coupled.

Abstract: A thermally conductive sheet has cut surfaces with low surface roughness and hence shows reduced thermal resistance at the interfaces, and high thermal conductivity in the thickness direction. Thus, the thermally conductive sheet can be interposed between any of various heat sources and a radiation member. The process for producing the thermally conductive sheet includes at least: an extrusion molding step in which a thermally conductive composition containing a polymer, an anisotropic thermally conductive filler, and a filler is extruded with an extruder to thereby mold an extrusion-molded product in which the anisotropic thermally conductive filler has been oriented along the extrusion direction; a curing step in which the extrusion-molded product is cured to obtain a cured object; and a slicing step in which the cured object is sliced into a given thickness with an ultrasonic cutter in the direction perpendicular to the extrusion direction.

Abstract: An ultrasonic cleaning apparatus according to the present invention comprises a plurality of cleaning tanks configured to store a cleaning liquid, an object-to-be-processed holder capable of being inserted into each cleaning tank, the object-to-be-processed holder being configured to hold an object to be processed and to immerse the object to be processed into the cleaning liquid, a vibrator disposed on each cleaning tank, a single ultrasonic oscillator configured to make each vibrator ultrasonically vibrate, an output switch interposed between the ultrasonic oscillator and the vibrator of each respective cleaning tank, the output switch being configured to switch the vibrator that is connected to the ultrasonic oscillator, and a control device configured to control the ultrasonic oscillator and the output switch, wherein the control device controls the ultrasonic oscillator and the output switch such that a timing at which the vibrator of one of the cleaning tanks is made to ultrasonically vibrate, and a tim

Abstract: A surface treatment device includes an enclosure which has an opening through which the leading edge of an aerofoil passes. A sealing element is provided on the enclosure to seal the device to the surfaces of the aerofoil. An abrasive is located within the enclosure and two fluid openings are also provided through which a chemical accelerant can be pumped. In operation the enclosure is oscillated relative to the component so that material is abraded. Whilst the enclosure is oscillated a chemical accelerant is simultaneously pumped through it. The device allows for the local application of a surface treatment on a component.

Abstract: A device for surface blasting, e.g., for ultrasonic shot blasting, components, e.g., gas turbine components, includes at least one vibrator having an oscillating surface, e.g., having at least one ultrasonic sonotrode, the or each oscillating surface of the or each vibrator being adjoined by a machining chamber for receiving a section to be blasted of the component to be machined. The machining chamber is bounded in its cross-section by at least three sides, e.g., by at least two substantially vertical sides and by at least one substantially horizontal side. At least the substantially vertical sides of the machining chamber are formed by oscillating surfaces of in each case one vibrator.

Abstract: An apparatus and method for grinding a workpiece by rotating the workpiece about a rotational axis, rotating a cylindrical grinding wheel about a rotational axis being parallel to the rotational axis of the workpiece, moving the grinding wheel relative to the workpiece at least in one of a first direction being perpendicular to the rotational axis of the workpiece for grinding the workpiece at a cylindrical surface of the grinding wheel and a second direction being parallel to the rotational axis of the workpiece for grinding the workpiece at an end surface of the grinding wheel being perpendicular to the rotational axis of the grinding wheel, and by superimposing a vibration signal including a plurality of frequency components to a driving signal outputted to one of a workpiece rotating means for rotating the workpiece and a grinding wheel rotating means for rotating the grinding wheel.

Abstract: A handheld instrument for minimizing pain during administration by injection of a liquid, such as, an anesthetic that has a main body, a vibration unit mounted in the main body when initiated to cause the main body to vibrate, and a detachable tip cantilever mounted on the main body to vibrate with it, the tip having a free end characterized by a bifurcation to form two spaced projections defining a space between them, whereby the spaced projections can be placed in proximity to, adjacent to and bracketing a preselected injection site on a human or animal and the tissue at said preselected injection site and vibrated while an injection is given.

Abstract: Machines and systems for removing materials from microfeature workpieces using fixed-abrasive mediums. One embodiment of a method for removing material from a microfeature workpiece comprises rubbing the workpiece against a surface of a fixed-abrasive medium having a matrix and abrasive particles attached to the matrix, and sensing a parameter indicative of frictional force at an interface between the workpiece and the surface of the fixed-abrasive medium. This method continues by moving at least one of the workpiece and the fixed-abrasive medium relative to each other in a direction transverse to the interface based on the parameter. For example, the workpiece and/or the fixed-abrasive medium can be vibrated or oscillated to reduce the frictional force and/or maintain a desired relative velocity between the workpiece and the fixed-abrasive medium.

Abstract: A superfinishing stone 2 is slid on a rotating subject surface 7 as pressed against the subject surface 7 and is held in contact against the subject surface 7 as vibrated thereon in a different direction from the sliding direction. The superfinishing stone includes plural stone portions 3, 4 divided by a split surface 6 inclined to both the sliding direction and the vibrating direction and mutually independently movable along the split surface 6 and in the pressing direction.

Abstract: A hand-held drilling device, and method for drilling using the device, has a housing, a transducer within the housing, with the transducer effectively operating at ultrasonic frequencies, a rotating motor component within the housing and rigid cutting end-effector rotationally connected to the rotating motor component and vibrationally connected to the transducer. The hand-held drilling device of the present invention operates at a noise level of from about 50 decibels or less.

Abstract: The invention relates to a device (2) for grinding and/or finishing a workpiece (8) mounted on and/or in a workpiece mounting (22, 28). The workpiece (8) and the workpiece mounting (22, 28) may be set in an oscillating movement (86) by means of a drive device (60, 108) and form an oscillating unit (96) or part of an oscillating unit (96), at least one balancer unit (94) being provided which is driven to run counter to the oscillating movement (86) of the oscillating unit (96).

Abstract: The object of the present invention is to enable efficient vibration processing by applying a sufficient displacement amount and response speed to an object to be vibrated. In grinding of an outer surface of a workpiece W, first and second supporting members are provided for supporting two opposed points of the workpiece, and first and second vibrators comprising a plurality of piezoelectric elements are arranged in blind holes formed in the center of the first and second supporting members. The first and second vibrators are activated with sine wave signals which differ in phase by 180 degrees so as to cause the first and second supporting members to expand and shrink in the back-and-forth direction. The displacement amount is amplified and the processing is performed. Also, the second supporting member can move back and forth toward the first supporting member.

Abstract: A method for manufacturing a lapping board having abrasive grains fixed on its surface, which is performed by the steps of: preparing a rotatable metal board having a surface of soft metal, an abrasive slurry-supplying tool arranged over the surface of the metal board, an abrasive-pressing tool which is placed on the metal board and has a hard surface, and a ultrasonic oscillation-generating tool attached to either or both of the abrasive-pressing tool and the metal board; rotating the metal board while supplying an abrasive slurry onto the surface of the metal board and while supplying electric power to the ultrasonic oscillation-generating tool to generate and apply ultrasonic oscillation to either or both of the abrasive-pressing tool and the metal board, whereby introducing the supplied abrasive slurry between the metal board and the abrasive-pressing tool and partly embedding some abrasive grains onto the metal board; and removing unfixed abrasive grains from the metal board.

Abstract: A low-stress polishing device includes a base; a plurality of actuators mounted to the base and spaced from each other in a predetermined interval, each of the actuators having a drive shaft and a buffer spring connected with the drive shaft for providing the drive shaft with a predetermined impulsive pressure, each of the drive shafts having a buffer pad located at a distal end thereof; at least one drive circuit electrically connected with the actuators for control of driving the actuators; a working plate mounted to the buffer pads; and a polishing pad mounted to the working plate. Accordingly, the vibration mode generated by the device provides a dynamic pressure on the wafer surface for destroying the chemical product on the wafer surface and is applicable to polishing of low-dielectric integrated copper structures.

Abstract: An ultrasonic blade includes a blade body and a cutting edge. The blade body is defined about a generally axial line. The cutting edge is on the blade body and is defined by the intersection of a first surface and a second surface. The first surface includes a first incident angle of about 0° to 35° from the axial line and a first curve of about 10° to 20° formed at the first incident angle. The second surface includes a second incident angle of about 0° to ?35° from the axial line and a second curve of about 10° to 20° formed at the second incident angle.

Abstract: A method of using ultrasonic cutting technology to make a decorative stone includes cutting a stone or other decorative materials into certain positive pieces having various shape by the ultrasonic cutting technology; cutting another stone to certain depth but not through according to the shape of the positive piece to make a negative piece by the ultrasonic cutting technology; taking out cut-off pieces from the stone; inlaying the positive pieces into the negative piece to form an integrated piece; and polishing a surface of the positive pieces and the negative piece. This ultrasonic technology can bring high manufacture efficiency and the inlay can be industrialized easily. It also increases the decorative effect due to having different pattern and specificity of stones.

Abstract: The invention provides a cutting method and a cutting apparatus that cuts without chipping a composite material consisting of laminated layers of crystal material and amorphous material, in which the amorphous material is cut with an ultrasonically vibrated cutting blade and the crystal material is cut with a cutting blade that does not ultrasonically vibrate. With such a method and apparatus, the crystal material portion and the amorphous material portion of the composite material can be cut cleanly without chipping.

Abstract: Apparatus for polishing are provided. An apparatus comprises a fluid controller, a polishing apparatus and a fluid interface membrane. The fluid controller is fluidly coupled to the polishing apparatus by way of at least one conduit. The fluid interface membrane is disposed within at least one of the fluid controller, the conduit and the polishing apparatus to separate a first fluid and a second fluid and to transfer pressure from the first fluid to the second fluid.

Abstract: A variety of techniques may be employed, alone or in combination, to enhance contact between a processed substrate and applied megasonic energy. In accordance with one embodiment of the new invention, the vibration plate is brought into intimate contact with one surface of the substrate, while cleaning or processing fluid contacts the other. In accordance with an alternative embodiment of the present invention, a reflecting surface may be provided to cause emanated energy to be reflected back into the near field and make it more uniform. In accordance with another alternative embodiment of the present invention, energy may be transferred across a substrate bounded on both sides by liquid with incidence of megasonic energy that is either normal to the substrate surface or within a critical range of incident angles. In yet another embodiment, generated dilatational waves may be converted to surface waves prior to contacting the substrate.

Abstract: The micro titer plates, especially for micro reaction systems used in biotechnology, each have an array of special microstructures, which typically include micro cups and micro channels with different cross-sections. These microstructures are introduced into a preferably borosilicate glass wafer (18) by ultrasonic machining. Individual rectangular micro titer plates (19?) made from borosilicate glass for biotechnology are produced by cutting the structured glass wafer into individual micro titer plates. Particularly arrays of from 10 to 100 of these microstructures are formed in a 6-inch borosilicate glass wafer, in order to facilitate subsequent cutting of the wafer to economically manufacture a corresponding number of these micro titer plates (19?).

Abstract: Material is removed from objects to be marked or machined by applying tools having cutouts arranged in a pattern on the objects, filling the cutouts with abrasive particles, pouring a molten metal over the tools to solidify as a backing, and then ultrasonically vibrating the backing to propel the abrasive particles through the cutouts to transfer the pattern to the objects.

Abstract: A method and apparatus of in situ monitoring and dispersing unwanted particles in slurry used during CMP polishing. The method includes providing a slurry path, applying to the slurry path a microcavitation field of a first level to detect particles of a predetermined size, applying to the slurry path a microcavitation field of a second level that is capable of dispersing said particles, and after the second applying step, feeding the slurry to a CMP polishing unit. Particle size may be detected and/or the microcavitation field strength may be set according to particle size. In addition, field strength may be calibrated according to levels determined by polystyrene control particles of a known size and/or concentration. A single or dual transducer may apply the microcavitation.

Abstract: In a polishing apparatus, a polishing tool including abrasive particles and a binder for bonding together the abrasive particles is pressed against a substrate to polish the substrate. The polishing apparatus has a light source for irradiating a polishing surface with light rays for weakening a bond force of the binder for bonding together the abrasive particles, and a waste matter removing mechanism for forcefully removing waste matter produced by polishing or waste matter produced by irradiation. By irradiating the polishing surface with the light rays, dressing of the polishing surface is performed, and products resulting from dressing and the like are removed. The polishing apparatus supplies abrasive particles to the polishing surface stably by dressing and allows high-speed polishing of the substrate.

Abstract: A tool for abrading a workpiece to smooth the surface thereof. The tool has a shank portion and a working portion. The working portion has a smooth and non-abrading surface, with one or more depressions formed therein. Each depression includes an abrading mechanism. The abrading mechanism does not protrude above the smooth surface of the working portion of the tool. During operation, once the workpiece has been smoothed by removal of the raised areas by the abrading mechanism, the smooth surface of the tool engages the workpiece and further abrasion of the workpiece is prevented.

Abstract: A method and apparatus for simultaneously inspecting and grinding roll mills which utilizes a transducer assembly which produces a creeping wave propagation in conjunction with a couplant fluid provider and data acquisition circuit which allows the operator to see the crack and imperfections in on the surface of the mill rolls as they are rotated and to grind them off.

Abstract: An object such as an electronic device can be favorably lapped by a method composed of preparing a lapping machine having a longitudinal or circular lapping board equipped with a ultrasonic oscillation-applying device which applies elliptical vibration to the lapping board and a supporting means arranged adjacently to the lapping board; placing the object on the lapping board via abrasive grains and further on the supporting means; and activating the ultrasonic oscillation-applying device to apply elliptical vibration to the lapping board whereby the object is caused to rotate on an axis thereof and lapped.

Abstract: An in-line oscillating device is essentially composed of an oscillating tank, an oscillating pipe, and an oscillating generator. The oscillating pipe is set in the oscillating tank and connects with a slurry pipe. The oscillating generator for generating ultrasonic waves is mounted on the oscillating tank. Furthermore, the oscillating tank is filled with a medium to transmit the ultrasonic waves generated by the oscillating generator to the oscillating pipe. The in-line oscillating device is suitable to be mounted on any location of the slurry pipe where oscillation is needed.

Abstract: There is disclosed a barrel-polishing apparatus comprising a polishing medium bath with polishing mediums received therein, a base, an arm mounted on the base, and a workpiece attachment device mounted on a distal end portion of the arm and adapted to attach a workpiece to the arm, wherein the polishing mediums are caused to flow within the polishing medium bath by an appropriate device and a pressing plate for pressing the polishing mediums is mounted on the polishing medium bath. A barrel-polishing method is also disclosed.

Abstract: A tool for abrading a workpiece to smooth the surface thereof. In one embodiment, the tool is an ultrasonic tip (12) having plural grooves (16) formed in a smooth surface (14) thereof. Each groove (16) includes an abrasive material (24) coating the depression thereof. Rough surface areas of a workpiece projecting into the groove (16) are abraded to thereby result in a smooth workpiece surface. Once the surface roughness of the workpiece has been removed, the smooth areas (14) of the ultrasonic tip (12) are engaged, thereby preventing further abrasion of the workpiece.

Abstract: Chemical-mechanical planarizing machines and methods to maintain processing pads and other planarizing media used in planarizing microelectronic workpieces. In one embodiment, a planarizing machine can include a surfacing device attached to one of a carrier or a support member. The surfacing device is positioned to transmit a non-abrasive energy, such as ultrasonic waves, against the planarizing medium. The planarizing machine can include a controller that is operatively coupled to the surfacing device for activating the surfacing device at appropriate moments either before or during a planarizing cycle of a microelectronic workpiece. In another embodiment the controller can be a computer having a database containing instructions for causing the surfacing device to transmit the non-abrasive energy against the planarizing pad.

Abstract: An in-line oscillating device is essentially composed of an oscillating tank, an oscillating pipe, and an oscillating generator. The oscillating pipe is set in the oscillating tank and connects with a slurry pipe. The oscillating generator for generating ultrasonic waves is mounted on the oscillating tank. Furthermore, the oscillating tank is filled with a medium to transmit the ultrasonic waves generated by the oscillating generator to the oscillating pipe. The in-line oscillating device is suitable to be mounted on any location of the slurry pipe where oscillation is needed.

Abstract: A press die for forming a contact of an electrical connector by blanking a metal sheet is disclosed. The die has a die insert for shaving an engaging section of the contact for electrically engaging with a conductive portion of a device mating with the electrical connector so that an electrical connection between the connector and the device is created. A profile of the die insert for the shaving operation is subject to a final finishing process by an ultrasonic machining using a machining agent consisted of diamond particles dispersed in liquid, wherein the diamond particles have a grit size of 8000#. The profile of the die insert has a surface roughness of 0.08 Ra.

Abstract: A method of conditioning a polish pad at the point of polish and for dispensing slurry at the point of polish. In one embodiment, the method comprises several steps. In the first step, polishing slurry is received at a CMP machine. Next, a polish pad is rotated. Then, the polishing slurry is dispensed onto a portion of said polish pad located proximately around a location designated for holding a wafer.

Abstract: The object of the present invention is to provide a polishing apparatus that can supply a polishing solution having a non-varying distribution of abrading particles sizes at a steady rate. An apparatus (20) for delivering a polishing solution to a polishing apparatus (22) is disclosed. The apparatus (20) comprises: a solution passage for transporting the polishing solution; and an ultrasonic vibrator (72) being provided in at least one location of the solution passage.

Abstract: A method and apparatus for mechanical and/or chemical-mechanical planarization of microelectronic substrates. In one embodiment, a conditioning device for removing waste matter from a microelectronic planarizing medium has a support assembly with a support member and a conditioning head attached to the support member. The support member may be a pivoting arm or gantry assembly that carries the condition head over the planarizing medium. The conditioning head may have a non-contact conditioning element that transmits a form of non-contact energy to waste matter on the planarizing medium. The non-contact conditioning element, for example, may be an emitter that transmits a selected waveform capable of penetrating the planarizing medium and the waste matter on the planarizing medium. In operation, the selected non-contact energy may impart energy to the waste matter that weakens or breaks bonds in the waste matter and/or bonds between the planarizing medium and the waste matter.

Abstract: A polishing apparatus and a polishing method can effectively prevent large diameter particles from being fed with slurry to an object to be polished. A large-diameter particle screener blocks or disperses large diameter particles from entering the slurry. Then, slurry free from large diameter particles is taken up from a slurry container by an intake pipe and fed to the object to be polished.

Abstract: The invention relates to a method and machine for so-called “ultrasonic” peening employing a mist of microbeads inside an active chamber 30c for peening parts 21 on a wheel 19, ie blades on a rotator. The periphery of the wheel 19 is brought simultaneously past the openings of at least three chambers with limited clearances E1 and E2. At least one chamber being active with a peening mist of microbeads and at least two chambers, either side of the active chamber, being passive. The wheel being rotated over the chambers and the microbeads are removed from the passive chambers and in that the active chambers are supplied with microbeads therefrom.

Abstract: There is disclosed a barrel-polishing apparatus comprising a polishing medium bath with polishing mediums received therein, a base, an arm mounted on the base, and a workpiece attachment device mounted on a distal end portion of the arm and adapted to attach a workpiece to the arm, wherein the polishing mediums are caused to flow within the polishing medium bath by an appropriate device and a pressing plate for pressing the polishing mediums is mounted on the polishing medium bath. A barrel-polishing method is also disclosed.

Abstract: The present invention provides a method and apparatus for conditioning a polishing pad in which slurry is directed under pressure at the polishing pad. Additionally, energy (i.e., ultrasonic energy) may be added to the slurry as it is directed towards the polishing pad, wherein embedded material in the polishing pad is removed or dislodged.

Abstract: A vibration inducing grinding wheel for removing material from a workpiece is provided. The vibration inducing grinding wheel is for use in a grinding machine. The vibration inducing grinding wheel includes a generally cylindrically shaped body defining a cylindrical outer periphery thereof. At least one of the composition and the contour of the outer periphery is selected so as to provide a vibration to the grinding machine such that the straightness of the workpiece is thereby improved with respect to the straightness of the workpiece ground by a standard grinding wheel having a cylindrical outer periphery thereof, the contour and composition of the outer periphery of the standard grinding wheel being uniform.

Abstract: A method and apparatus for mechanical and/or chemical-mechanical planarization of microelectronic substrates. In one embodiment, a conditioning device for removing waste matter from a microelectronic planarizing medium has a support assembly with a support member and a conditioning head attached to the support member. The support member may be a pivoting arm or gantry assembly that carries the condition head over the planarizing medium. The conditioning head may have a non-contact conditioning element that transmits a form of non-contact energy to waste matter on the planarizing medium. The non-contact conditioning element, for example, may be an emitter that transmits a selected waveform capable of penetrating the planarizing medium and the waste matter on the planarizing medium. In operation, the selected non-contact energy may impart energy to the waste matter that weakens or breaks bonds in the waste matter and/or bonds between the planarizing medium and the waste matter.

Abstract: A method and apparatus for conditioning a slurry used in a chemical mechanical polishing apparatus is disclosed. Megasonic generators are provided along the piping network between a slurry reservoir and the CMP apparatus. A megasonic generator may also be placed adjacent to the slurry reservoir. The megasonic generators discourage the formation of agglomerate particles, which in turn reduces the number of defects caused by the large particles in the slurry.

Abstract: The invention provides a NC unit provided with an ultrasonically oscillating tool, capable of indenting pits at equal pitches and detecting an amount of wastage of a stylus. In the NC unit, a PLL circuit outputs an ultrasonic signal S at a frequency equivalent to the resonant frequency of the ultrasonically oscillating tool and the frequency of the output signal S undergoes changes following up any change in the resonant frequency due to wear and tear of the stylus. Accordingly, the frequency of the output signal S has a value corresponding to the amount of wastage of the stylus. A frequency detection circuit 40 detects the frequency of the output signal S, and delivers data indicating the frequency to a CPU. When applying a process for indenting pits at equal pitches, the CPU changes over a synchronizing/changeover circuit so as to deliver the output signal S from the PLL circuit to an interpolative operation circuit.

Abstract: An ultrasonic vibration composite processing tool is disclosed wherein at least one small-sized processing member is arranged for carrying out processing of a processed material while applying vibration to the processed material, to thereby ensure stable operation of the processing tool to accomplish efficient processing of the processed material even when the processed material is large-sized. A processing structure and a vibration structure are arranged. The processing structure includes a rotatable base having a rotation axis and at least one processing member including a micro-cutting surface. The processing member is arranged on one surface of the base so as to be positioned in a circumferential direction of the base about the rotation axis of the base. The vibration structure functions to vibrate the processing member in directions of the processed material.

Abstract: An ultrasonic vibration composite grinding tool is disclosed wherein a plurality of small-sized grinding wheels are arranged for carrying out grinding of a ground material while applying vibration to the ground material, to thereby ensure stable operation of the grinding tool to accomplish efficient grinding of the ground material even when the ground material is large-sized. A grinding structure and a vibration structure are arranged. The grinding structure includes a rotatable base having a rotation axis and a plurality of grinding wheels formed into the same configuration and each including a micro-cutting surface. The grinding wheels are arranged on one surface of the base in a manner to be spaced from each other at predetermined intervals in a circumferential direction of the base about the rotation axis of the base. The vibration structure functions to vibrate the grinding wheels.

Abstract: A pad conditioner for a chemical mechanical polishing (CMP) apparatus which is adapted to remove a glazing phenomenon occurring on a polishing pad when wafers are machined using the CMP apparatus. The pad conditioner includes a swing arm pivotally mounted at one end thereof to a desired portion of the upper surface of the chemical mechanical polishing apparatus by a pivot shaft, a rotating oscillator coupled to the other end of the swing arm and adapted to horizontally rotate a conditioning tool mounted thereto while vertically oscillating the conditioning tool, the rotating oscillator including a rotating unit for horizontally rotating the conditioning tool and an oscillation generating unit for vertically oscillating the conditioning tool, and a vertical carrier unit coupled to the other end of the swing arm and adapted to vertically move the rotating oscillator.

Abstract: A method of cleaning a solid surface which is particularly effective for a surface having a complicated structure including slots and holes comprises immersing the solid surface in a cleaning slurry comprising a cleaning liquid and abrasive particles which are soluble in the cleaning liquid, the cleaning liquid comprising a saturated solution so as to greatly reduce the dissolution of the abrasive particles in the cleaning liquid.

Abstract: The present invention relates to a method and apparatus for surface treating and putting under compression prestress the inside wall of a cavity, in particular a cylindrical cavity of circular section. The apparatus comprises a bulb-shaped vibrator provided with a tubular portion designed to be engaged in an orifice of a cavity to be treated. It is associated with a vibration exciter designed to excite the vibrator at its resonant frequency. The treatment is obtained by shot in the form of balls being projected against the walls of the cavity and returned into the treatment field by a reflector. The method is particularly applicable to treating holes that are designed to receive the fixing pins of turbine blades.