Abstract: A polishing tool for processing an optical surface of a spectacle lens, having a carrier body and a polishing film, an elastic layer being arranged between said polishing film and said carrier body. Further, there is provision for a surface of said polishing film, which surface is active during processing, to decrease in size in an edge region of said polishing film outwards in said radial direction. Furthermore, an apparatus is provided for polishing an optical surface of a spectacle lens having a polishing tool as described above.

Abstract: An optical-grade surfacing tool (101) is provided with a resilient return element (115) including a plurality of resiliently flexible strips (118) that transversely project from a rigid central mounting (104), each strip (118) having a distal portion (144) that engages by bearing directly upon a petal (134) of a flexible flange (131) that surrounds the rigid mounting (104). The distal portion is curved along a round loop such that the end (145) of each the strip (118) is rotated toward the rigid mounting (104).

Abstract: A polishing head that can be disassembled and comprises a polishing cloth 1, sponge 2 and plastic base 3. The polishing cloth 1 is tightly pressed on the plastic base 3 by a sponge 2. The plastic base 3 is divided into one part with male threads and the other part with female threads. The two parts coordinate with each other to achieve dismantling or locking of the cloth and sponge to the base. When the polishing cloth is damaged, the plastic base can be unscrewed to change the damaged polishing cloth, while the base can be reused so as to reduce waste.

Abstract: Optical grade surfacing tool, including: a rigid support (60); an elastically compressible interface (12) attached to the rigid support (60); a flexible pad (13) adapted to be pressed against a surface (71) to be worked, attached to the interface (12) on the opposite side to the rigid support (60); and return spring elements (14) disposed between the rigid support (60) and a peripheral part (12b) of the interface (12); characterized in that the return spring elements (14) include a plurality of pairs of superposed elastically flexible blades (65, 66) that project transversely from the rigid support (60), respectively a first blade (65) having a distal portion cooperating in bearing engagement, through a first face, exclusively with the peripheral part (12b) of the interface (12), and a second blade (66) cooperating in bearing engagement with the first blade (65) via a second face opposite its first face.

Abstract: Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Abstract: A surface device includes a rigid holder (11), an elastically compressible interface (12) connected to the rigid holder, a flexible pad (13) adapted to be applied onto the surface to be machined (30) and a flexible belt (14) applied against and partially covering the side surface (18) of the interface (12), an annular portion (21) of the side surface (18) of the interface (12) being free between the belt (14) and the holder (11).

Abstract: The polishing pad includes a polishing surface, on which is formed with a plurality of first grooves and a plurality of second grooves, wherein the characteristic of the polishing pad is in that: the first grooves are connected to the second grooves, the width of first grooves are larger than that of the second grooves, the depth of first grooves are larger than that of the second grooves, the density of first grooves are larger than that of the second grooves, and the first grooves and the second grooves are uniformly distributed over the polishing surface respectively. Therefore when the polishing step is performed using the polishing pad, smaller scraps produced after polishing or smaller polishing particles in the slurry or more turbid slurry can flow out of the polishing pad via the second groove, and larger scraps or particles can flow out of the polishing pad via the first groove.

Abstract: The invention provides a polishing pad useful for polishing at least one of a magnetic, optical and semiconductor substrate in the presence of a polishing medium with a polishing pad. The polishing pad comprises a center, an inner region surrounding the center, a transition region connecting grooves from the inner region to an outer region surrounding the inner region. The outer region has multiple grooves with a high-rate path. The transition region is adjacent the outer region and within a radius from the center defined as follows: r TR = 0.7 ? r * ? ? to ? ? 1.3 ? r * where r * = R C ? ( R R C ) 2 - cos ? ( 2 ? ? c ? ? 0 ) - sin ? ( 2 ? ? c ? ? 0 ) ? ( R / R C cos ? ? ? c ? ? 0 ) 2 - 1 ; with the inner region originating continuous grooves that extend uninterrupted to the outer region.

Abstract: This tool includes: a rigid support (104) having a transverse end surface (113); an elastically compressible interface that is pressed against and covers the end surface; a flexible pad adapted to be pressed against the optical surface, itself pressed against and covering the interface on the opposite side of and in line with the end surface (113); spring return element (115) connecting the support (104) to a peripheral portion of the flexible pad situated transversely beyond the end surface (113); and a flexible flange (131) that is part of a base (130) to which the rigid support (104), which is surrounded by the flange (131), also belongs.

Abstract: The present invention relates particularly to an oscillating grinding machine. The grinding machine comprises a driving motor (3) surrounded by a body (3), and a drive shaft (4) cooperating with the driving motor. The drive shaft comprises a grinding head (5) that constitutes a support for a grinding product (8). The drive shaft (4) is arranged in two pieces and comprises a main shaft (11) and an eccentric shaft (10) arranged rigidly thereto. The eccentric shaft comprises a centre line (12) that assumes an angle (?) against a corresponding centre line (13) of the main shaft, and thus the grinding head (5) will assume an eccentric placement in relation to the main shaft (11). Thus, the grinding head is arranged to oscillate in a substantially spherical plane provided by the rotation of the main shaft and the eccentricity and inclination of the eccentric shaft in relation to the main shaft.

Abstract: A chemical mechanical polishing pad having a face for polishing an object to be polished, a non-polishing face opposite to the face and a side face for interconnecting these faces and including the pattern of recessed portions which are formed on the non-polishing face and are open to the non-polishing face but not on the side face.

Abstract: A polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular is disclosed, which comprises a support body, to which a foam layer is attached, wherein a polishing film bears against the foam layer. The polishing film is provided with at least one opening in a central region. During machining, the opening ensures pressure equalization and makes liquid polishing agent available from inside the foam layer, as a result of which better rinsing and cooling of otherwise disadvantaged regions of the polishing disk is achieved. As a result, a polishing disk of simple and cost-effective design is proposed, which is much more durable than the prior art while achieving high surface qualities.

Abstract: An optical surface-finishing tool includes a rigid support (4) having a transverse end surface (13); an elastically-compressible interface (5) which is applied against the end surface (13) such as to cover same; and a flexible buffer (6) which can be applied against the optical surface (2), which is applied against the interface (5) and which covers the interface at least partially, opposite and in line with the end surface (13). The buffer includes a central part (6a) which is in line with the end surface (13) and a peripheral part (14) which extends transversely beyond the end surface (13). There is also an elastic return element (15) having a collar (18) which is used to connect the peripheral part (14) to the support (4). Moreover, the collar (18) includes a continuous peripheral part (22) which rests on the peripheral part (14) of the buffer (6) such as to co-operate therewith.

Abstract: The invention refers to a polishing tool for optical lenses with at least one polishing pad adaptable at least partially to the shape of a lens surface of said lenses and drivable by means of a drive shaft, said polishing pad having a membrane, wherein said polishing pad can transmit a bearing force of said membrane at least in an orthogonal direction relative to a lens surface. Moreover, the polishing tool comprises a reinforcing member connectable to said membrane, said reinforcing member being dimensionally stable in a parallel direction relative to a surface of said membrane and being flexible and/or pliable in an orthogonal direction relative to the surface of said membrane, wherein at least one pressure pad with a pressure membrane is arranged within said polishing pad, wherein said pressure membrane can be made to bear and/or can be prestressed against said membrane or said reinforcing member in an indirect or in a direct manner.

Abstract: The polishing pad for a chemical mechanical polishing apparatus and method of making the same has a polishing pad with a bottom layer, a polishing surface on a top layer and a transparent sheet of material interposed between the two layers. Slurry from the chemical mechanical polishing process is prevented from penetrating the impermeable transparent sheet to the bottom layer of the polishing pad.

Abstract: A polishing pad (104, 300, 400, 500) for polishing a wafer (112, 516), or other article. The polishing pad includes a polishing layer (108) containing a plurality of grooves ((148, 152, 156)(304, 308, 324)(404, 408, 424)(520, 524, 528)) having orientations largely parallel to one or more corresponding respective velocity vectors (V1–V4)(V1?–V4?)(V1?–V4?) (V1??–V4??) of the wafer. These parallel orientations promote the formation of mixing wakes in a polishing medium (120) within these grooves during polishing.

Abstract: Systems and methods for beveling microfeature workpiece edges are disclosed. A system in accordance with one embodiment is configured to remove material from a microfeature workpiece having a first face, a second face facing opposite from the first face, an edge surface between the first and second faces, and an edge at a juncture between the edge surface and one of the first and second faces. The system can include a carrier positioned to carry the workpiece with the first and second faces generally normal to an axis, and a first polishing pad having a support surface and a polishing surface facing generally away from the support surface. The polishing surface can have a first shape with at least one portion oriented at an acute angle relative to the axis and the support surface to remove material from the edge of the workpiece.

Abstract: A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support surface. Also, a porous layer may be placed between the polishing media and the support surface to form dimples in the polishing media upon the application of vacuum. An alternative arrangement draws the polishing media against a carrier and the substrate to be polished.

Abstract: A chemical mechanical polishing pad (200) that includes a polishing layer (204) having a polishing region (208) and containing a plurality of grooves (212) extending at least partially into the polishing region. During polishing, the grooves contain a slurry (236) that facilitates polishing. Each groove includes a plurality of mixing structures (220) configured to cause mixing of slurry located in a lower portion (240) of the groove with slurry located in the upper portion (244) of the groove.

Abstract: A polishing pad for polishing curved surfaces has a pad element having an axis, a central opening adjoining the axis and forming an inner edge, and an outer peripheral edge, first engaging means provided on the outer peripheral edge for engaging an outer periphery of a curved supporting body, and second engaging means provided on the inner edge of the pad element and engageable with a central opening of the curved supporting body, the first and second engaging means being harder than the pad element.

Abstract: A polishing pad has a working layer provided with an abrasive powder, an attaching layer for attaching a pad to a polishing head of a power tool, and a connection layer which connects the working layer with the attaching layer, the connection layer being located between the working and the attaching layer and having a peripheral region which is thinner and also a central region which is thicker than the peripheral region and therefore has an increased elasticity so that during polishing an elasticity of a central portion of the working layer is increased.

Abstract: A chemical mechanical polishing pad and a system and a method for using such a pad are described. The polishing pad includes pockets of continuous porosity, each of the pockets being separated from the other pockets by a non-porous matrix. The non-porous matrix may include a network of trenches, or may have pores which have been filled with a material. The material may include a polymer resin. A system for polishing a wafer includes the polishing pad mounted on a platen. A drive assembly creates relative rotation between the wafer and the polishing pad through a drive shaft. The drive shaft may be connected to the platen or it may be connected to a wafer holder which holds the wafer. Alternatively, one drive shaft may be connected to the platen and another drive shaft may be connected to the wafer holder, and a pair of drive assemblies drive the drive shafts.

Abstract: A polishing pad (104, 300, 400, 500) for polishing a wafer (112, 516), or other article. The polishing pad includes a polishing layer (108) containing a plurality of grooves ((148, 152, 156)(304, 308, 324)(404, 408, 424)(520, 524, 528)) having orientations largely parallel to one or more corresponding respective velocity vectors (V1–V4)(V1?–V4?)(V1?–V4?)(V1??–V4??) of the wafer. These parallel orientations promote the formation of mixing wakes in a polishing medium (120) within these grooves during polishing.

Abstract: The invention is directed to chemical-mechanical polishing pads comprising a transparent window. In one embodiment, the transparent window comprises an inorganic material and an organic material, wherein the inorganic material comprises about 20 wt. % or more of the transparent window. In another embodiment, the transparent window comprises an inorganic material and an organic material, wherein the inorganic material is dispersed throughout the organic material and has a dimension of about 5 to 1000 nm, and wherein the transparent window has a total light transmittance of about 30% or more at at least one wavelength in the range of about 200 to 10,000 nm. In yet another embodiment, the transparent window comprises an inorganic/organic hybrid sol-gel material. In an additional embodiment, the transparent window comprises a polymer resin and a clarifying material, wherein the transparent window has a total light transmittance that is substantially higher than a window comprising only the polymeric resin.

Abstract: A polishing pad (104, 300, 400, 500) for polishing a wafer (112, 516), or other article. The polishing pad includes a polishing layer (108) having a polishing region (164, 320, 420, 504) defined by first and second boundaries ((168, 172), (312, 316), (412, 416) (508, 512)) having shapes and locations that are a function of the size of polished surface (116) of the article being polished and the type of polisher (100) used. The polishing region has several zones ((Z1–Z3) (Z1?–Z3?)(Z1?–Z3?)(Z1??–Z3??)) each containing corresponding grooves ((148, 152, 156)(304, 308, 324)(404, 408, 424)(520, 524, 528)) having orientations selected based on the direction of one or more velocity vectors (V1–V4)(V1?–V4?)(V1?–V4?) (V??–V4??) of the wafer in that zone.

Abstract: A polisher for polishing a curved surface such as a concave surface of a spectacle lens has a structure in which a polishing pad 3 comprising water passing grooves 5 having a width W of 0.1 to 5 mm is adhered to a dome-shaped elastic base member 2. The polishing pad 3 is composed of a plurality of pads 31, and the water passing grooves 5 are formed at the gaps between the pads 31, whereby the width W of the water passing grooves 5 are made small. It is effective to make the pads 31 polygonal in shape. The polishing pad 3 covers the moving region 6 of the work 8 to be polished. The polishing pad 3 is adhered through a high-tack adhesive layer 4. A polishing method is adopted in which such a polisher 1 is used and the work 8 is polished by pressing the polishing pad 3 against the work 8, whereby the polishing pad 3 adhered to the elastic base member 2 can be prevented from being stripped by an end edge of the work 8, and generation of defective polish can be prevented.

Abstract: The present invention discloses a polishing pad that can facilitate process stability, extend length of use, and mitigate process non-uniformity and process induced defects for chemical mechanical planarization processes. The polishing pad of the present invention is a composite of a top pad and a sealed sub-pad. The sealed sub-pad has a sealing mechanism that mitigates liquid penetration into the sub-pad thereby maintaining a substantially uniform compressibility of the sub-pad and the polishing pad and extending a useable life of the polishing pad.

Abstract: A porous polishing pad is useful for polishing semiconductor substrates. The porous polishing pad has a porous matrix formed from a coagulated polyurethane and a non-fibrous polishing layer. The non-fibrous polishing layer has a polishing surface with a pore count of at least 500 pores per mm2 that decreases with removal of the polishing layer; and the polishing surface has a surface roughness Ra between 0.01 and 3 ?m.

Abstract: The polishing pad for a chemical mechanical polishing apparatus and method of making the same has a polishing pad with a bottom layer, a polishing surface on a top layer and a transparent sheet of material interposed between the two layers. Slurry from the chemical mechanical polishing process is prevented from penetrating the impermeable transparent sheet to the bottom layer of the polishing pad.

Abstract: Methods and compositions are provided for the chemical mechanical planarization of ruthenium. The method includes polishing the ruthenium layer using a low contact pressure and exposing the ruthenium layer to a planarization composition while polishing. The planarization composition comprises a dispersing medium and a plurality of abrasive particles. The method further includes removing the ruthenium of the ruthenium layer as a ruthenium hydroxide if the pH of the composition is in the range of from about 8 to about 12. The planarization composition may further comprise an oxidizing agent, with the ruthenium removed as a ruthenium hydroxide if the pH of the composition is in the range of from about 2 to about 14. The planarization composition may further comprise a complexing agent, with the ruthenium transformed into an ionic state and removed as a ruthenium complex if the pH of the composition is no greater than about 2.5.

Abstract: A polishing body, e.g., pad (200, 230, 260, 300) or belt (400, 500) having a polishing layer (214, 404) that includes a backmixing region (202, 232, 262, 308, 416, 508) wherein backmixing can occur within a slurry (116) between a wafer (204, 234, 264, 304, 408), or other article, and the polishing layer under certain conditions. The polishing layer includes a first groove configuration (206, 236, 266, 312, 428, 504) within the backmixing region and a second grove configuration (208, 238, 268, 320, 432, 520) outside of the backmixing region that is different from the first groove configuration. The first groove configuration is designed based upon whether or not the presence of spent slurry within the backmixing region is detrimental or beneficial to polishing the wafer.

Abstract: The invention is directed to chemical-mechanical polishing pads comprising a transparent window comprising a polymer resin having a first index of refraction and an inorganic material having a second index of refraction. The transparent window has a light transmittance of about 10% or more at a wavelength of about 200 nm to about 10,000 nm. The difference between the first index of refraction and the second index of refraction is about 0.3 or less at the wavelength.

Abstract: An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness and hydrolytic stability.

Abstract: Disclosed is a chemical mechanical polishing pad formed at a polishing surface thereof with a plurality of concentric wave-shaped grooves having different radiuses while having the same shape. Each groove has a desired depth, width, and shape. The chemical mechanical polishing pad provides effects of effectively controlling a flow of slurry during a polishing process, thereby achieving a stability in the polishing process in terms of a polishing rate, and achieving an enhancement in the planarization of a wafer.

Abstract: The present invention describes an apparatus that includes a polish pad, the polish pad including a first through-opening; a vertical distribution layer located below the polish pad, the vertical distribution layer connected to the through-opening; a lateral distribution layer located below the vertical distribution layer, the lateral distribution layer connected to the vertical distribution layer; and a slurry dispense located over a front-side of the polish pad, the slurry dispense to provide a slurry to be transported through the polish pad to the lateral distribution layer. The present invention further describes a method including dispensing a slurry at a front-side of a polish pad; flowing the slurry to a location below the polish pad; flowing the slurry upwards and outwards, towards edges of the polish pad; and distributing the slurry to an upper surface of the polish pad.

Abstract: A retainer for retaining an abrasive pad on a lens making machine and an abrasive pad adapted to such retention comprises a retainer nestable with a lap of a lens making machine wherein when such retainer is nested, a pad placed upon said lap before nesting will be trapped in the desired position. The pad of the invention includes radially outwardly extending members beyond the working area of the pad whose purpose is to be trapped by the retainer. The invention enables automatic loading and unloading of pads on the lens making machine.

Abstract: New, versatile finishing surfaces are described. Unitary finishing elements having discrete finishing members attached to unitary resilient body are disclosed for finishing microdevices such as semiconductor wafers. Finishing surfaces such as discrete finishing members can be comprised of a multiphase polymeric composition. The new unitary finishing elements have lower cost to manufacture and high precision. The unitary finishing elements and finishing surfaces can reduce unwanted surface defect creation on the semiconductor wafers during finishing.

Abstract: A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.

Abstract: A retainer for retaining an abrasive pad on a lens making machine and an abrasive pad adapted to such retention comprises a retainer nestable with a lap of a lens making machine wherein when such retainer is nested, a pad placed upon the lap before nesting will be trapped in the desired position. The pad of the invention includes radially outwardly extending members beyond the working area of the pad whose purpose is to be trapped by the retainer. The invention enables automatic loading and unloading of pads on the lens making machine.

Abstract: A chemical mechanical polishing pad and a system and a method for using such a pad are described. The polishing pad includes pockets of continuous porosity, each of the pockets being separated from the other pockets by a non-porous matrix. The non-porous matrix may include a network of trenches, or may have pores which have been filled with a material. The material may include a polymer resin. A system for polishing a wafer includes the polishing pad mounted on a platen. A drive assembly creates relative rotation between the wafer and the polishing pad through a drive shaft. The drive shaft may be connected to the platen or it may be connected to a wafer holder which holds the wafer. Alternatively, one drive shaft may be connected to the platen and another drive shaft may be connected to the wafer holder, and a pair of drive assemblies drive the drive shafts.

Abstract: The polishing pad for a chemical mechanical polishing apparatus and method of making the same has a polishing pad with a bottom layer, a polishing surface on a top layer and a transparent sheet of material interposed between the two layers. Slurry from the chemical mechanical polishing process is prevented from penetrating the impermeable transparent sheet to the bottom layer of the polishing pad.

Abstract: A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support surface. Also, a porous layer may be placed between the polishing media and the support surface to form dimples in the polishing media upon the application of vacuum. An alternative arrangement draws the polishing media against a carrier and the substrate to be polished.

Abstract: An abrasive article is provided which comprises a backing and at least one three-dimensional abrasive coating bonded to a surface of the backing. The abrasive coating comprises a binder formed from a cured binder precursor having dispersed therein a plurality of diamond bead abrasive particles and a filler which comprises from about 40 to about 60 percent weight of the abrasive coating. The abrasive article is particularly suitable for abrading a glass or a glass ceramic workpiece in the presence of a lubricant.

Abstract: A fixed abrasive finishing element having a continuous phase of synthetic resin and discrete synthetic resin particles dispersed in the continuous phase of synthetic resin is described. The synthetic resin particles have abrasive particles dispersed therein. A compatibilizing agent can be used to enhance their finishing properties. The finishing elements are useful for polishing semiconductor wafers. Planarization and localized finishing can be improved using these finishing elements. Unwanted surface defects can be reduced. Methods to finish a semiconductor wafer using these finishing elements are described.

Abstract: A single-layer polishing pad is grooved in a pattern having relatively large turn radius bends (i.e., greater than the 90° bends of conventional rectangular grid grooving) to improve stability. The large radius bends allow slurry to be more easily and uniformly distributed across the surface of the polishing pad than conventional rectangular grooving. This improvement in slurry distribution tends to improve RR uniformity and WIWNU. In one embodiment, the polishing pad is grooved in a hexagonal pattern, which produces a grooving pattern with 120° bends. The grooves do not penetrate all of the way through the upper layer, thereby maintaining the “stiffness” of the polishing pad, which tends to improve planarization. When used in conjunction with standard pad conditioning techniques, polishing pads with groove patterns having large radius bends has yielded startling and unexpected improvement in stability.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a membrane formed from a compressible, flexible material, such as neoprene or silicone, and having a first portion with a thickness greater than that of a second portion. The membrane can be aligned with the microelectronic substrate to bias the microelectronic substrate against a planarizing medium such that the first portion of the membrane biases the microelectronic substrate with a greater downward force than does the second portion of the membrane. Accordingly, the membrane can compensate for effects, such as varying linear velocities across the face of the substrate that would otherwise cause the substrate to planarize in a non-uniform fashion or, alternatively, the membrane can be used to selectively planarize portions of the microelectronic substrate at varying rates.

Abstract: A polishing pad having a cross-sectional open area which varies with depth from the pad surface is provided. The cross-sectional open area of the pad may increase and/or decrease moving away from the outer pad surface. In some cases, the cross-sectional open area of the pad varies uniformly with depth over the entire pad. In other cases, certain regions of the pad may define local cross-sectional open areas which vary differently. This can, for example, allow the open area of the pad to vary with pad life and improve or tailor the polishing uniformity of the pad and/or extend the useful life of the pad.

Abstract: A polishing pad surface having a surface designed for chemical mechanical polishing of a substrate surface is described. The polishing pad surface includes a first area on the surface exposed to and capable of contacting a first amount of the substrate surface during chemical-mechanical polishing and a second area on the surface exposed to and capable of contacting a second amount of the substrate surface during chemical-mechanical polishing, wherein the second amount is larger than the first amount of the substrate surface to produce a more uniformly polished substrate surface.

Abstract: A polishing cloth according to the present invention includes: a polishing cloth substrate; a pressure-sensitive adhesive layer laminated on one face of the polishing cloth substrate; and a release sheet attached to the pressure-sensitive adhesive layer in a releasable manner. The pressure-sensitive adhesive layer includes an adhesive composition containing a polymer, the polymer having a first-order melt transition in a temperature range narrower than 15° C. Thus, the present invention provides a polishing cloth and a method for attaching/detaching the polishing cloth to/from a base plate of a polishing machine such that the polishing cloth can be peeled off the base by simply cooling the base plate and the adhesive layer of the polishing cloth.

Abstract: A polishing pad is provided, having its face shaped to produce controlled nonuniform removal of material from a workpiece. Non-uniformity is produced as a function of distance from the pad's rotational axis (the working radius). The pad face is configured with both raised, contact regions and voided, non-contact regions such that arcuate abrasive contact varies nonuniformly as a function of distance from the pad's rotational axis. Void density at any distance may be produced by several techniques such as varying void size as a function of working radius or varying the number of voids per unit area as a function of working radius. Either technique produces variation in voided area per total unit area for rings of pad surface concentric with the rotational axis having infintesimally small width.