Abstract: An improved silver-glass paste for bonding a silicon die to a ceramic substrate consisting essentially of silver flake, glass, resin, surfactant containing lyophilic and lyophobic groups and solvent. The surfactant provides a steric barrier around the silver and glass to stabilize the paste and reduce voiding and cracking when the paste is used to bond the die to the substrate.

Abstract: A low dielectric, low temperature fired glass ceramic produced by firing at about 800.degree.-950.degree. C. a mixture comprising at least one glass consisting of, by weight percent, 0 to 50% B.sub.2 O.sub.3, 35 to 65% CaO, and 10 to 65% SiO.sub.2 l , and selected from the glasses of CaO-B.sub.2 O.sub.3 -SiO.sub.2 glass system. The glass ceramic is light weight, exhibits a dielectric constant of less than about 5.2, has adequate mechanical strength and thermal conductivity, and is compatible with precious metal conductors. The glass ceramic is useful in the manufacture of integrated circuits and any other electronic or mechanical components where a glass ceramic exhibiting this particular combination of characteristics is suitable.

Abstract: A crystallizable glass composition comprising PbO and/or Bi.sub.2 O.sub.3, ZnO, B.sub.2 O.sub.3, Cr.sub.2 O.sub.3, SnO.sub.2 and optionally SiO.sub.2 and/or Al.sub.2 O.sub.3, having an optical density parameter .gtoreq.1.6.

Abstract: A crystallizable glass composition comprising ZnO, PbO, B.sub.2 O.sub.3, SiO.sub.2, SnO.sub.2 and optionally Al.sub.2 O.sub.3 and/or Cr.sub.2 O.sub.3.

Abstract: A crystalline composition having an X-ray diffraction pattern essentially the same as the high cristobalite form of silica comprising SiO.sub.2, Al.sub.2 O.sub.3 and a metal oxide (Me.sub.x O) in which Me is selected from Na, Ca, Sr and mixtures thereof.

Abstract: An improved sliver-glass paste for bonding a semiconductive element to a substrate comprising silver flake, glass frit, a surfactant, a thixotrope and a low boiling paraffinic hydrocarbon solvent.

Abstract: Low-expansion devitrifying glass compositions exhibiting a negative-slope temperature coefficient of expansion over a temperature range from about 125.degree. C. to about 500.degree. C. are useful for the fabrication of thick film copper via-fill inks for multilayer printed-circuit boards.

Abstract: An encapsulant composition comprising a lead zinc silicoborate glass which forms a crystalline phase of Zn.sub.2 SiO.sub.4 and ZnB.sub.2 O.sub.4 when it is fired at 650.degree.-800.degree. C.

Abstract: An improved silver-glass paste for bonding a semiconductive element to a substrate comprising a metal resinate. A surfactant containing lyophilic and lyophobic groups may also be included.

Abstract: An electronic package comprising dielectric layers including a densified aluminum nitride (AlN) base layer and at least one densified AlN-borosilicate glass composite layer bonded thereto is described. Any of the dielectric layers may be metallized with conductive circuit patterns and can contain conductive vias. Production of this package is accomplished by hot pressing a greenware laminate comprising a densified base (e.g., AlN); at least one green sinterable sheet (e.g., AlN-borosilicate glass composite); and a green sheet of non-sinterable material (e.g., boron nitride [BN]). The respective green sheets comprise homogeneous mixtures of the ceramic powders and a binder, e.g., polyethylene. The polyethylene is burnt off during the hot press operation. Residual BN is removed by brushing and/or grit blasting, leaving the finished electronic package, all ceramic elements of which are densified. The package provides superior thermal conductivity, strength, dielectric properties, and silicon-compatibility.

Abstract: This invention relates to a dielectric composition comprising:(a) about 30% to about 100% by weight of a glass composition selected from the group consisting of:(a-1) a bismuth-free, lead-free or low-lead containing glass composition having a glass transition temperature in the range of about 600.degree. C. to about 800.degree. C.;(a-2) a mixture of two bismuth-free, lead-free or low-lead containing glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C. and a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C.; or(a-3) a mixture of three bismuth-free, lead-free or low-lead containing glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C., a second glass composition having a glass transition temperature in the range of about 765.degree. C.

Abstract: A powdery coating glass material essentially consists of V.sub.2 O.sub.5 5-35 wt. %, ZnO 33-60 wt. %, B.sub.2 O.sub.3 3-25 wt. %, SiO.sub.2 1-15 wt. %, Al.sub.2 O.sub.3 0-5 wt. %, and at least one element 2-20 wt. % selected from the group consisting of MgO, CaO, SrO, and BaO, which coating glass material has a softening point of 600.degree. C. or less. A coating glass composition is prepared by the above powdery coating glass material or a coating glass paste for use in a thick-film technique which contains the above powdery coating glass material. The prepared coating glass composition has a thermal expansion coefficient ranging from 55.times.10.sup.-7 /.degree.C. to 75.times.10.sup.-7 /.degree.C.

Abstract: This specification is directed to a UV-base ceramic paint composition and a method of forming a glass sheet with a UV-base ceramic paint thereon. The method has the following steps. A UV-base ceramic paint is applied to the glass sheet. The UV-base ceramic paint includes selected ceramic paint components along with, as a new component thereof, finely divided zinc metal powder. The glass sheet is subjected to UV radiation and then heated to a temperature which softens the glass sheet sufficiently so that the glass sheet can be formed. The glass sheet and the ceramic paint thereon are engaged with a fiberglass covered forming die to form the heated glass sheet to a desired shape. The forming die is removed from engagement with the glass sheet. The finely divided zinc metal powder addition to the ceramic paint is credited with being effective to prevent sticking of any of the ceramic paint to the forming die. The glass sheet is cooled to obtain a formed glass sheet with a ceramic paint thereon.

Abstract: A copper paste composition for low temperature firing on a ceramic substrate is comprised of inorganic components and organic vehicle components. The inorganic components mainly consist of cooper powder, cuprous oxide powder, cupric oxide powder and glass powder. The mixing ratio off the inorganic components of this composition is 100 parts by weight of copper powder, about 10 to 15 parts by weight of cuprous oxide powder, about 12 to 17 parts by weight of cupric oxide powder, and about 7 to 12 parts by weight of glass powder. The mixing ratio of the inorganic components with the organic vehicle components is about 95 to 70 parts by weight of the organic vehicle components. Also the the average particle size of the copper powder is in a range of about 0.5 to 3 .mu.m and the oxygen content of the copper powder is about 0.05 to 0.15 weight percent.

Abstract: A thermal head obtained by calcining a mixed material comprising at least ruthenium oxide particles having a specific surface area of 10 to 40 m.sup.2 /g and a particle size of 1 .mu.m as the upper limit value of particle size distribution, glass fine particles and a dispersant which disperses these fine particles and disappears by calcining can reduce scattering of resistance values and give high image quality at thermal printing.

Abstract: The present invention contemplates a novel enamel composition, a novel electrodeposition bath, a novel metal substrate for enameling, and the novel PEMS produced from these materials and procedures. In general, the novel glass composition of the present invention are within the following composition ranges (which are set forth in percent by weight).______________________________________ SiO.sub.2 9-16% B.sub.2 O.sub.3 20-25% MoO.sub.3 2-10% MgO 30-40% BaO 16-22% ZnO 5-14% SnO.sub.2 0-4% ______________________________________In the novel application method of the present invention, an improved electrophoretic bath has been found in which the glass particles are suspended in a mixture of isopropyl alcohol and either dichloromethane or trichlorotrifluoroethane together with ethylene glycol and an acrylic additive. Stainless steel electroplated with a thin film of molybdenum and heat-treated at an elevated temperature is employed as the substrate.

Abstract: An insulating powder for the formation of a resistant coating is disclosed which comprises a glass powder consisting of 60 to 70% by weight of ZnO, 19 to 25% by weight of B.sub.2 O.sub.3, and 10 to 16% by weight of SiO.sub.2. A composition for the formation of a resistant coating is also disclosed which comprises the powdered oxide of a platinum-family element; the powder of at least one oxide selected from the group consisting of indium oxides, tin oxides, and cadmium oxides; a glass powder capable of forming a crystalline phase on being fired; a ceramic powder; and an organic vehicle.

Abstract: Silver-filled glass pastes useful for the attachment of silicon semi-conductor devices (dies) to substrates comprise particulate silver and a lead phosphate glass, together with conventional organic components. The pastes have low bonding temperatures, and give good adhesion at firing temperatures of 350.degree. to 460.degree. C.

Abstract: Resistive paste comprises at least one metal hexaboride and a vitreous binder suspended in an organic vehicle, and is characterized in that said vitreous binder is composed of a glass frit consisting essentially of 0.5 to 5.0 mol % of niobium oxide and the balance of alkaline earth metal borosilicate. The resistive paste may further contain at least one nitride selected from the group consisting of aluminum nitride and boron nitride, the content of aluminum nitride or boron nitride in the inorganic solid component composed of metal hexaboride, vitreous binder and aluminum or boron nitride in the paste being 5 to 30 wt %.

Abstract: Dielectric ink, paste and tape compositions having controlled thermal expansion contain a mixture of glasses wherein at least one glass has a coefficient of thermal expansion (CTE) below the CTE of the substrate to which the dielectric composition is applied and at least one glass has a CTE above the CTE of said substrate. The dielectric compositions significantly reduce or eliminate warpage of the substrate.

Abstract: A dielectric glass composition consisting essentially on a molar basis of 15-27% ZNO, 8-16% BaO, 40-60% SiO.sub.2, 3-14% Al.sub.2 O.sub.3, 0-5% PbO and 0.5-5% of a metal oxide selected from ZrO.sub.2, up to 2.5% P.sub.2 O.sub.5 and mixtures thereof, the composition being crystallizable and non-reducing when fired at 850.degree.-900.degree. C.

Abstract: The invention is directed to thick film glass ceramic dielectric compositions in which the dielectric is a mixture of amorphous aluminoborosilicate glass, which upon firing forms a single phase of ceramic crystals in a matrix of amorphous remainder glass, and a ceramic additive to minimize substrate bowing.

Abstract: A glaze coating on manufactured article substrates can be provided by agglomerated ceramic glazes obtained by mixing dry or wet glaze with a hardening binder until a paste-like mass is obtained, extruding the paste-like mass, cutting the extruded product into pieces, subjecting the cut pieces to a rapid surface-drying process and then heating the dried pieces to 100.degree.-120.degree. C. until the binder hardens.

Abstract: A composition which is useful for bonding integrated circuits to inorganic dielectric substrates comprising an admixture of finely divided particles of a thermally conductive metal or metal-containing compound, non-aqueously milled amorphous glass frit and fatty acid-based surfactant dispersed, in a solution of primary organic solvent selected from ethylene glycol monobutyl ether acetate, dimethyl adipate and mixtures thereof and optionally minor amounts of certain secondary solvents and an acrylic polymer which is free of polar functional groups.

Abstract: There is provided a glass enamel system adaptable to be fired from about 1000.degree. F. to about 1350.degree. F., said glass enamel characterized, upon firing, by a formation therein of metal orthosilicate crystals, which has the effect of substantially hardening the surface of said glass enamel even at its fusion point temperature, and within the range aforesaid.

Abstract: A composition for making low K dielectric layers which is an admixture of finely divided solids consisting essentially of (a) lead-free amorphous borosilicate glass containing Al.sub.2 O.sub.3, a mixture of oxides of alkali metals, alkaline earth metals or mixtures thereof containing Li.sub.2 O and (b) an inorganic filler selected from quartz and mixtures of quartz with 0.5-5% wt. inert oxides having a TCE equal to or greater than 7.

Abstract: A composition for making low K dielectric layers which is an admixture of finely divided solids consisting essentially of (a) lead-free amorphous borosilicate glass containing Al.sub.2 O.sub.3, a mixture of oxides of alkali metals, alkaline earth metals or mixtures thereof containing Li.sub.2 O, and (b) a ceramic filler selected from mullite, mixtures of mullite with fused silica and mixtures of quartz with fused silica.

Abstract: An improved dielectric ink for the fabrication of multilayer integrated circuits is disclosed. The subject inks comprise a devitrifying magnesium-barium-aluminum-zirconium-borophosphosilicate glass frit, an organic vehicle and, optionally, a suitable ceramic filler material. Dielectric layers and stand-alone substrates formed from the subject inks are characterized by good mechanical strength, heat resistance and exceptional density. The subject inks are particularly useful in the fabrication of multilayer circuit structures based on copper since their exceptional density renders them resistant to penetration by flux materials from the copper conductor layers.

Abstract: A ceramic composition for an electronic circuit board, a hybrid integrated circuit, an integrated circuit package or a multilayer ceramic structure, consisting essentially of at least one electrically insulating glass, at least one organic binder, at least one inorganic peroxide, and at least one material selected from the group which consists of: a metal selected from the platinum group; a compound of the platinum group; a manganese oxide; and a cobalt oxide.

Abstract: Disclosed is a dielectric paste for a ceramic multilayer wiring substrate, of which feature, among others, lies in the composition of inorganic components comprised of ceramics made of Al.sub.2 O.sub.3, SiO.sub.2, CaO and MgO, and a borosilicate glass. This can be prepared by mixing a part of the glass with the ceramic, calcining the mixture at a high temperature, and then adding the remaining glass to mix with the calcined product. The insulation layer is densely formed, and a dielectric paste excelling in electric insulating property can be obtained by mixing this composition with an organic liquid.

Abstract: A dielectric composition comprising an admixture of finely divided solids comprising (a) a noncrystallizable glass of which the deformation temperature (T.sub.d) is 580.degree.-625.degree. C. and the softening point (T.sub.s) is 630.degree.-700.degree. C., and (T.sub.s -T.sub.d) is 50.degree.-75.degree. C., and (b) a refractory which is substantially insoluble in the glass at temperatures of 825.degree.-900.degree. C.

Abstract: An ink for use in forming resistive structures for use in a gas discharge display panel containing mercury vapor to inhibit cathode sputtering, the ink comprising a mixture of silver and nickel with the nickel being controllably oxidized to impart the desired resistivity to the mixture and the final resistive body in the display panel.

Abstract: Improved copper conductor inks useful in fabricating multilevel circuits are provided. The inks comprise copper powder, a novel zinc-aluminum-lead-borosilicate glass frit, bismuth oxide and a suitable organic vehicle. The inks are advantageous in that the films formed therefrom are oxidation resistant and have a reduced tendency for flux components to leach into adjacent dielectric films.

Abstract: A method for inhibiting the formation of blisters during the firing of intermediate layers of fired multilayer electronic components comprising the sequential steps of:(1) applying to a substrate a first and second layer of finely divided particles of dielectric solids and glass dispersed in organic medium; and(2) firing the layers to effect volatilization of the organic medium therefrom, liquid phase sintering of the glass components and densification of both layers, the softening point of the glass, the particle size of the glass and the ratio of glass to dielectric solids in both layers being adjusted in such manner that when the layers are fired, the first layer is porous and the second layer is nonporous.

Abstract: An overglaze ink comprising(a) 55 to 70 weight % of a glass composition, the glass composition comprising(1) 15 to 43 weight % of a main glass component selected from the group consisting of BaO, SrO and SrO+BaO,(2) a glass forming component comprising34 to 45 weight % B.sub.2 O.sub.3 and0 to 6 weight % SiO.sub.2(3) 0 to 2 weight % of a colorant selected from the group consisting of Cr.sub.2 O.sub.3, CoO and NiO,(4) 7 to 20 weight % of a thermal expansion modifier selected from the group consisting of ZnO, Al.sub.2 O.sub.3, TiO.sub.2 and mixtures thereof, and(5) 1 to 7 weight % of a dopant comprising one or more of the following:ZnF.sub.2 having a weight % of 0 to 5,Li.sub.2 O having a weight % of 0 to 2,Na.sub.2 O having a weight % of 0 to 2,K.sub.2 O having a weight % of 0 to 2,LiF having a weight % of 0 to 2,NaF having a weight % of 0 to 2,KF having a weight % of 0 to 2,BaF.sub.2 having a weight % of 0 to 2,Na.sub.2 SiF.sub.6 having a weight % of 0 to 2,PbO having a weight % of 0 to 3,V.sub.2 O.sub.

Abstract: A casting composition for making dielectric green tapes comprising a dispersion of finely divided solids of (a) a noncrystallizable glass and (b) a mixture of refractory oxides in a solution of (c) organic polymer, which is readily depolymerizable at 825.degree.-1025.degree. C. in a nonoxidizing atmosphere, dissolved in (d) volatile nonaqueous solvent.

Abstract: A dielectric composition comprising an admixture of finely divided solids comprising (a) a noncrystallizable glass of which the deformation temperature (T.sub.d) is 580.degree.-625.degree. C. and the softening point (T.sub.s) is 630.degree.-700.degree. C., and (T.sub.s -T.sub.d) is 50.degree.-75.degree. C., and (b) a refractory which is substantially insoluble in the glass at temperatures of 825.degree.-900.degree. C.

Abstract: An aqueous solution of precursors for biologically active glass, support particles coated with the solution, support particles coated with the glass, spheroidal particles of biologically active glass, processes for making the solution, coating the support, and for making the coated support and the spheroidal glass particles. The materials that comprise the biologically active glass are useful in prosthetic devices and implants for the human body.

Abstract: A composition for a dielectric ink used in a screening process including a lead-free glass frit binder, silica, and a vehicle. The dielectric composition is particularly suited for use in gas plasma display panels.

Abstract: A coating is provided whih substantially lengthens the life of carbon and graphite electrodes used in electrical arc processes for the manufacture of ferrous metals. The coating forms a silica-phosphorus glass upon the electrodes.

Abstract: A composition for a dielectric ink used in a screening process including a lead-free glass frit binder, silica, and a vehicle. The dielectric composition is particularly suited for use in gas plasma display panels.

Abstract: The invention is directed to a barium borosilicate glass which is free of Bi, Cd and Pb. The glass, which also contains small amounts of NiO, is especially useful as a binder for thick film resistor compositions to be used for making low end resistors.

Abstract: The invention is directed to a barium borosilicate glass which is free of Bi, Cd and Pb. The glass, which also contains small amounts of CoO, is especially useful as a binder for thick film resistor compositions to be used for making high-end resistors.

Abstract: A mixture for preparation of protective and insulating coatings on metals and metal products which sticks well to metal surfaces, is resistant to high temperatures, has good electrical properties, and provides good heat removal. The mixture includes aluminum oxide, barium oxide, boron oxide, silicon oxide, and aluminum fluoride.

Abstract: In the enamelling of metal by applying a ground coat containing an additive, subsequently applying a cover coat, and baking the structure, the improvement which comprises employing as the additive a complexing agent having a solubility in water at 25.degree. C. and at a pH-value of from 4 to 9 of greater than about 0.05 g/l, with the exception of saccharides and their oxidation, reduction and modification products and polyethylene glycol containing up to 50 carbon atoms per molecule.

Abstract: A blister-resistant thick film dielectric is usable with multilayer circuits having one conductor layer comprising gold and another conductor layer comprising silver to prevent blistering and other unwanted phenomena resulting from an adverse electrochemical reaction from occurring between the conductor layers during the firing process. The dielectric is comprised be weight, without vehicle, of about 50% lead-boro-silicate glass, between about 25% to about 40% Al.sub.2 O.sub.3 and between about 10% to 25% an oxide mixture comprised of Co.sub.2 O.sub.3, Cr.sub.2 O.sub.3 Fe.sub.2 O.sub.3, said oxide mixture having been heated to about 1000.degree. C. for about 24 hours. In a preferred embodiment the dielectric is comprised by weight, without vehicle, of about 50% lead-boro-silicate, about 40% Al.sub.2 O.sub.3 and about 10% oxide mixture. The oxide mixture in a preferred embodiment is comprised by weight of about 37.4% Co.sub.2 O.sub.3, about 25.6% Cr.sub.2 O.sub.3 and about 37.0% Fe.sub.2 O.sub.3.

Abstract: A method for coating a substrate with a glass-like film comprises,applying to the substrate an aqueous alcoholic solution containing a polymeric network of partially hydrolyzed metal alkoxide into which network there is incorporated finely powdered glass, whereby there is achieved on the substrate a coherent and adherent initial film; andheating said film to a temperature sufficient to melt said powdered glass component, thereby converting said initial film to a final densified film.

Abstract: Improved medium and high value resistor inks are disclosed. The subject inks comprise indium oxide, a barium calcium borosilicate glass frit, a suitable organic vehicle and a temperature coefficient of resistance modifier selected from the group consisting of ferric oxide and vanadium oxide.

Abstract: A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.

Abstract: The invention relates to a process for two-layer and multi-layer one-bake enamelling, in which saccharides and/or their oxidation, reduction and/or conversion products and/or polyethylene glycol are added during preparation of the ground enamel slip and, optionally, the intermediate enamel slip, the additives containing up to 50 carbon atoms per molecule.