Abstract: The invention relates to crystallized glass that can be used with various electronic components such as magnetic heads and the like as bonding or sealing glass. This crystallized glass comprises, in % by weight, at least 11-17% of SiO.sub.2, 7-10% of B.sub.2 O.sub.3, 30-55% of PbO, 1-3% of CdO, 5-10% of A.sub.2 O (A stands for a kind of alkali metal), 7-35% of ZnO and 0-10% of ZrO.sub.2 with the sum of ZnO and ZrO.sub.2 not exceeding 35%, and has the characteristics of 550.degree.-600.degree. C. as the working temperature, (80-100).times.10.sup.-7 /.degree.C. as the thermal expansion coefficient, 550.degree. C. or more as the thermal expansion coefficient, and 550.degree. C. or more as the glass transition point after working.

Abstract: An improved silver-glass paste for bonding a semiconductive element to a substrate comprising a metal resinate. A surfactant containing lyophilic and lyophobic groups may also be included.

Abstract: In the low temperature-sintering porcelain components of the present invention, designating as A a group of main components containing 40.0-70.0% by weight of a Si component equivalent to SiO.sub.2, 25.0-55.0% by weight of a Ba component equivalent to BaCO.sub.3, 2.0-10.0% by weight of an Al component equivalent to Al.sub.2 O.sub.3, 1.0-3.0% by weight of a B component equivalent to B.sub.2 O.sub.3, 0.3-3.0% by weight of a Cr component equivalent to Cr.sub.2 O.sub.3, and 0.3-3.0% by weight of a Ca component equivalent to CaCO.sub.3, and designating Pb.sub.3 O.sub.4 as B, the low temperature-sintering porcelain components of the invention are ones which satisfy the following relations:80% by weight .ltoreq.A<100% by weigth and0% by weight <B.ltoreq.20% by weight.

Abstract: An optical isolator according to the present invention comprises a first polarizer, a Faraday rotator and a second polarizer which are adhered to one another in this order and held in a cylindrical magnet, wherein at least one adhered and supported portion comprises a low melting point glass 7 and 8. As the low melting point glass 7, 8, there may be used, for instance, those mainly comprising lead oxide and boron oxide; zinc oxide, lead oxide and boron oxide; lead oxide, boron oxide and thallium oxide; phosphoric acid and aluminum oxide; zinc oxide and boron oxide; and phosphorous pentaoxide, aluminum oxide and boron oxide. In the optical isolator according to the present invention, a low melting point glass is used for adhering the structural parts for the optical isolator, there is not observed any outgassing phenomenon due to the raise in ambient temperature as in the isolator which is assembled with an adhesive and the discrepancy of the optical axis due to the expansion of the adhesive.

Abstract: Enamel-like coatings consisting of glass frits and pigments are used for auto glass panes. An improved opacity of these enamel layers relative to silver conducting tracks on these layers is achieved if 0.1 to 10% by weight silicon, boron, carbon, lead and/or silver in elemental form are added to the enamel.

Abstract: A glass flux composition consisting essentially by weight of 30-70% SiO.sub.2, 10-30% CaO, 0-20% ZnO, 3-8% MoO.sub.3, 0-20% B.sub.2 O.sub.3, 0-25% Al.sub.2 O.sub.3, 0-10% K.sub.2 O, 0-10% Na.sub.2 O, 0-10% MgO, 0-15% BaO, 0-7% Li.sub.2 O, 0-10% PbO, 014 5% SrO, 0-10% CeO, 0-0.1% CoO and 0-5% P.sub.2 O.sub.5 is a useful opacifying composition for preparing a glaze composition for ceramics.

Abstract: An improved sliver-glass paste for bonding a semiconductive element to a substrate comprising silver flake, glass frit, a surfactant, a thixotrope and a low boiling paraffinic hydrocarbon solvent.

Abstract: An improved silver-glass paste for bonding a semiconductive element to a substrate comprising a metal resinate. A surfactant containing lyophilic and lyophobic groups may also be included.

Abstract: The present invention relates to a glass/ceramic sealing system. A sealing glass having a coefficient of thermal expansion in excess of 160.times.10.sup.-7 in/in/.degree. C. is provided. The glass is useful for matched sealing of copper and copper based alloys. The glass is capable of ceramization, greatly increasing the resistance of the glass to moisture penetration and fracture due to mechanical damage. The temperature of ceramization has been designed so that a solutionized copper alloy leadframe is age hardened during ceramization. The glass has particular utility in the manufacture of electronic packages and multi-layer circuitry.

Abstract: A sealing glass composition comprising, in wt. %, 30-70% lead oxide, 30-60% vanadium oxide, 1-10% phosphorous oxide, 0-30% bismuth oxide, 0.5 to 5% niobium oxide, and 1-15% of at least one oxide from the group consisting of tellurium oxide and selenium oxide.

Abstract: An improved dielectric formulation for the fabrication of multilayer, integrated circuits which comprises a devitrifying zinc-magnesium-barium-aluminum-zirconium-phosphosilicate glass frit, a devitrifying zinc-magnesium-barium-aluminum-silicate glass frit, or a devitrifying zinc-magnesium-strontium-aluminum-silicate glass frit which are stabilized by the presence of from about 0.01 to about 1 weight percent each of lead oxide and iron oxide.

Abstract: A surface conductive paste composition to be applied to the surface of a green sheet for a ceramic substrate or to the surface of a ceramic substrate after being fired and to be then fired, the solid content of which has a composition comprising from 80 to 99.9% by weight of Au powder, from 0.1 to 20% by weight of crystallized glass frit and from 0 to 19.9% by weight of non-crystallized glass frit, provided that the total of the crystallized glass frit and the non-crystallized glass frit is at most 20% by weight, and which has a lead compound powder incorporated in an amount of from 0 to 5% by weight based on the total amount of said composition.

Abstract: A solder paste for fastening semiconductors onto ceramic bases in a temperature range below 380.degree. C., consisting essentially of (1) 75 to 90% by weight of a mixture of silver powder and a low-melting glass powder with the weight ratio of silver to glass being between 2:1 and 9:1 and (2) 10 to 25% by weight of an organic solvent which contains 1 to 10% by weight of a thermally readily decomposable resin, the glass powder consisting essentially of 75 to 85% by weight lead oxide, 8 to 15% by weight boron oxide, 0.5 to 10% by weight silver (I) oxide 0.5 to 10% by weight bismuth (III) oxide, 0 to 5% by weight silicon dioxide, 0 to 2% by weight aluminum oxide 0 to 2% by weight tin oxide, 0 to 2% by weight zinc oxide, the glass powder having a glass transition temperature (Tg) of 250.degree. to 300.degree. C.

Abstract: Dielectric ink, paste and tape compositions having controlled thermal expansion contain a mixture of glasses wherein at least one glass has a coefficient of thermal expansion (CTE) below the CTE of the substrate to which the dielectric composition is applied and at least one glass has a CTE above the CTE of said substrate. The dielectric compositions significantly reduce or eliminate warpage of the substrate.

Abstract: There are described blue luminescent glasses having the following compositions(a) 0 to 90 mole % alkali metal oxide (sodium oxide, potassium oxide, lithium oxide), individually or several together, 0 to 90 mole % alkaline earth metal oxide (magnesium oxide, calcium oxide, strontium oxide, barium oxide), individually or several together, with the proviso that the magnesium oxide and/or calcium oxide can only be present in an amount of up to 25 mole % and at least 2 mole % of alkali metal oxide and/or alkaline earth metal oxide must be present(b)7 to 95 mole % silica0 to 70 mole % boron oxide (B.sub.2 O.sub.3)0 to 85 mole % aluminum oxide(c) 0.01 to 40 mole % lead oxide (PbO).

Abstract: A composition which is useful for bonding integrated circuits to inorganic dielectric substrates comprising an admixture of finely divided particles of a thermally conductive metal or metal-containing compound, non-aqueously milled amorphous glass frit and fatty acid-based surfactant dispersed, in a solution of primary organic solvent selected from ethylene glycol monobutyl ether acetate, dimethyl adipate and mixtures thereof and optionally minor amounts of certain secondary solvents and an acrylic polymer which is free of polar functional groups.

Abstract: This invention relates to a sealing glass for use in bonding glass, ceramics and metals and specifies the composition of a sealing glass which is workable at moderate temperatures and is excellent in transparency and strength. Amorphous magnetic materials have themselves a crystallization temperature and when used in a magnetic head, the amorphous materials undergo crystallization in assembling the head at a sealing temperature higher than the crystallization temperature and becomes not only brittle but also deteriorated in magnetic characteristics so that the head becomes unsuitable for use. The present glass is advantageously used in such a case.

Abstract: The invention described and claimed in the specification relates to the discovery that effective addition of Fe.sub.2 O.sub.3 to a lead phosphate glass results in a glass having enhanced chemical durability and physical stability, and consists essentially of the glass resulting from melting a mixture consisting essentially of, in weight percent, 40-66 percent PbO, 30-55 percent P.sub.2 O.sub.5 and an effective concentration up to 12 percent Fe.sub.2 O.sub.3.

Abstract: Lead-iron phosphate glasses containing a high level of Fe.sub.2 O.sub.3 for use as a storage medium for high-level radioactive nuclear waste. By combining lead-iron phosphate glass with various types of simulated high-level nuclear waste, a highly corrosion resistant, homogeneous, easily processed glass can be formed. For corroding solutions at 90.degree. C., with solution pH values in the range between 5 and 9, the corrosion rate of the lead-iron phosphate nuclear waste glass is at least 10.sup.2 to 10.sup.3 times lower than the corrosion rate of a comparable borosilicate nuclear waste glass. The presence of Fe.sub.2 O.sub.3 in forming the lead-iron phosphate glass is critical. Lead-iron phosphate nuclear waste glass can be prepared at temperatures as low as 800.degree. C., since they exhibit very low melt viscosities in the 800.degree. to 1050.degree. C. temperature range. These waste-loaded glasses do not readily devitrify at temperatures as high as 550.degree. C.

Abstract: There are described luminescent glasses having the following compositions(a) 0 to 80 mole % alkali metal oxide (sodium oxide, potassium oxide, lithium oxide), individually or several together, 0 to 30 mole % alkaline earth metal oxide (magnesium oxide, calcium oxide, strontium oxide, barium oxide), individually or several together, and at least 2 mole % of alkali metal oxide and/or alkaline earth metal oxide must be present(b)7 to 90 mole % silica1 to 50 mole % boron oxide (B.sub.2 O.sub.3)1 to 30 mole % aluminum oxide(c)0.1 to 5 mole % lead oxide (PbO)0.1 to 10 mole % vandium pentoxide (V.sub.2 O.sub.5).The glasses have white, yellow, or blue luminescence, depending on the PbO and V.sub.2 O.sub.5 content, at excitation with a wave length of 254 nm.

Abstract: An improved dielectric ink for the fabrication of multilayer, copper-based integrated circuits is disclosed. The subject inks comprise a suitable ceramic filler material, an organic vehicle and a lead-zinc-aluminum-borosilicate glass frit. Dielectric layers formed from the subject inks are characterized by exceptional resistance to the penetration therein by flux materials such as PbO and Bi.sub.2 O.sub.3 from conventional copper conductors during repeated firings.

Abstract: A ceramic comprises therein two or more dielectric portions having different dielectric constants formed by filling of one or more vacant spaces provided within a dielectric porcelain, a semiconductor porcelain as a precursor of said dielectric porcelain or a molded product as a precursor of said semiconductor procelain with one or more kinds of materials capable of becoming to have different dielectric constants from said dielectric porcelain and subsequent calcination.

Abstract: The invention is concerned with the production of pencil leads and also pencil leads as produced by the proposed method. In accordance with the invention, graphite, enamel frit and quartz flour, preferably at least approximately in a ratio of one part of graphite, two to four parts of enamel frit and one part of quartz flour, are processed to form a starting mixture which is then pressed into the form of a lead, is dried and is fired. The invention renders it possible to perform sintering below a temperature of 550.degree. C. and, accordingly, to perform the sintering firing operation in a normal oxidizing atmosphere.

Abstract: A lead phosphate glass to which has been added indium oxide or scandium oe to improve chemical durability and provide a lead phosphate glass with good optical properties.

Abstract: Platinum corrosion reducing amounts of a premelted oxide mixture that is PbO and B.sub.2 O.sub.3, or PbO and SiO.sub.2, or PbO, SiO.sub.2 and B.sub.2 O.sub.3 are added to raw batch ingredients for a lead-containing solder glass. All or part of the Pb.sub.3 O.sub.4 or PbO normally used in the raw batch is replaced for advantages including reducing the amount of platinum corrosion in a platinum melter used to melt the raw batch to provide the glass.

Abstract: A casting composition for making dielectric green tapes comprising a dispersion of finely divided solids of (a) a noncrystallizable glass and (b) a mixture of refractory oxides in a solution of (c) organic polymer, which is readily depolymerizable at 825.degree.-1025.degree. C. in a nonoxidizing atmosphere, dissolved in (d) volatile nonaqueous solvent.

Abstract: A dielectric composition comprising an admixture of finely divided solids comprising (a) a noncrystallizable glass of which the deformation temperature (T.sub.d) is 580.degree.-625.degree. C. and the softening point (T.sub.s) is 630.degree.-700.degree. C., and (T.sub.s -T.sub.d) is 50.degree.-75.degree. C., and (b) a refractory which is substantially insoluble in the glass at temperatures of 825.degree.-900.degree. C.

Abstract: A glass glazing is provided with a coating of a colored enamel composition along one or more edges. The enamel composition includes a vitreous matrix pigment and from 2 to 5% by weight of powdered tin dioxide which preferably is an additive during a comminution step. The vitreous matrix which represents at least 75% by weight of the enamel composition includes the following constituentsSiO: 25-33 (% by weight)PbO: 47-65B.sub.2 O.sub.3 : 3-7Na.sub.2 O: 1-4K.sub.2 O: 0-2Li.sub.2 O: 0-0.8ZnO: 0.2-0.5and provides a molar ratio of SiO.sub.2 to PbO between 1.6 and 2.7. The total content of the alkaline oxide are less than 5% by weight.The linear thermal expansion coefficient of the vitreous matrix is less than the glazing to be coated.

Abstract: A dielectric glass and a glass ceramic obtained therefrom is provided for separating crossing conductors in multilayer thick-film circuits. The dielectric glass has a composition in mol. % between the limits of 10-25% ZnO, 7.5-25% PbO, 50-60% SiO.sub.2, and 7.5-12.5% Al.sub.2 O.sub.3. These compositions are particularly suitable for conductor patterns having silver because they are free from micropores.

Abstract: Disclosed is a method for making glass bonded metal oxide electric resistors involving including in the mixture a refractory oxide for providing configuration stability during firing.

Abstract: A glass composition for covering a semiconductor element. The glass composition has excellent resistance to chemicals and excellent electric characteristics. The glass composition includes 3 to 8% by weight of Al.sub.2 O.sub.3, 35 to 45% by weight of SiO.sub.2, 10 to 30% by weight of ZnO, 5 to 30% by weight of PbO, 1 to 10% by weight of B.sub.2 O.sub.3, and more than 5% but not exceeding 20% by weight of an alkaline earth metal oxide selected from the group consisting of MgO, CaO, SrO and BaO, where the maximum contents of MgO, CaO, SrO and BaO are 7% by weight, 3% by weight, 7% by weight, and 15% by weight, respectively.

Abstract: This invention is concerned with the preparation of thermally crystallizable enamels suitable for application to glass-ceramics, particularly glass-ceramics having coefficients of thermal expansion less than 15.times.10.sup.-7 /.degree.C. The enamels are capable of being fired to maturity simultaneously with the precursor glass body being crystallized to a glass-ceramic. The enamels consist essentially, expressed in weight percent on the oxide basis, of:SiO.sub.2 : 36-58Al.sub.2 O.sub.3 : 8.5-16CaO: 0.5-10PbO: 27-40K.sub.2 O: 0.

Abstract: A sealing glass composition comprising a lead borate glass matrix and a Willemite filler that provides a blended sealing glass composition with outstanding properties including excellent thermal (button flow and rod seal stress values) and chemical properties. A method of making the Willemite filler is described, the method including critical firing times and temperatures in order to produce the highly effective filler.

Abstract: An improved semiconductor die bonding structure and method for electrical devices is described which utilizes a ductile foil between the semiconductor die and the base of the device package. The die is sealed to the foil with a die bonding material formed from a titania free base glass to which has been added 23.6 to 36.4 weight percent lead titanate powder to give a glass plus ceramic mixture consisting essentially of (by weight percent) 2.5-10.7% GeO.sub.2, 0-2.3% SiO.sub.2, 58.6-78.5% PbO, 0-5.3% PbF.sub.2, 7-13% B.sub.2 O.sub.3, 2.5-6.9% Al.sub.2 O.sub.3, 0-5.3% ZnO, 0.4-2.3% V.sub.2 O.sub.5, 0-5.3% CdO, and 6.2-9.6% TiO.sub.2. The ductile foil is bonded to the ceramic package base directly without intermediate layers or alternatively by means of an improved foil bonding glass material consisting essentially of (by weight percent) 10-15% SiO.sub.2, 45-55% PbO, 8-12% ZnO, 2-5% Al.sub.2 O.sub.3, and 25-30% B.sub.2 O.sub.3.

Abstract: Partially crystallizing glass solders, and stripping films using them as agents to be transferred, which are sintered at temperatures below 900.degree. C. from glass powder with granulation of less than <150 .mu.m, thereafter exhibiting thermal expansion coefficients of -23.5 to 34.3.sup..multidot. 10.sup.-7.multidot. K.sup.-1, whose crystallization temperature lies below 710.degree. C. and whose crystal phase consists predominantly of h-quartz mixed crystal phase exhibiting the following composition (in weight %): 23-44 SiO.sub.2, 20-37 Al.sub.2 O.sub.3, 5.5-11 Li.sub.2 O; 3-20 B.sub.2 O.sub.3 ; 0-36 PbO; 0-1 Na.sub.2 O; 0-1.5 K.sub.2 O; 0-0.1 F; 0-4 TiO.sub.2 ; 0-3.5 MgO; 0-2 CoO, provided B.sub.2 O.sub.3 +PbO+Na.sub.2 O+K.sub.2 O+F+TiO.sub.2 is 8.5-50.0.

Abstract: A solder glass comprising, by weight, about 65% Sb.sub.2 O.sub.3 ; about 30% B.sub.2 O.sub.3 ; and about 5% PbO. The glass is molten at about 350.degree. C. and can be employed as a molten seal in electrical devices such as tungsten-halogen lamps.

Abstract: This invention is directed to the preparation of glasses in the PbO--Ga.sub.2 O.sub.3 field exhibiting good infrared transmitting characteristics out to wavelengths of 8 microns. The binary glasses consist essentially, by weight, of about 15-28% Ga.sub.2 O.sub.3 and 72-85% PbO. However, the preferred glasses contain up to 85% Bi.sub.2 O.sub.3 and consist essentially as included within the area generally encompassed by the curve in FIG. 2.

Abstract: There is described a new material for jewelry and commodities which has a relatively low density and also is low carat but resistant to oxidation and corrosion. It consists of a noble metal or alloy and 1 to 70 volume % glass, whereby as glass there is used a glass frit having a transformation temperature of 300.degree. to 500.degree. C. and a softening interval of over 80.degree. C. There is also described a process for its production.

Abstract: A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.

Abstract: This invention is concerned with the fabrication of thick film, RuO.sub.2 -based resistors. More specifically, this invention is directed to the formulation of glass frits for use in such resistors exhibiting temperature coefficient of resistance values of less than 100 ppm. Such glass frits consist essentially, expressed in terms of mole percent on the oxide basis, of about 32-39% PbO, 44-47% B.sub.2 O.sub.3, 14-17% SiO.sub.2, and an effective amount up to 5% of WO.sub.3 or MoO.sub.3.

Abstract: A glass having a composition which would result by mixing from 20 to 80 weight percent of glass A with 80 to 20 weight percent of glass B and melting the mixture to form a homogeneous glass:______________________________________ Glass A Glass B Weight Weight Percent Percent ______________________________________ SiO.sub.2 1.8-2.2 SiO.sub.2 67-70 B.sub.2 O.sub.3 14-16.5 Li.sub.2 O 14-17 PbO 69-72 Al.sub.2 O.sub.3 4-5.5 ZnO 8.2-9.2 CaO 9-12 BaO 2.7-3.5 ______________________________________said glass having a coefficient of thermal contraction from 15.degree. C. below the annealing point to room temperature of from 106 to 115.times.10.sup.-7 /.degree.C.

Abstract: A fabrication technique is described for making various devices in which a certain type of glass is used as a surface protection layer. The glass layers are formed by particle bombardment (generally sputtering or E-beam) of a glass target. Devices with such surface layers are also described. Such glass layers are highly advantageous as encapsulating layers, diffusion barrier layers, etc., particularly for optical type devices and certain semiconductor devices. Particularly important is the preparation procedure for the glass target used in the bombardment process. The glass layers are moisture stable, act as excellent barriers against diffusion, and are usable up to quite high temperatures (i.e., in diffusion doping procedures) without cracking or peeling. The glass layers also provide long-term protection against atmosphere components including water vapor, oxygen, atmosphere pollution contaminants, etc., and can be removed by standard etching techniques.

Abstract: Acid and alkali oxides are smelted for an extended period of time at a first elevated temperature above their melting temperatures. The smelted mixture is then quenched in water and fritted. The fritted mixture is then disposed between a pair of members which are to be hermetically sealed relative to each other. The fritted mixture is then at least partially fused in an oxygen atmosphere at a second temperature below the first temperature for a relatively short period of time. The at least partially fused mixture is then rapidly cooled in air. In this way, the mixture is provided with a partially amorphous state and a partially crystalline state. The crystals in the mixture are disposed primarily at the borders of at least a particular one of the members to be sealed.The mixture hermetically seals the two members, is resistant to acids and alkalis and inhibits the propagation of cracks.

Abstract: A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.

Abstract: Thick film silver compositions, containing silver powder, glass and certain inorganic materials, useful for silver terminations for reduced barium titanate (RBT) capacitors, are provided. The inorganic materials or their precursors contain ions capable of substituting into the BaTiO.sub.3 lattice, existing as surface layers on the RBT bodies, or grains therein, to produce (Ba.sub.1-x M.sub.x ') (Ti.sub.1-y M.sub.y ")(O.sub.3-z A.sub.z) where x<1, y<1, and z<0.1. When terminated with these thick film silver compositions, RBT capacitors have excellent dielectric properties.

Abstract: Thick film dielectric compositions suitable for screen-printing comprising a substituted perovskite, an inorganic dopant, and a low temperature-devitrifiable frit or glass. Upon firing the dielectric composition is highly hermetic.

Abstract: Thick film dielectric compositions suitable for screen-printing comprising a perovskite, a bismuth-substituted pyrochlore, and a low temperature melting-devitrifiable glass. Upon firing the dielectric composition is highly hermetic.

Abstract: Improved thick-film overglaze inks useful in constructing multilayer integrated circuits on circuit boards, particularly porcelain-coated metal circuit boards, are provided. The subject inks comprise: a glass consisting of lead oxide, a modifier component consisting of the oxides of cadmium, zinc, barium and antimony and a glass-forming component consisting of aluminum oxide, boron trioxide and silicon dioxide; a suitable organic vehicle and, if desired, a colorant oxide.

Abstract: A glass enamel composition and the method of its manufacture for use in providing a decorative glass or ceramic article and which composition comprises a glass frit mixed with a nacreous pigment, the mixture being dispersed in an application medium and adapted to be applied to the surface of a glass or ceramic article and fired at a temperature whereat the glass composition fuses to form a decorative and esthetic surface on said article.

Abstract: Acid and alkali oxides are smelted for an extended period of time at a first elevated temperature above their melting temperatures. The smelted mixture is then quenched in water and fritted. The fritted mixture is then disposed between a pair of members which are to be hermetically sealed relative to each other. The fritted mixture is then at least partially fused in an oxygen atmosphere at a second temperature below the first temperature for a relatively short period of time. The at least partially fused mixture is then rapidly cooled in air. In this way, the mixture is provided with a partially amorphous state and a partially crystalline state. The crystals in the mixture are disposed primarily at the borders of at least a particular one of the members to be sealed.The mixture hermetically seals the two members, is resistant to acids and alkalis and inhibits the propagation of cracks.