Abstract: An abrasive article including (i) an embossed isolation layer defining inversely contoured first and second surfaces with a plurality of peaks on the first surface producing a plurality of pockets on the second surface, (ii) grinding aid-containing protrusions positioned within the pockets, and (iii) a coating of abrasive particles adhered to the contoured first surface of the isolation layer.

Abstract: An abrasive article is provided for precision grinding purposes, and the article comprises 3 to 25 volume % vitreous bond, 3 to 56 volume % MCA abrasive grain, and 28 to 63 volume % open porosity. Substantially all porosity in the abrasive article is impregnated with a lubricant component consisting of an oil and wax mixture having an oil:wax weight ratio of about 3:1 to about 1:4.

Abstract: Abrasive tools, such as coated abrasives, made using radaition curable resin binders can be given a greater depth of cure of the binder if they include an acylphosphine oxide initiator.

Abstract: An abrasive article, for example, a coated, bonded, or nonwoven abrasive article comprising a binder, a plurality of abrasive particles, and an antiloading component.

Abstract: The present invention is a polishing pad for use in chemical-mechanical planarization of semiconductor wafers, and a method for making the polishing pad. The polishing pad has a body, molecular bonding links, and abrasive particles dispersed substantially uniformly throughout the body. The body is made from a polymeric matrix material and the molecular bonding links are covalently bonded to the matrix material. Substantially all of the abrasive particles are covalently bonded to at least one molecular bonding link. The molecular bonding links securely affix the abrasive particles to the matrix material to enhance the uniformity of the distribution of the abrasive particles throughout the pad and to substantially prevent the abrasive particles from breaking away from the pad.

Abstract: An abrasive composition for polishing a substrate for a magnetic recording disc is described, which comprises finely divided zirconium oxide particles, an abrasion promoter, an optional water-soluble oxidizing agent, and water. This abrasive composition is used for polishing a substrate for a magnetic recording disc by a process wherein the substrate is polished with a pad while the abrasive composition is supplied between the substrate and the pad, and at least one of the pad and the substrate is rotated. The contents of the finely divided zirconium oxide particles, the abrasion promoter and the optional water-soluble oxidizing agent are 2-20 wt. %, 1-20 wt. % and up to 10 wt. %, respectively, based on the weight of the abrasive composition as used for polishing the substrate.

Abstract: A method of producing a carbon bonded abrasive tool by chemical vapor deposition of carbon, such as pyrolytic carbon, diamond, or a polymorphous form of diamond through a preshaped tool, the preshaped tool containing a mixture of abrasive particles, and also the carbon bonded abrasive tool produced by the method. The mixture of abrasive particles may include a mixture of a superabrasive powder and an abrasive powder filler. All or a portion of the filler has been impact processing by subjecting the filler to an uniform super-pressure exceeding one gigapascal to break up the filler into random size particles, some at the original mesh size interspersed with a continuum of smaller particles.

Abstract: This invention provides metallic thin film chemical mechanical polishing slurry compositions having improved suspension stability. The slurry contains 2.5-10% by weight of alumina powder and 2-20% by volume of phosphoric acid (80% concentration ) solution, and using potassium hydroxide to adjust its pH to 1-6 so as to increase suspension ability of the alumina powder in the aqueous slurry. The polishing slurry compositions can further combine with suitable oxidizers such as hydrogen peroxide, ferric nitrate and so on to be appropriately used for chemical mechanical polishing metallic thin film in the process of manufacturing semiconductor in order to control abrasion rate and unevenness more easily.

Abstract: An abrasive article is provided that includes at least one binder system formed from a polymeric additive and a thermosetting resin. The polymeric additive includes a polymeric backbone having substituents attached thereto, wherein the substituents include at least one urethane linked nitrogen bonded side chain having about 5 carbon atoms or more and a terminal methyl group and at least one oxygen linked water solubilizing group. An abrasive article that includes the binder system exhibits an increase of workpiece surface abraded in a Woodsanding Normal Force Test as compared to an abrasive article including a binder system formed from a composition containing substantially no polymeric additive.

Abstract: A resin bonded abrasive tool consists of abrasive grain and an organic bond comprising a thermosetting resin, such as epoxy resin, phenolic resin or rubber or blends thereof and a precursor filler system capable of forming in situ an active filler system by reacting under the heat generated during grinding. The organic bond optionally further comprises a filler system. A method of making the resin bonded abrasive tool consists of mixing the abrasive grain and the organic bond with the precursor filler system, pressing the resulting mixture into shape, and curing the abrasive tool at about 150 to 200.degree. C.

Abstract: An abrasive article is provided that includes a bond system formed from a binder precursor and about 15% by weight or less of a wax-containing modifier. An abrasive article that includes the bond system exhibits an increase of workpiece surface abraded in a Woodsanding Normal Force Test as compared to an abrasive article including a bond system formed from a composition containing substantially no wax-containing modifier.

Abstract: A method for chemical mechanical polishing (CMP) a copper layer (22) begins by forming the copper layer (22). The copper layer (22) is then exposed to a slurry (24). The slurry (24) contains an oxidizing agent such as H.sub.2 O.sub.2, a carboxylate salt such as ammonium citrate, an abrasive slurry such as alumna abrasive, an optional triazole or triazole derivative, and a remaining balance of a solvent such as deionized water. The use of the slurry (24) polishes the copper layer (22) with a high rate of removal whereby pitting and corrosion of the copper layer (22) is reduced and good copper interconnect planarity is achieved. This slurry (24) has good selectivity of copper to oxide, and results in copper devices which have good electrical performance. In addition, disposal of the slurry (24) is not environmentally difficult since the slurry (24) is environmentally sound when compared to other prior art slurries.

Abstract: The inventive polishing pad is used for planarizing semiconductor wafers or other substrates with a mechanical or CMP process; the polishing pad preferably has a body made from a matrix material, bonding molecules bonded to the matrix material, and abrasive particles bonded to the bonding molecules in a manner that affixes the abrasive particles to the matrix material and substantially maintains the affixation between the matrix material and the abrasive particles in the presence of an electrostatic CMP slurry or other planarizing solution. The bonding molecules are preferably covalently attached to the matrix material and substantially all of the abrasive particles are preferably covalently bonded to at least one bonding molecule.

Abstract: A slurry contains MnO.sub.2 or other manganese oxide as a primary component of abrasive particles. Further, a polishing process using such a manganese oxide abrasive and a fabrication process of a semiconductor device using such a polishing process are disclosed.

Abstract: An abrasive article comprising(a) a plurality of abrasive particles and(b) a bond system which adheres the plurality of abrasive particles, the bond system comprising a binder and a polysiloxane of formula (A): ##STR1## wherein R, R', R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, and R.sup.6 may be the same or different and can be an alkyl, vinyl, chloroalkyl, aminoalkyl, epoxy, fluororalkyl, chloro, fluoro, or hydroxy, and n is 500 or greater.

Abstract: Coated abrasive products are disclosed in which an ionizing irradiation curable epoxy resin formulation is employed as an abrasive binder. The ionizing irradiation curable epoxy resin formulation contains an onium salt initiator and is employed as at least one of the coatings of the coated abrasive product.

Abstract: Abrasive articles having an encapsulated lubricant are described. In one aspect, the articles are characterized by a base substrate comprising a plurality of polymeric fibers adhered to one another at mutual contact points, the substrate having a base weight within the range from 20 to 10,000 g/m.sup.2, abrasive grains adhered to the substrate and a plurality of lubricant capsules adhered to the substrate the capsules comprising a continuous shell with lubricant therein, and the shell comprising a cured thermosetting resin. In another aspect, a composite abrasive article is characterized by at least two layers of the aforementioned abrasive article compressed together and adhered by a binder, the composite article having a flexural modulus of not more than 100 kgf/cm.sup.2.

Abstract: An abrasive material is proposed which is useful for the precision treatment of surfaces. This material may be in the form of an abrasive layer adhered by chemical and/or physical bonds to a carrier, the latter preferably made of a flexible material such as plastic. Alternatively, the abrasive material may be in the form of a free abrasive without a carrier. The abrasive material may be in the form of a vacuum condensate consisting of at last 80 atomic percent of an ultradispersed composite superhard diamond-like substance, preferably containing carbon, and including not more than 0.1 atomic percent hydrogen and oxygen, combined. The abrasive material is preferably obtained from the pulse-flows of an accelerated electroerosive plasma.

Abstract: An abrasive article having a sheet-like substrate having at least one major surface; an abrasive coating adhered to the at least one major surface of the substrate, wherein the abrasive coating comprises a plurality of abrasive particles and an organic binder medium; and, a hard carbon coating layer comprising a diamond-like carbon film. The hard carbon coating layer in the coated abrasive article can be provided as a top coat or, alternatively, as located between the abrasive coating and a covering layer based on an organic binder layer. The invention also pertains to a method of making such an abrasive article.

Abstract: An abrasive article, for example, a coated, bonded, or nonwoven abrasive article comprising a binder, a plurality of abrasive particles, and an antiloading component.

Abstract: An improved treatment compound for rendering glass surfaces and the like water repellant, is described. The treatment compound comprises a mineral acid, a solvent, a mild abrasive constituent and an alkyl polysiloxane. The polysiloxane is a film former while the mild abrasive serves to enhance dirt and grit removal, smooth the water repellant film and indicate the area of application.

Abstract: An abrasive article comprising a substrate having a first major surface and an adhesive layer having abrasive particles embedded therein coated on the first major surface of the substrate, the adhesive layer comprising a hot melt adhesive comprising a polymer cross-linked via hydrolyzed or condensed silyl groups; and a method of preparing an abrasive article, the method comprising (a) providing a substrate having a first major surface, (b) applying an adhesive layer comprising a moisture-curable hot melt adhesive comprising a polymer having hydrolysable or condensable silyl groups to the first major surface of the substrate, the hot-melt adhesive being in a molten or semi-molten state, (c) depositing abrasive particles on the adhesive layer, and (d) curing the hot-melt adhesive.

Abstract: An abrasive material is proposed which is useful for the precision treatment of surfaces. This material may be in the form of an abrasive layer adhered by chemical and/or physical bonds to a carrier, the latter preferably made of a flexible material such as plastic. Alternatively, the abrasive material may be in the form of a free abrasive without a carrier. The abrasive material may be in the form of a vacuum condensate consisting of at least 80 atomic percent of an ultradispersed composite superhard diamond-like substance, preferably containing carbon, and including not more than 0.1 atomic percent hydrogen and oxygen, combined. The abrasive material is preferably obtained from the pulse-flows of an accelerated electroerosive plasma.

Abstract: A composition capable of forming uniform textured streaks and eliminating or reducing the occurrence of protrusions to as few as possible on the ground layer (the ground layer of a magnetic layer) of a magnetic disc. The composition comprises minute grains or powder of diamond etc., an alkylene gycol monoalkyl ether and a fatty acid or a metallic salt thereof.

Abstract: The present invention is a polishing pad for use in chemical-mechanical planarization of semiconductor wafers, and a method for making the polishing pad. The polishing pad has a body, molecular bonding links, and abrasive particles dispersed substantially uniformly throughout the body. The body is made from a polymeric matrix material and the molecular bonding links are covalently bonded to the matrix material. Substantially all of the abrasive particles are covalently bonded to at least one molecular bonding link. The molecular bonding links securely affix the abrasive particles to the matrix material to enhance the uniformity, of the distribution of the abrasive particles throughout the pad and to substantially prevent the abrasive particles from breaking away from the pad.

Abstract: Polycrystalline diamond has non-uniform impurity concentration along the direction of thickness. The diamond near the rake surface has a lower impurity concentration. The diamond near the fixation surface has a higher impurity concentration. The diamond with the higher impurity concentration near the fixation surface alleviates strong stress or absorbs external shock. Owing to the higher impurity concentration of diamond near the fixation surface, the diamond tool excels in chip resistance or toughness. The diamond with a lower impurity concentration near the rake surface heightens abrasion resistance, adhesion resistance and strength.

Abstract: An abrasive article having a sheet-like substrate having at least one major surface; an abrasive coating adhered to the at least one major surface of the substrate, wherein the abrasive coating comprises a plurality of abrasive particles and an organic binder medium; and, a hard carbon coating layer comprising a diamond-like carbon film. The hard carbon coating layer in the coated abrasive article can be provided as a top coat or, alternatively, as located between the abrasive coating and a covering layer based on an organic binder layer. The invention also pertains to a method of making such an abrasive article.

Abstract: Abrasive articles are described that include a plurality of abrasive particles, a plurality of coated grinding aid particles, the coated grinding aid particles comprising grinding aid particles coated with an inert, hydrophobic, hydrocarbon-containing substance, and a binder in which the abrasive particles and the coated grinding aid particles are dispersed.

Abstract: An abrasive article having a sheet-like structure having at least one major surface having deployed thereon a plurality of individual abrasive composites, each abrasive composite comprising a plasticizer and a plurality of abrasive particles dispersed in a binder, wherein said binder is formed by polymerizing a binder precursor and said plasticizer being combined with said binder precursor prior to said polymerizing in an amount of 30 to 70 parts plasticizer per 100 parts by weight of the combined binder precursor and plasticizer. There is also a method of using such as abrasive article to reduce the surface finish of a workpiece and a process of making the abrasive article.

Abstract: Improved compositions for polishing silicon, silica or silicon-containing articles is provided which consists of an aqueous medium, abrasive particles and an anion which controls the rate of removal of silica. The anion is derived from a class of compounds which contain at least two acid groups and where the pKa of the first dissociable acid is not substantially larger than the pH of the polishing composition. Methods using the composition to polish or planarize the surfaces of work pieces, as well as products produced by such methods, are also provided.

Abstract: The invention is a process of manufacturing an abrasive article with the steps of forming an abrasive article in the unfired state comprising an abrasive, a vitreous bond and a polymer resin wherein the polymer resin has an elastic modulus greater than about 2.0.times.10.sup.9 Pa, a weight gain due to moisture absorption when measured after exposure to a 90.degree. C. temperature and 85% relative humidity for 10 hours of less than about 2 wt % and a weight loss on firing in a nitrogen atmosphere at 5.degree. C. per minute to 550.degree. C. of greater than about 95 wt %, and firing the abrasive article thereby decomposing the polymer resin and creating pores in the abrasive article. The invention further includes the abrasive article formed in the unfired state by the above process.

Abstract: A blast media for stripping contaminants from a solid surface comprises abrasive particles and a surfactant in the form of a granular surfactant-clathrate compound formed of a surfactant and a water soluble compound having clathration capability such as urea. The surfactant reduces the amount of water soluble residues which remain on the targeted surface and enhances the removal of dirt, grease and oil from the targeted surface.

Abstract: A blast media for stripping contaminants from a solid surface comprises abrasive particles and a surfactant in the form of a granular surfactant-clathrate compound formed of a surfactant and a water soluble compound having clathration capability such as urea. The surfactant reduces the amount of water soluble residues which remain on the targeted surface and enhances the removal of dirt, grease and oil from the targeted surface.

Abstract: Coated abrasives provided with a coating comprising a grinding aid and a binder resin are particularly effective when the grinding aid is an halogenated hydrocarbon.

Abstract: A composition for abrading, polishing, honing or deburring a surface. The composition comprises a polyboron organo silicon polymer loaded with abrasive granules. The silicon-granules are modified with a metallic soap and a polybutylene. The metallic soap and polybutylene are gelled prior to blending with the polymer.

Abstract: This invention relates to surface cleaner/polish compositions comprising (i) a volatile liquid carrier selected from water, a monohydroxy alcohol having from 1 to 5 carbon atoms and mixtures thereof, and (ii) a crystalline aluminosilicate selected from Zeolite A, Zeolite X, Zeolite, Y, Zeolite P and mixtures thereof as an abrasive material, wherein said crystalline aluminosilicate has a particle size distribution sufficient to (a) provide enhanced wettability properties, (b) provide enhanced dispersion stability, (c) provide enhanced anti-fogging properties, (d) reduce or eliminate residual filming, and/or (e) reduce or eliminate dust during surface removal. This invention also relates to a process for preparation of the surface cleaner/polish compositions.

Abstract: A compound containing a tall oil fatty acid, oleic diethanol amide, aluminum oxide abrasive material, and organo-treated bentonite provides a polish for metals, such as aluminum, having a uniform viscosity and the abrasive particles uniformly dispersed throughout the carrier. Water may be added to form a scratch removing compound. Mineral spirits may be substituted for the fatty acid in the scratch remover to form a prepolish compound.

Abstract: Process for grinding and/or polishing metal articles in rotofinish equipment, in which (a) an adjusted quantity of said articles, which have a metal surface roughness that is higher than required for the finish, usually larger than 5 .mu.m in AA (i.e. arithmic average); are introduced to a rotofinish apparatus and rotated for some time with (b) an adequate quantity of chips suitable for grinding and/or polishing the metal articles to be treated and (c) a compound that promotes grinding and/or polishing comprising one or more organic acids, wherein the compound is an organic acid or mixture of organic acids or solutions of organic acids in a concentration suitable for grinding and/or polishing the metal articles, and in that the grinding environment also comprises a finely divided metal or alloy with an oxidation potential greater than zero.

Abstract: The present invention provides a flexible, coated abrasive product having a fabric or cloth substrate. The fabric has a warp direction and a fill direction and is preferably woven. The finished coated abrasive product is manually tearable in the warp direction in a straight line. The product is characterized by having a tear strength across the warp direction that is at least twice the tear strength across the fill direction. Tearing of the present products takes place along, or contiguous to, a single yarn in the warp direction. The coated abrasive product of the invention is particularly useful in the form of belts, elongated sheets or rolls.

Abstract: Grinding, lapping, and polishing compounds containing an abrasive material, a thickener, and a water-soluble alkylene oxide polymer. In addition to good applications-related characteristics, said compounds have the advantage of permitting the workpieces to be cleaned with water.

Abstract: A composition for use in treating surfaces susceptible of oxidation is disclosed herein which comprises the combination of a particulate abrasive material and a particulate, ascorbic-type reducing compound. A variety of percentages of the abrasive and reducing compounds may be employed, and the consistency of the abrasive material may be varied in accordance with the application for which the composition is intended. Also disclosed herein is a kit which includes a container of the described composition. A method for treating an oxidizable surface by use of a composition as described is also disclosed herein.

Abstract: The present invention relates to abrasive articles such as grinding wheels which employ organic binders and are improved by the use of certain oils or with the use of long chain aliphalic monhydroxy alcohols or long chain alkylated phenols alone or mixed with particular oils as dust depressants or dampening agents used with the conventional plasticizers. These dampening agents prevent "balling", minimize dusting and produce a more durable abrasive article.

Abstract: A process for grinding coal or ores containing metal values comprising carrying out said grinding in a liquid medium and with a grinding aid comprising an anionic polyelectrolyte dispersible in the liquid medium and having a hydrocarbon backbone and a plurality of pendant anionic groups, said grinding aid being present in an amount effective to provide increased grinding efficiency.

Abstract: This invention relates to a stick of diamond lapping compound in combination with a cosmetic type holder.

Abstract: A flowable abrasive composition comprising a polyboronorgano silicon compound and dispersed abrasive granules, said composition being modified with a gel formed from a metallic soap (8-22 carbon atoms) and a hydrocarbon oil. The composition is especially useful for honing, abrading, deburring or polishing surfaces, especially metallic surfaces.

Abstract: Disclosed are compositions and a method for repairing a damaged electrostatographic photoreceptor comprised of a conductive substrate with a uniform layer of selenium or a selenium alloy on its surface. The instant compositions contain amorphous silica of three distinct particle sizes. Scratches in the selenium layer of a depth less than its total thickness are polished with the instant composition whereby the affected surface area is buffed to a smooth finish. After application of the polish composition, the electrostatic effects of the original scratch are eliminated and the repaired photoreceptor will provide copies in which printout in the repaired areas is of the same quality as in the non-damaged areas.

Abstract: An improved lapping composition for use in lapping the surfaces of parts such as gears, seals, rings, and the like comprises a hydrocarbon liquid which is gelled by the addition of an alkyl orthophosphate gelling agent and to which is added the abrasive grit. The thixotropic character of the composition provides greatly improved suspension of the abrasive grit and highly desirable flow characteristics under shear, and results in an unexpected improvement in lapping rates.

Abstract: An alkaline cleaning and conditioning composition for ceramic surfaces is provided in the form of an abrasive powder mixture including a surfactant, and a silicone oil absorbed in a water soluble absorbent powder.

Abstract: A process for barrel finishing, vibratory finishing, deburring or polishing the surface of a metal workpiece such as a zinc die casting is described. The article to be finished is subjected to agitation in a rotating barrel or a vibratory machine containing abrasive media and an aqueous accelerator solution of a lower aliphatic acid having at least two and not more than six carbon atoms. The accelerator solution may also contain sodium bisulfate. In the process, the accelerator solution is added to or flushed through the finishing apparatus.

Abstract: Disclosed is a composition and method for repairing a damaged electrostatographic photoreceptor comprised of a conductive substrate with a uniform layer of selenium or a selenium alloy on its surface. Scratches in the selenium layer of a depth less than its total thickness are polished with the instant composition whereby the affected surface area is buffed to a smooth finish. After application of the polish composition, the electrostatic effects of the original scratch are eliminated and the repaired photoreceptor will provide copies in which printout in the repaired areas is of the same quality as in the non-damaged areas.