Abstract: TiO2 based scrubbing granules, and methods of making and using such TiO2 based scrubbing granules are described. TiO2-based scrubbing granules include granulated TiO2 and about 0.5% to about 20% dry weight inorganic salt binder. Other TiO2 based scrubbing granules include unsintered granulated TiO2 and about 0.5% to about 20% dry weight inorganic salt binder. Inorganic salt binder include sodium aluminate. Methods of making TiO2 based scrubbing granules include i) combining TiO2 particles with inorganic salt binder to form TiO2-binder mixture comprising from about 0.5% to about 20% dry weight binder; ii) granulating the TiO2-binder mixture; and drying the granulated TiO2-binder mixture to form TiO2-based scrubbing granules.

Abstract: A method of preparing silica composite particles includes preparing an alkali catalyst solution containing an alkali catalyst at a concentration of from 0.6 mol/L to 0.85 mol/L, in a solvent containing alcohol; and supplying, into the alkali catalyst solution, (i) a mixed solution of tetraalkoxysilane and an organic titanium compound in which an organic group is coupled to a titanium atom through oxygen, and (ii) an alkali catalyst. The mixed solution is supplied at a supply amount of from 0.001 mol/(mol·min) to 0.01 mol/(mol·min) relative to the alcohol, and the alkali catalyst is supplied at a supply amount of from 0.1 mol to 0.4 mol, relative to 1 mol of a total supply amount of the tetraalkoxysilane and the organic titanium compound supplied per one minute.

Abstract: A method of making a cutting element includes subjecting a mixture of diamond particles and a carbonate material to high-pressure high-temperature sintering conditions to form a sintered carbonate-polycrystalline diamond body having a diamond matrix of diamond grains bonded together and carbonates residing in the interstitial regions between the diamond grains, the carbonate material having a non-uniform distribution throughout the diamond matrix. The carbonate-polycrystalline diamond body is subjected to a controlled temperature, a controlled pressure condition or a combination thereof, to effect an at least partial decomposition of the carbonate material.

Abstract: A manufacturing method of a glass substrate for a magnetic disk is provided whereby nano pits and/or nano scratches cannot be easily produced in polishing a principal face of a glass substrate using a slurry containing zirconium oxide as an abrasive. The manufacturing method of a glass substrate for a magnetic disk includes, for instance, a polishing step of polishing a principal face of a glass substrate using a slurry containing, as an abrasive, zirconium oxide abrasive grains having monoclinic crystalline structures (M) and tetragonal crystalline structures (T).

Abstract: An agglomerate abrasive grain includes a mixture of individual abrasive grains and hollow bodies, wherein the abrasive grains and the hollow bodies are held together via a binding matrix of aluminosilicate and alkali silicate, and the agglomerate abrasive grain has an open porosity and a closed porosity in each case ranging from 5% by volume to 40% by volume, wherein the total porosity of the agglomerate abrasive grain is less than 50% by volume.

Abstract: A stable suspension of ethylpolysilicate nanoparticles having a size of between about 5 nm and 120 nm are in water and stabilized with between about 0.05 and 5 weight percent tetraalkylammonium hydroxide. The particles are between about 95% and 99.5% hydrolyzed and have superior removal rates when used in chemical mechanical polishing. A process for making ethylpolysilicate nanoparticles includes the step of adding reverse osmosis water and 25% tetramethylammonium hydroxide and ammonium hydroxide to a reactor, agitating the mixture and heating the mixture to about 80° C. Tetraethylalkoxy silane is added to the mixture and the mixture stirred and hydrolyzed. Ethanol is then removed. The mixture was then subjected to a vacuum to remove additional distillate. The material left in the reactor was then transferred to a plastic drum.

Abstract: A polishing composition contains abrasive grains and water. 50% by mass or more of the abrasive grains consists of particles A having particle sizes between 40 nm and 80 nm inclusive, and 10% by mass or more of the abrasive grains consists of particles B having particle sizes between 150 nm and 300 nm inclusive. The polishing composition is used to polish a surface of a compound semiconductor substrate.

Abstract: A polishing composition containing a silica, an acid, a surfactant, and water, wherein (a) the acid has solubility in water at 25° C. of 1 g or more per 100 g of an aqueous saturated solution; (b) the surfactant is a sulfonic acid represented by the formula (1) or (2), or a salt thereof; and (c) the polishing composition has a pH of a specified range; and a polishing process of a substrate using the polishing composition are provided. The polishing composition is suitably used, for example in polishing a substrate for disk recording media such as magnetic disks, optical disks and opto-magnetic disks.

Abstract: A cloth backing for an abrasive article is treated by combining a phenolic resin, a latex and a colloidal silicon oxide composition to prepare a colloidal formulation, which is then applied to the cloth backing and cured. Coated abrasive articles are formed by applying a make coat formulation to the treated cloth backing, applying an abrasive and then curing the make coat formulation.

Abstract: A high temperature bonded abrasive includes alumina abrasive grits, and a vitreous bond matrix in which the alumina abrasive grits are distributed, the vitreous bond matrix having a cure temperature not less than 1000° C. The alumina abrasive grits include polycrystalline alpha alumina having a fine crystalline microstructure characterized by an alpha alumina average domain size not greater than 500 nm, and the alumina abrasive grits further include a pinning agent that is a dispersed phase in the polycrystalline alpha alumina.

Abstract: Provided is an abrasive agent for substrates that includes, as an abrasive material component in the abrasive agent, cerium oxide as the main component. The abrasive agent for substrates includes soluble silica and cerium oxide. The concentration ratio of the soluble silica, calculated as Si content, and the cerium oxide in the abrasive agent is 0.001:1 to 0.1:1.

Abstract: Provided are a method for producing an alumina sintered compact satisfying the following (1) and (2), which comprises mixing and sintering an ilmenite powder and an alumina powder; the alumina sintered compact obtained according to the production method; and an abrasive grain and a grain stone. (1) The total amount of the TiO2-equivalent content of the titanium compound, the Fe2O3-equivalent content of the iron compound and the alumina content is at least 98% by mass; (2) The total amount of the TiO2-equivalent content of the titanium compound and the Fe2O3-equivalent content of the iron compound is from 5 to 13% by mass.

Abstract: The invention provides a plurality of polymeric particles embedded with alkaline-earth metal oxide. The gas-filled polymeric microelements have a shell and a density of 5 g/liter to 200 g/liter. The shell has an outer surface and a diameter of 5 ?m to 200 ?m with the outer surface of the shell of the gas-filled polymeric particles having alkaline-earth metal oxide-containing particles embedded in the polymer. The alkaline-earth metal oxide-containing particles have an average particle size of 0.01 to 3 ?m distributed within each of the polymeric microelements to coat less than 50 percent of the outer surface of the polymeric microelements.

Abstract: The present invention provides a polishing composition for a magnetic disk substrate that can reduce scratches and surface roughness of a polished substrate without impairing the productivity, and a method for manufacturing a magnetic disk substrate using the polishing composition. The polishing composition for a magnetic disk substrate includes colloidal silica having a ?CV value of 0 to 10% and water.

Abstract: A polishing composition of the present invention contains abrasive grains each having a surface with protrusions. Parts of the abrasive grains have larger particle diameters than the volume-based average particle diameter of the abrasive grains, and the average of values respectively obtained by dividing a height of each protrusion on the surface of each abrasive grain belonging to the parts of the abrasive grains by the width of a base portion of the same protrusion is 0.170 or more. Protrusions on the surfaces of abrasive grains belonging to the parts of the abrasive grains that have larger particle diameters than the volume-based average particle diameter of the abrasive grains have an average height of 3.5 nm or more. The polishing composition has a content of an organic alkali of 100 mmol or less per kilogram of the abrasive grains in the polishing composition.

Abstract: Suspensions of cerium oxide particles, well suited for polishing applications, the particles (secondary particles) of which have an average size of at most 200 nm, these secondary particles are formed from primary particles whose average size measured by TEM is at most 150 nm with a standard deviation of at most 30% of the value of this average size, and for which the ratio of the average size measured by TEM to the average size measured by BET is at least 1.5. Such suspensions are prepared from solutions of a cerium III salt, comprising a colloidal dispersion of cerium IV, which are contacted, in the presence of nitrate ions and under an inert atmosphere, with a base, and the medium obtained is subjected to a thermal treatment under an inert atmosphere and then acidified and washed.

Abstract: The present invention relates to abrasive grains, which are coated with a micro-particle inorganic powder and a binder, consisting of the group of conventional abrasive grains as well as the group of the “superabrasives”, wherein the binder comprises an aluminosilicate with a molar ratio of Al2O3 to SiO2 of 1:2 to 1:20 as well as at least one complex alkaline fluoride. The particular advantage of this coating is that the binder can already be completely hardened at below 400° C. The invention also relates to a method for producing such abrasive grains as well as to the use thereof for producing abrasives.

Abstract: To provide a polishing composition which can satisfy both suppression of the surface topography and a high stock removal rate, in a polishing step in the production of a wiring structure. A polishing composition comprising abrasive grains, a processing accelerator, a nonionic surfactant represented by R-POE (I) (wherein R is a C10-16 alkyl group having a branched structure, and POE is a polyoxyethylene chain) and having an HLB of from 7 to 12, an anionic surfactant, a protective film-forming agent, an oxidizing agent, and water.

Abstract: A polishing composition containing at least water and silica and satisfying all of the following conditions (a) through (d) is provided. Condition (a) The specific surface area of the silica contained in the polishing composition is 30 m2/g or more. Condition (b) Silica having a particle size of 10 to 50 nm is contained in the amount of 2% by mass or more. Condition (c) Silica having a particle size of 60 to 300 nm is contained in the amount of 2% by mass or more. Condition (d) The value obtained by dividing the average particle size of the silica specified in the condition (c) by the average particle size of the silica specified in the condition (b) is 2 or more.

Abstract: A vitrified superabrasive product includes a superabrasive component and a vitrified bond component in which the superabrasive component is dispersed. The vitrified bond includes an oxide of a lanthanoid. Additionally, the vitrified bond component defines pores that can be essentially all less than 800 ?m in diameter. Seventy percent of the pores are in a range of between about 40 ?m and about 500 ?m and have an average aspect ratio less than about 2. The porosity is in a range of between about 50% and about 90% of the total volume of the superabrasive product.

Abstract: A polishing composition comprising a colloidal dispersion of spherical silica particles and associated silica particles as abrasive is provided. When used in the step of polishing synthetic quartz glass substrates, the polishing composition ensures a higher polishing rate than conventional colloidal silica and is effective for preventing any microscopic defects on the substrate surface, thus providing the substrate with a high smoothness. The polishing composition can be used as the ceria replacement polishing composition for polishing a lapped surface.

Abstract: Abrasive particles which are shaped abrasive particles each with an opening are described. The shaped abrasive particles are formed from alpha alumina and have a first face and a second face separated by a thickness t. The opening in each of the shaped abrasive particles can improve grinding performance by reducing the size of a resulting wear flat, can provide a reservoir for grinding aid, and can improve adhesion to a backing in a coated abrasive article.

Abstract: The present invention relates to a bonded abrasive article comprising specific shaped abrasive particles and a bonding medium comprising a vitreous bond. The present invention also relates to the use of an article according to the present invention in grinding applications, in particular in high performance grinding applications and to the use of an article according to the present invention for abrading a workpiece material particularly a workpiece material selected from steels, non-ferrous metals, and alloys. In addition, the present invention relates to a method for abrading a workpiece, the method comprising frictionally contacting at least a portion of an abrasive article according to the invention with a surface of a workpiece; and moving at least one of the workpiece or the abrasive article to abrade at least a portion of the surface of the workpiece.

Abstract: A method for making a carbonate polycrystalline diamond body includes combining a first quantity of diamond with a first quantity of magnesium carbonate to form a first layer for forming a working surface, and combining a second quantity of magnesium carbonate to form a second layer adjacent to the first layer, forming an assembly. The method includes placing a quantity of silicon or aluminum in or adjacent to at least a portion of the assembly and sintering the assembly including the silicon or aluminum at high pressure and high temperature, causing the silicon or aluminum to infiltrate at least one layer of the assembly.

Abstract: A nonwoven, fibrous, article including a plurality of entangled fibers is provided. The fibers can have at least one of an anti-microbial agent or a plurality of abrasive particles. A binder material may bond the fibers to each other at points of crossing and contact between the fibers. The fibers may be made from post-consumer materials, post-industrial materials, heavy denier fibers, biodegradable materials, or heat resistant.

Abstract: A polishing composition for a magnetic disk substrate of the present invention includes water, silica particles, and at least one or more selected from an acid, a salt of the acid, and an oxidizing agent. The silica particles are observed with a transmission electron microscope to measure a maximum diameter and a projected area of each particle, and a value obtained by dividing the area of a circle whose diameter is the maximum diameter of a silica particle by the projected area of the silica particle and multiplying the result by 100, is in the range of 100 to 130.

Abstract: Improved silicon carbide particles, improved silicon carbide abrasive particles, and abrasive slurry compositions for use chemical mechanical planarization (CMP) processes. The particles can comprise nano-sized silicon carbide particles, particularly silicon carbide particles having a surface chemistry similar to silica.

Abstract: The present invention provides a technique of improving wear resistance of a Sialon sintered body. The Sialon sintered body has a Sialon phase including at least a ?-Sialon and a 12H-Sialon among an ?-Sialon, the ?-Sialon and the 12H-Sialon. A ratio of a second Sialon total content, which is a sum of the contents of the ?-Sialon and the 12H-Sialon, to a first Sialon total content, which is a sum of contents of the ?-Sialon, the ?-Sialon and the 12H-Sialon, is greater than 20% and not greater than 55%, and a ratio of the content of the 12H-Sialon to the first Sialon total content is not less than 2% and not greater than 55%.

Abstract: A method for chemical mechanical polishing of a substrate comprising a germanium-antimony-tellurium chalcogenide phase change alloy (GST) using a chemical mechanical polishing composition comprising, as initial components: water; an abrasive; at least one of a phthalic acid, a phthalic anhydride, a phthalate compound and a phthalic acid derivative; a chelating agent; a poly(acrylic acid-co-maleic acid); and an oxidizing agent; wherein the chemical mechanical polishing composition facilitates a high GST removal rate with low defectivity.

Abstract: An abrasive article includes a body having abrasive grains contained within a bond material comprising a metal or metal alloy, wherein the body comprises a ratio of VAG/VBM of at least about 1.3, wherein VAG is the volume percent of abrasive grains within the total volume of the body and VBM is the volume percent of bond material within the total volume of the body.

Abstract: Disclosed are substances and methods of cleaning musical instruments which are capable of abrading or removing dirt and grime from instrument surfaces or cracks. In one embodiment, the substance comprises a plastic flexible material mixed with at least one abrasive material. In one method of use: (1) a lubricant (such as a water/detergent solution) is gently sprayed on to a small area on the surface of a musical instrument; (2) the substance is, with light to medium pressure, rubbed across the lubricated surface multiple times until the area is visibly clean or smooth to the touch; and (3) steps one and two are repeated until the whole instrument is cleaned or smoothed.

Abstract: A method for producing and using an ultrapure colloidal silica dispersion is disclosed. The ultrapure colloidal silica dispersion has less than 200 ppb of each trace metal impurity disposed therein, excluding potassium and sodium, and less than 2 ppm residual alcohol. The method comprises dissolving a fumed silica in an aqueous solvent comprising an alkali metal hydroxide to produce an alkaline silicate solution, removing the alkali metal via ion exchange to generate a silicic acid solution, adjusting temperature, concentration and pH of said silicic acid solution to values sufficient to initiate nucleation and particle growth, and cooling the silicic acid solution at a rate sufficient to produce the colloidal silica dispersion.

Abstract: A vitrified superabrasive product includes a superabrasive component and a vitrified bond component in which the superabrasive component is dispersed, wherein the vitrified bond component defines pores occupying greater than about 50% of the total volume of the vitrified superabrasive product. The vitrified superabrasive product can be in the form of a grinding tool, such as a grinding wheel. A superabrasive mixture includes a glass powder, a superabrasive grit, a binder and a silicon carbide. The mixture can be in the form of a green body, which is fired under an atmosphere and pressure, and at a temperature sufficient to form a porous vitrified superabrasive product.

Abstract: A method of forming one or more TSP compacts is provided. The method includes placing one or more TSP material layers in an enclosure and surrounding each TSP material layer with at least one of a pre-sintered tungsten carbide powder, pre-cemented tungsten carbide powder, tungsten carbide powder, or partially sintered tungsten carbide substrates. The method also includes exposing the enclosure to a high temperature high pressure process wherein the at least one of a pre-sintered tungsten carbide powder, pre-cemented tungsten carbide powder, tungsten carbide powder, or partially sintered tungsten carbide substrates bond to the TSP material layers forming a stack of TSP material layers including the TSP material layers one over the other with tungsten carbide bonded to each of the TSP material layers and encapsulating each of the TSP material layers.

Abstract: Shot blasting particles are constituted by a ceramic material having an apparent relative density of more than 4.0 and less than 5.0 and comprising more than 5% of silica, as a percentage by weight based on the oxides.

Abstract: An abrasive article includes a shaped abrasive particle including a body having a first height (h1) at a first end of the body defining a corner between an upper surface, a first side surface, and a second side surface, and a second height (h2) at a second end of the body opposite the first end defining an edge between the upper surface and a third side surface, wherein the average difference in height between the first height and the second height is at least about 50 microns. The body also includes a bottom surface defining a bottom area (Ab) and a cross-sectional midpoint area (Am) defining an area of a plane perpendicular to the bottom area and extending through a midpoint of the particle, the body has an area ratio of bottom area to midpoint area (Ab/Am) of not greater than about 6.

Abstract: A superabrasive material and method of making the superabrasive material are provided. The superabrasive material may comprise a superabrasive crystal and a plurality of particles. The plurality of particles may be included within the superabrasive crystal. The plurality of particles may comprise a non-catalyst material.

Abstract: A silica having metal ions absorbed thereon and a fabricating method thereof are provided. The silica having metal ions absorbed thereon is a silica having metal ions absorbed thereon and being modified with persulfate salt. The method includes following steps. A solution is provided, and the solution includes silica and persulfate salt therein. The solution is heated to react the silica with the persulfate salt, so as to obtain silica modified with persulfate salt. Metal ion source is added in the solution, the metal ion source dissociates metal ions, and the silica modified with persulfate salt absorbs the metal ions to obtain the silica having metal ions absorbed thereon.

Abstract: The inventive chemical-mechanical polishing system comprises a polishing component, a liquid carrier, and a polyether amine. The inventive method comprises chemically-mechanically polishing a substrate with the aforementioned polishing system.

Abstract: A high temperature bonded abrasive includes alumina abrasive grits, and a vitreous bond matrix in which the alumina abrasive grits are distributed, the vitreous bond matrix having a cure temperature not less than 1000° C.

Abstract: A method is provided for recycling and treating the wastes of silicon wafer cutting and polishing processes. To begin with, a dewatered filter cake is mixed with water so that the filter cake is diluted to form a working fluid. The water reacts with silicon in the filter cake to produce silicon dioxide and hydrogen. After the hydrogen is extracted for storage, specific gravity separation takes place via water so that silicon carbide and silicon particles are separated for sorting. Then, solid-liquid separation is performed on the remaining working fluid to separate silicon dioxide (solid) from water and PEG (liquid), before PEG is separated from water. Thus, the useful silicon particles, silicon carbide, silicon dioxide, and PEG are recycled from the filter cake to reduce the total amount of wastes. Moreover, as the side product, hydrogen, is of high commercial value, the method also adds value to recycling.

Abstract: Shaped abrasive particles comprising a ceramic and comprising a first plate integrally joined to a second plate at a predetermined angle?.

Abstract: A polishing slurry including an oxidant, a metal oxide dissolver, a metal inhibitor and water and having a pH from 2 to 5. The polishing slurry having a high metal-polishing rate, reducing etching rate and polishing friction, results in the production, with high productivity, of semiconductor devices reduced in dishing and erosion in metal wiring.

Abstract: The present invention relates to a thermally curable liquid resin composition capable of being used in the manufacture of abrasive articles, and to the resulting abrasive articles.

Abstract: The invention provides a laminate capable of polishing and grinding the surface of a material having a high hardness such as diamond, sapphire or hard carbon film, rapidly and in a simplified manner with high planarity and high accuracy, utilizing the high adhesiveness to substrates, the hardness and the surface planarity that a carbon film has, but using neither diamond abrasive grains nor alkali slurry. The laminate comprises a substrate and a carbon layer provided on the substrate, wherein the carbon layer comprises a diamond fine grain provided on the substrate and crushed by impact given thereto, a formation/growth inhibiting material that inhibits the formation of an impurity inhibiting the growth of a carbon grain and/or inhibits the growth of a carbon grain, and a carbon grain, and an amount (amount per unit volume) of the formation/growth inhibiting material decreases from a lower layer toward an upper layer on the substrate side.

Abstract: An abrasive article having an abrasive body including abrasive grains contained within a bond material, wherein the abrasive grains comprise microcrystalline alumina, and wherein the bond material includes less than about 1.0 mol % phosphorous oxide (P2O5), and a ratio measured in mol % between a total content of sodium oxide (Na2O) and a total content of potassium oxide (K2O) defined by [K2O/Na2O] having a value greater than about 0.5.

Abstract: Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) and methods of fabricating polycrystalline diamond tables and PDCs in a manner that facilitates removal of metal-solvent catalyst used in the manufacture of polycrystalline diamond tables of such PDCs.

Abstract: A chemical mechanical polishing aqueous dispersion includes (A) abrasive grains, (B) an organic acid, and (C1) copper ions or (C2) at least one kind of metal atoms selected from Ta, Ti, and Rb, the chemical mechanical polishing aqueous dispersion including the copper ions (C1) at a concentration of 1×101 to 2×105 ppm, or including the at least one kind of metal atoms (C2) selected from Ta, Ti, and Rb at a concentration of 1×10?1 to 1×103 ppm.

Abstract: An abrasive article including a body having a bond material and abrasive particles contained in the bond material, the abrasive particles including a composite composition having alumina (Al2O3), iron oxide (Fe2O3), and silica (SiO2). The abrasive particles further include an aspect ratio of at least 1:1 and an average porosity in a range of about 0 vol % to not greater than about 15 vol %.

Abstract: A polishing composition of the present invention at least comprises about 750 ppm to less than 5000 ppm by weight of abrasive particles, hydrogen peroxide, an accelerator, a dual-corrosion inhibitor and water, wherein the dual-corrosion inhibitor contains a first and a second corrosion inhibitor. The dual-corrosion inhibitor is applied to the planarization of metal layers so as to maintain a high removal rate of metal layers as well as suppress etching of the metal, thus capable of reducing polishing defects such as dishing, erosion and the like.