Abstract: An object of the invention is to provide a jig electrolytic stripper that can sufficiently remove palladium adhered to the current-conducting portion of a plating jig, that can remove palladium adhered to the insulating-material-coated portion of the jig, and that exhibits reduced erosion of the metal of the current-conducting portion of the jig. The jig electrolytic stripper comprises the following components (A) to (C): (A) at least one member selected from the group consisting of nitric acid and salts thereof, (B) at least one member selected from the group consisting of ammonia, ammonium salts, ethylene amine compounds, alkyl diamine compounds, and amino acids, and (C) a bromide.

Abstract: A fluorescent brightener premix comprising from 1% to 15% of a fluorescent brightener and 10% to 80% of an alkoxylated nonionic surfactant, by weight of the premix. The premix, upon being added into a liquid composition, has minimized impact on the pH of the liquid composition.

Abstract: A liquid composition comprising (A) at least one polar organic solvent, selected from the group consisting of solvents exhibiting in the presence of from 0.06 to 4% by weight of dissolved tetramethylammonium hydroxide (B), the weight percentage being based on the complete weight of the respective test solution (AB), a constant removal rate at 50° C. for a 30 nm thick polymeric barrier anti-reflective layer containing deep UV absorbing chromophoric groups, (B) at least one quaternary ammonium hydroxide, and (C) at least one aromatic amine containing at least one primary amino group, a method for its preparation and a method for manufacturing electrical devices, employing the liquid composition as a resist stripping composition and its use for removing negative-tone and positive-tone photoresists and post etch residues in the manufacture of 3D Stacked Integrated Circuits and 3D Wafer Level Packagings by way of patterning Through Silicon Vias and/or by plating and bumping.

Abstract: A method of cleaning a substrate having a metal layer including copper or a copper-containing alloy, the method including cleaning the substrate using a cleaning liquid that includes a mercapto compound represented by one or both of the following formulas (1) and (2), and a solvent containing water and a water-soluble organic solvent: in which R represents a substituent group; m is an integer of 1 to 3; and n is an integer of 0 to 3, when m is 2 or 3, R may be the same or different; HS—(CH2)x—OH??(2), in which x is an integer of no less than 3.

Abstract: Provided are a cleaning liquid for lithography that exhibits excellent corrosion suppression performance in relation to ILD materials, and excellent removal performance in relation to a resist film and a bottom antireflective coating film, and a method for forming a wiring using the cleaning liquid for lithography. The cleaning liquid for lithography according to the present invention includes a quaternary ammonium hydroxide, a water soluble organic solvent, water, and an inorganic base. The water soluble organic solvent contains a highly polar solvent having a dipole moment of no less than 3.0 D, a glycol ether solvent and a polyhydric alcohol, and the total content of the highly polar solvent and the glycol ether solvent is no less than 30% by mass relative to the total mass of the liquid for lithography.

Abstract: The present invention relates to an acidic, aqueous composition which comprises a thiodiglycol alkoxylate for treating metallic surfaces. The invention furthermore relates to the use of one or more compound(s) of the general formula (I) as a corrosion inhibitor.

Abstract: Resist stripping agents, useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits with reduced metal etch rates, particularly copper etch rates, are provided with methods for their use. The preferred stripping agents contain low concentrations of a copper salt with or without an added amine to improve solubility of the salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.

Abstract: Resist stripping agents, useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits with reduced metal etch rates, particularly copper etch rates, are provided with methods for their use. The preferred stripping agents contain low concentrations of a copper or cobalt salt with or without an added amine to improve solubility of the copper or cobalt salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.

Abstract: A degreasing agent includes a mixture of trisodium phosphate, sodium silicate, sodium carbonate, sodium dodecyl benzene sulphonate, sodium hydrosulphite and octyl-phenol-polyoxyethylene ether. The degreasing agent may maintain degreasing effect for longer period of time. In addition, the metal product cleaned by the degreasing agent has a low cleaning inferior rate.

Abstract: A well stimulation and purging composition which is typically used in well cleanup, well stimulation and formation purging applications for enhancing oil and gas production. The composition is a cationic surfactant characterized by a homogenous aqueous solution of a coco diamine amido benzyl chloride type quaternary compound, phosphate chelator/ester, isopropanol anhydrous, ammonium bisulfide, and potassium chloride or a clay stabilizer formulation, and aids in extracting water and condensate from wells and dissipates, disperses and retards bacterial growth and buildup of iron sulfide, iron oxide, calcium and salt. The composition is applied to the wells in order to clear the water and condensate and significantly enhance total well production by chelating minerals such as salt, iron and calcium; retarding bacterial growth; and flocculating and foaming the water, condensate and solids from the well.

Abstract: Disclosed in the present application is a composition that is useful for rust and/or corrosion removal that contains a reducing agent, a chelating agent, a surfactant, and a dispersant. Disclosed also are processes for using this composition in aqueous systems and metal surface treatment.

Abstract: A metal cleaning composition useful in an aqueous solution comprises an alkali metal salt and a corrosion inhibitor. The corrosion inhibitor is provided in the form of zinc phosphate compounds such as zinc orthophosphate.

Abstract: An acid based cleaning and passivating treatment for metal surfaces is provided. The single step acid based cleaning and passivating is provided by incorporating a corrosion inhibiting amount of an ethoxylated tertiary dodecyl mercaptan into an acidic metal cleaner.

Abstract: Substituted .alpha.-halogenopropionic acids and their derivatives of the general formula ##STR1## wherein R.sup.1 to R.sup.3, Y and X have the meanings given in the description, are prepared by a process which is characterized in that substituted vinylidene chlorides of the general formula ##STR2## are reacted with chlorine or bromine chloride in the presence of compounds of the formulaR.sup.5 --SO.sub.3 R.sup.6 (III)wherein R.sup.5 and R.sup.6 have the meaning given in the description, and the products obtained are treated, if appropriate, with water or alcohol. Certain of the substituted .alpha.-halogeno-propionic acids and the substituted vinylidene chloride of the formula ##STR3## are new. The end products are useful as herbicides and intermediates for insecticides.