With Solid Polymer Derived Solely From Ethylencally Unsaturated Monomers Patents (Class 522/102)
  • Patent number: 11480713
    Abstract: Disclosed are polymerizable compositions for ophthalmic lenses. The compositions employ peroxide-based polymerization initiators with decreased capacity for dye degradation. The compositions enable the inclusion of color-balancing dyes, resulting in lenses with improved clarity and color balance.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: October 25, 2022
    Assignee: Essilor International
    Inventors: Tipparat Lertwattanaseri, Pierre Fromentin
  • Patent number: 9809899
    Abstract: A method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive; and heating the electroplating rack with the plastisol composition thereon to a suitable temperature and for a sufficient time to cure the plastisol and form a solid insulating coating on the electroplating rack. The coated electroplating rack may then be used for mounting non-conductive substrates for subsequent metallization steps.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: November 7, 2017
    Inventors: Roderick D. Herdman, Trevor Pearson, Roshan V. Chapaneri, Alison Hyslop
  • Patent number: 9611040
    Abstract: The present disclosure pertains to a seat device of an aircraft or spacecraft, having a seat which comprises a headrest, and a loudspeaker device which includes at least one pair of loudspeakers which are spaced apart from one another and located in the region of the headrest.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: April 4, 2017
    Assignee: Airbus Operations GmbH
    Inventors: Christian Riedel, Stefan Mahn
  • Patent number: 9580633
    Abstract: A reaction resin composition that can be used for the chemical fastening of anchoring means in boreholes and for construction gluing is described. The composition includes (A) a resin component, which contains at least one radically hardenable compound and at least one epoxy resin, which contains, on average, more than one epoxy group per molecule, and a (B) hardener component, which contains a hardening agent for at least one radical compound and at least one amine. The radically hardenable compound and hardening agent in each case being reaction-inhibiting spatially separated from one another. In an embodiment the composition contains no Cu—, Mn—, and iron compound, and no bridging compound. The ratio of double bond value to epoxy value nDB:nEP in the resin component is between 0.01 and 0.55 or between 5 and 50.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: February 28, 2017
    Assignee: Hilti Aktiengesellschaft
    Inventors: Armin Pfeil, Memet-Emin Kumru
  • Patent number: 9487685
    Abstract: The present invention relates to an adhesive composition including 100 parts by weight of a first epoxy compound having a glass transition temperature of a homopolymer of not less than 120° C., 30 parts by weight to 100 parts by weight of a second epoxy compound having a glass transition temperature of a homopolymer of not more than 60° C., and 0.5 parts by weight to 20 parts by weight of a cationic photopolymerization initiator, and a polarizing plate using the same.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: November 8, 2016
    Assignee: LG Chem, Ltd.
    Inventors: Eun-Mi Seo, Eun-Soo Huh, Nam-Jeong Lee, Hwa-Sub Shim, Kyun-II Rah, Jun-Wuk Park, Jee-Hyon Min, Yi-Rang Lim
  • Publication number: 20140078457
    Abstract: Embodiments of the invention provide a frame sealant and a process for preparing the same, as well as use thereof. The frame sealant comprises, by weight, 25%-30% acrylic resins, 25%-30% oligmers as shown in Structure Formula I, 10%-15% organic powders, 10%-15% inorganic powders, 0%-10% epoxy resins, 10%-15% heat curing agents, 0.1%-1% photoinitiators, and 0.1%-1% coupling agents, wherein, in Structure Formula I, n indicates an integer of 10-20.
    Type: Application
    Filed: September 16, 2013
    Publication date: March 20, 2014
    Applicant: Beijing BOE Optoelectronics Technology Co.,Ltd.
    Inventors: Ang Xiao, Haibo Zhu, Sung Hun Song
  • Patent number: 8513332
    Abstract: Disclosed is a color filter ink composition that includes an acrylic-based copolymer resin including repeating units represented by a particular chemical formula, a polymerizable monomer, a pigment, and a solvent. According to the present invention, the color filter ink composition can have excellent ejection properties and ejection stability by using a new acrylic-based copolymer resin as a binder resin, and also can have excellent storage stability, so that it can be used for a long period. In addition, a pattern formed using the color filter ink composition can have improved heat resistance, chemical resistance, and film strength.
    Type: Grant
    Filed: April 16, 2010
    Date of Patent: August 20, 2013
    Assignee: Cheil Industries Inc.
    Inventors: Jong-Seung Park, In-Jae Lee, Jin-Ki Hong, Seung-Joo Shin, Sung-Woong Kim, Tae-Woon Cha
  • Patent number: 8507583
    Abstract: An actinic energy radiation curable ink-jet ink comprising an actinic energy radiation polymerizable compound, wherein the actinic energy radiation polymerizable compound comprises a vinyl ether compound, a total content of the vinyl ether compound is 30% or more by mass, the vinyl ether compound comprises a bis-vinyl ether compound and a multifunctional vinyl compound having three or more vinyl ether groups, 10 to 70% by mass of the ink is the bis-vinyl ether compound, and 5 to 70% by mass of the ink is the multifunctional vinyl compound having three or more vinyl ether groups.
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: August 13, 2013
    Assignee: Konica Minolta IJ Technologies, Inc.
    Inventors: Atsushi Nakajima, Masaki Nakamura
  • Patent number: 8378011
    Abstract: Lubricous coatings, methods for making and using lubricous coatings, and medical device that include lubricious coatings. An example lubricous coating may include a hydrophilic polymer, a flow modifier, an acrylic monomer, a photoinitiator, and a solvent. The coating can be used to coat a medical device along an inner surface, an outer surface, or an intermediate surface.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: February 19, 2013
    Assignee: Boston Scientific Scimed, Inc.
    Inventors: Lincoln Eramo, Jr., James Campbell, Paul Matlin
  • Patent number: 8367744
    Abstract: Disclosed is a sealant composition for a liquid crystal display device, the sealant composition including a (meta) acrylate compound as expressed in Chemical Formula 1 below
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: February 5, 2013
    Assignee: Korea Kumho Petrochemical Co., Ltd.
    Inventors: Ki In Son, Joo Hyun Park, Gyu Won Cho
  • Patent number: 8258201
    Abstract: To provide a photocurable composition whereby it is possible to obtain a cured product provided with both release property and high refractive index, and a process whereby it is possible to produce a molded product having a high refractive index and having on its surface a fine pattern having a reverse pattern of a mold precisely transferred. The photocurable composition comprising from 61 to 90 mass % of a compound (A) having a refractive index of at least 1.55 at a wavelength of 589 nm before curing and having at least two (meth)acryloyloxy groups, from 2 to 15 mass % of a compound (B) having fluorine atoms and at least one carbon-carbon unsaturated double bond (provided that compound (A) is excluded), from 5 to 35 mass % of a compound (C) having one (meth)acryloyloxy group (provided that compound (B) is excluded), and from 1 to 12 mass % of a photopolymerization initiator (D) (provided (A)+(B)+(C)+(D)=100 mass %).
    Type: Grant
    Filed: September 23, 2010
    Date of Patent: September 4, 2012
    Assignee: Asahi Glass Company, Limited
    Inventor: Yasuhide Kawaguchi
  • Patent number: 8252879
    Abstract: Provided are a photosensitive resin and a photosensitive resin composition comprising the photosensitive resin. The photosensitive resin has the structure of Formula 1, which is described in the specification. The photosensitive resin and the photosensitive resin composition have good sensitivity, improved resistance to heat and chemicals, and excellent storage stability. Further provided are a method for preparing the photosensitive resin and a cured product of the photosensitive resin composition.
    Type: Grant
    Filed: August 20, 2008
    Date of Patent: August 28, 2012
    Assignee: LG Chem, Ltd.
    Inventors: Han Soo Kim, Min Young Lim, Sung Hyun Kim, Yoon Hee Heo, Dae Hyun Kim, Ji Heum Yoo, Sun Hwa Kim
  • Patent number: 8163813
    Abstract: To provide a photocurable composition from which a cured product excellent in mold release characteristics and mechanical strength can be obtained, and a method for producing a molded product excellent in durability, with a fine pattern having a reverse pattern of a mold precisely transferred on its surface. A photocurable composition 20 comprising from 15 to 60 mass % of a compound (A) which is an aromatic compound having at least two rings or an alicyclic compound having at least two rings and which has two (meth)acryloyloxy groups, from 5 to 40 mass % of a compound (B) having a fluorine atom and having at least one carbon-carbon unsaturated double bond (excluding the compound (A)), from 10 to 55 mass % of a compound (C) having one (meth)acryloyloxy group (excluding the compound (B)) and from 1 to 12 mass % of a photopolymerization initiator (D) (provided that (A)+(B)+(C)+(D)=100 mass %) is used.
    Type: Grant
    Filed: August 17, 2009
    Date of Patent: April 24, 2012
    Assignee: Asahi Glass Company, Limited
    Inventors: Yasuhide Kawaguchi, Kentaro Tsunozaki
  • Patent number: 8119702
    Abstract: The present invention provides a resin composition consisting of a functionalized polypropylene (PP) and a functionalized styrenic thermoplastic elastomer (TPS). The functionalized PP is a PP grafted with N-vinyl pyrrolidone (NVP) and glycidyl methacrylate (GMA), and the functionalized TPS is a TPS grafted with acrylamide or methacrylamide. The functionalized PP and the functionalized TPS are subjected to melt blending to obtain the resin composition with a slight cross-linking structure due to the reaction between GMA and acrylamide or methacrylamide, therefore the resin composition presents good physical properties. Besides, the resin composition without additional plasticizer or other small molecular organic compounds can be utilized in blood bags, blood transfusion and collection apparatuses, etc. Thus, it does not release small molecular substances which are of potential harm to human body during use.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: February 21, 2012
    Assignee: Changchun Institute of Applied Chemistry Chinese Academy of Sciences
    Inventors: Shifang Luan, Jinghua Yin, Zhongzhi Li, Jianwei Wang, E Zhang, Huawei Yang
  • Patent number: 8092981
    Abstract: A negative photoresist composition and a method of manufacturing an array substrate. The negative photoresist composition includes a photocurable composition including an ethylene unsaturated compound containing an ethylene unsaturated bond and a photopolymerization initiator, a thermosetting composition including an alkali-soluble resin crosslinked by heat and an organic solvent. The negative photoresist composition improves stability, photosensitivity, detachability after performing a developing operation and reduces residue to improve the reliability of an organic insulation layer. Furthermore, the negative photoresist composition improves the transmittance of an organic insulation layer and reduces the variation of color coordinates to improve the display quality of a display apparatus.
    Type: Grant
    Filed: December 29, 2008
    Date of Patent: January 10, 2012
    Assignees: Samsung Electronics Co., Ltd., Techno Semichem Co., Ltd.
    Inventors: Hoon Kang, Jae-Sung Kim, Yang-Ho Jung, Hi-Kuk Lee, Yasuhiro Kameyama, Yuuji Mizuho, Jong-Cheol Kim, Se-Jin Choi
  • Patent number: 8044110
    Abstract: Optical fiber has a glass portion and at least one coating of crosslinked polymer material surrounding the glass portion, the coating being obtained by crosslinking a composition of (a) at least one radically crosslinkable oligomer containing at least two reactive functional groups and having a number average molecular weight lower than about 1,000, preferably between about 400 and about 900; (b) at least one cationically crosslinkable compound containing at least one reactive functional group; (c) at least one free radical photoinitiator; and (d) at least one cationic photoinitiator. Preferably, the coating is a secondary coating or, in the case of a ribbon of optical fibers, it is a common polymer coating known as a “common coating”.
    Type: Grant
    Filed: May 29, 2003
    Date of Patent: October 25, 2011
    Assignee: Prysmian Cavi e Sistemi Energia S.r.l.
    Inventors: Luca Castellani, Emiliano Resmini, Luigia Rossiello, Raffaella Donetti
  • Patent number: 8017211
    Abstract: A composition, etc. are provided, which can enhance hardness and afford abrasion resistance even in a thin film as well as excellent antifouling property and durability of the antifouling property. An organic polymer, is provided, which comprises 5 to 30 weight percent of a radical polymerizable monomer having a perfluoroalkyl group, 0.01 to 5 weight percent of ?,?-dimercaptopolysiloxane, 5 to 40 weight percent of a radical polymerizable monomer having a cationic photo polymerizable epoxy group, and 25 to 75 weight percent of the other radical polymerizable monomer copolymerizable therewith, said organic polymer having a structure corresponding to a radical polymerizable copolymer of a mixture of the monomers in which a molar ratio of the mercapto group to the epoxy group is 0.0001 to 0.025, and/or a structure obtained by reacting the epoxy groups of the radical polymerizable copolymer with (meth) acrylic acid.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: September 13, 2011
    Assignee: Mitsubishi Chemical Corporation
    Inventor: Makoto Terauchi
  • Publication number: 20110097527
    Abstract: A shaped article including a modified ethylene-vinyl alcohol copolymer (C), wherein the modified ethylene-vinyl alcohol copolymer (C) is a product obtained by modifying an unmodified ethylene-vinyl alcohol copolymer (A) with an epoxy compound (B) having a double bond and has a degree of modification with the epoxy compound (B) of 0.1 to 10 mol % based on the monomer units of the ethylene-vinyl alcohol copolymer (A), and at least a part of the modified ethylene-vinyl alcohol copolymer (C) is crosslinked, and the gel fraction of the shaped article is 3% by weight or more. Thereby, a shaped article which contains almost no harmful crosslinking agent and which is excellent in hot water resistance, heat resistance and a gas barrier property is provided.
    Type: Application
    Filed: April 17, 2007
    Publication date: April 28, 2011
    Applicant: Kuraray Co., Ltd
    Inventors: Kaoru Ikeda, Masakazu Nakaya, Kazuhiro Kurosaki, Tomoyuki Watanabe
  • Publication number: 20110092611
    Abstract: An photo-curable sealing agent composition comprising (A) an unsaturated group-containing urethane resin having a number average molecular weight of 1,000-100,000 and an unsaturation degree of 0.1-1 mol/kg, which is obtained by reaction of (a) a polycarbonate diol having a number average molecular weight of 500-3,000, (b) a bifunctional epoxy (meth)acrylate having two hydroxyl groups and two ethylenically unsaturated groups, and (c) a polyisocyanate; (B) a (meth)acrylic acid ester monomer, wherein an alcohol residue, ester-bonded with an (meth)acyloyl group, is a hydrocarbon group which may contain an oxygen atom, and has 1-20 carbon atoms and a molecular weight of not larger than 1,000; and (C) a photo-polymerization initiator. The sealing agent composition exhibits a high curability performance and gives a cured product having a low hardness and enhanced flexibility and elongation, and improved physical and mechanical strength and enhanced durability.
    Type: Application
    Filed: June 17, 2009
    Publication date: April 21, 2011
    Inventors: Riichiro Maruta, Haruhiko Nishida
  • Patent number: 7910631
    Abstract: A photosensitive resin composition which is excellent in flame resistance, resolution and flexibility, and substantially free from deposition of components thereof to prevent contamination of a product. The photosensitive resin composition comprises: (A) a cyclic phosphazene compound represented by the following general formula (1): wherein at least one of the Rs is an organic group having the urethane(meth)acrylate structure represented by the following general formula (2) and n is a positive number of 2 to 5: wherein R1 is a hydrogen atom or a methyl group; (B) a carboxyl-containing linear polymer obtained by polymerizing an ethylenically unsaturated compound through addition polymerization; (C) an epoxy resin; (D) an ethylenically unsaturated group-containing polymerizable compound; and (E) a photopolymerization initiator; wherein the cyclic phosphazene compound (A) is present in a proportion of 5 to 30 wt % based on the total weight of the composition.
    Type: Grant
    Filed: October 16, 2008
    Date of Patent: March 22, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Hirofumi Fujii, Katsutoshi Hirashima, Masaki Mizutani, Kyouyuu Jo
  • Patent number: 7838589
    Abstract: There is disclosed a sealant material for providing sealing to a substrate and preferably an interface. The sealant material may also include a material, shape, ingredient or otherwise for inhibiting the flow of bubbles throught the material.
    Type: Grant
    Filed: March 15, 2007
    Date of Patent: November 23, 2010
    Assignee: Zephyros, Inc.
    Inventors: Terry Finerman, Abraham Kassa
  • Patent number: 7666920
    Abstract: The present invention relates to a radiation curable resin composition which comprises epoxy (meth)acrylate, a monofunctional (meth)acrylate, a bifunctional (meth)acrylate having a specific structure, and a bifunctional (meth)acrylate obtained from an aliphatic dihydric alcohol having an oxyalkylene structure and (meth)acrylic acid and further contains a thermoplastic resin, thereby causing satisfactory adhesion to plastic substrates, sufficient shape retention, and excellent shape recovery properties, and satisfaction in moldability including casting efficiency and shape reproducibility, as well as a high refractive index and appropriateness for use as a lens sheet.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: February 23, 2010
    Assignees: Dai Nippon Ink and Chemicals, Inc., Dai Nippon Printing Co., Ltd.
    Inventors: Hiroyuki Tokuda, Yasunari Kawashima, Yasuhiro Doi
  • Patent number: 7566745
    Abstract: A subject for the invention is to provide a method of refractive index regulation by which the refractive index of an optical polymer molding can be efficiently changed without necessitating a complicated step, such as the step of oxidizing beforehand, and which when used for producing an optical device, imparts excellent transparency thereto. Another subject is to provide a photochemically refractive-index-changing polymer or photochemically refractive-index-changing polymer composition for use in the method.
    Type: Grant
    Filed: October 1, 2004
    Date of Patent: July 28, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Yoshihide Kawaguchi, Yutaka Moroishi, Tetsuo Inoue, Kazunori Mune
  • Patent number: 7452923
    Abstract: The present invention discloses an anisotropic conductive adhesive comprising an insulating adhesive component and a number of conductive particles dispersed in the insulating adhesive component, wherein the insulating adhesive component contains a crosslinked rubber resin. The anisotropic conductive adhesive of the present invention prevents exfoliation of an adhesive or reduction in adhesive strength of circuit by minimizing its the heat-contraction occurring in the process of a polymerization or a hardening reaction when connecting micro-circuits, whereby a short circuit between adjacent electrodes can be prevented when connecting the circuits, and excellent connection reliability according to a long-term use is achieved.
    Type: Grant
    Filed: October 5, 2004
    Date of Patent: November 18, 2008
    Assignee: LG Cable Ltd.
    Inventors: Young Mi Jeon, Yoon Jae Chung, Jong Yoon Jang, Woo Young Ahn, Yong Seok Han
  • Publication number: 20080226889
    Abstract: Curable compositions are disclosed. Also disclosed are optical media comprising said curable compositions when cured and methods of making such optical media.
    Type: Application
    Filed: March 5, 2008
    Publication date: September 18, 2008
    Applicant: Rohm and Haas Company
    Inventors: Lujia Bu, Edward C. Greer, Georg R. Kestler, Alan I. Nakatani, Charles R. Szmanda
  • Patent number: 7387812
    Abstract: The present invention relates to a resin composition comprising an at least bifunctional prepolymer (A) curable under the action of heat, a telechelic elastomer and a particulate material having an elastomeric core and a thermoplastic shell. Layers and patterns which are produced using the formulation according to the invention have excellent adhesion properties, chemical stability, good electrical properties and high resistance to rapid temperature ranges. The compositions are suitable in particular as solder resists in the production of circuit boards.
    Type: Grant
    Filed: November 21, 2002
    Date of Patent: June 17, 2008
    Assignee: Huntsman Advanced Materials Americas Inc.
    Inventors: Roger Pierre-Elie Salvin, Martin Roth, Masato Hoshino, Yasuharu Nojima
  • Patent number: 7335402
    Abstract: Disclosed are radiation curable putty compositions that include (a) a radiation curable material, (b) a radiation cure initiator, and (c) a filler comprising a polymer, such as a polymer that is transparent to ultraviolet radiation. Also disclosed are methods for refinishing a coated substrate utilizing such putty compositions, and articles coated with such putty compositions.
    Type: Grant
    Filed: March 9, 2005
    Date of Patent: February 26, 2008
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Tracy A. Shamray, Albert C. Zadroga
  • Patent number: 7071243
    Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.
    Type: Grant
    Filed: May 20, 2004
    Date of Patent: July 4, 2006
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kuniaki Sato, Hiroaki Hirakura, Toshihiko Ito, Takao Hirayama, Toshizumi Yoshino
  • Patent number: 7034063
    Abstract: A solvent-containing multicomponent system curable thermally and with actinic radiation (dual cure) and comprising (A) at least one component comprising (A1) at least one constituent containing at least 1.8 meq/g of isocyanate-reactive functional groups, (A2) at least one constituent containing at least 1.8 meq/g of isocyanate-reactive functional groups and at least one functional group having at least one bond which can be activated with actinic radiation, and (B) at least one component comprising at least one polyisocyanate (B1); and its use as a coating material, adhesive or sealing compound.
    Type: Grant
    Filed: October 1, 2001
    Date of Patent: April 25, 2006
    Assignee: BASF Coatings AG
    Inventors: Egbert Nienhaus, Bernhard Lettmann
  • Patent number: 6995193
    Abstract: A photocurable composition which can be produced and cured while utilizing two different polymerization modes, can be used for bonding over a sufficiently long time period, and has excellent peel strength. The composition comprises (A) a compound containing a polymerizable unsaturated bond and giving a homopolymer having a glass transition temperature of 0 to 100° C., (B) a compound which has an unsaturated bond and is copolymerizable with the compound (A), (C) a compound having at least one cationically polymerizable group per molecule, (D) a polymerization catalyst which upon irradiation with light initiates the polymerization of the compounds (A) and (B), and (E) a cationic polymerization catalyst which upon irradiation with light initiates the cationic polymerization of the compound (C) at the cationically polymerizable group(s).
    Type: Grant
    Filed: February 14, 2000
    Date of Patent: February 7, 2006
    Assignee: Sekisui Chemical Co., Ltd.
    Inventor: Hiroji Fukui
  • Patent number: 6933325
    Abstract: A high refractive index, curable, synthetic resin composition comprising a core resin composition composed of a mixture of ethylenically unsaturated compounds, and an initiation system containing both photo and thermal initiators, particularly a photochromic resin composition which further includes at least one photochromic dye. Also a curing process, which includes a combination of multi-step radiation curing and thermal annealing. Articles produced of cured composition exhibit superior physical and, in appropriate cases, photochromic properties and can be easily mass produced on a commercial scale due to short processing time and use of readily available chemicals.
    Type: Grant
    Filed: October 11, 2002
    Date of Patent: August 23, 2005
    Assignee: Rodenstock GmbH
    Inventors: Qiang Zheng, Donald Scott Nelson, Charles William Carper, Jr., Manfred Melzig, Herbert Schuster, Herbert Zinner
  • Patent number: 6903145
    Abstract: A process for preparing a multicomponent system curable thermally and with actinic radiation (dual cure), where (A) at least one component comprising at least one constituent (A1) containing per molecule at least two isocyanate-reactive functional groups, and (B) one component containing one polyisocyanate (B1), are mixed with one another, which comprises mixing component (A) and/or component (B), shortly before their mixing, with one further liquid component (C) comprising (C1) one constituent which is curable with actinic radiation and contains per molecule at least two functional groups which contain bond which can be activated with actinic radiation, and/or (C2) one constituent which is curable thermally and with actinic radiation and contains per molecule at least one functional group which contains at least one bond which can be activated with actinic radiation, and containing per molecule at least one isocyanate-reactive functional group or containing at least one isocyanate group, and subsequently mi
    Type: Grant
    Filed: October 1, 2001
    Date of Patent: June 7, 2005
    Assignee: BASF Coatings AG
    Inventors: Egbert Nienhaus, Bernhard Lettmann
  • Patent number: 6897248
    Abstract: The present invention discloses an ultraviolet light curable ferromagnetic composition and method for making such a composition that may be used to produce a ferromagnetic coating on a suitable substrate. These coatings may be used to produce printed capacitors and inductors. The disclosed composition does not contain any significant amount of volatile organic solvents that do not become incorporated in the active layer after curing.
    Type: Grant
    Filed: February 24, 2004
    Date of Patent: May 24, 2005
    Assignee: Allied PhotoChemical, Inc.
    Inventor: Roy C. Krohn
  • Patent number: 6858260
    Abstract: A radiation curable, flexible, paintable composition produced from epoxy compounds and one or more polyol(s) has enhanced durability, thick and thin film adhesion, resistance to mold growth and dimensional changes while reducing solvent emissions. The composition can reduce, if not eliminate, runs and drips during the thermal bake cycles which are associated with using conventional compositions in automotive applications.
    Type: Grant
    Filed: March 6, 2002
    Date of Patent: February 22, 2005
    Assignee: Denovus LLC
    Inventors: Donald W. Taylor, Todd W. Scrivens, Laurie Denise Lovshe, Jeffrey T. Pachl
  • Patent number: 6803392
    Abstract: Aqueous storage-stable, non-sedimenting photoinitiator suspensions comprising (a) a mono- or bis-acylphosphine oxide of formula (I), wherein R1 is C1-C20alkyl; C2-C20alkyl interrupted by one or more O atoms; C1-C12alkoxy; phenyl-C1-C4alkyl; or phenyl that is unsubstituted or substituted by C1C20alkyl, C1-C12alkoxy, halogen, cyclopentyl, cyclohexyl, C2-C12alkenyl, C2-C18alkyl interrupted by one or more O atoms, and/or by phenyl-C1-C4alkyl; or R1 is biphenylyl; R2 is an aromatic radical or has one of the meanings give for R1; R3 and R4 are each independently of the other C1-C12alkyl, C1-C12alkoxy or halogen; and R5 is hydrogen, C1-C12alkyl, C1-C12alkoxy or halogen; (b) a dispersant; and (c) water are suitable especially in the photopolymerisation of aqueous formulations comprising ethylenically unsaturated monomers.
    Type: Grant
    Filed: March 18, 2002
    Date of Patent: October 12, 2004
    Assignee: Ciba Specialty Chemicals Corporation
    Inventors: Manfred Köhler, Beat Michael Aebli, Martin Holer, Ernst Eckstein, Jean-Pierre Wolf
  • Publication number: 20040180981
    Abstract: The present invention provides network polymers obtained by curing compositions that comprise an ester with at least two terminal epoxy groups. Preferred esters include those represented by the formula (1), wherein each R1 independently represents a substituted or unsubstituted homoaliphatic or hctcroaliphatic group; A represents a substituted or unsubstituted homoalkylene, hetemalkylene, arylene, or hetematylene segment; and n represents an integer equal to or greater than 2.
    Type: Application
    Filed: March 11, 2004
    Publication date: September 16, 2004
    Inventors: Leonardo C Lopez, Jimmy D Earls, Jerry E White, Zenon Lysenko
  • Patent number: 6777027
    Abstract: The present invention provides UV curable coating powders comprising a blend of one or more than one free radical curable resin and one or more than one cationic curable resin, at least one free radical photoinitiator and at least one cationic photoinitiator, including suitable cross-linking agents and additives to enhance the chemical and physical properties of the coating appearance. The coating powder, preferably finely ground to between 5 and 30 microns in average particle size, is applied to a substrate, heat fused, and cured for an amount of time sufficient to form a powder coating having a low gloss finish.
    Type: Grant
    Filed: October 8, 2002
    Date of Patent: August 17, 2004
    Assignee: Rohm and Haas Company
    Inventors: Andrew T. Daly, Eugene P. Reinheimer, Richard P. Haley, Navin B. Shah, Richard A. Kraski, Jr.
  • Publication number: 20040067440
    Abstract: An actinic energy ray-curable resin is obtained by reacting (c) an epihalohydrin with hydroxyl groups of a linear epoxy resin (A′) which is a product of the polyaddition reaction of (a) a bifunctional hydrogenated bisphenolic epoxy compound with (b) a compound having at least two carboxyl groups in its molecule to obtain a polynuclear epoxy resin (A″) having epoxy groups in its terminal and side chain and further reacting (d) an unsaturated monocarboxylic acid with an epoxy group of the polynuclear epoxy resin (A″) to introduce a photopolymerizable unsaturated group therein and further reacting (e) a polybasic acid anhydride with a hydroxyl group of the polynuclear epoxy resin to introduce a carboxyl group therein. A photocurable and thermosetting resin composition capable of being developed with an aqueous alkaline solution is obtained by mixing this actinic energy ray-curable resin with a photopolymerization initiator, a diluent, and a polyfunctional epoxy compound.
    Type: Application
    Filed: September 22, 2003
    Publication date: April 8, 2004
    Inventors: Shoji Minegishi, Yuta Ogawa
  • Patent number: 6716893
    Abstract: The present invention discloses an ultraviolet light curable ferromagnetic composition and method for making such a composition that may be used to produce a ferromagnetic coating on a suitable substrate. These coatings may be used to produce printed capacitors and inductors. The disclosed composition does not contain any significant amount of volatile organic solvents that do not become incorporated in the active layer after curing.
    Type: Grant
    Filed: July 11, 2002
    Date of Patent: April 6, 2004
    Assignee: UV Specialties, Inc.
    Inventor: Roy C. Krohn
  • Publication number: 20040052968
    Abstract: An actinic radiation curable composition, comprising a photo-acid generating agent selected from the group consisting of sulfonium represented by General Formulas (I)-(III).
    Type: Application
    Filed: August 25, 2003
    Publication date: March 18, 2004
    Applicant: KONICA CORPORATION
    Inventor: Toshiyuki Takabayashi
  • Patent number: 6632481
    Abstract: The invention relates to a binder, preferably for coating materials, which is curable thermally and/or by high-energy radiation and comprises a mixture of substances comprising (a) as one component, monomers or polymers which have a least one vinyl ether, vinyl ester, (meth)acrylic and/or allyl group and (b) as a further component, saturated polymers and/or unsaturated polymers different from component (a), with the proviso that at least one of components (a) and (b) has structural units of the formulae (I) and/or (II) the other component (b) has structural units of the formulae (I) and/or (II) at least when it contains saturated polymers. The invention also relates to a process for preparing the binder and to a formulation which comprises the binder of the invention. This formulation is in the form of a pigmented or unpigmented coating material or powder coating material.
    Type: Grant
    Filed: February 7, 2001
    Date of Patent: October 14, 2003
    Assignee: BASF Coatings AG
    Inventors: Rainer Blum, Rodriguez Jorge Prieto, Wolfgang Reich
  • Publication number: 20030175622
    Abstract: In accordance with the present invention, there are provided high performance, photoimageable resin compositions for flexographic printing, having excellent physical properties, e.g., resilience, hardness, toughness, and the like, as well as increased rates of cure upon exposure to radiation. In a further aspect of the invention, there are provided printing plates prepared employing invention compositions, wherein said printing plates are characterized as having excellent exposure sensitivity, the capability of rapidly curing upon exposure, excellent retention of fine details, and excellent colorless performance. Moreover, printing plates prepared employing invention compositions have good flexibility, excellent washout properties, and retain such properties over extended periods of storage. In another aspect of the invention, there are provided methods for the preparation of formulations comprising said compositions and methods for use thereof.
    Type: Application
    Filed: March 11, 2003
    Publication date: September 18, 2003
    Applicant: Napp Systems, Inc.
    Inventors: Yuxin Hu, David H. Roberts, Reny R. Paguio, Maria Teresa A. Castillo
  • Patent number: 6583198
    Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can gives a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.
    Type: Grant
    Filed: November 24, 1998
    Date of Patent: June 24, 2003
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kuniaki Sato, Hiroaki Hirakura, Toshihiko Ito, Takao Hirayama, Toshizumi Yoshino
  • Patent number: 6579664
    Abstract: In accordance with the present invention, there are provided high performance, photoimageable resin compositions for flexographic printing, having excellent physical properties, e.g., resilience, hardness, toughness, and the like, as well as increased rates of cure upon exposure to radiation. In a further aspect of the invention, there are provided printing plates prepared employing invention compositions, wherein said printing plates are characterized as having excellent exposure sensitivity, the capability of rapidly curing upon exposure, excellent retention of fine details, and excellent colorloss performance. Moreover, printing plates prepared employing invention compositions have good flexibility, excellent washout properties, and retain such properties over extended periods of storage. In another aspect of the invention, there are provided methods for the preparation of formulations comprising said compositions and methods for use thereof.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: June 17, 2003
    Assignee: Napp Systems, Inc.
    Inventors: Yuxin Hu, David H. Roberts, Reny R. Paguio, Maria Teresa A. Castillo
  • Patent number: 6576382
    Abstract: An improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts, by weight per 100 parts of resin system, of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight, of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of a difunctional epoxy resin. The photosensitive cationically polymerizable epoxy based system is especially useful as a solder mask and does not contain bromine.
    Type: Grant
    Filed: May 9, 2002
    Date of Patent: June 10, 2003
    Assignee: International Business Machines Corporation
    Inventors: Richard Allen Day, David John Russell, Donald Herman Glatzel
  • Patent number: 6528552
    Abstract: A resist composition for permanent protective coating of a printed wiring board, which resist composition is excellent in flame resistance and is obtained by incorporating as essential components a flame retardant containing 100 to 140 parts by weight of (a) aluminum hydroxide, 0.1 to 15 parts by weight of (b) a molybdenum compound and 0.1 to 10 parts by weight of (c) a zinc stannate type compound into 100 parts by weight of a resin.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: March 4, 2003
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Nobuyuki Ikeguchi, Takabumi Omori, Kenji Ishii, Toru Harada
  • Patent number: 6489375
    Abstract: An Offset Lithographic Printing Process employing low VOC lithographic printing ink formulations containing monomeric diluents, curable by cationic polymerization in the presence of fountain solution and resin rheology modifiers compatible with cationic catalysts.
    Type: Grant
    Filed: September 20, 2001
    Date of Patent: December 3, 2002
    Assignee: Sun Chemical Corporation
    Inventors: Edward Stone, Gordon Kotora, Mikhail Laksin, Subhankar Chatterjee, Bhalendra J. Patel
  • Publication number: 20020177072
    Abstract: According to the present invention, an improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts, by weight per 100 parts of resin system, of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight, of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of an difunctional epoxy resin. Since the photosensitive cationically polymerizable epoxy based solder mask does not contain bromine, it is particularly advantageous halogens in waste processing chemicals or in incinerated scrap circuit boards are regulated by environmental concerns. The photosensitive cationically polymerizable non-brominated epoxy based solder mask has a glass transition temperature greater than about 100° C., preferably greater than about 110° C.
    Type: Application
    Filed: May 9, 2002
    Publication date: November 28, 2002
    Applicant: International Business Machines Corporation
    Inventors: Richard Allen Day, David John Russell, Donald Herman Glatzel
  • Patent number: 6461691
    Abstract: A radiation curable, flexible, paintable composition produced from epoxy compounds and one or more polyol(s) has enhanced durability, thick and thin film adhesion, resistance to mold growth and dimensional changes while reducing solvent emissions. The composition can reduce, if not eliminate, runs and drips during the thermal bake cycles which are associated with using conventional compositions in automotive applications.
    Type: Grant
    Filed: November 24, 1999
    Date of Patent: October 8, 2002
    Assignee: Denovus LLC
    Inventors: Donald W. Taylor, Todd W. Scrivens, Laurie Denise Lovshe, Jeffrey T. Pachl
  • Patent number: 6432613
    Abstract: The present invention discloses a photo-sensitive composition, used as a solder resist or a photosensitive material for insulation layers in the production of printed circuit boards. The photo-sensitive composition comprises a prepolymer containing carboxylic groups and unsaturated vinyl groups; photoinitiator; unsaturated photo-monomer; and the reaction adduct of bismaleimide derivative, barbituric acid derivative and epoxy compounds. The obtained photosensitive composition exhibits high adhesion towards PI substrates, in addition, it can be developed with alkaline water. The photosensitive composition obtained in the invention is very useful in packaging substrates, such as P-BGA, T-BGA and F-CSP due to its high heat resistance and solder resistance.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: August 13, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Man-Lin Chen, Jing-Pin Pan, Hsien-Kuang Lin, Shur-Fen Liu