Abstract: Acyl germanium compound according to general formula [RmAr—(C?O)—]4—Ge and process for the preparation thereof. The compound is suitable as initiator for radical polymerization.

Abstract: Certain embodiments disclosed herein relate to compositions, methods, devices, systems, and products regarding frozen particles. In certain embodiments, the frozen particles include materials at low temperatures. In certain embodiments, the frozen particles provide vehicles for delivery of particular agents. In certain embodiments, the frozen particles are administered to at least one biological tissue.

Abstract: The present invention is directed to photoactive resins employed in radiation curable compositions and ink. The radiation curable compositions include mono or multi-functional acrylates, an amine and the above-mentioned photoactive resin. Radiation curable inks at least include the components of the radiation curable composition in addition to colorants.

Abstract: The invention relates to radiation-curable formulations which contain adhesion promoters containing phosphoric acid and which in the cured state afford a particular degree of corrosion control for metallic substrates, and to a process for preparing them.

Abstract: The present invention relates to a one-part dual curing clear coating composition comprising acrylic modified acrylate for cars, the composition containing an acrylic oligomer resin and a melamine resin as main components, and to a dual curing process utilizing the clear coating composition, the process comprising applying the clear coating composition to a substrate to form a coated film and curing the coated film by UV light and heat. According to the present invention, the clear coating composition increases dual coating workability, improves the appearance and mechanical properties of the coated film and is environmentally friendly, because it contains a small amount of a solvent so as to inhibit the emission of volatile organic compounds. In addition, the dual curing process has advantages in that energy consumption and the emission of volatile organic components are reduced compared to existing processes.

Abstract: The invention relates to polymer compositions of carbonyl-hydrogenated ketone-aldehyde resins and polyisocyanates in reactive solvents, to a process for their preparation and to the use, particularly in radiation-curable coating materials and adhesives.

Abstract: Composition with at least one polymerizable binder and at least one polymerization initiator, which contains at least one acylgermanium compound according to general Formula (I), in which R0 is a substituted or unsubstituted C1-18-alkyl radical or an acyl group; R1 and R2 are H, an acyl group or have one of the meanings given for R3; R3 is a branched or linear C1-18-alkyl radical which can be unsubstituted or substituted one or more times by —O—, —NH—, —NR—, —S— or interrupted by other groups, trimethylsilyl, hal-(CH3)2Si—[OSi(CH3)2]r?, (CH3)3Si—[OSi(CH3)2]r—, —COOH, —COO—R10, —CO—NR11R12, —CO-vinyl, —CO-phenyl, phenyl-C1-4-alkyl, phenyl, naphthyl or biphenyl, C5-12 cycloalkyl, a 5 or 6-membered O, S or N-containing heterocyclic ring, halogen, OH, an aromatic C6-30 radical which can be substituted or unsubstituted and/or interrupted by O, S or —NR—, or a branched, cyclic or linear C1-20 alkyl, -alkenyl, -alkoxy or -alkenoxy radical; m is 1, 2 or 3; n is 0 or 1 and p is 0 or 1; wherein in each case two of

Abstract: A photosensitive resin which exhibits excellent storage stability, affinity, miscibility, or solubility with respect to a variety of compounds, and high sensitivity can be solidified even under hydrous conditions as well as exhibiting high cure-related sensitivity and high flexibility and being uniformly solidified even under highly hydrous conditions, a photosensitive resin composition containing the resin, and a novel compound. The photosensitive resin is a saponified poly(vinyl acetate)-based photosensitive resin having a structural unit represented by formula (1): (wherein R1 represents H or Me; R2 represents a linear or branched C2-C10 alkylene group; n is an integer of 1 to 3; X represents m is an integer of 0 to 6; and Y represents an aromatic ring or a single bond).

Abstract: The present invention provides radiation curable resin compositions that contain no or essentially no volatile organic components (VOCs), and to methods of using these compositions. The radiation curable resin compositions find particular use as coating compositions. In particular, the radiation curable resin compositions of this invention comprise a vinyl dioxolane end-capped oligomer blended with a photoinitiator.

Abstract: A radiation sensitive resin composition containing an alkali-soluble resin, for example a novolak-quinonediazide positive-working radiation sensitive resin composition and a chemically amplified negative-working resin composition, wherein the alkali-soluble resin contains at least an alkali-soluble resin obtained by polycondensation of a compound represented by the following general formula (I) and a phenol if necessary, with an aldehyde. wherein R represents a hydroxyl group or an alkyl group with 1 to 4 carbon atoms, n is 0 or an integer of 1 to 3 and, when n is 2 or 3, each R group may be the same or different.

Abstract: A non-aqueous coating composition based on an oxidatively drying alkyd resin and a photo-initiator. An acid or latent acid and one or more compounds of the group of vinyl ethers, acetals, and alkoxysilanes which are reactive in the presence of an acid are incorporated into the coating composition. The vinyl ethers, acetals, and alkoxysilanes preferably are covalently bounded to the alkyd resin. The ratio of the number of oxidatively drying groups present in the alkyd resin to the number of groups reactive in the presence of an acid preferably is in the range of 1/10 to 15/1. The acid preferably is the phosphoric acid dibutyl ester.

Abstract: A radiation sensitive resin composition containing an alkali-soluble resin, for example a novolak-quinonediazide positive-working radiation sensitive resin composition and a chemically amplified negative-working resin composition, wherein the alkali-soluble resin contains at least an alkali-soluble resin obtained by polycondensation of a compound represented by the following general formula (I) and a phenol if necessary, with an aldehyde. wherein R represents a hydroxyl group or an alkyl group with 1 to 4 carbon atoms, n is 0 or an integer of 1 to 3 and, when n is 2 or 3, each R group may be the same or different.

Abstract: The present invention provides polyester/vinyl dioxolane based coating compositions containing no or essentially no volatile organic components. Oligomers for forming the coating compositions of the present invention are vinyl dioxolane end-capped polyester oligomers.

Abstract: An ultraviolet-curing liquid undercoating composition for use in metallizing FRP, which is a one-component type, has an unlimited pot life, and is excellent in adhesion and heat resistance. The composition comprises 20 to 80 parts by weight of a compound(s) containing at least two (meth)acryloyl groups in its molecule, 80 to 20 parts by weight of oil-modified alkyd resin(s), and 2 to 15 parts by weight of a sensitizer, optionally further 5 to 20 parts by weight of an amino resin based on 100 parts by weight in total of the above compound and the above alkyd resin(s). It is suited for the undercoating of an automotive reflector.

Abstract: Photosensitive, dielectric insulating, crosslinkable copolyester films used as dielectric and as photoresist films for microelectronics circuits which are also suitable for use in producing MCM-L packages. In various embodiments of the invention there is provided photosensitive, dielectric insulating, crosslinkable copolyester film forming mixtures for coating onto microelectronics substrate surfaces, a photosensitive oligomer for producing the crosslinkable copolyesters and MCM-L products produced using the crosslinked copolyesters.

Abstract: Resin compositions useful for filament winding applications comprising an epoxy component including at least one polyepoxide resin curable by heat, an olefinicially unsaturated monomer component including at least one polyolefinically unsaturated monomer curable by actinic radiation, at least one photoinitiator which is not a peroxide, at least one organic peroxide, and a heat activated curing agent for epoxides. The compositions have a viscosity less than about 2000 centipoise (cps) and are capable of retaining this viscosity for at least about 2 hours at a temperature of from about ambient temperature to about 60.degree. C. The resins are capable of being immobilized by actinic radiation exposure and further heat cured without substantial resin drip. One or more organic peroxides are employed, selected from the group of organic peroxides having 10 hour decomposition half lives at temperatures of from about 50.degree. C. to less than about 104.degree. C.

Abstract: A liquid composition which on exposure to actinic radiation polymerizes to form a heat-curable solid film adhesive, said composition comprising (A) a heat-curable phenol-aldehyde resol resin, (B) a photopolymerizable polyurethane or polyester having, on average, more than one polymerizable acrylic group per molecule, or a mixture of said polyurethane and said polyester, (C) a photopolymerization initiator for (B) and (D) a polyvinylacetal.

Abstract: A liquid composition which on exposure to actinic radiation polymerises to form a heat-curable solid film adhesive, said composition comprising (A) a heat-curable phenol-aldehyde resol resin, (B) a photopolymerisable resin having, on average, more than one polymerisable acrylic group per molecule, (C) a photopolymerisation initiator for (B) and (D) an aminotriazine-formaldehyde resin.

Abstract: Thermally reversible polyurethane hydrogels are formed by adding water to a gel forming hydrophilic polyurethane polymer produced by reacting under anhydrous conditions a non-aromatic organic diisocyanate with a glycol component in an NCO/OH mole weight ratio of from about 0.900/1 to about 0.980/1, the glycol component having a number average molecular weight of from about 1000 to 3500 wherein the percentage by weight of the diisocyanate in the reaction mixture is from about 7% to about 20%. The hydrogels are solids at room temperature but liquify at higher temperatures such as body temperature and therefore are useful as carriers for the protection, delivery and sustained release of a variety of active agents including pharmaceuticals, cosmetics, living cells and organisms.

Abstract: A positive radiation-sensitive mixture is disclosed comprising a compound which forms an acid under the action of actinic radiation, and an acid-cleavable compound, the acid-cleavable compound producing, as cleavage product, an aromatically-substituted alcohol of the general formula I. The radiation-sensitive mixture according to the inventionexhibits a wide processing latitude since different holding times do not cause any changes with respect to the development times.

Abstract: A radiation curable adhesive composition comprising a liquid oligomer, a chain transfer agent, and an N-methyl compound can give a surface protective film which is slightly influenced in adhesive strength with the lapse of time, and excellent in weather resistance and heat resistance.