Abstract: According to the present invention, good image resolution of a cationically polymerized epoxy based coating, such as a solder mask or dielectric or etch resist, is provided by combining a cationically polymerized epoxy based coating with conventional epoxy glass substrates cured with a curing agent that does not produce basic reaction products. Preferably, the coating is photoimagable. The method for making the same is also provided. The coating material includes an epoxy resin system comprising between from about 10% to about 90%, preferably about 28% to about 57% by weight of a polyol epoxy resin, and from about 10% to about 90%, preferably about 43% to 72% by weight, of a brominated epoxy resin. Optionally, a polyepoxy resin or an epoxy creosol novolak resin is added to the resin system. The polyepoxy resin may be added from an effective amount up to less than 90% of the resin system; the epoxy creosol novolak may be added from an effective amount up to about 80 pph.

Abstract: A thermosettable resin composition having a viscosity that decreases during processing temperatures and increases as the temperature is raised to curing temperatures is provided. The composition comprises thermosettable resins and thermoplastic particles that are insoluble in the thermosettable resins at processing temperatures but soluble in the thermosettable resins at curing temperatures. Prepregs prepared from the thermosettable resin composition are also provided.

Abstract: A process for producing a reinforced crystalline engineering plastic composition is disclosed, comprising melt-kneading (A) from 60 to 97 parts by weight of a crystalline engineering plastic and (B) from 5 to 100 parts by weight, per 100 parts by weight of the sum of (A) and (C), of glass fibers and melt-kneading the resulting mixture with (C) from 3 to 40 parts by weight of an epoxy- or acid anhydride-containing ethylene copolymer. The composition obtained provides, with excellent moldability, a molded article having an improved appearance while exhibiting well-balanced mechanical and thermal properties.

Abstract: A thermoplastic resin composition for casting high-voltage coils containing two kinds of fillers (A) and (B), and products as molded coils and panels obtained by casting and curing the composition.The composition of the present invention contains 60%-85% by weight, based on the total weight of the composition, of a silica type filler which is an admixture (A) a spherical silica having an average particle diameter of 0.1-0.9 .mu.m and (B) a ground silica having an average particle diameter of 3-9 .mu., the ratio A/(A+B) being 1%-7% by weight.Products as molded coils and panels prepared by using the composition have good resistance to cracking and resistance to moisture.

Abstract: A machinable, high strength epoxy tool which is the polymeric reaction product of a mixture containing 5 to 12 weight percent of a bisphenol A epoxy, 3 to 8 weight percent of at least one polyoxypropylene amine catalyst, 60 to 85 weight percent of a mixture of no less than three different sized particulate fillers, the major portion of which is iron powder, 5 to 15 weight percent of short (<250 .mu.m) glass fibers, and 0.02 to 1 weight percent of a surface active agent.

Abstract: A simplified aqueous sizing composition utilizing a variety of components achieves improved stability, wettability and strength characteristics. The composition utilizes one or more aqueous, soluble, dispersible or emulsifiable bisphenol A type polyester film forming polymers with an epoxy containing film forming copolymer compatible with and soluble in the matrix polymer. One or more organo-silane coupling agents are also utilized. The sizing composition preferably includes a single nonionic surfactant in conjunction with a cationic amidated polyamine lubricant. One or more anti-static agents, generally cationic organic quaternary ammonium salts having one or more alkoxy moieties, are utilized in an effective anti-static amount. An anti-foaming agent may also be utilized for the prevention or suppression of foam during the mixing process. The improved stability and wettability characteristics of the aqueous sizing composition are preferably achieved through the use of a single epoxidized surfactant.

Abstract: An adhesive bonding composition with bond line limiting spacer system includes an adhesive paste composition having a hardenable adhesive component, and a plurality of spacer elements distributed in the adhesive paste composition. The spacer elements are sized to provide a self-limiting bond line thickness between the surfaces to be bonded, the bond line thickness being maintained at a selected lower limit by the spacer elements.

Abstract: In a light transmissive epoxy resin composition comprising (A) an epoxy resin and (B) a curing agent are blended (C) an organic phosphorus anti-discoloring agent and (D) silica-titania glass beads surface treated with an organic silicon compound. The composition restrains coloring in composition form and discoloration in cured form while curing into clear low stressed products having high light transmittance. Optical semiconductor devices encapsulated with the cured epoxy resin composition are reliable.

Abstract: An encapsulating resin composition for electrical and electronic components consists of cycloaliphatic epoxy resin, a hardener, an accelerator, a filler and, sometimes, a pigment. As a result of the combination of the cycloaliphatic epoxy resin with the provision of methylnadic anhydride as hardener and amporhous SiO.sub.2 as a filler, the material is capable of flowing at room temperature, is physiologically harmless and also otherwise well suited for mass production of a wide variety of electrical and electronic components, for example diodes and other semi-conductors for the motor vehicle industry. A small addition of hollow glass spherical particles counteracts sedimentation of amorphous SiO.sub.2 in pre-hardening storage of the resin.

Abstract: High transparency silica-titania glass beads are characterized by a linear transmittance of at least 70% as measured at a wavelength of 900 nm to 600 nm by a specific measurement method. Such beads are prepared by hydrolyzing and polycondensing a silicon alkoxide and a titanium alkoxide to form a silica-titania sol, converting the sol into a dry gel, and then grinding the gel followed by heating or heating the gel followed by grinding. A light transmisson epoxy resin composition comprising a curable epoxy resin, a curing agent, and the high tranparency silica-titania glass beads has crack resistance and high transparency in cured state. It is useful in encapsulating optical semiconductor devices.

Abstract: Radomes having increased transparency and reduced reflectivity and refractivity to radar waves may be prepared or repaired utilizing heat-curable resin-containing structural materials in which the heat-curable resin contains greater than about 70 weight percent of cyanate functional monomers. The structural materials take the form of matrix resin impregnated prepegs and composites, film adhesives, paste adhesives, syntactic foams, and expandable foams, and may be used to prepare numerous useful structural features including honeycomb materials and leading edge radomes containing syntactic foams.

Abstract: There are provided novel mixtures and composites comprising a normally crystalline acetal polymer and a reinforcing material comprising glass fibers or filaments sized with a normally non-crystalline elastomeric copolymer of about 15 to 45 mol %, preferably about 25 to 35 mol % of trioxane, about 55 to 85 mol %, preferably about 65 to 75 mol % of 1,3-dioxolane, said mol percents based on the total of trioxane and 1,3-dioxolane, and about 0.005 to 0.15 wt. %, preferably about 0.05 to 0.12 wt. % of 1,4-butanediol diglycidyl ether or butadiene diepoxide as a bifunctional monomer, based on the total weight of copolymer.

Abstract: Ultravioletsetting resin composition contains fragmentary quartz glass powder in the ratio of 50 to 200 parts to 100 parts of the ultravioletsetting resin. The surface hardness of the ultravioletsetting resin of the present invention is increased in a short time by the application of ultraviolet rays.

Abstract: Described is a liquid sprayable epoxy composition comprising a liquid epoxy resin, an effective reinforcing amount of a fiber, an elastomeric component and an amine containing epoxy curing agent capable of curing the composition at equal or greater than 40.degree. F. temperatures wherein the cured product is light stable and has a hardness on the Shore D scale. Further described is a method of forming in situ a cured product such as a truck bed liner by spraying, brushing or troweling the epoxy composition onto the substrate such as the trunk bed, curing and forming the product on the substrate at a temperature of at least 40.degree. F. temperature. The ratio of epoxy reactive groups to amine reactive groups ranges from 0.9 to 1.1:1. Further described is a technique of modifying the coating coefficient of friction by sand embedment between the induction period and cure set time of applied epoxy composition.

Abstract: A polymaleimide/epoxy blend is cured with cyanamide to provide interlocked one-phase networks with superior thermal properties.

Abstract: An epoxy resin composition suitable for use as a casting resin for the potting of an ignition coil is disclosed which comprises:(A) a mixture containing(a.sub.1) a liquid, Bisphenol-type epoxy resin, and(a.sub.2) an inorganic filler,(a.sub.3) a polyether polyol; and(B) a liquid curing agent including(b.sub.1) an acid anhydride, and(b.sub.2) an imidazole compound.

Abstract: The present invention is directed to a method for making a chopped fiber-reinforced composite. The method comprises dispersing a polyamide acid/epoxy blend and greater than 50 wt-% chopped fiber in an aerated surfactant foam. The foam is deposited on a foraminous layer and collapsed to form a web. The web is consolidated at a temperature of greater than about 280.degree. C. and a pressure of greater than about 500 psi. The resulting composite typically has a flexural modulus of greater than 2,000 ksi and flexural strength values of greater than about 30,000 psi and typically between about 30,000 and 50,000 psi. The composite should find use in applications requiring effective high mechanical stiffness and strength, and flame resistance.

Abstract: A fiber reinforced plastics comprises a resin and chopped strands dispersed in the resin, wherein the chopped strands comprise glass fiber chopped strands composed of cut assemblies of glass filaments and high elastic chopped strands composed of cut assemblies of high modulus inorgtanic filaments having higher elastic modulus than the filaments and having 3000 or less number of assembled filaments. By this arrangement, the both chopped strands are closely and uniformly dispersed in the resin and the force interaction between the both chopped stands are enhanced. The resultant plastics has remarkably improved strength and fatigue durability, and higher rigidity than conventional ones.

Abstract: A filled resin composition is provided which is particularly adapted for the formation of wear-resistant, lubricious surfaces. The compositions when formed into integral threads with the bodies of plastic-reinforced pipe provide superior thread action and extended thread life.The compositions comprise a thermosetting resin such as epoxy resin and hardener, in combination with a filler which in turn comprises ceramic powder, graphite and short fiber lengths. The compositions may vary widely as will hereinafter become apparent.

Abstract: A low warp, filled polyoxymethylene composition comprises a bimodal distribution of glass beads.

Abstract: Thermoplastic molding materials contain, as essential components,(A) from 2 to 97.9% by weight of a nylon,(B) from 2 to 97.9% by weight of a polyaryl ether ketone and(C) from 0.1 to 30% by weight of a polymeric component containing hydroxyl groupsand in addition(D) from 0 to 50% by weight of an impact-modifying rubber and(E) from 0 to 60% by weight of fibrous and/or particulate fillers.

Abstract: A curable resin composition comprises an epoxy compound and a propargyl aromatic ether.

Abstract: Profound improvements and advantages are realized in the process of cutting semiconductor ingots to provide wafers if the adhesive used to bond said ingot to a mounting or cutting beam contains hollow microspheres.

Abstract: High-strength magnesium aluminosilicate glass fibers coated with the dried residue of a dilute aqueous sizing composition containing emulsified epoxy resin or emulsified epoxy resin solution, both 3-methacryloxypropyltrimethoxysilane and 3-aminopropyltriethoxysilane, and at least one lubricant, are compatible as reinforcing elements with unsaturated polyester, vinylester and epoxy resin matrixes.

Abstract: A low warp, filled polyoxymethylene composition comprises a bimodal distribution of glass beads.

Abstract: A resin composition is suitable for molding to a gear and comprises 30 to 98 percent by weight of a resin being capable of the anisotropic phase in the molten state and the melt processing and 2 to 70 percent by weight of fibers such as metal fibers, carbon fibers, glass fibers, inorganic fibers, synthetic fibers and mineral fibers.

Abstract: The invention relates to inorganic-organic compound substances useful for biomedical purposes. The object of the invention is to develop inorganic-organic compound materials which overcome the disadvantages of the state of art, wherein inorganic-organic compound substances for biomedical purposes possess to a large extent specifically adjustable characteristics. Inorganic initial substances form a new solid chemical compound with organic initial substances. The inorganic initial component consists of a biocompatible silicate glass and/or a silicate glass ceramic of the system SiO.sub.2 -Al.sub.2 O.sub.3 -MgO-Na.sub.2 O/K.sub.2 O-F.sup.-, and/or a bioactive phosphate silicate glass and/or a phosphate silicate glass ceramic of the system SiO.sub.2 -Al.sub.2 O.sub.3 -MgO-Na.sub.2 O/K.sub.2 O-CaO-P.sub.2 O.sub.5 F.sup.- and/or of the system SiO.sub.2 -MgO-K.sub.2 O-F.sup.- -CaO-P.sub.2 O.sub.5, and/or a bioactive phosphate glass and/or a phosphate glass ceramic of the system P.sub.2 O.sub.5 -Al.sub.2 O.sub.

Abstract: An epoxy resin-based composition suitable for encapsulation of semiconductor devices is proposed. The resin composition is capable of giving a cured resin encapsulation highly resistant against crack formation by virtue of the unique ingredient therein, in addition to the thermally curable epoxy resin and an inorganic filler, which is a combination of an organopolysiloxane having a hydrocarbon group substituted by certain functional groups, e.g. glycidyl, amino, mercapto and the like, and a block copolymer composed of the segments of a polymeric aromatic moiety and segments of an organopolysiloxane moiety.

Abstract: A thermosetting resin composition of an epoxy resin mixture of 1,2 epoxy resin having at least two epoxide groups per molecule and a polyglycol diepoxide having viscosity of 2,000-5,000 centipoises at 25.degree. C. and in addition small but effective amounts of both a catalytic hardener and an accelerator has special utility in the production of composite molded bodies of electrical insulation having thermoplastic shells because of its unique combination of properties including thermal stability, thermal-cycling crack resistance, high impact strength, toughness, room-temperature curability and bondability to both thermoplastic and metallic surfaces, and because it does not stress crack thermoplastic shells to which it is bonded in curing.

Abstract: A novel adhesive exhibiting low outgassing upon exposure to high temperatures is disclosed. The instant adhesive comprises: (a) a soluble polyimide resin, (b) a solvent for said polyimide resin, (c) an epoxy resin, (d) a cross-linking agent reactive with the polyimide solvent of (b), and (e) a catalyst which accelerates the reaction between (b) and (d). Optionally, the adhesive may also contain a conductive material. A process for making the adhesive is also disclosed.

Abstract: This invention provides an insulating protective material effective for protection of electronic and electric devices such as electronics elements. This insulating protective material contains at least one hydrous oxide of a metal which has ion exchange properties together with a fusion bonding component such as low-melting glass, epoxy resin, phenolic resin, silicone resin, etc. and a filler such as fused silica, .beta.-eucryptite, glass fiber, glass beads, etc.Said specific hydrous oxide can be used together with a sulfur-containing organic high molecular weight compound.The hydrous oxides used in protective materials as a sealing material for electronic and electric devices can capture an ionic impurity eluted from the components of the protective material and fix it therein thereby to provide stable electronic materials excellent in performance.

Abstract: Processes for the preparation of random-fiber thermoset composite sheets by employing a latent curing agent thermoset resin formulation or a coreactant thermoset system such that uncured thermoset composite sheets are formed which can be subsequently formed and cured into articles of manufacture.

Abstract: An adhesive composition comprising, by weight, (1) 100 parts of triglycidyl ether of trisphenol, (2) 0-40 parts of a polyfunctional epoxy resin, (3) a diamine type curing agent selected from (a) an aromatic diamine compound and (b) a reaction product having an amino group at each terminal thereof, prepared by reacting together an aromatic diamine compound, divinylsilane compound and bismaleimide compound, and, if desired, (4) a powdery inorganic filler.

Abstract: A novel adhesive exhibiting low outgassing upon exposure to high temperatures is disclosed. The instant adhesive comprises: (a) an epoxy resin, (b) a soluble polyimide resin, (c) a reactive solvent; and (d) an alkenylphenol crosslinker which preferably contains polyhydroxy and polyalkenyl substituents. Optionally, the adhesive may also contain a conductive material.

Abstract: An epoxy resin composition which comprises:(a) an epoxy resin having an epoxy equivalent of at most 200;(b) a condensation mixture of 1 mol of a polybasic carboxylic acid anhydride, from 0.07 to 0.3 mol of a bisphenol A having the formula: ##STR1## and from 0.07 to 0.3 mol of a monohydric phenol having the formula: ##STR2## wherein R is an alkyl group, as a curing agent; and (c) an inorganic powder, as a filler.

Abstract: An epoxy resin composition which comprises an epoxy resin having an epoxy equivalent of at most 200; a condensation mixture (A) of a polybasic carboxylic acid anhydride, a bisphenol A having the formula: ##STR1## and a polyhydric alcohol, as a curing agent; and an inorganic powder, as a filler.

Abstract: An epoxy resin powder coating composition is described, comprising an epoxy resin and at least a hardener and a filler compounded thereto, wherein the filler is a mixture of from 30 to 180 parts by weight of a needle-like glass powder having an average length of at least 40 .mu.m and an aspect ratio of at least 4:1 and at least 30 parts by weight of a granular inorganic filler having an average particle diameter of 1.0 .mu.m or less, both being based on 100 parts by weight of the epoxy resin. This powder coating composition can provide a coating exhibiting excellent impact resistance not only at room temperature but also at lower temperatures, and further having good flexibility. A steel member with the coating of the present powder coating composition has a high practical value.

Abstract: An epoxy resin composition for cast molding which comprises:(A) an epoxy resin;(B) a curing agent;(C) cut fibers having distributions of 3 to 20 .mu.m in diameter and 3 to 1500 .mu.m in length;(D) inorganic powder having a size distribution of particles with 90% by weight or more of particles with particle sizes of 10 .mu.m or less and 50% by weight or more of particles with particle sizes of 5 .mu.m or less,the total amount of the components (C) and (D) formulated being 40 to 225 parts by volume per 100 parts by volume of the total amount of the components (A) and (B) formulated displays excellent crack resistance, strength as well as a low shrinkage characteristic and, good fluidity.

Abstract: A low warp, filled oxymethylene polymer composition which when molded into products, exhibits improved surface appearance and low warpage as compared to products molded from glass fiber filled oxymethylene polymer compositions. The composition contains an oxymethylene polymer, a minor proportion of a phenoxy resin which is a compound of the formula: ##STR1## and glass beads.

Abstract: A novel adhesive exhibiting low outgassing upon exposure to high temperature is disclosed. The instant adhesive comprises: (a) a soluble polyimide resin, (b) a solvent for said polyimide resin, (c) a tackifier, (d) an epoxy resin, (e) a hardener for said epoxy resin, (f) a catalyst which catalyzes the reaction between the epoxy and hardener, (g) a cross-linking agent reactive with the polyimide solvent of (b), (h) a catalyst which accelerates the reaction between (b) and (g), and (i) a filler material. Optionally, the adhesive may also contain a conductive material. A process for making the adhesive is also disclosed.

Abstract: Compositions of a vinylized epoxy resin, sized glass fibers and a complexing agent exhibit reduced fiber prominence upon curing with a metal composition than when employing no complexing agent.

Abstract: A paint composition for inhibiting corrosion of a metal surface includes a powdered sacrificial metal for that surface and a powdered water soluble corrosion inhibiting glass. Typically the paint is a zinc rich paint and the glass is a calcium/zinc phosphate glass.

Abstract: Flame retardant reinforced with thermoplastic polyester resin compositions are disclosed glass fiber and a system of flame retardants represented by the following general formulas (I) and (II), together with antimony trioxide. The flame retardant system is a blend of 1-20 parts by weight of component (I), and 2-40 parts by weight of component (II), provided the weight ratio (I)/(II) of the flame retardant components (I) to (II) is in the range of 0<(I)/(II).ltoreq.5, and that the total amount of flame retardants (I) plus (II) is in the range of 3-40 parts by weight. From 2 to 3 parts by weight of antimony trioxide is present and 5 to 60% by weight of glass fiber is also present, these two percentages being expressed on the basis of the weight of the total resin composition. The resin compositions exhibit outstanding mechanical, thermal, forming and machining properties in addition to being fire retardant.

Abstract: A soft vinyl chloride resin composition having a light weight and a superior abrasion resistance and lusterless surface is provided, which composition is obtained by blending 100 parts by weight of a vinyl chloride copolymer consisting of 99.0 to 99.95% by weight of vinyl chloride and 1.0 to 0.05% by weight of a polyethylene glycol diacrylate or a polyethylene glycol dimethacrylate both having 4 to 50 polymerization units of ethylene glycol, mainly with (a) 5 to 100 parts by weight of a filler having a specific gravity of 0.7 or less and a compressive strength of 70 Kg/cm.sup.2 or higher and (b) 30 to 150 parts by weight of a plasticizer.

Abstract: Flame retardant reinforced with polyester resin compositions are disclosed glass fiber and a system of flame retardants represented by the following general formulas (I) and (II), together with antimony trioxide. The flame retardant system is a blend of 1-20 parts by weight of component (I), and 2-30 parts by weight of component (II), provided the weight ratio (I)/(II) of the flame retardant component (I) to (II) is in the range of 0.2<(I)/(II)<4, and that the total amount of flame retardants (I) plus (II) is in the range of 3-40 parts by weight. From 2 to 30 parts by weight of antimony trioxide is present and 5 to 60% by weight of glass fiber is also present, these two percentages being expressed on the basis of the weight of the total resin composition. The resin compositions exhibit outstanding mechanical, thermal properties and moldability in addition to being fire retardant.

Abstract: A conductive paste and an electroconductive body fabricated from the paste, in which the paste comprises inorganic non-metallic particles coated with silver, silver particles and an organic binder, or inorganic non-metallic particles coated with silver, silver particles, particles of glassy material and an organic vehicle. An electroconductive body comprises silver particles, and inorganic non-metallic particles coated with silver, both embedded in a matrix of organic material or of glassy material. The silver particles and silver-coated inorganic non-metallic particles are in effective contacting relationship within the matrix. Also disclosed are a silver-coated glass bead, for incorporation in paste and an electroconductive body, and methods for fabricating an electroconductive body. The electroconductive bodies are useful, for example, as termination elements for capacitors, and as internal conductive elements in capacitors of the type used in thick-film technology applications.

Abstract: A curable composition, and composites comprising (A) an epoxy resin and (B) a heterocyclic compound prepared by reacting at least one aromatic or aliphatic polyamine compound having at least two amine groups, which are separated by no more than one carbon atom, with at least one carbonyl-containing compound selected from the group consisting of aldehydes and ketones.

Abstract: A conductive paste and an electroconductive body fabricated from the paste, in which the paste comprises inorganic non-metallic particles coated with silver, silver particles and an organic binder, or inorganic non-metallic particles coated with silver, silver particles, particles of glassy material and an organic vehicle. An electroconductive body comprises silver particles, and inorganic non-metallic particles coated with silver, both embedded in a matrix of organic material or of glassy material. The silver particles and silver-coated inorganic non-metallic particles are in effective contacting relationship within the matrix. Also disclosed are a silver-coated glass bead, for incorporation in paste and an electroconductive body, and methods for fabricating an electroconductive body. The electroconductive bodies are useful, for example, as termination elements for capacitors, and as internal conductive elements in capacitors of the type used in thick-film technology applications.

Abstract: A thermosetting powder resin based water-slurry coating composition prepared by dispersing water insoluble thermosetting resin particles and an adduct of a structurally symmetrical diol having a molecular weight of from 90 to 300 with ethylene oxide or propylene oxide, or a mixture thereof in an aqueous medium. The composition provides improvements in the anti-sedimentation properties and redispersibility of particles, and consequently in the extended storage stability and application performance thereof. The composition is applied to form a film with excellent smoothness, gloss, water resistance, moisture resistance, corrosion resistance, etc., without developing any pinholing and cratering by solvent popping, and checking on film formation by heating.

Abstract: A composition for producing surface layers on wood or other substrates is formed from diatomite, expanded perlite, chopped glass fibers and a thermosettable resin mixed in specified amounts to provide a flowable mixture. When applied to the substrate as a layer about 1 to 2 cms. thick and the resin component has cured, a tough, impact-resistant, watertight surface is created on the substrate. The new compositions and surfacing methods are particuarly useful for refinishing the hulls of wooden boats.