Phosphorus Dnrm Patents (Class 523/451)
  • Patent number: 5428086
    Abstract: Disclosed are reinforced polyester compositions having repeat units from terephthalic acid and 1,4-cyclohexanedimethanol which have improved melt stability due to the addition of small amounts of an epoxy compound and either a phosphite or phosphonite.
    Type: Grant
    Filed: May 3, 1993
    Date of Patent: June 27, 1995
    Assignee: Eastman Chemical Company
    Inventors: Larry A. Minnick, Robert W. Seymour
  • Patent number: 5395889
    Abstract: Glycidyl (meth)-acrylate polymer and an organic acid, phosphoric acid, phosphorous acid, hypophosphoric acid and/or a compound other than an organic acid containing one or more functional groups selected from among carboxyl, amino, hydroxyl, acid anhydride and thiol groups added to an aromatic polycarbonate resin composition, decrease the luster of the composition without compromising the properties of the composition.
    Type: Grant
    Filed: November 8, 1993
    Date of Patent: March 7, 1995
    Assignee: GE Plastics Japan
    Inventors: Tomohide Fujiguchi, Hideyuki Itoi, Akihiro Saito
  • Patent number: 5389704
    Abstract: The present invention provides a process for preparing an epoxy phosphate ester resin, which comprises (1) reacting an epoxy resin having an average of greater than one vicinal epoxy group with a phosphoric acid source material to obtain an epoxy phosphate ester; and (2) further reacting the obtained epoxy phosphate ester with a phosphoric acid source material. The present invention provides epoxy phosphate ester resins obtained by the above process, which exhibit good water-solubility. The coating compositions containing such epoxy phosphate ester resin show good coating properties such as good corrosion resistance, chemical resistance, heat resistance and flexibility.
    Type: Grant
    Filed: July 15, 1993
    Date of Patent: February 14, 1995
    Assignee: The Dow Chemical Company
    Inventor: Yoshimitsu Yabu
  • Patent number: 5389708
    Abstract: An internal release agent comprises a sulfur-containing acid phosphoric esters selected from the group consisting of thiophosphoric acid esters and dithiophosphoric acid esters of the formula, ##STR1## where X and Y are independently selected from the group consisting of an oxygen atom and a sulfur atom, at least one of X and Y is a sulfur atom, and R.sub.1 and R.sub.2 are independently alkyl groups.
    Type: Grant
    Filed: January 27, 1993
    Date of Patent: February 14, 1995
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Masahiko Kusumoto, Hiroyuki Yamashita, Teruyuki Nagata
  • Patent number: 5374668
    Abstract: The present invention relates to a polysulfide based resin lens, comprising a mixture of at least one epoxy resin having at least two epoxy groups, and at least one polythiol compound having at least two mercaptan groups, and at least one internal release agent, which is cast polymerized, and the process for preparing the same.
    Type: Grant
    Filed: November 8, 1993
    Date of Patent: December 20, 1994
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Yoshinobu Kanemura, Katsuyoshi Sasagawa, Masao Imai
  • Patent number: 5367012
    Abstract: This invention is directed to an alloy, and a method of producing an alloy, of increased resistance to moisture, comprising a melt mixture of at least one phosphate glass, at least one organic thermoplastic or thermosetting polymer, and an amount of a water soluble stabilizer component which provides a source of metal cations having a valency of 2.sup.+ or higher The amount of the stabilizer component added is that amount effective to improve the alloy's resistance to moisture. Preferably, the alloy is comprised of: (a) 5-80% of the matrix material; (b) 15-90% of the phosphate glass; and, (c) 0.1 to 40% of the stabilizer component. Additionally, the metal cations which are found in the stabilizer component and which form part of the insoluble surface layer are preferably selected from the group consisting of Ba.sup.2+, Mg.sup.2+, Ca.sup.2+, Al.sup.3+, Zn.sup.2+, Sr.sup.+2 and Fe.sup.3+.
    Type: Grant
    Filed: August 9, 1993
    Date of Patent: November 22, 1994
    Assignee: Corning Incorporated
    Inventors: Bruce G. Aitken, Dana C. Bookbinder, James E. Dickinson, Jr., Brent M. Wedding
  • Patent number: 5362775
    Abstract: An epoxy resin composition comprising (i) an epoxy resin, (ii) a phenolic curing agent, (iii) an organophosphorous curing agent, (iv) alumina, and (v) a separating means for separating the organophosphorous curing agent and the alumina, which may be a coating over the surfaces of the organophosphorous curing agent.
    Type: Grant
    Filed: March 24, 1992
    Date of Patent: November 8, 1994
    Assignees: Nippondenso Co., Ltd., Shin-Etsu Chemical Co., Ltd.
    Inventors: Akira Shintai, Hiroshi Shibata, Toshio Shiobara, Koji Futatsumori, Seizi Katayama, Yasutaka Yoshida
  • Patent number: 5232970
    Abstract: A ceramic-filled thermally-conductive composite for use in microelectronic applications includes a substantially homogeneous mixture of a solidified polymeric material and an adamantine-structured ceramic filler, such as aluminum nitride or boron nitride, wherein the solidified polymeric material is substantially continuous. The solidified polymeric material may be a material containing a predominant amount of a fusible semi-crystalline polyamide having a melting point of greater than about 250.degree. C. or a polybenzocyclobutene.
    Type: Grant
    Filed: January 10, 1992
    Date of Patent: August 3, 1993
    Assignee: The Dow Chemical Company
    Inventors: Jitka Solc, Douglas G. Kleweno
  • Patent number: 5145889
    Abstract: A light-emitting diode device includes a light-emitting diode chip, lead-frames respectively connected to an anode and a cathode of the light-emitting diode chip, an encapsulant for encapsulating the light-emitting diode chip and the lead-frames, and a buffer layer, formed between the encapsulant, on the one hand, and the light-emitting diode chip and the lead-frames, on the other, for reducing the stress acting from the encapsulant onto the light-emitting diode chip and the lead-frames. This device can be minimized degradation of quality caused by this stress, and maintained high product quality for a long period of time. An encapsulating epoxy resin composition contains 100 parts by weight of an epoxy resin, 70 to 140 parts by weight of a curing agent including an acid anhydride, 0.5 to 4.0 parts by weight of a curing accelerator including an onium or diazabicycloalkene salt, and 0.1 to 5.0 parts by weight of a thiophosphite. This resin composition can be suitably used as an encapsulant for LED devices.
    Type: Grant
    Filed: November 28, 1989
    Date of Patent: September 8, 1992
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yusuke Wada, Michiya Higashi
  • Patent number: 5130198
    Abstract: Polymeric-containing compositions having improved oxidative stability have the polymer and at least two stabilizing agents. These agents are selected from low temperature antioxidants such as alkali metal and alkaline earth metal hypo or hydrogen phosphites, high temperature antioxidants such as: alkali metal or alkaline earth metal phenylphosphonates, thioethers like dialkyl thioalkylionate and polymers thereof and metal deactivating agents like polydentate ligands and ethylene diamine-tetracidic acid compounds. The composition can be a coating composition for substrates including those like fibrous material including fibers, bundles of fibers, strands, roving, flakes and beads. The composition can be present as a dried residue on the substrate. For fibrous substrates, the composition also has at least one organofunctional silane coupling agent, may also have processing aids such as epoxy polyester polymers and/or lubricants.
    Type: Grant
    Filed: April 27, 1990
    Date of Patent: July 14, 1992
    Assignee: PPG Industries, Inc.
    Inventors: Robert G. Swisher, Peter C. Gaa, James W. Kasunic
  • Patent number: 5115005
    Abstract: Compounds of the formula Ia or Ib ##STR1## in which R.sub.1 and R.sub.2, independently of one another, are hydrogen, alkyl, cycloalkyl, alkenyl, aryl or aralkyl or, together with the carbon atoms in the .alpha.-position to the carbonyl groups, form a cyclopentane, cyclopentene, cyclohexane, cyclohexene, cyclohexadiene or bicyclo[2.2.1]hept-5-ene ring which is unsubstituted or substituted by C.sub.1 -C.sub.4 alkyl, or form a monocyclic or polycyclic, aromatic ring system which is unsubstituted or substituted by C.sub.1 -C.sub.4 alkyl, R.sub.3 and R.sub.4, independently of one another, are hydrogen, alkyl, alkenyl, aryl or aralkyl, and R.sub.5 and R.sub.6, independently of one another, are alkyl, aryl or aralkyl groups, are highly suitable as flame retardants for polymers.
    Type: Grant
    Filed: September 9, 1991
    Date of Patent: May 19, 1992
    Assignee: Ciba-Geigy Corporation
    Inventor: Hans-Peter Horner
  • Patent number: 5079094
    Abstract: Reactive hot melt structural adhesives comprising urethane oligomer and epoxy mixture in specified ratios. The compositions offer very high shear, peel, and impact strengths, properties of particular value in bonding adherends in an auto body assembly line.
    Type: Grant
    Filed: August 8, 1990
    Date of Patent: January 7, 1992
    Assignee: W. R. Grace & Co.-Conn.
    Inventor: Michael E. Kimball
  • Patent number: 5059640
    Abstract: This invention relates to a corrosion-resistant coating capable of being lied to various substrates, e.g., particularly metal and plastic surfaces, as a single coat characterized as having a high-gloss, good adhesion and a high degree of flexibility. The corrosion inhibiting composition comprises an epoxide resin containing an effective amount of a corrosion-inhibiting pigment system consisting essentially of critical amounts of at least one zinc phosphate, zinc molybdate and at least one zinc salt of a benzoic acid.
    Type: Grant
    Filed: September 28, 1990
    Date of Patent: October 22, 1991
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Charles R. Hegedus, Donald J. Hirst, Anthony T. Eng, William J. Green
  • Patent number: 5034556
    Abstract: The disclosure is directed to a compound which is a reaction product of at least one phosphonic acid group of an alpha-aminomethylene phosphonic acid containing at least one group corresponding to the formula, ##STR1## with an epoxy group of a compound containing at least one epoxy group. The disclosure is also directed to waterborne coating compositions, organic solvent-borne coating compositions, and powder coating compositions containing the aforesaid reaction product.
    Type: Grant
    Filed: April 3, 1989
    Date of Patent: July 23, 1991
    Assignee: PPG Industries, Inc.
    Inventor: Charles F. Kahle, II
  • Patent number: 5026583
    Abstract: Disclosed is a process for the preparation of rubber laminates, according to which a rubber laminate having a high bonding strength can be obtained by contacting an uncured composition A comprising a fluororubber and a metal oxide with an uncured composition B comprising an epichlorohydrin rubber and a phosphonium salt represented by the following general formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each stand for a hydrocarbon residue having 1 to 20 carbon atoms, which may be substituted, with the proviso that up to three of R.sub.1, R.sub.2, R.sub.3 and R.sub.4 may be a primary, secondary or tertiary amino group of a fluoroalkyl group, and R.sub.5 stands for a hydrogen atom or an alkyl group having 1 to 20 carbon atoms, and curing the uncured compositions.
    Type: Grant
    Filed: August 12, 1988
    Date of Patent: June 25, 1991
    Assignee: Nippon Zeon Co., Ltd.
    Inventors: Takashi Nakagawa, Osamu Sugimoto
  • Patent number: 5021473
    Abstract: Process for enhancing the electrostatic chargeability of powder coatings or powders, and the use thereof for surface coating solid objects.Process for enhancing the electrostatic chargeability of powder coatings or powders intended for the surface-coating of solid objects, by homogeneously incorporating at least one salt-like, cationic compound of the formula (1) ##STR1## in which R.sub.1, R.sub.2, R.sub.3 and R.sub.4, independently of one another, denote hydrogen atoms, straight-chain or branched alkyl groups having 1 to 30 carbon atoms, mononuclear or polynuclear cycloaliphatic radicals having 5 to 12 carbon atoms, oxethyl groups of the general formula --(CH.sub.2 --CH.sub.2 --O).sub.n --R in which n denotes a number from 1 to 10 and R denotes a hydrogen atom, a (C.sub.1 -C.sub.
    Type: Grant
    Filed: November 3, 1988
    Date of Patent: June 4, 1991
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Hans-Tobias Macholdt, Alexander Sieber, Claus Godau, Albrecht Manz
  • Patent number: 5019605
    Abstract: A low density self-extinguishing epoxide composition employing an epoxide, an epoxide hardener, a smoke suppressant and a low density filler is provided. The composition contains from 3 to 10 weight percent bromine.
    Type: Grant
    Filed: March 15, 1989
    Date of Patent: May 28, 1991
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Patrice Jannic
  • Patent number: 5001173
    Abstract: This invention relates to aqueous epoxy resin-containing compositions and to such compositions which are particularly useful for depositing coatings on metallic substrates in order to protect substrates against corrosion. The aqueous compositions generally comprise (A) an organic resin component consisting essentially of at least one water-dispersible or emulsifiable epoxy resin or a mixture of resins containing more than 50% by weight of at least one water-dispersible or emulsifiable epoxy resin, (B) chromium trioxide, and (C) water, said composition further characterized as being substantially free of strontium chromate. The aqueous compositions may also contain other ingredients including zinc and/or ferro alloys.These aqueous compositions are useful as pretreatment coatings on metal surfaces, and in particular, on steel and on galvanized and aluminized metal substrates.
    Type: Grant
    Filed: March 8, 1988
    Date of Patent: March 19, 1991
    Assignee: Morton Coatings, Inc.
    Inventors: Karl P. Anderson, Whaite M. Clark, Poli C. Yu, Richard T. Moyle
  • Patent number: 4999388
    Abstract: Branched polyester resins comprising a polyepoxy compound, a hindered phenol and a catalyst compound having enhanced melt viscosity are disclosed.
    Type: Grant
    Filed: September 14, 1989
    Date of Patent: March 12, 1991
    Assignee: General Electric Company
    Inventor: Kevin T. Okamoto
  • Patent number: 4997876
    Abstract: Flame-retarding composition for rendering self-extinguishing polymers, copolymers, mixtures of polymers and various polymeric materials, comprising a polymer, a copolymer, or a mixture of polymers of hydroxyalkyl-derivatives of isocyanuric acid and ammonium polyphosphate, and so-obtained self-extinguishing polymers and polymeric materials.
    Type: Grant
    Filed: January 18, 1989
    Date of Patent: March 5, 1991
    Assignee: V.A.M.P. S.r.l.
    Inventor: Luciano Scarso
  • Patent number: 4975139
    Abstract: Disclosed is a process for the preparation of a rubber laminate, which comprises bringing an uncured composition comprising a fluororubber and a metal oxide incorporated therein into contact with an uncured composition comprising an epoxy group-containing acrylate rubber and a phosphonium salt of the following general formula incorporated therein: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are selected from the group consisting of hydrocarbon groups having 1 to 20 carbon atoms, secondary and tertiary amino groups substituted with a hydrocarbon group having 1 to 20 carbon atoms and fluoroalkyl groups having 1 to 20 carbon atoms, with the proviso that the case where all of R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are secondary or tertiary amino groups or fluoroalkyl groups is excluded, and R.sub.5 stands for a hydrogen atom or an alkyl group having 1 to 20 carbon atoms, and curing them.
    Type: Grant
    Filed: June 22, 1989
    Date of Patent: December 4, 1990
    Assignee: Nippon Zeon Co., Ltd.
    Inventor: Osamu Sugimoto
  • Patent number: 4962138
    Abstract: Novel reactive hot melt structural adhesives comprising urethane oligomer and epoxy mixture in specified ratios. The compositions offer very high shear, peel, and impact strengths, properties of particular value in bonding adherends in an auto body assembly line.
    Type: Grant
    Filed: May 27, 1988
    Date of Patent: October 9, 1990
    Assignee: W. R. Grace & Co.-Conn.
    Inventor: Michael E. Kimball
  • Patent number: 4959400
    Abstract: An epoxy resin composition having exceptional stability which is useful in the preparation of electrical laminates comprises an epoxy resin such as the diglycidyl ether of bisphenol A, an organic solvent, a polyhydric phenolic hardener and an acid having a pKa at 25.degree. C. of less than 2.5 or an ester or anhydride of such acid. The epoxy resin composition can also contain a bishenol or bisphenol derivative such as bisphenol A. In addition, an accelerator such as an alkyl substituted imidazole can also be added to the composition prior to its use as in the preparation of electrical laminates.
    Type: Grant
    Filed: August 24, 1989
    Date of Patent: September 25, 1990
    Assignee: The Dow Chemical Company
    Inventor: Diane Sexton
  • Patent number: 4957950
    Abstract: Flame-retardant polymer compositions contain a flame-retardant system consisting of a phosphorus/nitrogen-component, aluminum hydroxide, and a least one synergetically active component selected from the group consisting of organic nitrogen compounds, polyalcohols or derivatives thereof, the phosphorus/nitrogen-component being ammonium polyphosphate, if desired.
    Type: Grant
    Filed: September 9, 1988
    Date of Patent: September 18, 1990
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Horst Staendeke, Daniel Scharf
  • Patent number: 4943604
    Abstract: A structural adhesive having excellent anti-corrosion properties which comprises: (A) a rubber modified epoxy resin prepared by reaction of a bisphenol epoxy resin and a butadiene-acrylonitrile-(meth)acrylic acid copolymer, (B) an urethane modified epoxy resin, (C) a latent curing agent, and (D) a rust inhibiting pigment selected from the group consisting of: (i) a rust inhibiting pigment comprising aluminum orthophosphate and a zinc compound, (ii) a rust inhibiting pigment comprising aluminum metaphosphate, a zinc compound and/or an alkaline earth metal compound, and (iii) a rust inhibiting pigment comprising aluminum metaphosphate and a zinc compound and optionally an alkaline earth metal compound, wherein the adhesive contains said rubber modified epoxy resin (A) and said urethane modified epoxy resin (B) in a weight ratio of 1:9 to 3:1, and said latent curing agent (C) and said rust inhibiting pigment (D) at 0.
    Type: Grant
    Filed: November 29, 1988
    Date of Patent: July 24, 1990
    Assignee: Sunstar Giken Kabushiki Kaisha
    Inventors: Yasuhiro Okuri, Toshimori Sakakibara
  • Patent number: 4863974
    Abstract: The present invention provides for a bone growth material for filling in defects or hollow portions of bones to be ingrown by and coalesce with bone tissues wherein the bone growth material is comprised of expanded PTFE and calcium phosphate.
    Type: Grant
    Filed: August 3, 1988
    Date of Patent: September 5, 1989
    Assignee: W. L. Gore & Associates, Inc.
    Inventors: Robert S. Mallouk, William P. Mortimer, Jr.
  • Patent number: 4845136
    Abstract: An adhesive resin composition comprising (a) an expoxy resin, (b) a curing agent therefor, and (c) an aluminum orthophosphate-zinc compound rust inhibiting pigment. When applied to the assembly of car body components, the composition assures improved bond strength and corrosion resistance.
    Type: Grant
    Filed: May 27, 1988
    Date of Patent: July 4, 1989
    Assignees: Sunstar Engineering Inc., Teikoku Kako Co., Ltd.
    Inventors: Atsushi Saito, Yasuhiro Okuri, Takahiro Nakano, Masahiko Murakami, Masaaki Okuda
  • Patent number: 4830779
    Abstract: An electrically conductive resin composition comprising:(i) a resin;(ii) a metallic powder;(iii) a diphosphonic acid derivative; and(iv) a hydroxyl-containing compound; wherein the weight ratio of the compound (i)/the component (ii) is 30/70 to 85/15 and the amounts of the components (iii) and (iv) are 0.5 parts by weight or more and 0.08 parts by weight, respectively, based on 100 parts by weight of the components (i) and (ii).
    Type: Grant
    Filed: December 17, 1987
    Date of Patent: May 16, 1989
    Assignee: Lion Corporation
    Inventors: Seiji Maeno, Hidetaka Ozaki, Hisashi Yamada
  • Patent number: 4806577
    Abstract: An adhesive composition comprising 10 to 80% by weight of a binder composed of an aminoalkyl ester group-containing acrylic copolymer shown ##STR1## wherein R denotes an alkylene possessing 2 to 3 carbon atoms, as a pendant group and an epoxy resin, and if desired a rust-proofing pigment and a silane coupling agent.
    Type: Grant
    Filed: November 14, 1986
    Date of Patent: February 21, 1989
    Assignee: Nippon Shokubai Kagaku Kogyo Co., Ltd.
    Inventors: Kazutomo Takahashi, Kazuo Kodama, Minoru Saotome
  • Patent number: 4788235
    Abstract: Composition comprising an epoxy resin, an adduct of a tetra-substituted titanate and a di-substituted hydrogen phosphite, a neutral ester of a phosphorous acid, and a curing agent for the epoxy resin.The composition is particularly useful as an adhesive for bonding structures made of sheet molding compound to like structures, to steel, and to other substrates commonly used in the automotive area.
    Type: Grant
    Filed: November 23, 1987
    Date of Patent: November 29, 1988
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Michael A. Johnson
  • Patent number: 4788233
    Abstract: A modified epoxy resin composition having improved flexibility which comprises a reaction product of an epoxy resin and a synthetic rubber reactive with an epoxy resin in the presence of a nonionic or anionic surfactant, which has uniform and stable dispersion state of the rubber in epoxy resin without increase of viscosity. The epoxy resin composition is useful as a material for adhesives and coating agents.
    Type: Grant
    Filed: November 18, 1987
    Date of Patent: November 29, 1988
    Assignee: Sunstar Giken Kabushiki Kaisha
    Inventors: Toshimori Sakakibara, Takahiro Nakano, Tatsuya Okuno
  • Patent number: 4776980
    Abstract: Disclosed are compositions useful in fabricating blocks or inserts for inductors comprising:(a) about 98 percent to about 99.5 percent by weight of a high purity, annealed electrolytically prepared iron powder; and(b) about 0.5 percent to about 2 percent of an insulating polymer binder selected from the group consisting of epoxies, flourocarbon, hot melt adhesives, and mixtures thereof;wherein said iron powder has a specific surface area of less than about 0.25 m.sup.2 /g and a carbon content of less than about 0.01 percent; andwherein said composition after pressing at at least about 30 Tsi demonstrates a maximum of 5 percent regression in permeability and a total core loss of less than about 0.8 to about 1.2 ohms between 10 KHz and 500 KHz. Blocks and inserts made from such compositions, as well as methods of manufacturing such inserts, are also disclosed.
    Type: Grant
    Filed: October 30, 1987
    Date of Patent: October 11, 1988
    Inventor: Robert S. Ruffini
  • Patent number: 4747966
    Abstract: An electrically conductive thermoplastic resin and coating composition comprising a diphosphonic acid derivative having the formula: ##STR1## wherein R represents an alkyl or aryl group and M.sup.1 to M.sup.4 independently represent hydrogen or a cation.The electrically conductive thermoplastic resin composition has excellent electrical conductivity and retains the electrical conductivity for extended periods without using expensive noble metals. Furthermore, the electrically conductive coating composition provides an excellent electrical conductivity and shielding property retention without using expensive noble metals.
    Type: Grant
    Filed: September 30, 1986
    Date of Patent: May 31, 1988
    Assignee: Lion Corporation
    Inventors: Seiji Maeno, Hidetaka Ozaki, Hisashi Yamada, Osamu Ito
  • Patent number: 4740539
    Abstract: A two component structural adhesive which is composed of a mixture of an epoxy component which comprises a polyepoxide and a polyisocyanate and a hardener component which comprises a long chain, flexible polyamine and an epoxy resin homopolymerization catalyst is described.
    Type: Grant
    Filed: April 21, 1986
    Date of Patent: April 26, 1988
    Assignee: Ashland Oil, Inc.
    Inventor: Anil B. Goel
  • Patent number: 4731394
    Abstract: The invention relates to inorganic-organic compound substances useful for biomedical purposes. The object of the invention is to develop inorganic-organic compound materials which overcome the disadvantages of the state of art, wherein inorganic-organic compound substances for biomedical purposes possess to a large extent specifically adjustable characteristics. Inorganic initial substances form a new solid chemical compound with organic initial substances. The inorganic initial component consists of a biocompatible silicate glass and/or a silicate glass ceramic of the system SiO.sub.2 -Al.sub.2 O.sub.3 -MgO-Na.sub.2 O/K.sub.2 O-F.sup.-, and/or a bioactive phosphate silicate glass and/or a phosphate silicate glass ceramic of the system SiO.sub.2 -Al.sub.2 O.sub.3 -MgO-Na.sub.2 O/K.sub.2 O-CaO-P.sub.2 O.sub.5 F.sup.- and/or of the system SiO.sub.2 -MgO-K.sub.2 O-F.sup.- -CaO-P.sub.2 O.sub.5, and/or a bioactive phosphate glass and/or a phosphate glass ceramic of the system P.sub.2 O.sub.5 -Al.sub.2 O.sub.
    Type: Grant
    Filed: June 12, 1986
    Date of Patent: March 15, 1988
    Assignee: Friedrich-Schiller-Universitaet Jena
    Inventors: Werner Vogel, Guenther Heublein, Wolfram Hoeland, Manfred Boese, Karin Naumann, Gunter Carl, Juergen Vogel, Peter Wange, Jens Gummel, Peter Zinner, Eggert Beleites, Thomas Schubert
  • Patent number: 4668718
    Abstract: The invention relates to epoxy resin moulding compositions containing(a) at least one epoxy resin adduct of a low molecular diglycidyl ether of a bisphenol and an aromatic or cycloaliphatic diamine that contains not less than 2.0 epoxide equivalents/kg of resin,(b) at least one aromatic polyol containing more than 5 hydroxyl equivalents/kg of polyol as hardener, the amount of said hardener being such that the content of hydroxyl groups is 0.5 to 0.8 per epoxy group,(c) at least one curing accelerator,(d) up to 70% by weight of aluminium hydroxide and(e) 1-20% by weight of a calcium phosphate, the amount of components (d) and (e) together being not more than 85% by weight and the percentages by weight being based on the total weight of the epoxy resin moulding composition.These moulding compositions are self-extinguishing and have good tracking resistance. They are suitable e.g. for making electrical components.
    Type: Grant
    Filed: September 26, 1985
    Date of Patent: May 26, 1987
    Assignee: Ciba-Geigy Corporation
    Inventor: Bruno Schreiber
  • Patent number: 4661539
    Abstract: A two-component structural adhesive comprising a first epoxy component composed of an epoxy resin containing from 0.5 to 8% by weight based on the weight of the epoxy resin of fumed silica and a second hardener component composed of an amido amine, primary and secondary amines having tertiary amine groups or alkylene ether groups in the backbone, and a phenolic compound is disclosed.
    Type: Grant
    Filed: March 21, 1986
    Date of Patent: April 28, 1987
    Assignee: Ashland Oil, Inc.
    Inventor: Anil B. Goel
  • Patent number: 4647601
    Abstract: The present invention relates to self-sanitizing epoxy resin and to an additive which is incorporated therein so that the epoxy product or film is made self-sanitizing.The additive is an alkyl phosphate derivative with the following structure: ##STR1## where R is an alkyl group of from 8 to 18 carbon atoms, R.sub.1 is an alkyl group or a hydroxy alkyl group, and R.sub.2 is selected from the group consisting of hydrogen and an alkyl group of from 6 to 18 carbon atoms, with at least one R.sub.2 group being the alkyl group.The additive is highly effective against both gram-negative and gram-positive bacteria and is also highly effective against eukaryotic microorganisms such as yeasts, molds and fungi. In addition to the unique and unexpected microbiocidal properties of the self-sanitizing epoxy, the microbiocidal activity remains in the epoxy product or film over long periods of time.
    Type: Grant
    Filed: May 21, 1985
    Date of Patent: March 3, 1987
    Assignee: Interface Research Corporation
    Inventor: Robert H. McIntosh
  • Patent number: 4605570
    Abstract: The present invention relates to novel compositions comprising epoxy resins and phosphate ceramic compositions derived from wollastonite, a metal oxide, and phosphoric acid. In addition to providing a curing component for the inorganic constituents of the composition, the phosphoric acid also serves as an acid catalyst for the epoxy resin. As a result, a system is obtained which can be highly filled with inert material, yet which provides superior resistance to traffic and other wear conditions. In one preferred embodiment, the above composition comprises latent curing additives which provide an accelerated cure to the system.
    Type: Grant
    Filed: August 9, 1985
    Date of Patent: August 12, 1986
    Assignee: Armstrong World Industries, Inc.
    Inventors: Richard E. Felter, Dean A. Markley
  • Patent number: 4560716
    Abstract: Epoxy resin compositions including an epoxy resin, a hardener and an additive for forming a rust preventing film are provided. The additive is at least one selected from dithiophosphoric acids, dithiophosphoric acid derivatives, metal salts of dithiocarbamic acids and oxidized waxes. The composition may also include a secondary additive such as an organosilicon compound, an organoaluminum compound or an organotitanium compound for dithiophosphoric acid and/or dithiophosphoric acid derivative; an alkylarylsilsesquioxane silicone compound for a metal salt of dithiocarbamic acid; an alkylarylsilsesquioxane silicone compound, an organoaluminum compound, an organotitanium compound or an organotin compound for an oxidized wax. These epoxy resin compositions, when used as encapsulating materials, prevent moisture and impurities from penetrating into the surface of an encapsulated product because of the rust preventing film existing between the composition and the encapsulated product.
    Type: Grant
    Filed: August 24, 1984
    Date of Patent: December 24, 1985
    Assignee: Kabushiki Kaisha Toyota Chuo Kenkyusho
    Inventors: Shigeyuki Sato, Mitsumasa Matsushita
  • Patent number: 4554213
    Abstract: Sheet steel used for making the cores of electrical machines is improved as to its punchability by coating it with a heat resistant coating of a complex mixture of phosphates and resins compatible with acid phosphate ions. The coating contains between 60 and 95% by weight of the phosphates and between 5 and 40% by weight of the resins. The resins can be acrylic base resins, ethylene-vinyl acetate copolymer resins, or thermosetting epoxy resins.
    Type: Grant
    Filed: November 29, 1984
    Date of Patent: November 19, 1985
    Assignees: Centro Sperimentale Metallurgico SpA, Terni - Societa per l'Industria e l'Elettricita SpA
    Inventors: Paolo Marini, Marcello Candiotti
  • Patent number: 4551488
    Abstract: A resinous protective coating useful in adhering plastics to metallic substrates. The protective coating is particularly useful as a solder mask and in the manufacture of printed circuit boards with circuit patterns having a resolution of at least 0.25 mm lines and spaces thereon. The protective coating comprises resins dissolved in solvents, wherein the coating, upon being subjected to heat, goes from a liquid or soft "gel-like" state into a solid phase without bleeding. The protective coating is resistant to copper, nickel and gold electroplating baths, adheres to insulating substrates, adhesive coated base materials as well as metallic substrates and is capable of withstanding the thermal shock of dip soldering.
    Type: Grant
    Filed: June 29, 1984
    Date of Patent: November 5, 1985
    Assignee: Kollmorgen Technologies Corporation
    Inventors: Edward J. Leech, Frank D. Russo
  • Patent number: 4548959
    Abstract: This invention relates to hydroxyapatite, ceramic material, implant material and a process for preparing thereof. The ceramic material is hydroxyapatite ceramic having an excellent thermal stability.
    Type: Grant
    Filed: October 25, 1983
    Date of Patent: October 22, 1985
    Assignee: Kureha Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hirosi Nagai, Yasushi Nishimura
  • Patent number: 4528306
    Abstract: A soft vinyl chloride resin composition having a light weight and a superior abrasion resistance and lusterless surface is provided, which composition is obtained by blending 100 parts by weight of a vinyl chloride copolymer consisting of 99.0 to 99.95% by weight of vinyl chloride and 1.0 to 0.05% by weight of a polyethylene glycol diacrylate or a polyethylene glycol dimethacrylate both having 4 to 50 polymerization units of ethylene glycol, mainly with (a) 5 to 100 parts by weight of a filler having a specific gravity of 0.7 or less and a compressive strength of 70 Kg/cm.sup.2 or higher and (b) 30 to 150 parts by weight of a plasticizer.
    Type: Grant
    Filed: April 20, 1984
    Date of Patent: July 9, 1985
    Assignee: Chisso Corporation
    Inventors: Koga Shigehiro, Kanazawa Yoshihisa, Okamoto Takeshi, Yamanouchi Masafumi, Shudo Kazumichi
  • Patent number: 4500703
    Abstract: This invention relates to a storage stable, heat reactive, adhesive dispersion composition comprising a solid epoxy resin containing more than one epoxy group and a solid, sterically unhindered, tertiary amine catalyst in a liquid vehicle which is a non-solvent for the solids but in which said solids are at least partially soluble in the melt. Heating said dispersion to a temperature at or above which the solids melt results in a thermoset product usable as an adhesive, sealant or coating.
    Type: Grant
    Filed: December 28, 1983
    Date of Patent: February 19, 1985
    Assignee: W. R. Grace & Co.
    Inventors: James L. Guthrie, Ronald T. Wojcik
  • Patent number: 4489183
    Abstract: Particulate red amorphous phosphorus is stabilized against oxidation and phosphine formation by the use of a combination of titanium dioxide or titanium phosphate and an organic resin, usually an epoxy resin, a melamine-formaldehyde resin or a urea-formaldehyde resin.
    Type: Grant
    Filed: December 13, 1983
    Date of Patent: December 18, 1984
    Assignee: ERCO Industries Limited
    Inventor: Helena Twardowska
  • Patent number: 4480006
    Abstract: Proposed is a distance sheeting for construction of molds and models; the sheeting is produced by curing of 100 parts by weight of a mixture consisting of 45-60 parts by weight of an internally plasticized epoxy resin of low epoxide value, 5-10 parts by weight of an external plasticizer and 35-45 parts by weight of a globular-amorphous filler material with 9-13 parts by weight of polyamine curing agent. This distance sheeting is especially suitable as a substitute for the sheetings made of lead or wax which are being used currently for this purpose.
    Type: Grant
    Filed: September 29, 1982
    Date of Patent: October 30, 1984
    Assignee: Ciba-Geigy GmbH
    Inventors: Rudolf Rampf, Erich Sollner
  • Patent number: 4476263
    Abstract: Certain alkali metal salts of organic diacids having one or more hydroxyl functional groups, as for example sodium and potassium citrate, provide improved adhesion of organic coatings electrodeposited on metal substrate. The new sanitary coatings are particularly useful for untreated aluminum and aluminum alloy cans used in the packaging of various food products including acidic foods like tomatoes, corn, and green beans which require in-can-sterilization.
    Type: Grant
    Filed: November 23, 1983
    Date of Patent: October 9, 1984
    Assignee: SCM Corporation
    Inventor: Phillip M. Owens
  • Patent number: 4474685
    Abstract: High shielding efficiencies to emissions of electromagnetic interference are achieved with molding compositions comprised of thermosetting resins and a multi-component electroconductive filler system. Compounds having a combination of at least two conductive fillers provide shielding efficiencies of 30 dB of attenuation or more to electromagnetic emissions over a frequency range of 0.5 to 1000 Mhz without adversely affecting mechanical properties and processing capabilities.
    Type: Grant
    Filed: March 29, 1982
    Date of Patent: October 2, 1984
    Assignee: Occidental Chemical Corporation
    Inventor: Myron C. Annis
  • Patent number: H601
    Abstract: An asbestos-free intumescent thermal protection coating consisting essently of from 0.5 to 1.5 weight percent of a ceramic fiber that comprises from 40 to 50 weight percent of Al.sub.2 O.sub.3, 50 to 60 weight percent of SiO.sub.2, from 0.5 to 1 weight percent of Fe.sub.2 O.sub.3, and from 1.2 to 2 weight percent of TiO.sub.2, the fiber having the dimensions of less than 3.2 millimeters in length and from 0.8 to 1.2 micrometers in diameter and from 98.5 to 99.5 weight percent of a polysulfide-epoxide binder. The binder may include a filler.
    Type: Grant
    Filed: December 17, 1987
    Date of Patent: March 7, 1989
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Lloyd C. Carlton, Julie A. Finnegan