Abstract: A double coating, curing method, cured coating, and kit are provided. A first layer of the double coating can be a first cure coating composition, which has a first hydroxy-functional resin, a first crosslinking agent, and a non-polar catalyst. A second layer of a second cure coating composition can have a second hydroxy-functional resin, a second crosslinking agent, and a polar catalyst. The non-polar catalyst catalyzes crosslinking between the second hydroxy-functional resin and crosslinking agent, and not between the first hydroxy-functional resin and crosslinking agent. The polar catalyst catalyzes crosslinking between the first hydroxy-functional resin and crosslinking agent, and not between the second hydroxy-functional resin and crosslinking agent. The polarity of the catalysts can facilitate catalyst migration from one layer to the other. The separate compositions can be shelf-stable and/or the curing can occur at low temperature.

Abstract: A reactive hot-melt adhesive composition that is moisture curable contains: a urethane prepolymer having an isocyanate group, a (meth)acrylic resin, and an adhesion promoter containing at least an isocyanate group-containing (meth)acrylamide compound.

Abstract: Described is a polyurethane wire enamel composed of at least one blocked polyisocyanate adduct, blocked with alkylphenols, at least one hydroxy polyester comprising ester and/or imide and/or amide groups, at least one hydrocarbon-based organic solvent, and further auxiliaries and additives.

Abstract: Composite compositions and machine and contact tools, for example, metal boring tools and face mills that are manufactured from them. The tools are provided with composite structure to lighten the tools and yet retain the strength and durability of the tool. The novelty resides in the use of additives to certain composites that make up a portion of the tool, especially tool bars.

Abstract: The present invention provides an epoxy resin adhesive composition and a perforated floor panel for a clean room including the same. The epoxy resin adhesive composition is a two-component epoxy resin adhesive composition comprising a main material including graphite having conductivity and a curing agent including a amide compound, wherein the main material and the curing agent are mixed at a weight ratio of 2:1. When this epoxy resin adhesive composition is disposed between a base panel and a resin tile constituting the perforated floor panel for a clean room, the adhesion between the base panel and the resin tile becomes high, heat is easily discharged to the outside by graphite, and the generation of static electricity can be reduced.

Abstract: Epoxy resin compositions that include an epoxy resin component that includes at least one epoxy resin and a solvent blend that includes methyl ethyl ketone and glycol methyl ether acetate are provided. The compositions are well-suited for use in the fabrication of prepregs and composite electrical laminates made therefrom.

Abstract: Provided are an adhesive film and an organic electronic device (OED) encapsulation product using the same. As moisture resistance is maintained by preventing traveling of moisture in a matrix resin, moisture or oxygen input to the organic electronic device from an external environment may be effectively prevented, and temporal stability, life span and durability may be enhanced even when a panel of the organic electronic device is formed as a thin film, thereby ensuring long-term reliability.

Abstract: The present invention provides a resin composition comprising: 1 to 20 parts by weight of a reinforcing fiber; 0.2 to 5 parts by weight of an anti-settling agent; 20 to 40 parts by weight of an epoxy resin; 0.1 to 3 parts by weight of a curing agent; and 50 to 75 parts by weight of a high dielectric constant filler. The present invention further provides a dielectric layer produced from the resin composition and a capacitor comprising the dielectric layer. In the dielectric layer made from the resin composition provided by the present invention, the fibers can be evenly dispersed and can enhance the mechanical strength of the resin composition, and cooperate with the epoxy resin to bring excellent toughness. Therefore, the mechanical strength of the produced dielectric layer can be remarkably improved, and its fragility can be effectively overcome when the dielectric layer is used in the PCB double-side etching process.

Abstract: A clear coat coating composition with a resin solids content comprising a hydroxyl-functional binder component and a crosslinker component, wherein the hydroxyl-functional binder component comprises at least one hydroxyl-functional urethane component comprising at least one aliphatic polyether polyol having —OCH2CnF2n+1 groups with n=1 or 2 as a building block, and wherein said —OCH2CnF2n+1 groups provide the clear coat coating composition with a fluorine content of 0.1 to 3 wt. %, calculated on the resin solids content of the clear coat coating composition.

Abstract: A coating composition, in particular a clear coat coating composition, with a resin solids content comprising a cross-linkable binder component having functional groups with active hydrogen and a cross-linker component, wherein the cross-linker component comprises at least one isocyanate-functional urethane component comprising at least one aliphatic polyether polyol having —OCH2CnF2n+1 groups with n=1 or 2 as a building block, and wherein said —OCH2CnF2n+1 groups provide the clear coat coating composition with a fluorine content of 0.1 to 3 weight %, calculated on the resin solids content of the coating composition.

Abstract: A thermosetting adhesive is configured to include a photoradical generator which generates radicals from irradiation of active energy rays in a thermosetting insulating adhesive component. In a repair method when this thermosetting adhesive is used, a cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays from the substrate side or the electronic component side prior to separating the electronic component from the substrate, and the cured matter is removed using such solvent. Alternatively, the cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays after the electronic component has been separated from the substrate, and the cured matter is removed using such solvent.

Abstract: Methods of forming microelectronic packaging structures and associated structures formed thereby are described. Those methods and structures may include forming a wafer level underfill (WLUF) material comprising a resin material, and adding at least one of a UV absorber, a sterically hindered amine light stabilizer (HALS), an organic surface protectant (OSP), and a fluxing agent to form the WLUF material. The WLUF is then applied to a top surface of a wafer comprising a plurality of die.

Abstract: The present invention is directed to anti-corrosion coatings. It is particularly directed to coatings comprising a monomer, such as pyrrole, aniline, thiophene, or their analogs, and a resin. These coatings can be used with substrates such as cold-rolled steel and other metals to inhibit surface oxidation.

Abstract: An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25° C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70° C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts.

Abstract: The present invention relates to a fluorine-containing polymer comprising a structure represented by the following general formula (I), as well as the preparation process and use thereof. According to the technical solution of the invention, a novel fluorine-containing polymer with a larger molecular weight and an aromatic side group is obtained through a simple reaction, and it can be used as a non-ionic fluorine carbon surfactant, and especially, is applicable to the preparation of a pigment dispersion. Additionally, the invention further relates to a pigment dispersion and the preparation process thereof.

Abstract: A method for producing a rubber composition which gives a cross-linked rubber which has a low volume resistivity value, which is low in hardness, and which is kept down in contamination of the photoconductor when used as a conductive member is provided, that is, a production method of a rubber composition comprising a step of mixing a polyether rubber which is dissolved in a solvent at 0.1 to 30 wt % of concentration and a liquid ethylenically unsaturated nitrile-conjugated diene copolymer rubber in a solution is provided.

Abstract: Disclosed is a polyamideimide-based film coating composition free from any restricted substance or a substance which might possibly be a restricted one such as N-methyl pyrrolidone and N-ethyl pyrrolidone and capable of replacing a conventional coating composition using a solvent such as N-methyl pyrrolidone. The polyamideimide-based film coating composition of the present invention is a polyamideimide-based film coating composition comprising a polyamideimide resin and a solvent, the polyamideimide resin being dissolved as a binder in the solvent, wherein the solvent contains ?-butyrolactone and cyclopentanone, and a volume of ?-butyrolactone is 50% by volume or more compared to a total volume of ?-butyrolactone and cyclopentanone.

Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition including a liquid crystal oligomer having a low coefficient of thermal expansion and an improved glass transition temperature, and the like.

Abstract: A pigment dispersion and a method for preparing the same are provided. The pigment dispersion comprises the following components in the following mass percentage: 10%˜20% pigment, 1.5%˜12% dispersant, 0.75%˜7.5% binder resin, 58.5%˜87.3% solvent and 0.45%˜2% nonionic surfactant, based on the total mass of the pigment dispersion. The pigment dispersion is improved in stability, and is applicable to a colored filter.

Abstract: The invention relates to thermosetting compositions containing isocyanurate ring(s) prepared through chain extension of an epoxy resin (a) with carboxyl-functional oligomers (b), which are the reaction product of polyols (i) containing one or more isocyanurate ring(s) and polycarboxylic acids or their anhydrides (ii). The polyols (i) containing one or more isocyanurate ring(s) can be prepared from the reactions of tris (2-hydroxyalkyl) isocyanurates with a modifier from a caprolactone or alkylene oxide, or glycidyl ester or glycidyl ether and mixtures thereof. The epoxy-functional thermosetting compositions containing an isocyanurate ring(s) can be further reacted with unsaturated acids, preferably (meth)acrylic acid, to obtain a curable polyacrylate. Both epoxy-functional isocyanurate and acrylate-functional isocyanurate thermosetting compositions can be further modified with a polyisocyanate to produce a composition that is useful as a reactive adhesive, binder or in other applications.

Abstract: The present invention relates to an organic-inorganic hybrid paint composition comprising (a) an organic resin comprising an acrylic resin, a melamine resin and an epoxy resin; (b) a ceramic resin; and (c) a solvent. The paint composition of the present invention may be easily cured without a curing accelerator unlike conventional paint compositions, and it may form a paint film having generally improved properties of surface hardness and scratch resistance, as well as gloss, adhesion, boil resistance, chemical resistance, and the like.

Abstract: This invention provides a polymer that is useful in a variety of applications, including as a binder polymer of a coating composition, and especially a packaging coating composition. Packaging articles (e.g., containers) comprising the polymer and methods of making such packaging articles are also provided.

Abstract: The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, R1 to R6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond ? electrons and is capable of coordinating with a metal.

Abstract: The present invention discloses both amine compositions and amine-epoxy compositions containing N,N?-dimethyl-meta-xylylenediamine. A novel process for producing amines such as N,N?-dimethyl-meta-xylylenediamine, and structurally similar amines, is also disclosed.

Abstract: The invention relates to thermosetting compositions containing isocyanurate ring(s) prepared through chain extension of an epoxy resin (a) with carboxyl-functional oligomers (b), which are the reaction product of polyols (i) containing one or more isocyanurate ring(s) and polycarboxylic acids or their anhydrides (ii). The polyols (i) containing one or more isocyanurate ring(s) can be prepared from the reactions of tris (2-hydroxyalkyl) isocyanurates with a modifier from a caprolactone or alkylene oxide, or glycidyl ester or glycidyl ether and mixtures thereof. The epoxy-functional thermosetting compositions containing an isocyanurate ring(s) can be further reacted with unsaturated acids, preferably (meth)acrylic acid, to obtain a curable polyacrylate. Both epoxy-functional isocyanurate and acrylate-functional isocyanurate thermosetting compositions can be further modified with a polyisocyanate to produce a composition that is useful as a reactive adhesive, binder or in other applications.

Abstract: The invention relates to a glass printing ink and a glass printing lacquer comprising at least one pigment, at least one photoinitiator and at least two resins. One resin is an epoxy resin having an average molecular weight based on bisphenol A, diluted in a UV hardening monomer. Another resin is a resin which contains free functional amino, hydroxy, epoxy, acid, acid anhydride and/or acrylate groups. The invention also relates to the use of the glass printing ink and glass printing lacquer when printing a glass substrate and to a method for printing a glass substrate.

Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.

Abstract: A thermosetting adhesive is configured to include a photoradical generator which generates radicals from irradiation of active energy rays in a thermosetting insulating adhesive component. In a repair method when this thermosetting adhesive is used, a cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays from the substrate side or the electronic component side prior to separating the electronic component from the substrate, and the cured matter is removed using such solvent. Alternatively, the cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays after the electronic component has been separated from the substrate, and the cured matter is removed using such solvent.

Abstract: The disclosure provides microstructured articles and methods useful for detecting an analyte in a sample. The articles include microwell arrays.

Abstract: The present invention deals with a novel curable epoxy composition comprising an aromatic di-isoimide chemical compound. The di-isoimide serves effectively as a thermally activated latent catalyst in epoxy curing, thereby increasing shelf life, and avoids premature cross-linking. Novel laminated articles and printed wiring boards, including encapsulated printed wiring boards are also disclosed.

Abstract: An adhesive adapted to enable spray delivery and seamless polymerization during epoxy resin vacuum infusion techniques.

Abstract: There is provided a composition for forming a resist underlayer film for electron beam or EUV lithography that is used in a device manufacture process using EUV lithography, reduces the adverse effects caused by an electron beam or EUV, and is effective for the formation of a good resist pattern and a resist pattern formation method using the composition for forming a resist underlayer film for lithography. A composition for forming a resist underlayer film for electron beam or EUV lithography, comprising: a polymer having a repeating unit structure of Formula (1): [where Q is a group of Formula (2) or Formula (3): {where Q1 is a C1-10 alkylene group, a phenylene group, a naphthylene group, or an anthrylene group, X1 is a group of Formula (4), Formula (5), or Formula (6): and a solvent.

Abstract: The invention provides an adhesive comprising structurally modified, pyrogenically prepared silicas containing on their surface organosilane groups of the formula (I) SiCnH(2n+1), where n is 2 to 18. The invention further provides for the use of these structurally modified, pyrogenically prepared silicas in adhesives.

Abstract: A vinyl chloride-based resin latex which froths little when unreacted monomer remaining in the latex are recovered under heat and reduced-pressure conditions, and a thermal transfer image-receiving sheet which has satisfactory water resistance, does not yellow during storage, and gives images having excellent durability and light resistance. The invention provides a vinyl chloride-based resin latex contains a copolymer containing a vinyl chloride and an epoxy-group-containing vinyl or contains vinyl chloride, an epoxy-group-containing vinyl, and a carboxylic acid vinyl ester, wherein a content of the epoxy-group-containing vinyl is 0.1% by weight or more but less than 3% by weight, and wherein the latex contains no surfactant, and has a solid concentration of 25% by weight or more; a process for producing the latex; and a thermal transfer image-receiving sheet obtained using the latex.

Abstract: The present disclosure relates to a seamless model free of bond lines made by a method which includes the steps of providing a substructure having an exposed outer surface, applying a modeling paste to the outer surface of the substructure in the form of a continuous layer, curing the continuous layer of applied modeling paste, and machining said cured layer of modeling paste to the desired contour to form the seamless model. The modeling paste may be a mechanically frothed syntactic foam prepared by injecting inert gas with mechanical stirring into either a formed froth-forming polyurethane or epoxy composition containing mieroballoons.

Abstract: The present invention provides epoxy curing agent compositions comprising alkylated aminopropylated alkylenediamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.

Abstract: Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1) below, while satisfying the condition 1 below. This epoxy resin is excellent in workability during production of a composition and is easy to control quality. Condition 1: The following relation (?) is satisfied with A being the hydroxyl equivalent (as measured in accordance with JIS K 0070) of a phenol-modified epoxy resin obtained by adding an equivalent molar amount of phenol relative to the epoxy equivalent of the epoxy resin, and B being the epoxy equivalent of the epoxy resin. 50?1000×(A?B)/B?250 (?).

Abstract: A thermosetting resin composition which includes an epoxy-containing component and a curing agent component containing a cyclohexanetricarboxylic anhydride. The cured product of the thermosetting resin composition is excellent in surface hardness, solvent resistance, transparency, and adhesion to substrate, and is useful as a surface protection layer of the substrate.

Abstract: A curing agent for epoxy resin, and a coating composition using the curing agent curing agent that delivers excellent recoatability and overcoatability after a long time exposure. (A) An epoxy curing agent that is derived by adduction between amide-type reactants from polyamine compounds comprising from 25-75 mol % of a polyoxyalkylene-polyamine and carboxylic acids or a mixture thereof and glycidyl ether compound; (B) An epoxy curing agent of the mixture of (B1) amide-type reactants prepared through polyoxyalkylene-polyamine and carboxylic acids or a mixture thereof, and (B2) a reactant is derived by adduction between other aliphatic polyamines or a mixture thereof and glycidyl ether compound. Coating composition comprising the epoxy curing agent of the above described A or B.

Abstract: Bonding compositions are provided herein for bonding a curable fluoroelastomer composition, and preferably a perfluoroelastomer composition, to a substrate during a heat curing process. The compositions include (a) a compound selected from the group consisting of aluminum acrylates, silicon acrylates, ammonia acrylates, and combinations thereof, (b) an adhesive compound; and (c) a solvent. Methods of bonding fluoro- and perfluoroelastomers to a substrate surface are also including herein which utilize the bonding compositions.

Abstract: A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant, and a solvent. A halogen-free prepreg is also provided, including a glass fabric cloth and a halogen-free resin layer on the glass fabric. The halogen-free resin layer is made from the foregoing halogen-free resin.

Abstract: Disclosed is a polyamideimide-based film coating composition free from any restricted substance or a substance which might possibly be a restricted one such as N-methyl pyrrolidone and N-ethyl pyrrolidone and capable of replacing a conventional coating composition using a solvent such as N-methyl pyrrolidone. The polyamideimide-based film coating composition of the present invention is a polyamideimide-based film coating composition comprising a polyamideimide resin and a solvent, the polyamideimide resin being dissolved as a binder in the solvent, wherein the solvent contains ?-butyrolactone and cyclopentanone, and a volume of ?-butyrolactone is 50% by volume or more compared to a total volume of ?-butyrolactone and cyclopentanone.

Abstract: The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, in which the film for flip chip type semiconductor back surface before thermal curing has, at the thermal curing thereof, a volume contraction ratio within a range of 23° C. to 165° C. of 100 ppm/° C. to 400 ppm/° C.

Abstract: The present invention provides a liquid curable epoxy resin composition that has excellent storage stability and curing properties and provides a cured product having excellent properties, particularly, excellent organic solvent resistance. For that purpose, a clathrate containing a carboxylic acid compound and at least one selected from the group consisting of an imidazole compound represented by formula (I), wherein R1 to R4 each represent a hydrogen atom or the like, and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU) is mixed in an epoxy resin. The liquid curable epoxy resin composition uses a liquid epoxy resin or an organic solvent.

Abstract: A composition comprising: a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, wherein the composition is prepared from a halogen-containing compound is disclosed.

Abstract: A method comprising (a) mixing a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, into a dispersant to provide a dispersion; and (b) adding the dispersion to a varnish, is disclosed.

Abstract: A process comprising: contacting a) an epoxy resin; b) a compound selected from the group consisting of a phenol-containing compound, an isocyanate-containing compound, and mixtures thereof and c) a stabilizer comprising a metal-containing compound, said metal-containing compound comprising a metal selected from the Group 11-13 metals and combinations thereof; in the presence of a catalyst in an advancement reaction zone under advancement reaction conditions to produce an advancement reaction product is disclosed.

Abstract: A resin composition for a pre-coated steel sheet having good processibility, heat resistance, and corrosion resistance, and a pre-coated steel sheet fabricated by using the resin composition are disclosed. The resin composition includes a 10 to 40 parts by weight of a hardener comprising end-capped blocked polyisocyanate and a melamine resin by 2:1 to 3:1 by parts by weight and 0. 1 to 10 parts by weight of organized layered nano-clay, based on a 100 parts by weight of a base resin. The pre-coated steel sheet obtained by the method exhibits good processibility, heat resistance, and corrosion resistance.

Abstract: A resin composition is provided which allows improvement of the ultraviolet laser processability of the resin and can be not only used as an electronic material for an insulating film of a build-up board and the like but also used to form a circuit board whose electrical insulating property does not deteriorate. A multilayer resin film employing the resin composition is provided. A resin composition is provided which contains a thermosetting resin (A), a curing agent (B), a silica (C), an ultraviolet absorber (D), and a solvent (E) and in which: the content of the ultraviolet absorber (D) is from 0.5 to 50 parts by weight per the total amount of the thermosetting resin (A), the curing agent (B), and the ultraviolet absorber (D); and the blending amount of the solvent (E) is from 20 to 500 parts by weight per 100 parts by weight of the total amount of the thermosetting resin (A) and the curing agent (B).

Abstract: The present invention provides a resin composition for printed wiring board to be used for electronic devices in which operating frequency exceeds 1 GHz, and a varnish, a prepreg and a metal clad laminated board using the same. One invention of the present invention is a resin composition for printed wiring board containing a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and a varnish, a prepreg and a metal clad laminated board using the same.