Abstract: A fiber reinforced thermoplastic resin molded article contains inorganic fibers (A), organic fibers (B), and a thermoplastic resin (C), the fiber reinforced thermoplastic resin molded article containing 5 to 45 parts by weight of the inorganic fibers (A), 1 to 45 parts by weight of the organic fibers (B), and 10 to 94 parts by weight of the thermoplastic resin (C), based on 100 parts by weight of the total of the inorganic fibers (A), the organic fibers (B), and the thermoplastic resin (C), the inorganic fibers (A) in the fiber reinforced thermoplastic resin molded article having a weight average fiber length (Lwa) of 0.01 mm or more and 3 mm or less, the organic fibers (B) having a weight average fiber length (Lwb) of more than 4 mm and 20 mm or less.

Abstract: (A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 ?m. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150° C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C.

Abstract: The invention relates to a curing agent composition for an epoxy resin compound for the chemical fastening of construction elements, to an epoxy resin compound, and to a multi-component epoxy resin system. The invention further relates to a method for the chemical fastening of construction elements in boreholes. The invention also relates to the use of a salt (S) as an accelerator in an epoxy resin compound for chemical fastening, the epoxy resin compound comprising 3-aminomethyl-3,5,5-trimethylcyclohexane and at least one further cycloaliphatic amine which is reactive to epoxy groups.

Abstract: The present invention relates to a low friction polymerizable composition, a prepolymer thereof, and a friction component material prepared using the same, and the low friction polymerizable composition according to the present invention includes a curing agent and a filler together with a phthalonitrile compound, and thus has an excellent low friction property as well as high heat resistance and excellent processability.

Abstract: The present invention provides an epoxy resin composition that serves to produce a cured epoxy resin that simultaneously realizes a high heat resistance, a high elastic modulus, and a low color and to produce a molded article having a good appearance without suffering the formation of white spots on the surface thereof when used as matrix resin in a fiber reinforced composite material. The epoxy resin composition includes an epoxy resin as component [A], an aromatic urea [B1] and/or an imidazole compound [B2] as component [B], and a borate ester compound as component [C], containing dicyandiamide in the amount of 0.5 part by mass or less relative to the total quantity of epoxy resins which accounts for 100 parts by mass, wherein the epoxy resin composition meets certain sets of further requirements with respect to its composition.

Abstract: The invention relates to a fiber reinforced polymer composite material and a preparation method thereof, wherein the fiber reinforced polymer composite material comprises a polymeric resin matrix in a continuous phase, and chemical fiber fabric and reinforced fibers dispersed in the polymeric resin matrix, and the chemical fiber fabric covers the reinforced fibers so as to avoid exposure of the reinforced fibers to an outside surface of the composite material. The invention reduces or even avoids exposure of the reinforced fibers of the fiber reinforced polymer composite material, and can be used for manufacturing cable bridges, frames of doors, windows and curtain walls, etc. The method for preparing the fiber reinforced polymer composite material of the invention effectively improves the performance of the composite material and also reduces the cost of surface treatment and increases production efficiency.

Abstract: An information handling system includes an organic light emitting diode layer, an optically clear adhesive layer, and a flexible glass substrate. A surface film includes a self-healing polymer layer, the self-healing polymer layer including a self-healing polymer.

Abstract: The present invention discloses a two-dimensional nanomaterial dispersant, a preparation method of a two-dimensional nanomaterial by liquid phase exfoliation, and use thereof.

Abstract: According to an embodiment of the present invention, there is provided a method of preparing a copolymer which includes (a) polymerizing an aromatic vinyl monomer and a conjugated diene-based monomer in the presence of a solvent, a first randomizing agent, and a catalyst to prepare a first copolymer including the aromatic vinyl monomer in an amount of 15 to 40 wt %; and (b) reacting the first copolymer with one or more of a second randomizing agent different from the first randomizing agent and an additional aromatic vinyl monomer to prepare a second copolymer.

Abstract: A latex product composition that includes an anionically-stabilized latex and one or more water soluble, polymers or polymeric adducts that have a backbone with a plurality of amine functional groups and hydroxyl functional groups. The polymers or polymeric adducts may be an addition product formed from at least one multifunctional amine compound reacted with one or more polyfunctional epoxy compounds, one or more monofunctional epoxy compounds, or a combination thereof. The amine compound and the one or more epoxy compounds are reacted to form polymers or polymeric adducts with the molar equivalent ratio of 1.3 to 3.8 amine functional group per epoxy functional group. The addition product may be present in about 0.1 to 15.0 wt. % and the at least one volatile base compound is present in about 1.0 wt. % to 10.0 wt. % based on the weight of the particles present in the anionically-stabilized latex.

Abstract: Pre-impregnated composite material (prepreg) that can be cured/molded to form aerospace composite parts. The prepreg includes carbon reinforcing fibers and an uncured resin matrix. The resin matrix includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and optionally a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component.

Abstract: A curing agent for curing an epoxy resin comprises a fluorinated central moiety covalently bonded to first and second imide-amine moieties, the first and second imide-amine moieties include amine terminal functional groups, wherein the amine functional groups of the curing agent, when applied to the epoxy resin, take part in curing reactions with ring molecules of the epoxy resin.

Abstract: Pre-impregnated composite material (prepreg) is provided that can be cured/molded to form composite parts having high levels of compressive strength under dry conditions at room temperature and which retain their compressive strength when subjected to hot and wet conditions. The pre-impregnated composite materials are composed of reinforcing fibers and an uncured resin matrix. The uncured resin matrix includes a resin component made up of one or more difunctional epoxy resins and multifunctional epoxy resins. The uncured resin matrix further includes a thermoplastic particle component, a thermoplastic toughening agent and a curing agent. The thermoplastic particle component is composed of a mixture of a first group of polyamide particles that do not contain crosslinked polyamide and a second group of polyamide particles that contain crosslinked polyamide.

Abstract: A method for forming a halogen-free curable composition containing a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.

Abstract: The present invention relates to a polyarylene sulfide resin composition having excellent impact resistance in which a polyarylene sulfide resin having a specific end group, an epoxy-containing olefin-based elastomer, and/or an organic or inorganic filler are included, and a preparation method thereof.

Abstract: A morphing skin for an air vehicle structure, the skin being formed by a composite material which includes: a multiplicity of fibres, a matrix incorporating the fibres, and a thermo-sensitive material, such as a thermo-plastic. The thermo-sensitive material can be reversibly transitionable in response to a change in temperature, between (i) an ambient temperature mode in which the thermo-sensitive material is capable of transferring loads in the composite material, and (ii) a heated mode in which the ability of the thermo-sensitive material to transfer the loads is reduced. This can allow the stiffness of the skin to be temporarily reduced to enable the skin to be morphed into a different shape.

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, and an insulating film, a prepreg, a copper clad laminate, or a printed circuit board manufactured by using the same. More specifically, the insulating resin composition contains an eucryptite inorganic filler having a negative coefficient of thermal expansion, such that a glass transition temperature and a coefficient of thermal expansion may be improved, and warpage of the insulating film, the prepreg, the copper clad laminate, or the printed circuit board manufactured by using the insulating resin composition for a printed circuit board may be minimized.

Abstract: The present invention relates to a process for the production of a ready-to-use epoxy composition having a filler content of at least 55 vol.-%, relative to the complete ready-to-use epoxy composition, which comprises: providing a liquid A, which comprises at least one epoxy resin, providing a liquid B, which comprises at least one curing agent, providing a solid component C, which comprises at least one filler, wherein in a first step one of the liquids A or B is filled in a mixing container, in a second step the solid component C is deposited on top of the liquid in the mixing container, in a third step the remaining liquid A or B is deposited on top of the solid component C, and in a fourth step the components are mixed to obtain the ready-to-use epoxy composition.

Abstract: Provided is an epoxy-amine adduct that offers high reactivity, contributes to better adhesion between a resin and a reinforcing fiber in a fiber-reinforced composite material, and can be easily blended with another component such as a resin. The epoxy-amine adduct has two or more amino groups per molecule and is obtained by a reaction of an epoxy compound (A) having two or more alicyclic epoxy groups per molecule with an amine compound (B) having two or more amino groups per molecule.

Abstract: A manufacturing method of artificial graphite sheet and a product thereof. The artificial graphite sheet manufactured by means of the manufacturing method can be rolled up to minimize the occupied space and facilitate transfer and delivery. The manufacturing method includes steps of: selecting graphite powder (granules) and polymer and mixing the graphite powder with polymer; heating, compounding and homogenizing the mixture to form a graphite (mixture) subassembly with a basic thickness; calendering the graphite subassembly to form a graphite (mixture) sheet assembly with a purposed thickness; thermostatically maturing the graphite sheet assembly and gradually cooling the graphite sheet assembly to room temperature to form a flexible sheet body; and rolling up the flexible sheet body into a roll form with a rolling apparatus. The manufacturing equipment and process of the artificial graphite sheet are simplified and the manufacturing time is shortened.

Abstract: Method embodiments for producing a fiber-reinforced epoxy composite comprise providing a mold defining a shape for a composite, applying a fiber reinforcement over the mold, covering the mold and fiber reinforcement thereon in a vacuum enclosure, performing a vacuum on the vacuum enclosure to produce a pressure gradient, insulating at least a portion of the vacuum enclosure with thermal insulation, infusing the fiber reinforcement with a reactive mixture of uncured epoxy resin and curing agent under vacuum conditions, wherein the reactive mixture of uncured epoxy resin and curing agent generates exothermic heat, and producing the fiber-reinforced epoxy composite having a glass transition temperature of at least about 100° C.

Abstract: The present disclosure provides a liquid curing agent composition comprising at least 50% by weight of a polyamine and 0.2% to 10% by weight of dicyandiamide, the amine/epoxy composition and the product from the cured amine/epoxy composition.

Abstract: There is provided a liquid composition that can form a resistor exhibiting a stable resistance value. One mode of the liquid composition of the invention is a liquid composition comprising (a) an epoxy resin, (b) carbon black particles, (c) carbon nanotubes and (d) a solvent with a vapor pressure of less than 1.34×103 Pa at 25° C.

Abstract: A roll cover is produced, in particular for use in a machine for producing and/or processing a fibrous web such as a web of paper or cardboard. The roll cover includes least one layer of a resin matrix that is filled with at least one particulate filler. The filler particles are produced in a polymer component of the resin matrix and/or introduced into the resin matrix from a dispersion via matrix exchange.

Abstract: A composite material is disclosed for use in a high-voltage device having a high-voltage electrical conductor, the material containing a polymeric matrix and at least one fiber embedded in the polymeric matrix, the fibers having an average diameter of less than about 500 nm.

Abstract: A process for the preparation of a prepreg comprising superimposing layer of unidirectional fibrous reinforcement comprising a plurality of tows each comprising a plurality of parallel filaments onto a resin impregnated layer of unidirectional fibrous reinforcement comprising a plurality of tows each comprising a plurality of parallel filaments wherein the superimposed laminate of layers is compressed to the extent that the resin penetrates the interstices between the tows but penetrates the voids within the tows to less than 22 to 60% by volume of the tows.

Abstract: Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness (preferably, further having excellent reflow heat resistance). The photosensitive resin composition includes components (A), (C), and (D) and preferably further includes a component (B) as follows: (A) a cationically polymerizable compound at least including a compound containing an alicyclic epoxy group and devoid of ester bonds; (B) a hydroxyl-containing compound having a molecular weight of 500 or more; (C) a photo-cationic polymerization initiator; and (D) a light-shielding material.

Abstract: A method for dispersing a filler having high agglomerating properties in a resin and a micro-dispersing mixer used in the method are provided. Further, a method for producing a sealing material that can avoid a defect caused by agglomerates of a filler (for example, carbon black) in an electronic material such as a semiconductor package, a masterbatch resin produced by the method, and a micro-dispersing mixer used in the method are provided. When a filler is dispersed in a molten resin composition to produce a filler-dispersed molten resin composition, a resin composition containing filler aggregates and a molten resin composition is preliminarily mixed by a mixing means, and, thereafter, the preliminarily mixed mixture is allowed to pass through the micro-dispersing mixer with a fine flow path to disperse the filler in a filler resin composition.

Abstract: Polyamide-filled acrylate copolymer compositions comprising a continuous acrylate copolymer phase and a discontinuous polyamide phase are produced by a melt mixing process. When crosslinked with diamine curatives the polyamide-filled acrylate copolymer compositions exhibit enhanced resistance to heat aging compared to carbon black-reinforced acrylate copolymer compositions.

Abstract: The invention relates to a heat compression molding process for the manufacturing of composite material articles, the process comprising the steps of i) providing a mold (20) in which the negative shape (31, 32) of an article (30) to be manufactured is formed; ii) inserting into said mold (20) an SMC semi-finished product (10) comprising one or more sheets of composite material comprising a matrix of a heat-hardening resin and carbon fibers, the mold being pre-heated at a temperature suitable to allow the cure of said heat-hardening resin; iii) closing the mold (20) and carrying out a compression cycle in an autoclave according to a pre-defined time-pressure law; and iv) extracting the article (30), wherein the amount of SMC semi-finished product (10) inserted in the mold (20) is calculated by weighing on the basis of the volume of the article (30) to be manufactured.

Abstract: The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity at low temperature and which produces a cured product having excellent mechanical strength, and also provides a cured product thereof, a fiber-reinforced composite material, a fiber-reinforced resin molding having excellent heat resistance, and a process for producing a fiber-reinforced resin molding with good productivity. A resin composition for a fiber-reinforced composite material contains, as essential components, an epoxy resin (A), an acid group-containing radical polymerizable monomer (B), a radical polymerization initiator (C), and an amine-based curing agent (D) for an epoxy resin, and has a viscosity of 500 mPa·s or less at 50° C. measured with an E-type viscometer. The composition is impregnated into reinforcing fibers and cured.

Abstract: A rubber composition which can be used in particular in tires, based on at least one diene elastomer, one reinforcing filler, one crosslinking system, between 1 and 20 phr of an epoxide resin and between 1 and 15 phr of an amine-comprising curing agent. The pair formed of epoxide resin with an amine-comprising curing agent advantageously replaces the pair formed of phenollformaldehyde resin, which is a methylene acceptor, with the curing agent(s) HMT or H3M, which are conventional methylene donors. The use of this pair of reactants, epoxide resin and amine-comprising curing agent, makes it possible to obtain rubber compositions exhibiting a greater low-strain stiffness in comparison with conventional rubber compositions, without significantly damaging the hysteresis. Moreover, the combination of a phenolic resin, which is a methylene acceptor, with HMT or H3M, which is a methylene donor, produces formaldehyde during the vulcanization of the rubber composition.

Abstract: Multi-pack curable composition comprising: a first pack comprising a blend of (i) an epoxy resin, (ii) an unsaturated polyester or vinyl ester resin, and optionally (iii) a peroxyester, a second pack comprising an amine curing agent for the epoxy resin and at least one transition metal compound selected from iron, copper, and manganese compounds, and at least when the first pack does not contain a peroxyester, a third pack comprising a peroxide.

Abstract: The invention provides a method for preparing an epoxy based coating composition. The method includes preparing a first dispersion including one or more colorants, one or more fillers and an epoxy based paint work material dispersed in a first portion of one or more solvents. The first dispersion is prepared by dispersing the one or more colorants and the one or more fillers in the epoxy based paint work material dispersed in the first portion of the one or more solvents. The method further includes preparing a second dispersion including one or more types of carbon nanotubes, a second portion of the one or more solvents and a hardener. The second dispersion is prepared by dispersing the one or more types of carbon nanotubes and the second portion of the one or more solvents in the hardener. Additionally, the method includes mechanically mixing the first dispersion and the second dispersion.

Abstract: The invention relates to the use of alkyl or dialkyl-semicarbazone as a hardener for hardening epoxy resin and to a method for controlling the hardening of epoxy resin and epoxy resin compounds.

Abstract: A resin composition for encapsulation, which contains 100 parts by weight of a synthetic resin, 10 to 500 parts by weight of a carbon precursor having a volume resistivity of 102 to 1010 ?·cm, 0 to 60 parts by weight of a conductive filler having a volume resistivity lower than 102 ?·cm and 100 to 1,500 parts by weight of an other inorganic filler.

Abstract: Disclosed herein are adhesive compositions comprising (a) a first component; (b) a second component that chemically reacts with said first component; and (c) graphenic carbon particles having an oxygen content of no more than 2 atomic weight percent. Disclosed herein are associated methods for forming the adhesive compositions and applying the adhesive compositions to a substrate to form a bonded substrate.

Abstract: A two-pack type epoxy resin composition for fiber-reinforced composite materials includes components [A] to [D], with component [D] being a liquid at room temperature or a solid having a melting point of 130° C. or less: [A] an epoxy resin; [B] an acid anhydride; [C] a compound that has an average of 2.5 or more hydroxyphenyl structures in each molecule; and [D] an organic phosphorus compound or imidazole derivative.

Abstract: The present invention provides a dual-cure composition containing multifunctional polyols, uretidiones, peroxide curable monomers containing unsaturation and crosslinking agents. The dual-cure composition may be used to form a high modulus material useful as the matrix in a prepreg material and in composites. The present invention also relates to methods for the production of the dual-cure composition, prepreg materials comprising the dual-cure composition and a fibrous support, and composites made from the prepreg material.

Abstract: The present invention pertains to a prepreg containing reinforcing fibers and an epoxy resin composition. Said prepreg is sandwiched between dies preheated to 140.degree.C and pressurized to MPa and held for five minutes at this temperature to obtain a cured article having a G?Tg of at least 150.degree.C. The present invention also pertains to a fiber-reinforced composite material and a method for producing same. According to this invention, it is possible to provide a prepreg which is well suited to press-molding, particularly to high-cycle press-molding. It is also possible to provide a fiber-reinforced composite material which can be heat-cured at a lower temperature and over a shorter time than conventional methods, with which it is possible to minimize excessive flow of resin in hot-press curing, and which is resistant to performance defects such as fiber meandering and defects in surface appearance. A method for producing the same can also be provided.

Abstract: The present invention provides: a carbon fiber sizing agent that can obtain a carbon fiber bundle having a superior effect of improving mechanical properties when composited using a resin; an aqueous dispersion thereof; a carbon fiber bundle; a sheet-shaped article having a carbon fiber bundle; and a composite material. The carbon fiber sizing agent contains: a compound (A) that is an ester of an unsaturated monobasic acid and an epoxy compound having a plurality of epoxy groups in the molecule, and that has at least one epoxy group in the molecule; a urethane acrylate oligomer (B) that is bifunctional and that has a tensile elongation rate of the cured product of at least 40%; and a polyurethane resin (C) having a tensile elongation rate of a dried coating film of 350-900% inclusive. The amounts of A-C contained satisfy the conditions described in the description. The aqueous dispersion disperses the sizing agent. The carbon fiber bundle contains 0.6-3.0 mass % inclusive of the sizing agent.

Abstract: The invention relates to methods and a novel powdered curable monomer which may be used to manufacture bulk polymers, adhesives and coatings composite materials with high percentage weight inclusions of particulate filler materials, more specifically to fibre reinforced polymer composite materials with high percentage weight inclusions of particulate filler materials. The preferred particulate filler materials are carbon nanotubes. The method according to the invention allows greater than 0.5 wt % of carbon nanotubes, typically greater 10% wt of carbon nanotubes or other high aspect ratio fillers to be readily incorporated in the resin matrix, before being applied to the fibre reinforcing plys.

Abstract: A carbon nanotube composite material having carbon nanotubes and carbon fibers dispersed in a matrix is provided wherein a carbon nanotube group formed from a plurality of the carbon nanotubes is present between the carbon fibers, an average diameter of the carbon fibers is 1 ?m or more and 50 ?m or less, an average diameter of the carbon nanotubes is 0.7 nm or more and 50 nm or less, the carbon nanotubes are included in a range of 0.01 wt % or more and 30 wt % or less and the carbon fibers are included in a range of 10 wt % or more and 60 wt % or less with respect to 100 wt % of the carbon nanotube composite material, thermal conductivity of the matrix is less than 10 W/mK, and the carbon nanotube composite material includes thermal conductivity in a direction of 10 W/mK or more.

Abstract: Disclosed herein are adhesive compositions comprising (a) a first component; (b) a second component that chemically reacts with said first component; and (c) graphenic carbon particles having a compressed density of 0.9 or less. Disclosed herein are associated methods for forming the adhesive compositions and applying the adhesive compositions to a substrate to form a bonded substrate.

Abstract: A two-component curable epoxy resin system is disclosed. The resin system includes an epoxy resin component containing at least 80% by weight of a polyglycidyl ether of a polyphenol that has an epoxy equivalent weight of up to about 200 and contains no more than 2% by weight of monohydrolyzed resin species.

Abstract: The present invention relates to a curable composition which comprises epoxy resin, epoxy-group-bearing reactive diluent and the hardener 2,2?,6,6?-tetramethyl-4,4?-methylenebis(cyclohexylamine), curing thereof, and the cured epoxy resin obtainable therefrom, and the use of 2,2?,6,6?-tetramethyl-4,4?-methylenebis(cyclohexylamine) as a hardener for epoxy resins in curable compositions with epoxy-group-bearing reactive diluent.

Abstract: A die backside film including a matrix material; and an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles. A method including introducing a die backside film on a backside surface of a die, the die backside film including a matrix material including an elastomer an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles; and disposing the die in a package.

Abstract: The invention relates to a rubber composition with a stiffness property promoted by combination of short fibers and resin product of a methylene donor and a methylene acceptor, where at least a portion of the methylene acceptor is comprised of expoxidized phenol formaldehyde, and to a tire with a component comprised of such rubber composition.

Abstract: Multifunctional melamine epoxy resins, methylols and amines are provided. Methods of making multifunctional melamine epoxy resins, methylols and amines are also provided.

Abstract: An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.