Abstract: A reinforced polycarbonate composition includes 30-60 wt % of a homopolycarbonate; 5-30 wt % of a poly(carbonate-siloxane); 10-40 wt % of a high heat polycarbonate having a glass transition temperature of 170° C. or higher determined per ASTM D3418 with a 20° C./min heating rate; 1-10 wt % of a phosphorous-containing flame retardant present in amount effective to provide 0.1-1.5 wt % phosphorous; 0.01-0.5 wt % of an anti-drip agent; 5-30 wt % of a reinforcing fiber; and optionally, up to 10 wt % of an additive composition, wherein each amount is based on the total weight of the reinforced polycarbonate composition, which sums to 100 wt %. A molded sample of the polycarbonate composition has a heat deflection temperature greater than 115° C., preferably greater than 125° C., more preferably greater than 130° C., or a flame test rating of V1, preferably V0 as measured according to UL-94 at a thickness of 0.8 millimeter, or at a thickness of 0.6 mm, or at a thickness of 0.4 mm.

Abstract: A polyurethane foam is disclosed having unique load bearing characteristics rendering it suitable for a variety of applications. The foam exhibits high surface-softness and smoothness properties, making it well-suited for use in articles such as pillows and mattress toppers. However, upon continued application of pressure, the resilience of the foam increases sharply, translating into a remarkable support characteristics that make the foam suitable for use in the seat portions of chairs and sofas, as well as in the base portion of mattresses. The foams therefore address the limitations of conventional, high-resilience and visco-elastic polyurethane foams. A process of making the foam and its use in various articles is also disclosed.

Abstract: Articles exhibiting flame retardancy and heat resistance are fabricated from a composition that includes specific amounts of a poly(phenylene ether)-polysiloxane block copolymer reaction product, a flame retardant, and a reinforcing filler. Articles benefiting from the composition's properties include fuser holders for electrophotographic copiers, fan blades, battery parts for hybrid and electric vehicles, parts for automotive kinetic energy recovery systems, and electric vehicle junction boxes.

Abstract: A phosphazene compound having a vinyl group is manufactured by a reaction between a vinyl compound and a phosphazene compound having a hydroxyl group and added to a resin composition for manufacturing a prepreg or a resin film so as to be applicable to copper-clad laminates and printed circuit boards to thereby achieve satisfactory circuit laminate properties, namely low coefficient of thermal expansion, low dielectric properties, heat resistant, fire resistant, and halogen-free.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of polyphenylene oxide resin; (B) 10 to 50 parts by weight of maleimide resin; (C) 5 to 100 parts by weight of polybutadiene copolymer; (D) 5 to 30 parts by weight of cyanate ester resin; and (E) 15 to 150 parts by weight of phosphazene. The halogen-free resin composition is characterized by specific ingredients and proportions thereof to achieve circuit board laminate properties, such as a high glass transition temperature, low coefficient of thermal expansion, low dielectric properties, heat resistance, flame retardation, and being halogen-free, and thus is applicable to the manufacturing of a prepreg or resin film, thereby being applicable to the manufacturing of metal laminates and printed circuit boards.

Abstract: A phosphazene compound having a vinyl group is manufactured by a reaction between a vinyl compound and a phosphazene compound having a hydroxyl group and added to a resin composition for manufacturing a prepreg or a resin film so as to be applicable to copper-clad laminates and printed circuit boards to thereby achieve satisfactory circuit laminate properties, namely low coefficient of thermal expansion, low dielectric properties, heat resistant, fire resistant, and halogen-free.

Abstract: A resin composition contains: (A) 100 parts by weight of the cyanate ester resin; (B) 5 to 80 parts by weight of the styrene-maleic anhydride copolymer; (C) 15 to 80 parts by weight of the styrene-butadiene-divinyl benzene (SBDVB) terpolymer; and (D) 5 to 60 parts by weight of the acrylate compound, where the contents of the styrene-maleic anhydride copolymer, the styrene butadiene divinyl benzene terpolymer, and the acrylate compound are based on 100 parts by weight of the cyanate ester resin. By providing such formulation, the resin composition of the present invention exhibits low dielectric constant, low dielectric dissipation, high thermal stability and high flame resistance, and is useful in manufacturing a prepreg or a resin film, and is further useful in manufacturing a laminate and a printed circuit board.

Abstract: A reinforced poly(phenylene ether)-polysiloxane block copolymer composition includes specific amounts of a poly(phenylene ether)-polysiloxane block copolymer reaction product, a flame retardant, and a reinforcing filler. The composition exhibits a desirable balance of flame retardancy, heat resistance, and stiffness relative to a corresponding poly(phenylene ether) composition, and it is useful to fabricate articles including fuser holders for electrophotographic copiers.

Abstract: A reinforced poly(phenylene ether)-polysiloxane block copolymer composition includes specific amounts of a poly(phenylene ether)-polysiloxane block copolymer reaction product, a flame retardant, and a reinforcing filler. The composition exhibits a desirable balance of flame retardancy, heat resistance, and stiffness relative to a corresponding poly(phenylene ether) composition, and it is useful to fabricate articles including fuser holders for electrophotographic copiers.

Abstract: The use of at least one diphosphine of formula (I), wherein X is S or O; n is 0 or 1; R1, R2, R3, R4 are independently C1-C10-alkyl, C1-C10-hydroxyalkyl, C1-C10-alkoxy, C1-C10-hydroxyalkoxy, C3-C10-cycloalkyl, C3-C10-cycloalkoxy, C6-C10-aryl, C6-C10-aryloxy, C6-C10-aryl-C1-C4-alkyl, C6-C10-aryl-C1-C4-alkoxy, C6-C10-hydroxy-aryl, C6-C10-hydroxy-aryloxy, C1-C10-thioalkyl, C6-C10-thioaryl or C1-C4-thioalkyl-C6-C10-aryl, NR5R6, COR2, COOR5 or CONR5R6; R5, R6 are H, C1-C10-alkyl, C3-C10-cycloalkyl, C6-C10-aryl or C6-C10-aryl-C1-C4-alkyl; as a flame retardant in a polyurethane material is provided.

Abstract: A reinforced poly(phenylene ether)-polysiloxane block copolymer composition includes specific amounts of a poly(phenylene ether)-polysiloxane block copolymer reaction product, a flame retardant, and a reinforcing filler. The composition exhibits a desirable balance of flame retardancy, heat resistance, and stiffness relative to a corresponding poly(phenylene ether) composition, and it is useful to fabricate articles including fuser holders for electrophotographic copiers.

Abstract: There is provided a resin composition containing: a polycarbonate resin; an acrylonitrile/butadiene/styrene resin, a polylactic acid resin, at least one flame retardant selected from a condensed phosphate and a phosphazene compound, and talc modified with an acid; and provided a resin molded article containing: a polycarbonate resin; an acrylonitrile/butadiene/styrene resin; a polylactic acid resin; at least one flame retardant selected from a condensed phosphate and a phosphazene compound; and talc modified with an acid.

Abstract: Disclosed herein are compositions comprising polyamides, thermoplastic polyimides, and inorganic fillers. The compositions can also comprise a flame retardant additive. Also disclosed are materials and devices made thereof. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

Abstract: Disclosed herein too is a flame retardant composition comprising a polyphenylene ether, a polyphenylene ether-polysiloxane copolymer, or a combination comprising at least one of the foregoing polymers; an impact modifier; and a phosphazene compound. Disclosed herein too is a method comprising blending a polyphenylene ether, a polyphenylene ether-polysiloxane copolymer, or a combination comprising at least one of the foregoing polymers; an impact modifier; and a phosphazene compound.

Abstract: Disclosed herein is a flame retardant composition comprising a polycarbonate; 5 to 10 weight percent of a polysiloxane-polycarbonate copolymer; where the polysiloxane-polycarbonate copolymer comprises an amount of greater than 10 weigh percent of the polysiloxane and where the molecular weight of the polysiloxane-polycarbonate copolymer is greater than or equal to 25,000 grams per mole; 5 to 20 weight percent of a branched polycarbonate; 5 to 60 weight percent of a reinforcing filler; and 1 to 15 weight percent of a flame retarding compound.

Abstract: Disclosed herein is a flame retardant composition comprising 10 to 90 weight percent of a linear polycarbonate; 5 to 50 weight percent of a polysiloxane-polycarbonate copolymer; where the polysiloxane-polycarbonate copolymer comprises 10 weight percent or more of polysiloxane and where the molecular weight of the polysiloxane is 30,000 grams per mole or greater; and 1 to 20 weight percent of a phosphazene compound; where all weight percents are based on the total weight of the composition.

Abstract: Disclosed herein is a flame retardant polycarbonate composition comprising 10 to 90 weight percent of a polycarbonate composition, a fibrous reinforcing and a flame retardant composition that comprises a phosphazene compound and a mineral filler synergist. In an embodiment, the polycarbonate composition comprises a first copolyestercarbonate copolymer and a second copolyestercarbonate copolymer, where the first copolyestercarbonate copolymer has a lower molecular weight than the second copolyestercarbonate copolymer. In another embodiment, the polycarbonate composition comprises a linear polycarbonate, a branched polycarbonate, or a combination of a linear and a branched polycarbonate. Disclosed herein too is a method of manufacturing the composition and articles that can be manufactured from the composition.

Abstract: A resin composition for a flexible printed circuit board that can attain high adhesiveness and solder reflow resistance even if a base film having low dielectric properties is used, and that attains excellent electrical properties. The resin comprises a fluororesin and an isocyanate compound, wherein the fluororesin has a content of 1 to 50% by mass, and a hydroxyl equivalent of 300 to 5500 g/equivalent.

Abstract: Disclosed herein is a flame retardant composition comprising 10 to 75 weight percent of a polycarbonate; 10 to 30 weight percent of a polyester; 10 to 35 weight percent of a polysiloxane-polycarbonate copolymer; and a phosphazene flame retardant, where all weight percents are based on the total weight of the flame retardant composition. Disclosed herein too is a method of manufacturing a flame retardant composition comprising blending 30 to 50 weight percent of a polycarbonate; 10 to 30 weight percent of a polyester; 10 to 35 weight percent of a polysiloxane-polycarbonate copolymer; and a phosphazene flame retardant, where all weight percents are based on the total weight of the flame retardant composition.

Abstract: Disclosed herein is a flame retardant composition comprising a polycarbonate composition, glass fibers, and a flame retardant that comprises a phenoxyphosphazene compound. Disclosed herein too are methods for manufacturing a flame retardant composition that comprises blending a polycarbonate composition, glass fibers and a flame retardant that comprises a phenoxyphosphazene compound.

Abstract: The present invention provides polycarbonate compositions having a tunable decomposition temperature. Suitable cationic additives (e.g., phosphonium, phosphazene, quaternary ammonium, guanidinium, pyridinium, arsonium, etc.) are disclosed for lowering the decomposition temperature of polymer compositions. The invention further provides methods of preparing such polymer compositions with tunable decomposition temperatures.

Abstract: A defoaming coalescent for a water-based composition including a coalescent carrier; and one or more defoamer-active components is provided. A method for making a defoaming coalescent including the steps of: providing a coalescent carrier and one or more defoamer-active components; and combining the carrier and defoamer-active components is also provided. A water-based composition including a polymer latex or a polymer dispersion; and a defoaming coalescent is also provided.

Abstract: The invention relates to flame-retardant polyester compounds comprising as component A 40% to 89.9% by weight of thermoplastic polyesters, as component B 5% to 25% by weight of phosphinic salt of the formula (V) and/or diphosphinic salt of the formula (VI) and/or polymers thereof, in which R1 and R2 are H or C1-C6-alkyl and/or aryl; R3 is C1-C10-alkylene, C6-C10-arylene, -alkylarylene or -arylalkylene; M is Mg, Ca, Al, Sb, Sn, Ge, Ti, Fe, Zr, Ce, Bi, Sr, Mn, Li, Na, K and/or a protonated nitrogen base; m is 1 to 4; n is 1 to 4; and x is 1 to 4, and as component C 5% to 25% by weight of a phosphazene, as component D 0% to 15% by weight of reaction products of melamine with phosphoric acid and/or condensed phosphoric acids, as component E 0% to 45% by weight of reinforcing agents, and as component F 0.1% to 3% by weight of further additives, the sum of the components by weight being 100% by weight.

Abstract: Disclosed herein is a flame retardant thermoplastic resin composition including a polycarbonate resin, a branched acrylic copolymer, and a flame retardant. The flame retardant thermoplastic resin composition can have good compatibility as well as good flame retardancy, scratch resistance, colorability and appearance without requiring the addition of a compatibilizer.

Abstract: The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E).

Abstract: An active-energy-ray-curable hot-melt urethane resin composition contains a hot-melt urethane and an active energy ray polymerization initiator, the hot-melt urethane being obtained by converting more than 50% and 100% or less of the total number of isocyanate groups in an isocyanate group-terminated urethane prepolymer into terminal (meth)acryloyl groups by a reaction with hydroxyl groups in a reactive functional group-containing (meth)acrylic compound, the isocyanate group-terminated urethane prepolymer being obtained by reacting a polyisocyanate component with a polyol component that contains an aromatic polyester polyol containing a 2,2-dimethyl-1,3-propylene structure in its molecule in an amount of 90% by mole or more of a glycol component and a polyol other than the aromatic polyester polyol.

Abstract: The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 10 to 150 parts by weight of phosphazene; and (E) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.

Abstract: The present invention relates to a flame retardant plexifilamentary film-fibril strand comprising at least one polyolefin and at least one flame retardant selected from the group consisting of: phosphate esters, phosphonate esters, phosphinate esters, polyphosphazines, nitrogen-containing polyphosphates, hindered amines and mixtures thereof. The present invention also relates to flame retardant sheet made from the flame retardant plexifilamentary film-fibril strands. The sheet can be made into a flame retardant building substrate, garment, banner, light reflector and cover.

Abstract: The halogen-free resin composition comprises (A)100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 5 to 100 parts by weight of maleimide; (E) 10 to 150 parts by weight of phosphazene; and (F) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition of the invention offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.

Abstract: The invention relates to hydrophilized curable silicone compositions which contain organopolysiloxanes, hydrophilizers and at least one stabilizing phosphorous compound. The compositions are particularly suitable as curable impression materials in dental applications, especially as wash impression materials.

Abstract: A resin composition, containing at least (A) a polylactic acid, (B) a phosphazene compound and (C) a crystal nucleator.

Abstract: The invention relates to a flame retardant comprising a) at least one sulfur compound of the formula (I) b) at least one halogen-free organophosphorus compound with phosphorus content in the range from 0.5 to 40% by weight, based on the phosphorus compound.

Abstract: The present invention is directed to a pneumatic tire comprising a ground contacting tread, the tread comprising a rubber composition comprising at least one additional diene based rubber; silica; a sulfur donor; a sulfenamide accelerator; and a dithiophosphate of the formula wherein Q is divalent Zn or S, and R3 may be identical or different, and R3 is hydrogen or a monovalent hydrocarbon group of 1 to 18 carbon atoms; wherein the zinc content of the rubber composition is less than 0.5 parts by weight, per 100 parts by weight of elastomer (phr) as Zn meta.

Abstract: The present invention provides polymer compositions having a tunable decomposition temperature. Suitable additives are disclosed for lowering the decomposition temperature of polymer compositions. The invention further provides methods of preparing such polymer compositions with tunable decomposition temperatures.

Abstract: A resin composition, containing at least (A) a polylactic acid, (B) a phosphazene compound and (C) a crystal nucleator.

Abstract: Phosphine sulfide derivatives of the formula (I), S?PR1R2R3??(I) are suitable as flame retardants, in particular for polymers, where the definitions of the symbols in the formula (I) are as follows: R1 and R2 are identical or different, being C1-C12-alkyl, C3-C8-cycloalkyl, which may have no substitution or may have one or more C1-C4-alkyl groups as substituents, C2-C12-alkenyl, C2-C12-alkynyl, C6-C10-aryl, or C8-C10-aryl-C1-C4-alkyl; R3 is H, SH, SR4, OH, OR5 or a —(Y1)n—[P(?X1)R6—(Y2)n]m—P(?X2)R7R8 group; or two groups R1, R2, R3 form, together with the phosphorus atom bonded thereto, a ring system; X1 and X2 are identical or different, being O or S; Y1 and Y2 are identical or different, being O or S; R4, R5, R6, R7 and R8 are identical or different, being independently from one another C1-C12-alkyl, C3-C8-cycloalkyl, which may have no substitution or may have one or more C1-C4-alkyl groups as substituents, C2-C12-alkenyl, C2-C12-alkynyl, C6-C10-aryl, or C6-C10-aryl-C1-C4-alkyl; n is 1 if Y1 and, respec

Abstract: The use of at least one diphosphine of formula (I), wherein X is S or O; n is 0 or 1; R1, R2, R3, R4 are independently C1-C10-alkyl, C1-C10-hydroxyalkyl, C1-C10-alkoxy, C1-C10-hydroxyalkoxy, C3-C10-cycloalkyl, C3-C10-cycloalkoxy, C6-C10-aryl, C6-C10-aryloxy, C6-C10-aryl-C1-C4-alkyl, C6-C10-aryl-C1-C4-alkoxy, C6-C10-hydroxy-aryl, C6-C10-hydroxy-aryloxy, C1-C10-thioalkyl, C6-C10-thioaryl or C1-C4-thioalkyl-C6-C10-aryl, NR5R6, COR2, COOR5 or CONR5R6; R5, R6 are H, C1-C10-alkyl, C3-C10-cycloalkyl, C6-C10-aryl or C6-C10-aryl-C1-C4-alkyl; as a flame retardant in a polyurethane material is provided.

Abstract: The invention provides a flame retardant resin composition containing a polyalkylene furan dicarboxylate represented by the following formula (1), an aromatic polycarbonate, a phosphazene compound represented by the following formula (2) and a fluorine-containing compound: wherein m and n1 are each an integer of 2 or more; wherein n2 is an integer of 2 or more, and R1 and R2 are each an alkyl group having 1 to 20 carbon atoms or an aryl group.

Abstract: The present invention provides a method for improving the flame retardant efficiency of a phenoxyphosphazene compound, and provides a prepreg, a laminate, and a laminate for printed circuit that are made by the method. The present invention compounds a phenoxyphosphazene compound and a dihydrobenzoxazine ring-containing compound in a halogen-free flame retardant resin composition, so as to effectively improve the flame-retardant efficiency of the phenoxyphosphazene compound. Besides, the prepreg, the laminate and the laminate for printed circuit that are made by the method for improving the flame retardant efficiency of a phenoxyphosphazene compound have excellent flame retardancy, chemical resistance, anti-CAF property, high glass transition temperature (Tg), high thermal resistance, low dielectric dissipation factor, low moisture, and low C.T.E, etc.

Abstract: Disclosed is a flame-retardant polyamide composition which has excellent mechanical properties such as toughness, excellent heat resistance and flow ability during reflow soldering, and good thermal stability during molding, without using a halogen flame-retardant. This flame-retardant polyamide composition exhibits stable flame retardance particularly when a thin article is molded. Specifically disclosed is a flame-retardant polyamide composition containing 20-80% by mass of a specific polyamide resin (A), 5-30% by mass of a phosphinate compound (B), and 0.01-10% by mass of a phosphazene compound (C).

Abstract: One aspect of the invention relates to a flame retardant thermoplastic resin composition. The invention also relates to a method of making the foregoing composition and an article made from the foregoing composition.

Abstract: The present invention relates to a flame retardant polycarbonate thermoplastic resin composition that comprises a polycarbonate resin, a rubber modified vinyl-grafted copolymer, a phosphorous mixture of a cyclic phosphazene oligomer compound and a phosphate ester morpholide compound as a flame retardant, and a fluorinated polyolefin resin, which has good flame retardancy, heat resistance, mechanical strength, impact strength, heat stability, processability, and appearance.

Abstract: Thermosetting resin compositions for manufacturing circuit boards and build-up circuit boards, and build-up boards, and multilayer bodies and circuit boards manufactured using these compositions are provided. A composition contains polyimide resin (A), phenol resin (B), and epoxy resin (C) components. The mixing ratio by weight (A)/[(B)+(C)] is 0.4 to 2.0, the ratio being the ratio of the weight of (A) to the total weight of (B) and (C). By using such a composition, multilayer bodies and circuit boards, excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. can be manufactured. A composition contains a polyimide resin (A), a phosphazene (D), and a cyanate ester (E). D includes a phenolic hydroxyl group-containing phenoxyphosphazene (D-1) and/or a crosslinked phenoxyphosphazene (D-2) prepared by crosslinking (D-1), (D-2) having at least one phenolic hydroxyl group.

Abstract: The flame retardant thermoplastic resin composition of the present invention comprises (A) 45˜95 parts by weight of a polycarbonate resin; (B) 1˜50 parts by weight of a rubber modified vinyl graft copolymer; (C) 0˜50 parts by weight of a vinyl copolymer; (D) 1˜30 parts by weight of a mixture of organic phosphorous compounds consisting of (d1) 1˜50% by weight of a oligomeric compound of cyclic phosphazene and (d2) 99˜50% by weight of an oligomeric phosphoric acid ester compound, per 100 parts by weight of the sum of (A), (B) and (C); and (E) 0.05˜5 parts by weight of a fluorinated polyolefin resin per 100 parts by weight of the sum of (A), (B) and (C).

Abstract: A flame retardant polycarbonate resin composition comprises 100 parts by weight of a polycarbonate resin (A), 0.01 to 3 parts by weight of a silicone compound (B) having a branched chain structure and organic functional groups, wherein said organic functional groups comprise (I) aromatic groups or (ii) aromatic groups and hydrocarbon groups (excluding aromatic groups), 0.5 to 20 parts by weight of a phosphazene compound (C), 0.01 to 2 parts by weight of an organometallic salt (D) and 0.01 to 2 parts by weight of a fiber-forming type fluorine-containing polymer (E). 5 to 25 parts byweight of titanium oxide (F) and 0.05 to 2 parts by weight of a poly(organo hydrogen sioxane) (G), per 100 parts by weight of a polycarbonate resin (A), may be further added.

Abstract: A thermoplastic molding composition suitable for preparing articles by thermoforming is disclosed. The molding composition that comprise A) branched, aromatic poly(ester)carbonate, B) graft polymer, C) an optional vinyl(co)polymer and or polyalkylene terephthalate, D) at least one flame retarding phosphorous compound selected from the group consisting of mono- and oligomeric phosphorus and phosphonic acid esters, phosphonate amines and phosphazenes and E) talc, is characterized in that its flexural modulus at room temperature is at least 3000 N/mm2 and that its falling dart energy at break, at ?30° C., is at least 40.0 J. Sheets extruded of the composition are suitable for making useful articles by thermoforming.

Abstract: The present invention relates to a flame retardant thermoplastic resin composition that contains a phenol resin derivative having good char formability, regardless of the base resin. A flame retardant thermoplastic resin composition according to the present invention comprises (A) 100 parts by weight of a thermoplastic resin as a base resin, (B) about 0.1˜100 parts by weight of a phenol resin derivative, and (C) about 0.1˜50 parts by weight of a phosphorous compound or a mixture of phosphorous compounds.

Abstract: The object of the present invention is to provide a flame-resistant fiber which possesses low negative effects on the environment and humans, such as emission of hazardous substances, which displays excellent both flame and weather resistance, and which does not reduce spinnability and fiber strength, and is able to provide a fiber molding obtained from the fiber. A flame-resistant fiber comprising at least one type of phosphazene derivatives selected from cyclic phosphazene derivatives and linear phosphazene derivatives, a hindered amine derivative containing specific groups, and a thermoplastic resin, wherein the fiber contains 0.25-5.0 wt % of the phosphazene derivative and 0.025-3.0 wt % of the hindered amine derivative, and the fiber fineness is 0.01-100 dtex.

Abstract: A flame retardant comprising a phosphazene compound, a polyphenylene oxide-series resin, and if necessary a styrenic resin and/or a nitrogen-containing compound imparts flame retardancy to a polyalkylene arylate-series resin. The phosphazene compound comprises at least a crosslinked phenoxyphosphazene compound. The obtained polyalkylene arylate-series resin composition shows high flame-retardancy.

Abstract: The present invention relates to a flame retardant thermoplastic resin composition that contains a polyphenylene ether resin and a phenol resin derivative, both of them having good char formability, regardless of the base resin. A flame retardant thermoplastic resin composition according to the present invention comprises (A) 100 parts by weight of a thermoplastic resin as a base resin, (B) about 0.1˜100 parts by weight of polyphenylene ether, (C) about 0.1˜100 parts by weight of a phenol resin derivative, and (D) about 0.1˜50 parts by weight of a phosphorous compound or a mixture of phosphorous compounds. The thermoplastic resin composition may contain up to 5.0 parts by weight of an anti-dripping agent based on 100 parts by weight of the base resin.