Abstract: The present invention relates to an adhesive composition for a touch panel, and adhesive film, and to a touch panel. When the adhesive composition of the present invention is applied to the touch panel, for example, to an electrostatic capacitance-type touch panel, the present invention has superior durability under high-temperature and high-humidity conditions and superior wettability and adhesiveness to various objects to be adhered, and can provide the adhesive composition and the adhesive film having excellent durability to chemicals, such as resistance to sebum.

Abstract: A polymer and composition useful in forming an insulating film provided with a low permittivity, a high heat resistance, and a high mechanical strength and an insulating film obtained from these and an electronic device having the same are provided. The polymer for forming an insulating film according to the present invention is characterized by being obtained by polymerizing a reactive compound represented by Formula (1). The insulating film according to the present invention is formed using a composition for forming an insulating film including that polymer, has molecular spaces having an average space size of 0.7 nm to 5 nm, and has a permittivity of 2.3 or less. The electronic device according to the present invention has the insulating film.

Abstract: An organic insulating material includes a prepolymer of a cage structure compound having a polymerizable unsaturated bond-containing group and a cage structure with an adamantane structure as the minimal unit. The prepolymer has a number-average molecular weight of between 2,000 and 500,000 based on polystyrene and measured by gel permeation chromatography. The prepolymer includes unsaturated bonds produced by reaction between the polymerizable unsaturated bonds and the unreacted polymerizable unsaturated bonds. The prepolymer has a residue rate of unreacted polymerizable unsaturated bonds of between 20% and 80%.

Abstract: There is provided a display particles including: a copolymer having a repeating unit corresponding to a vinyl compound represented by the following Formula (1) and a repeating unit corresponding to a compound with a polar group and an ethylenically unsaturated bond: Ar?H2C?CH2)n??Formula (1) wherein Ar represents an unsubstituted aromatic ring or an aromatic ring substituted with an alkyl group having from 1 to 6 carbon atoms or an aryl group having from 6 to 12 carbon atoms, and n represents an integer of from 1 to 4.

Abstract: A target variable analysis unit (11) calculates the triad fractions of monomer units in the composition of a known polymer sample from the copolymerization reactivity ratios of the monomer units to obtain a target variable. A waveform processing unit (12) processes NMR measurements, signals, etc. An explanatory variable analysis unit (13) obtains explanatory variables from the amount of chemical shift and signal strength in the NMR measurements of the known sample. A model generation unit (14) determines the regression equation of the regression model of the target variable and the explanatory variables by partial least squares regression, and obtains regression model coefficients. A sample analysis unit (15) uses the regression model to calculate the triad fractions for an unknown copolymer sample from the amount of chemical shift and signal strength in the NMR measurements of the unknown copolymer sample.

Abstract: Organic materials which possess outstanding stability to oxidative, thermal or light-induced degradation comprise as stabilizers at least one compound of the formula I wherein the general symbols are as defined in claim 1. The compounds of formula I are especially useful as stabilizers for protecting polymers and lubricants against oxidative, thermal or light-induced degradation and as scavengers for oxidized developer in color photographic material.

Abstract: The water-soluble resin composition for forming fine patterns comprises a water-soluble polymer represented by Chemical Formula 1 and a first water-soluble solvent. The composition is coated and heated on a photoresist layer having contact holes to reduce a size of the contact holes.

Abstract: An organic-inorganic hybrid material containing inorganic fine particles and a thermoplastic resin having recurring units of the following formulae (1) and (2): wherein R1 to R4 and R11 to R14 represent hydrogen, alkyl, aryl, —COOR5 or —OCOR5 provided that at least one of R11 to R14 is -L-X; L represents single bond or divalent linking group; X represents a functional group capable of bonding to inorganic fine particles; R5 represents alkyl or aryl; and m and n indicate 0 or 1.

Abstract: The instant disclosure describes methods for preparing latex resins for coated carriers using surfactant partitioning, which resins exhibit both lower ? potential and greater latex stability, while not adversely affecting particle size, toner charge or other metrics.

Abstract: The present invention relates to coatings comprising a matrix and an active polymer embedded therein, characterised in that either (i) the matrix is cross-linked, or (ii) the active polymer is cross-linked or (iii) the active polymer is covalently bonded to the matrix; and in case of a cross-linked active polymer a matrix may be omitted; and the active polymer contains structural units according to the description, and a cross-linking agent and/or coupling reagent are optionally contained therein. Said coatings exhibit outstanding anti-ice properties. The invention further relates to shaped articles and devices comprising such coatings, and to a method for the manufacturing and the use of such coatings, shaped articles and devices.

Abstract: An adhesive composition of the present invention includes, as a main component, a polymer produced by copolymerization of a monomer composition including: styrene; a (meth)acrylic acid alkyl ester having a chain structure; a (meth)acrylic acid ester having an aliphatic ring; and a (meth)acrylic acid ester having an aromatic ring, wherein: the styrene is contained in a range of 40 to 69 parts by mass; the (meth)acrylic acid alkyl ester having the chain structure is contained in a range of 20 to 30 parts by mass; the (meth)acrylic acid ester having the aliphatic ring is contained in a range of 10 to 25 parts by mass; and the (meth)acrylic acid ester having the aromatic ring is contained in a range of 1 to 5 parts by mass, where the total amount of the above components is 100 parts by mass.

Abstract: An aromatic ring-containing polymer for an underlayer of a resist, including a unit structure represented by Chemical Formula 1:

Abstract: Polymers having ordered architectures and one or more reactive functional groups incorporated in select blocks or regions of the polymer in particular proportions relative to other regions in the polymer, are described. The polymers are well suited for use in adhesive compositions, and particularly for pressure sensitive adhesive compositions. In addition, various methods for forming the noted polymers and adhesive compositions utilizing the ordered polymers are disclosed.

Abstract: The invention relates to an ink-jet printer ink comprising polymerizable monomers and/or oligomers and optionally at least one initiator, wherein the monomers and/or oligomers are formed at least up to 65% by weight, preferably exclusively, by at least one, preferably radically polymerizable, vinyl-based compound or the monomers and/or oligomers are formed at least partially, preferably exclusively, by at least one vinyl-based compound and the initiator is formed by monomers which react with the at least one vinyl-based compound during polymerization to form a covalent bond therewith.

Abstract: The invention provides a colored composition including a dye multimer having an alkali-soluble group as a dye, the dye multimer having a weight-average molecular weight (Mw) of from 5,000 to 20,000 and a dispersity (weight-average molecular weight (Mw)/number-average molecular weight (Mn)) of from 1.00 to 2.50.

Abstract: A resin for thermal imprint including a cyclic-olefin-based thermoplastic resin that contains at least one of skeletons represented by the following chemical equation 1 or the following chemical equation 2 in a main chain. The glass transition temperature Tg (° C.) and the value ([M]) of MFR at 260° C. satisfy the following equation 1, and [M]>10. The thermal imprint characteristics (transferability, mold release characteristic, and the like) are superior and the productivity (throughput) is improved. Tg (° C.

Abstract: An aromatic ring-containing polymer for an underlayer of a resist, including a unit structure represented by Chemical Formula 1:

Abstract: A hydrogenated norbornene ring-open polymer obtained by hydrogenating 80% or more of main-chain carbon-carbon double bonds of a ring-open polymer obtained by ring-opening polymerization of 2-norbornene. The hydrogenated norbornene ring-open polymer has a weight average molecular weight determined by gel permeation chromatography (GPC) of 50,000 to 200,000, a molecular weight distribution of 1.5 to 10.0, and a melting point of 110 to 145° C. A hydrogenated norbornene ring-open polymer obtained by hydrogenating 80% or more of carbon-carbon double bonds of a ring-open polymer obtained by ring-opening copolymerization of 2-norbornene and a substituent-containing norbornene monomer, wherein the proportion of a repeating unit (A) derived from the 2-norbornene with respect to all repeating units is 90 to 99 wt % and the proportion of a repeating unit (B) derived from the substituent-containing norbornene monomer with respect to all repeating units is 1 to 10 wt %. A resin composition and a molding material.

Abstract: An etch resistant thermally curable Underlayer composition for use in a multiplayer lithographic process for producing a photolithographic bilayer coated substrate, the composirion being a composition of: (a) a polymer comprising repeating units of Structure I, II and III (b) at least one crosslinking agent; (c) at least one thermal acid generator; and (d) at least one solvent.

Abstract: In general, the invention features a pressure sensitive adhesive that comprises the reaction product of: (a) from about 25 to about 95 parts by weight of at least one acrylic acid ester of a monohydric alcohol whose homopolymer has a Tg less than 0° C., (b) from 0 to about 75 parts by weight of at least one non-polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of no greater than 10.50 and a Tg greater than 15° C.; and (c) from about 5 to about 35 parts by weight of at least one polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of greater than 10.50 and a Tg greater than 15° C. The pressure sensitive adhesives adhere to substrates having a low surface energy and/or high surface energy.

Abstract: A hydrogenated norbornene ring-open polymer obtained by hydrogenating 80% or more of main-chain carbon-carbon double bonds of a ring-open polymer obtained by ring-opening polymerization of 2-norbornene. The hydrogenated norbornene ring-open polymer has a weight average molecular weight determined by gel permeation chromatography (GPC) of 50,000 to 200,000, a molecular weight distribution of 1.5 to 10.0, and a melting point of 110 to 145° C. A hydrogenated norbornene ring-open polymer obtained by hydrogenating 80% or more of carbon-carbon double bonds of a ring-open polymer obtained by ring-opening copolymerization of 2-norbornene and a substituent-containing norbornene monomer, wherein the proportion of a repeating unit (A) derived from the 2-norbornene with respect to all repeating units is 90 to 99 wt % and the proportion of a repeating unit (B) derived from the substituent-containing norbornene monomer with respect to all repeating units is 1 to 10 wt %. A resin composition and a molding material.

Abstract: The present invention relates to a process for preparing phenolic polymers utilizing Coprinus cinereus peroxidase. More particularly, the present invention relates to a process for preparing phenolic polymers by polymerizing phenolic monomers with Coprinus cinereus peroxidase instead of using typical peroxidase which essentially requires the use of toxic formalin or peroxidase of plant origin which is very costly and easily deactivated by hydrogen peroxide in the polymerization of phenolic monomers, wherein the polymerization is conducted in the presence of a polar organic solvent under mild reaction conditions of atmospheric temperature and pressure to economically produce desired phenolic polymers having excellent water and chemical resistances with high yield.

Abstract: The present invention relates to a pressure-sensitive adhesive composition comprising: a monomer mixture comprising the following (a1), (a2) and (a3) or partially polymerized product thereof; and thermal-expandable fine particles: (a1): alkyl (meth)acrylate monomer having 4 to 12 carbon atoms in its alkyl moiety and having a glass transition temperature when formed into a homopolymer of lower than 0° C.; (a2): monomer having at least one nitrogen atom and one ethylenically unsaturated bond in its molecule; and (a3): monomer having one ethylenically unsaturated bond in its molecule and having a glass transition temperature when formed into a homopolymer of 0° C. or higher (excluding (a2) above).

Abstract: The present invention relates to a branched copolymer comprising a hydrophilic component obtainable by an addition polymerisation process and compositions and uses thereof said copolymer comprising: i) a residue of at least one monofunctional monomer comprising one polymerisable double bond per molecule and a molecular weight of less than 1000 Daltons; ii) a residue of at least one multifunctional monomer comprising at least two polymerisable double bonds per molecule and a molecular weight of less than 1000 Daltons; and wherein the end termini of the copolymer chains comprise one or more of a residue of a chain transfer agent; an initiator or a terminal group derived from a termination reaction; wherein; the molar ratio of the monofunctional monomer to multifunctional monomer is between 50:1 to 2.

Abstract: An adhesive composition which is reduced in gas generation upon heating (has low hygroscopicity), has high alkali resistance, has heat resistance of 200° C. or higher, and can be easily removed with a stripping liquid; and an adhesive film made with the adhesive composition. The adhesive composition is prepared using, at least as a major ingredient, an acrylic polymer produced from (a) styrene, (b) a (meth)acrylic ester monomer containing a cyclic skeleton, and (c) an alkyl (meth)acrylate monomer. The adhesive film has an adhesive composition layer formed from this adhesive composition.

Abstract: An adhesive composition of this invention includes a hydrocarbon resin and a solvent for dissolving the hydrocarbon resin, the solvent containing a condensed polycyclic hydrocarbon. Thus, an adhesive composition having excellent product stability is provided.

Abstract: The present invention relates to a (meth)acrylate polymer for preparing a coating composition, where the (meth)acrylate polymer has a weight-average molecular weight in the range from 10 000 to 60 000 g/mol and the (meth)acrylate polymer comprises 0.5 to 40% by weight of units derived from (meth)acrylic monomers which in the alkyl radical have at least one double bond and 8 to 40 carbon atoms, 0.1 to 10% by weight of units derived from monomers containing acid groups, and 50 to 99.4% by weight of units derived from (meth)acrylates having 1 to 12 carbon atoms in the alkyl radical that have no double bonds or heteroatoms in the alkyl radical, and these (meth)acrylates having 1 to 12 carbon atoms in the alkyl radical are selected such that a polymer composed of these (meth)acrylates having 1 to 12 carbon atoms in the alkyl radical has a glass transition temperature of at least 40° C., based in each case on the weight of the (meth)acrylate polymer.

Abstract: Organic materials which possess outstanding stability to oxidative, thermal or light-induced degradation comprise as stabilizers at least one compound of the formula (I) wherein the general symbols are as defined in claim 1. The compounds of formula I are especially useful as stabilizers for protecting polymers and lubricants against oxidative, thermal or light-induced degradation and as scavengers for oxidized developer in color photographic material.

Abstract: The present invention relates to a (meth)acrylate polymer for preparing a coating composition, where the (meth)acrylate polymer comprises 0.5% to 20% by weight of units derived from (meth)acrylic monomers which in the alkyl radical have at least one double bond and 8 to 40 carbon atoms, 0.1% to 60% by weight of units derived from hydroxyl-containing monomers which have up to 9 carbon atoms, 0.1% to 95% by weight of units derived from (meth)acrylates having 1 to 12 carbon atoms in the alkyl radical, and 0.1% to 60% by weight of units derived from styrene monomers, based in each case on the weight of the (meth)acrylate polymer, and the (meth)acrylate polymer has a weight-average molecular weight in the range from 2000 to 60 000 g/mol. The present invention further relates to a coating composition and to a method of producing a coating. The present invention describes, furthermore, a coated article comprising a coating obtainable by the method.

Abstract: The present invention relates to curable mixtures for the sealing, encapsulation, bonding or coating of opto-electronic components, such as OLEDs, solar cells, optical sensors and liquid-crystal displays, or for the alignment of liquid crystals.

Abstract: Disclosed is an adhesive composition in which a solid component is dissolved in a solvent, the solid component being dissolved in the solvent to have a solid component content of not less than 20% by weight with respect to a total amount of the solid component and the solvent, the solid component containing resin obtained by polymerizing a monomer composition that contains a cycloolefin monomer, the solvent having no carbon-carbon double bond, and an alcohol content contained in the solvent being not more than 0.45% by weight with respect to an entire amount of the solvent.

Abstract: A novel cycloolefin copolymer that can be employed in the production of molding with fewer defects, for example, fewer gel particles (fish eyes). There is provided a cycloolefin copolymer comprising 80 to 20 mol % of repeating units derived from an ?-olefin monomer and 20 to 80 mol % of repeating units derived from at least one cycloolefin monomer selected from the group consisting of monomer of the general formula (I), monomer of the general formula (II), monomer of the general formula (III), monomer of the general formula (IV) and monomer of the general formula (V), wherein with respect to the repeating units derived from cycloolefin monomer, the proportion thereof being present in the form of dimer (Rd) is 50 mol % or below and the proportion thereof being present in the form of trimer (Rt) 5 mol % or above.

Abstract: Copolymer compositions and methods for making these compositions are described. The copolymers include a vinyl aromatic monomer; a second monomer, and a biobased monomer. The second monomer is selected from the group consisting of butadiene, alkyl acrylates, alkyl methacrylates, and mixtures thereof. Examples of biobased monomers useful in the compositions include isobornyl acrylate, isobornyl methacrylate, tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, lauryl acrylate, lauryl methacrylate, and mixtures thereof. The compositions described herein can be used for binder or coating compositions and can include coating pigments, mineral fillers, and other additives.

Abstract: To provide a temporary bonding adhesive for a semiconductor wafer that can reduce damage to the semiconductor wafer, is easily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using the same. A temporary bonding adhesive for a semiconductor device is provided, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition such that the difference between the 95% weight loss temperature and the 5% weight loss temperature is 1 degree Celsius?(95% weight loss temperature)?(5% weight loss temperature)?300 degrees Celsius.

Abstract: A composition includes a first cylcoolefin substituted with at least one epoxy group and an aromatic amine. The composition is capable of bonding to a filler having a corresponding binding site. The composition is compatible with a metathesis catalyst capable of catalyzing a ring-opening metathesis polymerization reaction when contacted with the first cycloolefin. An associated method is also provided.

Abstract: A composition includes a first cylcoolefin substituted with at least one epoxy group and an aromatic amine. The composition is capable of bonding to a filler having a corresponding binding site. The composition is compatible with a metathesis catalyst capable of catalyzing a ring-opening metathesis polymerization reaction when contacted with the first cycloolefin. An associated method is also provided.

Abstract: Embodiments in accordance with the present invention provide for non-self imageable norbornene-type polymers useful for immersion lithographic processes, methods of making such polymers, compositions employing such polymers and immersion lithographic processes that make use of such compositions. More specifically the embodiments of the present invention are related to norbornene-type polymers useful for forming top-coat layers for overlying photoresist layers in immersion lithographic process and the process thereof.

Abstract: Multistage polymers predominantly stabilized by nonionic emulsifiers and derived from hard and soft monomer compositions containing vinyl esters, of which at least one monomer composition must contain an unsaturated compromisable organosilicon compound, are described. The plastic dispersions can be used as binders in emulsion paints and finishes and impart to these excellent scrub resistance in addition to good blocking resistance.

Abstract: Disclosed are an aqueous pigment dispersion containing at least a pigment, water, a high-molecular dispersant, and an alkali. The high-molecular dispersant is a diblock polymer having a formula (1) of A-B or a triblock polymer having a formula (2) of A-B-C. The diblock or triblock polymer is a diblock or triblock polymer obtained by polymerizing addition-polymerizable monomers with a radical generator while using an organic iodide as a polymerization initiating compound and an organic phosphorus compound, organic nitrogen compound or organic oxygen compound as a catalyst. Also disclosed are a production method and use of the aqueous pigment dispersion. With the high-molecular dispersant obtained by a simple living radical polymerization process free of the problems of conventional living radical polymerization and having a precisely-controlled molecular structure, the aqueous pigment dispersion can be obtained with the pigment dispersed in it.

Abstract: Provided are a resin for an optical component, which has heat resistance, does not suffer from yellowing because of its stability against heat, and is excellent in transparency and workability; a raw material composition used for the resin for an optical component; and an optical component. Specifically, provided is a resin for an optical component containing a (meth)acrylate compound unit (A1), in which a hydrocarbon group containing an adamantane structure is ester-bonded, and a (meth)acrylate compound unit (B1) having a polyfunctional group, which is other than the unit (A1). Also, provided is a raw material composition used for a resin for an optical component, which contains a (meth)acrylate compound (A2) in which a hydrocarbon group containing an adamantane structure is ester-bonded, and a (meth)acrylate compound (B2) having a polyfunctional group, which is other than the compound (A2). Further, provided is an optical component which is obtained by polymerizing and molding the raw material composition.

Abstract: Polymer capsules from amphiphilic graft copolymers comprising reactive, hydrophobic polyolefin backbones, and hydrophilic poly(ethylene glycol) (PEG) grafts are produced by self-assembly of the polymers at the oil-water interface, and crosslinking the assembly with bis-cyclooctene PEG derivatives in conjunction with ring-open metathesis polymerization catalysts. The use of the graft copolymer architecture in capsule synthesis provides significant opportunities to tune both the surface properties, in terms of recognition, and the membrane properties, in terms of mechanical strength, encapsulation, and release.

Abstract: Electrical insulation system, which optionally contains a filler material and/or further additives, wherein said electrical insulation system comprises poly(dicyclopentadiene) as the main component, and method of making said electrical insulation system.

Abstract: New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.

Abstract: The present invention relates to a process for preparing phenolic polymers utilizing Coprinus cinereus peroxidase. More particularly, the present invention relates to a process for preparing phenolic polymers by polymerizing phenolic monomers with Coprinus cinereus peroxidase instead of using typical peroxidase which essentially requires the use of toxic formalin or peroxidase of plant origin which is very costly and easily deactivated by hydrogen peroxide in the polymerization of phenolic monomers, wherein the polymerization is conducted in the presence of a polar organic solvent under mild reaction conditions of atmospheric temperature and pressure to economically produce desired phenolic polymers having excellent water and chemical resistances with high yield.

Abstract: A two-component mortar composition suitable for construction purposes is disclosed. The two-component mortar composition includes a resin component A with a resin curable with a peroxide containing at least one norbornene group and at least one methacrylate containing compound and a hardener component B with a peroxide and at least one thiol. At least one of the resin component A and the hardener component B contains at least one inorganic filler. The resin component A and the hardener component B are spatially separated from one another to inhibit any reaction before mixing of the components.

Abstract: A mixture of compounds useful to make a polymer or a prepolymer, the mixture of compounds including compounds having the formula I; wherein R1 is H, acryloyl, methacryloyl or vinyl, wherein R2 is acryloyl, methacryloyl or vinyl, wherein compounds having the formula I consist of a mixture of cis and trans-1,3- and 1,4-substituted cyclohexane and wherein the trans-1,4-substituted cyclohexane content of the compounds having the formula I is less than forty mole percent. A process for producing a mixture of compounds including compounds having the formula II: wherein compounds having the formula II consist of a mixture of cis and trans-1,3- and 1,4-methanol substituted cyclohexane and wherein the trans-1,4-methanol substituted cyclohexane content of the compounds having the formula II is less than twenty five mole percent.

Abstract: The invention provides an aqueous ink composition comprising (A) a colorant, (B) a polymer including a hydrophobic structural unit represented by Formula (1) below, (C) a polymerization initiator, (D) a polymerizable compound including an ethylenically unsaturated bond, and (E) water.

Abstract: A pressure-sensitive adhesive composition is disclosed. The composition comprises a particulate polymer of a monomer mixture comprising (a) an alkyl (meth)acrylate monomer; (b) at least one of (b?1) an alkyl (meth)acrylate monomer with the alkyl group having a carbon number of 15 to 24 and the alkyl group being a linear alkyl group and (b?2) an alkyl (meth)acrylate monomer with the alkyl group having a carbon number of 15 to 24 and the alkyl group being a branched alkyl group; and (c) a monoolefmically unsaturated monomer having a ketone group with the alkyl group having a carbon number of 8 to 14. Pressure sensitive adhesive tapes incorporating such adhesive compositions are also described.

Abstract: The invention provides an inkjet ink composition including a pigment and colloidal silica, the pigment being covered with a water-insoluble resin including a constituent unit having an acidic group, with which rub resistance of images formed and ink discharge reliability are excellent and deterioration of liquid repellency of an inkjet head member is suppressed.

Abstract: The present invention provides an inkjet ink composition including: self-dispersing polymer particles, each of the self-dispersing polymer particles including a structural unit derived from a hydrophilic monomer and a structural unit derived from a hydrophobic monomer; colloidal silica; and colorant particles, the inkjet ink composition having excellent dischargeability and suppressing the deterioration of the liquid repellency of an inkjet head member.