Two Or More Carboxylic Acids Or Derivatives, Or Two Or More Nitrogen Containing Compounds Patents (Class 524/607)
  • Patent number: 11820891
    Abstract: The invention relates to a thermoplastic polymer composition comprising polyamides, its preparation method and a device for a motor vehicle capable of damping vibrations. The composition (I1, I2, I3, I4) comprises an aliphatic polyamide a polyphthalamide coming from a C6-C12 aliphatic diamine and from an aromatic diacid comprising terephthalic acid, the aliphatic polyamide/polyphthalamide weight ratio being >1 and a reinforcing filler comprising glass fibers. The composition has, after “RH50” conditioning, maximum tan delta values according to ISO 6721-5 between 60-90° C. and 1-3000 Hz, with (i) tan delta >4.20% at 60° C. and/or (ii) tan delta >4.00% at 80° C. and/or (iii) tan delta >3.80% at 90° C.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: November 21, 2023
    Assignee: Hutchinson
    Inventors: Antoine Lucas, Marion Doudeau-Pirat
  • Patent number: 11746233
    Abstract: The use of circular-section glass fibres in a mixture including at least one MXDZ polyamide, obtained from polycondensation of meta-xylylenediamine (MXD), with a C6 to C18 aliphatic (Z) dicarboxylic acid, and at least one aliphatic polyamide A obtained from the polycondensation of a unit selected from: a C6 to C12 lactam, a C6 to C12 amino acid, and an XY unit obtained from the polycondensation of a C4 to C18 aliphatic diamine (X), and a C6 to C18 aliphatic dicarboxylic acid (Y), circular-section glass fibres and optionally at least one impact modifier and/or at least one additive, said circular-section glass fibres and said mixture constituting a composition, said circular-section glass fibres being present from 30 to 75% by weight and with respect to the total weight of the composition, to improve the mechanical properties of said composition, including elongation at break, after processing, in particular by injection or compression moulding.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: September 5, 2023
    Assignee: Arkema France
    Inventors: Benoît Brule, Antoine Breuil, Hao Wang, Xiong Yao
  • Patent number: 11447632
    Abstract: An easily tearable film includes polyamide resin components including more than 20 parts by mass and 70 parts by mass or less of a semi-aromatic polyamide resin A and less than 80 parts by mass and 30 parts by mass or more of an aliphatic polyamide resin B; wherein the semi-aromatic polyamide resin A is constituted of a diamine-derived constituent unit and a dicarboxylic acid-derived constituent unit; 60 mol % or more of the diamine-derived constituent units are derived from metaxylylenediamine; 60 mol % or more of the dicarboxylic acid-derived constituent units are derived from an ?,?-linear aliphatic dicarboxylic acid having from 4 to 10 carbons; and the molar concentration of phosphorus atoms, the total molar concentration of alkali metal atoms and the total molar concentration of alkaline earth metal atoms, and Mn of the semi-aromatic polyamide resin satisfy predetermined relationships.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: September 20, 2022
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kosuke Otsuka, Takafumi Oda
  • Patent number: 11193915
    Abstract: A composite material for sensing a chemical species in a medium is provided. The composite material includes a polymer having a glass transition temperature, a porosity promoter dispersed in the polymer in an amount such that the chemical species is transportable from the medium into the composite material at a temperature below the glass transition temperature, and a chemical indicator dispersed in the composite material, the chemical indicator providing an optical response varying with a concentration of the chemical species in the composite material.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: December 7, 2021
    Assignee: INSTITUT NATIONAL D'OPTIQUE
    Inventors: Sebastien Dubus, Serge Caron, Nolwenn Le Bouch, Antoine Proulx
  • Patent number: 10844172
    Abstract: The invention relates to a process for preparing a polymer composition, comprising a blending step wherein a first polymer (component A1) and at least one further component are dosed into and mixed in a mixing apparatus, and wherein the first polymer A1 is a granulate polyamide material directly obtained by direct solid state polymerization of a diammonium dicarboxylate salt prepared by fluidized bed spray granulation. The invention also relates to a dry-blend obtainable by said process.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: November 24, 2020
    Assignee: DSM IP ASSETS B.V.
    Inventors: Hans Klaas Van Dijk, Michiel Gerardus Henricus Maria Baltussen
  • Patent number: 10836905
    Abstract: The present invention relates to polyamide molding compounds that are characterized by high notch impact resistance and high gloss. These polyamide molding compounds comprise the following components or consist of these components: (A) 84.5 to 97.0 wt % of at least one amorphous or microcrystalline copolyamide selected from the group comprising PA 6I/6T/MACMI/MACMT/PACMI/PACMT/Y, PA 6I/6T/MACMI/MACMT/Y, and mixtures thereof; (B) 3.0 to 9.5 wt % of at least one specific functionalized impact resistance modifier; and (C) 0 to 6 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100 wt %. The present invention furthermore relates to molded bodies composed of this polyamide molding compound.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: November 17, 2020
    Assignee: EMS-PATENT AG
    Inventors: Thomas Wiedemann, Botho Hoffmann, Sepp Bass
  • Patent number: 10577500
    Abstract: The invention relates to a process for the preparation of a semi-crystalline semi-aromatic polyamide copolymer (Co-PA) having a melting temperature (Tm-Co-PA) of at least 300° C., comprising steps of (a) preparing a first semi-crystalline semi-aromatic polyamide (A), having a melting temperature (Tm-A) of at least 310° C.; and consisting of repeat units derived from 45-50 mol % terephthalic acid; 47.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: March 3, 2020
    Assignee: DSM IP ASSETS B.V.
    Inventors: Johannes Hoekstra, Rudy Rulkens, Hans Klaas Dijk,Van
  • Patent number: 9982094
    Abstract: Methods and compounds for producing nylon 6 are disclosed. Di-substituted furanic compounds may be used as the raw material for producing precursor compounds for nylon 6, and the precursor compounds are convertible to nylon 6.
    Type: Grant
    Filed: October 22, 2013
    Date of Patent: May 29, 2018
    Assignee: EMPIRE TECHNOLOGY DEVELOPMENT LLC
    Inventor: Josef Peter Klein
  • Patent number: 9796928
    Abstract: The present invention provides a functional material, its preparation method, an alignment material and a liquid crystal substrate, which belong to the display technical field and can solve the problem that current liquid crystal display devices will produce pollution. The functional material of the present invention comprises an inorganic powder whose surface has a modified layer, wherein the inorganic powder comprises any one or more of aluminum oxide, magnesium oxide, zinc oxide, zirconium oxide, silicon dioxide, titanium dioxide, boron oxide, diiron trioxide, calcium oxide, potassium oxide, sodium oxide and lithium oxide; the modified layer is generated via cyclization by dehydrating the reaction product of a dianhydride and a diamine. The alignment material of the present invention comprises the above functional material. The liquid crystal display substrate of the present invention comprises an alignment layer made from the above alignment material.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: October 24, 2017
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Jiuxia Yang, Feng Bai, Zhenpeng Guo, Jing Su, Jiantao Liu, Hongbo Feng
  • Patent number: 9181403
    Abstract: The present invention provides block copolymers comprising at least one covalent polymer block and at least one supramolecular polymer block, processes for their preparations and uses thereof.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: November 10, 2015
    Assignees: WISCONSIN ALUMNI RESEARCH FOUNDATION, YISSUM RESEARCH DEVELOPMENT COMPANY OF THE HEBREW UNIVERSITY OF JERUSALEM, LTD.
    Inventors: Roy Shenhar, Paul F. Nealey, Marcus Müller, Kostas Daoulas
  • Patent number: 9034974
    Abstract: Polyamide molding materials for transparent molding parts. The materials comprise transparent copolyamides that contain: (A) 40 to 100 wt % of at least one transparent copolyamide with a glass transition temperature (Tg) of at least 80° C. and not more than 150° C., composed of at least two diamines that are different from each other, wherein the at least two diamines are a mixture of (a) 50 to 90 mol % bis-(4-amino-3-methylcyclohexyl)methane (MACM) and/or bis-(4-amino-3-ethylcyclohexyl)methane (EACM) and/or bis-(4-amino-3,5-dimethylcyclohexyl)methane (TMACM) and b) 10 to 50 mol % aliphatic diamine having 9 to 14 carbon atoms, in particular decandiamine, particularly preferably at least 20 mol % decandiamine, each relative to the total amount of diamines, and of one or more aliphatic dicarboxylic acids, having 6 to 36 carbon atoms, (B) 0 to 60 wt % of at least one further polymer, (C) 0 to 10 wt % of additives, the sum of the components (A), (B) and (C) totaling 100% by weight.
    Type: Grant
    Filed: April 21, 2009
    Date of Patent: May 19, 2015
    Assignee: EMS-PATENT AG
    Inventors: Friedrich Severin Buhler, Etienne Aepli, Sepp Bass
  • Publication number: 20150126646
    Abstract: A method of producing a composite material, comprising an assembly of natural fibres, impregnated with an amorphous or semi-crystalline thermoplastic polymer, said method including: i) a step of impregnating said assembly with a precursor composition in the molten state and including: a) at least one prepolymer P(X)n of said thermoplastic polymer, having a molecular chain P having, at the ends of same, n reactive functions X, with n ranging from 1 to 3, in particular n being 1 or 2, and preferably 2 b) at least one chain extender Y-A-Y including reactive functions Y with at least one of said functions X ii) a step of polymerisation by mass (poly)addition, in the molten state, of said prepolymer with said chain extender with: said thermoplastic polymer being the result of said polymerisation by mass polyaddition and said impregnation i) and polymerisation ii) taking place at a temperature lower than 250° C.
    Type: Application
    Filed: May 30, 2013
    Publication date: May 7, 2015
    Inventors: Gilles Hochstetter, Marc Audenaert, Thierry Briffaud
  • Patent number: 9023914
    Abstract: A new process is provided for preparing nitrile rubbers by free-radical polymerization in an organic solvent and in the presence of specific modifier substances. This polymerization may be followed by hydrogenation to give likewise new hydrogenated nitrile rubbers, the hydrogenation advantageously taking place likewise in organic solvent. The optionally hydrogenated nitrile rubbers obtained are notable for having fragments of the employed modifier substances in the main polymer chain and/or as end groups. They can be prepared with a wide diversity of molecular weights and polydispersity indices, especially with very low polydispersity indices.
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: May 5, 2015
    Assignee: LANXESS Deutschland GmbH
    Inventors: Michael Klimpel, Sven Brandau, Uwe Westeppe, Christopher Barner-Kowollik, Andreas Kaiser
  • Patent number: 9012567
    Abstract: Supramolecular polymers having repeat units connected by hydrogen bonds, where the repeat units are monomers, macromers, oligomers or polymers where at least one on the monomers contains at least one 2,5-diketopiperazine group are described. Composition prepared from these supramolecular polymers and articles produced from these compositions are also described.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: April 21, 2015
    Assignee: Rhodia Operations
    Inventors: Thierry Badel, Stéphane Jeol, Franck Touraud
  • Patent number: 9012566
    Abstract: A polyamide molding composition is described comprising the following components (A)-(C) in the following composition, where the entirety of components (A), (B) and (C) gives 100% by weight: (A) from 25 to 75% by weight of at least one transparent copolyamide composed of (a) from 50 to 90 mol % of a cycloaliphatic diamine selected from the group consisting of: bis(4-amino-3-methylcyclohexyl)methane (MACM), bis(4-aminocyclohexyl)methane (PACM), bis(4-amino-3-ethylcyclohexyl)methane (EACM), bis(4-amino-3,5-dimethylcyclohexyl)methane (TMACM) and mixtures thereof and (b) from 10 to 50 mol % of an unbranched, aliphatic diamine, based in each case on the total amount of diamines, and also (c) of one or more aliphatic and cycloaliphatic dicarboxylic acid(s), (B) from 25 to 75% by weight of at least one further polyamide of PAXY type, where X and Y can assume, independently of one another, the values from 9 to 14, (C) from 0 to 10% by weight of additives.
    Type: Grant
    Filed: November 10, 2011
    Date of Patent: April 21, 2015
    Assignee: EMS-Patent AG
    Inventors: Friedrich Severin Bühler, Sepp Bass
  • Publication number: 20150099332
    Abstract: Provided are a resin composition and a substrate that are capable of being used for producing an electronic device including thin-film transistors having an excellent switching property. The resin composition contains an aromatic polyamide and a solvent dissolving the aromatic polyamide. The resin composition is used to form a layer, and a total light transmittance of the layer in a wavelength of 355 nm is 10% or less. Further, a method of manufacturing the electronic device using such a substrate is also provided.
    Type: Application
    Filed: October 3, 2014
    Publication date: April 9, 2015
    Applicants: AKRON POLYMER SYSTEMS INC., SUMITOMO BAKELITE COMPANY LIMITED
    Inventors: Limin SUN, Dong ZHANG, Jiaokai JING, Frank W. HARRIS, Hideo UMEDA, Toshihiko KATAYAMA, Jun OKADA, Mizuho INOUE, Manabu NAITO
  • Publication number: 20150097174
    Abstract: Provided are a resin composition and a substrate that are capable of being used for manufacturing an electronic device having excellent light extraction efficiency. The resin composition contains a crystalline polymer and a solvent dissolving the crystalline polymer. The resin composition is used to form a layer, and a haze value of the layer is 5% or more. Further, a method of manufacturing the electronic device by using such a substrate, and the electronic device are also provided.
    Type: Application
    Filed: October 3, 2014
    Publication date: April 9, 2015
    Applicants: AKRON POLYMER SYSTEMS INC., SUMITOMO BAKELITE COMPANY LIMITED
    Inventors: Limin SUN, Dong ZHANG, Jiaokai JING, Frank W. HARRIS, Hideo UMEDA, Jun OKADA, Manabu NAITO
  • Patent number: 8999494
    Abstract: The invention relates to a polyesteramide resin containing ester groups and at least one amide group in the back-bone characterized in that it has at least one hydroxyalkylamide endgroup, and a Tg<0° C.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: April 7, 2015
    Assignee: DSM IP Assets B.V.
    Inventors: Franciscus Johannes Marie Derks, Jelle Bernandas Otto Van der Werf
  • Publication number: 20150064398
    Abstract: The object of the present invention is to provide an image formation method that can give an image that is excellent in terms of adhesion to a substrate, blocking resistance of a resulting printed material, and molding suitability, in particular vacuum forming properties, and that can suppress post-molding cracking of a molding. Disclosed is an image formation method comprising, in order, Step a: a step of applying Liquid A to a substrate, Step b: a step of irradiating the applied Liquid A with actinic radiation so as to carry out complete curing or semi-curing up to a degree of cure of at least 90%, Step c: a step of applying Liquid B to a cured layer of the completely cured or semi-cured Liquid A, and Step d: a step of completely curing Liquid A and Liquid B.
    Type: Application
    Filed: August 28, 2014
    Publication date: March 5, 2015
    Applicant: FUJIFILM Corporation
    Inventor: Tsutomu UMEBAYASHI
  • Patent number: 8956716
    Abstract: A printed material includes a first printed layer and a second printed layer. The first printed layer is produced by printing using a first curing ink which is provided in a first processing region for deformation process and contains at least a monofunctional polymerizable compound. The second printed layer is produced by printing using a second curing ink which is provided in a second processing region for shear processing and contains at least a multifunctional polymerizable compound. In the first curing ink, y1/x1 is 0.5 or less, where x1 and y1 are respective masses of the monofunctional polymerizable compound and the multifunctional polymerizable compound in the first curing ink. In the second crying ink, y2/x2 is 1 or greater, where x2 and y2 are respective masses of the monofunctional polymerizable compound and the multifunctional polymerizable compound in the second curing ink.
    Type: Grant
    Filed: April 5, 2012
    Date of Patent: February 17, 2015
    Assignee: Seiko Epson Corporation
    Inventor: Keigo Sugai
  • Publication number: 20150027754
    Abstract: A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate in 3 mass % aqueous sodium hydroxide at 45° C. is 0.95 or more after a heat history of 90° C. for 10 minutes with the solution rate before the heat history assumed to be 1, (b) the solution rate in 3 mass % aqueous sodium hydroxide at 45° C. ranges from 0.001 ?m/sec to 0.02 ?m/sec after the heat history of 180° C. for 60 minutes, (c) a bleed-out amount is 50 mg/m2 or less in storing at 40° C. for 2 weeks after the heat history of 180° C. for 60 minutes, and (d) a thermogravimetric decrease at 260° C. is 2.0% or less in measuring on a temperature rising condition of 10° C./min from 40° C. by thermogravimetric analysis (TG).
    Type: Application
    Filed: January 18, 2013
    Publication date: January 29, 2015
    Applicant: ASAHI KASEI E-MATERIALS CORPORATION
    Inventors: Koichiro Shimoda, Yasuhito Iizuka, Masaki Yamamoto, Yoro Sasaki, Hiroaki Adachi, Shuji Kashiwagi
  • Patent number: 8940834
    Abstract: An unreinforced, halogen-free polyamide moulding composition having the following composition: (A) 62-87% by weight of a partially aromatic, partially crystalline copolyamide having a melting point of 270° C. to 320° C. and made up of 100% by weight of diacid fraction composed of: 50-100% by weight of terephthalic acid (TPA) and/or naphthalenedicarboxylic acid; 0-50% by weight of isophthalic acid (IPA), and 100% by weight of diamine fraction; (B) 5-15% by weight of ionomer; (C) 8-18% by weight of flame retardants; (D) 0-5% by weight of additives; where the components (A)-(D) add up to 100% by weight.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: January 27, 2015
    Assignee: EMS-Patent AG
    Inventors: Andreas Bayer, Manfred Hewel
  • Publication number: 20150025191
    Abstract: The present invention relates to a carbon fiber bundle excellent in terms of adhesion to matrix resins and process handleability and less apt to suffer the shedding of the sizing agent in processing steps the carbon fiber bundle being a carbon fiber bundle having a sizing agent adherent to the surface thereof, characterized in that the carbon fiber bundle includes a plurality of carbon fibers and the sizing agent includes a copolyamide resin, the copolyamide resin having both a specific polyamide component and nylon-6 and/or nylon-66 as repeating units and having a melting point of 180° C. or lower, the copolyamide resin preferably having a melting point of 60 to 160° C., or a glass transition temperature of ?20 to 50° C.
    Type: Application
    Filed: March 8, 2013
    Publication date: January 22, 2015
    Applicant: Teijin Limited
    Inventors: Takeshi Naito, Tsubasa Ono, Hiroshi Sakurai
  • Patent number: 8933167
    Abstract: A polyamide comprising (a) a unit comprising adipic acid and hexamethylenediamine and (b) a unit comprising isophthalic acid and hexamethylenediamine, wherein a ratio of the isophthalic acid component to the total carboxylic acid component in the polyamide is 0.05?(x)?0.5 and a range of blocking ratio (Y) is ?0.3?(Y)?0.8. Also provided are compositions comprising 30 to 95% by mass of the above polyamide and 5 to 70% by mass of an inorganic filler.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: January 13, 2015
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Yukiyoshi Sasaki, Hiroshi Oyamada, Yasukazu Shikano
  • Publication number: 20140378610
    Abstract: The invention relates to a polyamide composition with an increased resistance against blistering that is for example the result of a reflow soldering process. The composition comprises: A) 99-50 wt % of at least one polyamide A derived from: A1) at least one di-amine monomer having 4 carbon atoms and wherein the amount of C4-diamine is at least 2 mol % relative to the total amount of di-amine and, A2) at least one di-acid monomer, wherein at least one of the monomers has at least one aromatic structural unit, and wherein the polyamide A, has a molecular weight, expressed as Mn, of at least 9000 g/mol, and B) 1-50 wt % of at least one reinforcing agent and C) 0-20 wt % of inorganic fillers and/or additives, D) 0-49 wt % of one or more polymers other than A) wherein the sum of A, B, C and D amounts to 100 wt %. The invention also relates to the use of the polyamide composition and to a shaped article made out of the polyamide composition.
    Type: Application
    Filed: February 6, 2013
    Publication date: December 25, 2014
    Inventors: Frank Van Der Burgt, Patrick Gerardus Duis
  • Patent number: 8916626
    Abstract: Drag reducing compositions comprising polymer particles, where the polymer particles include copolymers comprising the residues of at least one methacrylate monomer and at least one comonomer having a polymerizable vinyl group, where the comonomer has no more than one pendant substituent per vinyl carbon. The drag reducing compositions can have improved dissolution rates in hydrocarbon-containing fluids. The drag reducing compositions can be added to a hydrocarbon-containing fluid to decrease the pressure drop associated with the turbulent flow of the hydrocarbon-containing fluid through a conduit.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: December 23, 2014
    Assignee: Lubrizol Specialty Products, Inc.
    Inventor: Stuart N. Milligan
  • Publication number: 20140371388
    Abstract: The instant invention provides a crosslinkable coating composition, and method of producing the same. The crosslinkable coating composition according to the present invention comprises: (a) one or more polycarbamates derived from one or more polyesters comprising the condensation reaction product of one or more polyols with one or more polyacids, wherein said one or more polyols comprise at least 25 percent by weight of one or more units having 4 or more hydroxyl groups; (b) one or more crosslinking agents; (c) one or more acid catalysts; and (d) optionally one or more organic solvents.
    Type: Application
    Filed: June 18, 2013
    Publication date: December 18, 2014
    Inventors: Gary E. Spilman, Jeff R. Anderson, John N. Argyropoulos, Paul Foley
  • Patent number: 8912259
    Abstract: The present disclosure provides a halogen-free thermosetting composition including a benzoxazine compound, a monobenzoxazine monomer, and a naphthalene epoxy. The halogen-free thermosetting composition is especially suited for use in aerospace, automobile, rail and marine applications.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: December 16, 2014
    Assignee: Huntsman Advanced Materials Americas LLC
    Inventor: James Hoge
  • Patent number: 8883048
    Abstract: The present invention relates to a reflector for a light-emitting device consisting of (A) an polyamide composition comprising a polyamide polymerized from (a) a dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and (b) a diamine comprising at least 50 mol % of a diamine with a branched main chain.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: November 11, 2014
    Assignees: Asahi Kasei Chemicals Corporation, Nichia Corporation
    Inventors: Kazuhiko Hashimoto, Kazunori Terada, Masafumi Kuramoto, Motohisa Kitani
  • Patent number: 8877888
    Abstract: A polyamide modified by a multi-functional compound, and a method for producing said polyamide and compositions comprising same are described. A method for the production of a polyamide comprising linear macromolecular chains and star-shaped macromolecular chains is also described. A resulting polyamide having optimal mechanical and rheological properties in order to (i) improve mould filling speed and quality, and (ii) produce moldable compositions with high filler contents is also described.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: November 4, 2014
    Assignee: Rhodia Operations
    Inventors: Franco Speroni, Damien Zaher
  • Patent number: 8877324
    Abstract: One aspect of the present invention relates to the use of a polyamide as a binder for printing inks, wherein the polyamide is a reaction product (P) of (1) one or more compounds which are chosen from the group of primary and/or secondary monoamines and polyamines with (2) a dimer fatty acid and (3) a carboxylic monoacid, with the proviso that the dimer fatty acid (2) building block of (P) contains at least 30% by weight of monomer fatty acid.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: November 4, 2014
    Assignee: Cognis IP Management GmbH
    Inventors: Dharakumar Metla, Vasudevan Balasubramaniam, Matthew Bianchi
  • Patent number: 8871862
    Abstract: A molding compound, containing at least 30% by weight of a copolyamide, which is derived from the following monomers: a) 50 to 95 mole percent of the combination of a diamine, selected from the group consisting of 1,9-nonane diamine, 1,10-decane diamine, 1,11-undecane diamine and 1,12-dodecane diamine, and terephthalic acid, and b) 5 to 50 mole percent of the combination of a diamine, selected from the group consisting of 2,2,4-trimethylhexamethylene diamine, 2,4,4-trimethylhexamethylene diamine, and mixtures thereof, and terephthalic acid. The copolyamide is crystalline and has low water absorption.
    Type: Grant
    Filed: July 8, 2010
    Date of Patent: October 28, 2014
    Assignee: Evonik Degussa GmbH
    Inventors: Andreas Pawlik, Martin Roos, Franz-Erich Baumann, Harald Haeger
  • Publication number: 20140316062
    Abstract: A process for the production of a polyamide containing monomeric units of 1,4-butylene diamine, an aliphatic dicarboxylic acid having 6-12 carbon atoms and a fatty acid based dicarboxylic acid and/or diamine derived there from, which process comprises the steps of: a) making an aquous salt mixture containing 1,4-butylene diamine, the aliphatic dicarboxylic acid having 6-12 carbon atoms and the fatty acid based dicarboxylic acid and/or diamine derived there from, the mixture containing less than 50 wt % water and distilling the mixture to less than 15 wt % of water at a pressure of less than 16 barg, while keeping the mixture at a temperature high enough to keep it liquid, b) starting the polymerization of the mixture obtained in step a) by increasing the temperature until to at least 180° C.
    Type: Application
    Filed: February 10, 2012
    Publication date: October 23, 2014
    Applicant: DSM IP ASSETS B.V.
    Inventors: Pim Gerard Anton Janssen, Rudy Rulkens, Godefridus Bernardus Wilhelmus Leonardus Ligthart
  • Publication number: 20140316063
    Abstract: A method for producing a composite material, including an assembly of one or a plurality of synthetic reinforcement fibres, impregnated with at least one thermoplastic polymer having a vitreous transition temperature Tg greater than or equal to 80° C. including: i) a step of impregnating said assembly with a precursor composition in the molten state and including: a) at least one prepolymer P(X)n of said thermoplastic polymer, including a molecular chain P having, at the ends n thereof, identical reactive functions X, said prepolymer having a semi-aromatic and/or semi-cycloaliphatic structure, b) at least one chain extender including two identical functions Y, which are reactive with at least one of said functions X; ii) a step of polymerisation by mass (poly)addition, in the molten state, of said prepolymer with said chain extender, with said thermoplastic polymer of the thermoplastic matrix being the result of said polymerisation by mass polyaddition.
    Type: Application
    Filed: October 23, 2012
    Publication date: October 23, 2014
    Applicant: ARKEMA FRANCE
    Inventors: Gilles Hochstetter, Thierry Briffaud, Michel Glotin, Pierre Nogues, Maliha Khusrawy
  • Publication number: 20140305597
    Abstract: This disclosure, viewed from one aspect, relates to a solution of polyamide comprising: an aromatic polyamide; and a solvent; wherein elastic modulus at 30.0° C. of a cast film formed by applying the solution onto a glass plate is 5.0 GPa or less, and coefficient of thermal expansion (CTE) of the cast film is more than 30 ppm/K, and wherein the aromatic copolyamide comprises at least two repeat units, and at least one of the repeat units has one or more free carboxyl groups.
    Type: Application
    Filed: April 14, 2014
    Publication date: October 16, 2014
    Applicants: Akron Polymer Systems, Inc., Sumitomo Bakelite Co., Ltd.
    Inventors: Frank W. HARRIS, Dong Zhang, Limin Sun, Jiaokai Jing, Hideo Umeda, Ritsuya Kawasaki, Toshihiko Katayama, Yusuke Inoue, Jun Okada, Mizuho Inoue, Manabu Naito
  • Patent number: 8859677
    Abstract: The present invention provides a dispersant of formula (1): T-V-(A)n, -U-Z-W, Formula (1) wherein, T is a polymerization terminating group; V is a direct bond or divalent linking group; A is the residue of one or more different hydroxy carboxylic acids or lactones thereof, U is a direct bond or a divalent linkage; Z is the residue of a polyamine or polyimine; W is the residue of an oxide or urea; m is from 2 to 2000; and x is from 1 up to the maximum number of available amino and/or imino groups in Z which do not carry the group T-V-(A)n, -U-.
    Type: Grant
    Filed: December 6, 2005
    Date of Patent: October 14, 2014
    Assignee: Lubrizol Limited
    Inventor: Dean Thetford
  • Publication number: 20140303293
    Abstract: The present invention discloses a heat-resistant polyamide composition and application thereof. The composition comprises the following components in percentage by weight: 40% to 90% of heat-resistant polyamide resin, 5% to 35% of mineral fiber A, 0 to 35% of mineral filler B, 0.1% to I% of light stabilizer, 0.1% to 1% of flow modifier and 0.1% to 1% of antioxidant. In the present invention, heat-resistant polyamide resin with the ratio of amine-terminated group and carboxyl-terminated group between 0.1 and 0.8 is selected to be matched with deformed glass fibers with an aspect ratio of 2 to 6, the mineral filler B and the flow modifier to obtain the heat-resistant polyamide composition.
    Type: Application
    Filed: December 8, 2011
    Publication date: October 9, 2014
    Applicants: SHANGHAI KINGFA TECHNOLOGY DEVELOPMENT CO., LTD., KINGFA SCI & TECH CO LTD.
    Inventors: Qingfeng Yi, Sujun Jiang, Jiehong Mai, Zhingqiang Jiang, Jieming Long, Xia Yan, Kaijun Ning, Tongmin Cai
  • Publication number: 20140234532
    Abstract: This disclosure, viewed from one aspect, relates to a laminated composite material, including a glass plate and an organic resin layer. The organic resin layer is laminated on one surface of the glass plate, the organic resin is a polyamide resin, the rate of mass change of the polyamide resin from 300° C. to 400° C. measured by thermo gravimetry (TG) is 3.0% or less, and the glass transition temperature of the polyamide resin is 300° C. or more.
    Type: Application
    Filed: February 12, 2014
    Publication date: August 21, 2014
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Hideo UMEDA, Ritsuya KAWASAKI, Toshihiko KATAYAMA, Yusuke INOUE, Jun OKADA, Mizuho INOUE, Manabu NAITO
  • Publication number: 20140228489
    Abstract: A semi-aromatic polyamide including an aromatic dicarboxylic acid component, an aliphatic diamine component and a monocarboxylic acid component and having a melting point of 300° C. or higher, wherein the monocarboxylic acid component includes a monocarboxylic acid having a molecular weight of 140 or more, and the content of the monocarboxylic acid component is 1 to 8% by mass.
    Type: Application
    Filed: September 6, 2012
    Publication date: August 14, 2014
    Applicant: UNITIKA LTD.
    Inventors: Makoto Nakai, Mariko Morimoto, Ryosuke Kobayashi, Yuji Kitora
  • Publication number: 20140194570
    Abstract: There is provided a production method of a crystalline polyamide resin by thermal polycondensation of a mixture including at least a diamine component, a dicarboxylic acid component and water as a starting material, wherein the diamine component includes (A) pentamethylene diamine at a ratio that is equal to or greater than 10 mol % and less than 80 mol % relative to a gross amount of the diamine component; and the dicarboxylic acid component includes (B) at least one selected from the group consisting of an aromatic dicarboxylic acid, an alicyclic dicarboxylic acid and dialkyl ester derivatives thereof at a ratio that is equal to or greater than 76 mol % and equal to or less than 100 mol % relative to a gross amount of the dicarboxylic acid component, the production method comprising: a first step that heats the above mixture, which has a water content equal to or less than 30% by weight, at a temperature equal to or higher than 200° C. under a pressure of 1.8 to 3.
    Type: Application
    Filed: August 13, 2012
    Publication date: July 10, 2014
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Koya Kato, Atsushi Masunaga, Eri Hatano, Hideo Matsuoka
  • Publication number: 20140194569
    Abstract: Provided is a thin-wall article formed from a polyamide resin which can be stably produced with little variation in mechanical properties such as flexural strength, flexural modulus and impact resistance. A thin-wall article formed by molding a polyamide resin (C) obtained by polycondensing a diamine (A) and a dicarboxylic acid (B) or a polyamide resin composition containing the polyamide resin, wherein 70 mol % or more of a diamine structural unit is derived from xylylenediamine and the polyamide resin has a melt viscosity (i) of 50 to 200 Pa·s as measured at a temperature of the melting point plus 10° C. for a holding time of 6 minutes at a shear rate of 122 sec?1.
    Type: Application
    Filed: August 7, 2012
    Publication date: July 10, 2014
    Applicant: Mitsubishi Gas Chemical Compamy, Inc.
    Inventors: Jun Mitadera, Takahiro Takano
  • Patent number: 8772383
    Abstract: The present invention provides a material for alignment layer of liquid crystal display, which includes a solvent and a polymer dissolved in the solvent. The polymer includes a backbone and a first side chain linked to the backbone. The first side chain has a stronger lateral dipole moment. The material for alignment layer of liquid crystal display is characterized in that a first side chain that contains both a flexible chain segment and rigid chain segment is linked to the backbone of the polymer and the first side chain has a stronger lateral dipole moment, making it taking a rotation or tilting motion under the application of an electric field so as to effect alignment of the liquid crystal molecules in the pre-tilt angle.
    Type: Grant
    Filed: August 3, 2012
    Date of Patent: July 8, 2014
    Assignee: Shenzhen China Star Optoelectronics Technology co., Ltd.
    Inventors: Xinhui Zhong, Hongji Huang, Kuancheng Lee
  • Publication number: 20140175683
    Abstract: This disclosure, viewed from one aspect, relates to a solution of polyamide comprising: an aromatic polyamide, silane coupling agent and a solvent. The solution of polyamide can improve adhesion between the polyamide film and the base of glass or silicon wafer.
    Type: Application
    Filed: December 24, 2013
    Publication date: June 26, 2014
    Applicants: Akron Polymer Systems, Inc., Sumitomo Bakelite Co., Ltd.
    Inventors: Frank W. HARRIS, Dong ZHANG, Limin SUN, Jiaokai JING, Hideo UMEDA, Jun OKADA
  • Publication number: 20140179866
    Abstract: What is described is the use of a polyamide moulding composition for the production of a stain-resistant article, the staining tendency (ST) of the article being at most 15. Here, the composition contains 30-100% by weight of a polyamide mixture, consisting of more than 50 and up to 98% by weight of at least one semi-aromatic polyamide comprising 2 to up to 50% by weight of amorphous and/or microcrystalline polyamides having a glass transition temperature of at least 100° C., based on: 20-100 mol % of at least one cycloaliphatic diamine; and 0-80 mol % of at least one other aliphatic and/or aromatic diamine; and also aromatic and/or aliphatic dicarboxylic acids comprising at least 6 carbon atoms. In addition, 0-70% by weight of fibrous additives (B1) and/or particulate additives (B2), 0-30% by weight of impact toughness modifier and/or polymers different from (A), 0-25% by weight of a flame retardant, and 0-3% by weight of additives may also be contained.
    Type: Application
    Filed: April 12, 2013
    Publication date: June 26, 2014
    Applicant: EMS-PATENT AG
    Inventors: Mark PFLEGHAR, Etienne AEPLI, Heinz HOFF, Botho HOFFMANN
  • Publication number: 20140179850
    Abstract: What is described is the use of a polyamide moulding composition for the production of a stain-resistant article, the staining tendency (ST) of the article being at least 2. Here, the composition contains 30-100% by weight of a polyamide or a polyamide mixture, consisting of 50-100% by weight of at least one amorphous and/or microcrystalline polyamide having a glass transition temperature of at least 100° C., based on: 20-100 mol % of at least one cycloaliphatic diamine; and 0-80 mol % of at least one other aliphatic and/or aromatic diamine; and also aromatic and/or aliphatic dicarboxylic acids comprising at least 6 carbon atoms, and 0-50% by weight of at least one semi-aromatic polyamide. In addition the moulding composition comprises 0.01-20% by weight of one or several inorganic white pigments.
    Type: Application
    Filed: December 20, 2013
    Publication date: June 26, 2014
    Applicant: EMS-PATENT AG
    Inventors: Etienne Aepli, Mark Pfleghar, Botho Hoffman, Heinz Hoff
  • Publication number: 20140179851
    Abstract: A polyamide moulding composition for the production of a stain-resistant article, the staining tendency (ST) of the article being at most 15. The composition contains 30-100% by weight of a polyamide mixture, consisting of more than 50 and up to 98% by weight of at least one semi-aromatic polyamide comprising 2 to up to 50% by weight of amorphous and/or microcrystalline polyamides having a glass transition temperature of at least 100° C., based on: 20-100 mol % of at least one cycloaliphatic diamine; and 0-80 mol % of at least one other aliphatic and/or aromatic diamine; and also aromatic and/or aliphatic dicarboxylic acids comprising at least 6 carbon atoms. In addition, the composition comprises inorganic white pigments. fibrous or particulate additives, impact toughness modifier and/or polymers different from (A), 0-25% by weight of a flame retardant.
    Type: Application
    Filed: December 20, 2013
    Publication date: June 26, 2014
    Applicant: EMS-PATENT AG
    Inventors: Mark PFLEGHAR, Etienne AEPLI, Heinz HOFF, Botho HOFFMANN
  • Publication number: 20140170418
    Abstract: Anti-corrosion coatings comprising electroconductive polymers polymerized in the presence of one or more film forming polymers are provided. These coatings can be used with metal substrates such as cold-rolled steel and other metals to inhibit corrosion.
    Type: Application
    Filed: May 23, 2012
    Publication date: June 19, 2014
    Applicant: AXALTA COATING SYSTEMS IP CO., LLC
    Inventors: Simona Percec, Susan H. Tilford, Kayleigh J. Ferguson
  • Publication number: 20140170355
    Abstract: Disclosed is a transparent thermoplastic container including a thermoplastic composition including: A) a polyamide resin including a) 10 to 40 mol % of a first repeat unit of formula (I), and b) 60 to 90 mol % of a second repeat unit selected from the group consisting of formula (II) —C(O)(CH2)nC(O)NH(CH2)6NH—??(II); wherein n is an integer selected from 10, 12, and 14; and the mol % of repeat units are based on the total repeat units present in the copolyamide; optionally, B) an aliphatic homopolyamide having one repeat unit selected from the group of formula (II) and C) a functional additive,
    Type: Application
    Filed: December 6, 2013
    Publication date: June 19, 2014
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: SHAILESH RATILAL DOSHI
  • Publication number: 20140127440
    Abstract: The present invention relates to components of mobile electronic devices made of an amorphous polyamide composition characterized by excellent mechanical properties, low moisture uptake, low distortion and very good aesthetical properties. The amorphous polyamide has recurring units derived from the polycondensation of a mixture of monomers of aromatic dicarboxylic acid(s), cycloaliphatic diamine(s) with 6 to 12 carbon atoms, and a third monomer with 10 to 16 carbon atoms.
    Type: Application
    Filed: November 6, 2013
    Publication date: May 8, 2014
    Applicant: SOLVAY SPECIALTY POLYMERS USA, LLC.
    Inventors: Linda M. Norfolk, Geert J. Verfaillie, Rahul Shingte, Soumyadeb Ghosh, Rajdeep Majumder, Jignesh Markandray Shukla, Gururajan Padmanaban, Joel Flores, Suresh R. Sriram
  • Patent number: 8710132
    Abstract: Disclosed is a flame-retardant polyamide composition excellent in fluidity during molding and granulation ability on a twin-screw extruder or the like. A molded article produced from the composition is excellent in mechanical properties including stiffness, heat resistance and flame retardancy during a reflow soldering process, and shows low warpage. Specifically disclosed is a flame-retardant polyamide composition comprising 20 to 80 mass % of a specific polyamide resin (A), 1 to 40 mass % of a flame retardant (B), 5 to 60 mass % of a glass fiber (C), and 0.5 to 5 mass % of an auxiliary flame retardant (D), which can be molded in an article having reduced warpage. Preferably, the glass fiber (C) has a cross section having an aspect ratio of greater than 3.
    Type: Grant
    Filed: November 19, 2007
    Date of Patent: April 29, 2014
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Hideto Ogasawara, Masashi Seki