Contacting With Aldehyde Or Aldehyde-type Reactant Or Polymer Therefrom Patents (Class 525/134)
  • Patent number: 9388297
    Abstract: A process for making a phosphorus-containing compound is disclosed. The process comprises contacting a compound of formula (A) wherein RA and RB are selected from optionally substituted aryl, aryloxy, alkyl and alkoxy groups or can be combined to form cyclic structures; and RC is methyl, ethyl, isopropyl, n-butyl, i-butyl, t-butyl, phenyl or benzyl; and a compound of formula (B) wherein R1-R4 are selected from optionally substituted aryl, aryloxy, alkyl and alkoxy groups. The phosphorus-containing compound can then be used as a flame retardants for polymers, especially for epoxy, polyurethane, thermosetting resins and thermoplastic polymers. Such flame retardant-containing polymers can be used to make protective coating formulations and ignition-resistant fabricated articles, such as electrical laminates, polyurethane foams, and various molded and/or foamed thermoplastic products.
    Type: Grant
    Filed: May 1, 2012
    Date of Patent: July 12, 2016
    Assignee: BLUE CUBE IP LLC
    Inventors: Anteneh Z. Worku, Michael J. Mullins
  • Patent number: 8617930
    Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: December 31, 2013
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Teiichi Inada, Michio Mashino, Michio Uruno
  • Patent number: 8563661
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: October 22, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Patent number: 8450446
    Abstract: Rosin modified phenolic resins are prepared by reacting together resin acid, fatty acid, tri- or higher-functional phenolic compound and aldehyde. The fatty acid may be Monomer (derived from the fatty acid dimerization process). The reaction mixture may optionally include a,l3-olefinically unsaturated carbonyl compounds and/or polyol. The resin may be dissolved in a solvent to form a varnish. The resin may be used as a component of printing inks, e.g., inks for lithographic or gravure printing.
    Type: Grant
    Filed: August 27, 2007
    Date of Patent: May 28, 2013
    Assignee: Arizona Chemical Company, LLC
    Inventor: Thomas Fontana
  • Patent number: 8372916
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: February 12, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Patent number: 8268929
    Abstract: A resin composition comprises (a) 100 parts by weight of at least one compound selected from the group consisting of phenol resins and brominated phenol resins, (b) 20 to 500 parts by weight of a crystalline olefin resin, provides that copolymers of ethylene with unsaturated carboxylic acid ester or vinyl acetate are precluded, and (c) 0 to 300 parts by weight of a non-aromatic softening agent for rubber. The resin composition is easy to handle in dynamic cross-linking of rubber or a thermoplastic elastomer to give uniform cross-linking. A cross-linked rubber composition or thermoplastic elastomer composition has improved compression set and moldability.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: September 18, 2012
    Assignee: Riken Technos Corporation
    Inventor: Naoyuki Ono
  • Patent number: 8158743
    Abstract: Rosin modified phenolic resins are prepared by reacting together rosin, fatty acid, phenol and aldehyde. The fatty acid may be Monomer (derived from the fatty acid dimerization process). The reaction mixture may optionally include ?,?-olefinically unsaturated carboxylic acid(s) or anhydride(s), and polyol(s). The resin may be dissolved in a solvent to form a varnish. The resin may be used as a component of inks for lithographic or gravure printing.
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: April 17, 2012
    Assignee: Arizona Chemical Company, LLC
    Inventor: Thomas A. Fontana
  • Patent number: 7968195
    Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: June 28, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Teiichi Inada, Michio Mashino, Michio Uruno
  • Patent number: 7968194
    Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: June 28, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Teiichi Inada, Michio Mashino, Michio Uruno
  • Patent number: 7939609
    Abstract: A redispersible polymer powder including: a polymer to be redispersed; and an ortho-cresol based condensation product or salt thereof; wherein the ortho-cresol based condensation product or salt thereof includes N-containing units derived from a N-based component incorporated into the ortho-cresol based condensation product or salt thereof during polymerization.
    Type: Grant
    Filed: September 22, 2005
    Date of Patent: May 10, 2011
    Assignee: Acquos Pty Ltd
    Inventor: Valentino De Fazio
  • Patent number: 7927691
    Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.
    Type: Grant
    Filed: April 3, 2009
    Date of Patent: April 19, 2011
    Assignee: E.I. du Pont de Nemours and Company
    Inventors: Subhotosh Khan, Halvar Young Loken
  • Patent number: 7439304
    Abstract: A composition comprising (i) a dynamically-cured rubber, (ii) from about 20 to about 300 parts by weight of a thermoplastic resin per 100 parts by weight rubber, (iii) from 0.2 to 0.9 parts by weight stannous chloride per 100 parts by weight rubber, and (iv) from 0.25 to 4.0 parts by weight metal oxide per 100 parts by weight rubber.
    Type: Grant
    Filed: September 1, 2004
    Date of Patent: October 21, 2008
    Assignee: Advanced Elastomer Systems, L.P.
    Inventors: Maria D. Ellul, Christopher Hrbacek
  • Patent number: 7105601
    Abstract: An adhesive resin composition comprising, based on the total weight of the composition, a first resin component having one or more glass transition temperatures of about ?15 to about 50° C.; optionally, up to about 49 weight percent of a second resin component having one or more glass transition temperatures greater than about 100° C.; and up to about 50 weight percent of a particulate inorganic filler; wherein a tan ? value of the adhesive resin composition is greater than about 0.2 over a temperature range of about ?15 to about 50° C. when measured at a frequency of 1 Hz. The adhesive resin compostions are of particular utility in suspension assemblies.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: September 12, 2006
    Assignee: World Properties, Inc.
    Inventors: Hong-Fei David Guo, Robert Henry Walker, III
  • Patent number: 6875807
    Abstract: A silane-modified phenolic resin is prepared by reacting a phenolic compound (e.g., resorcinol) with an aldehyde to produce a phenolic novolak resin. The phenolic novolak resin is further reacted with at least one silane compound to produce the silane-modified phenolic resin. The reaction is typically carried out in the presence of an acid or base catalyst. The resulting resin has a lower softening point and can be used as a methylene acceptor compound in a vulcanizable rubber composition.
    Type: Grant
    Filed: May 28, 2003
    Date of Patent: April 5, 2005
    Assignee: Indspec Chemical Corporation
    Inventors: Raj B. Durairaj, C. Michael Walkup, Mark A. Lawrence
  • Patent number: 6827872
    Abstract: A procedure for removing a water-insoluble finish from aramide fibers, wherein the aramide fibers are present as short-cut, random fibers or flat textile materials and are treated with an agent that contains at least one hydrophilic fluid.
    Type: Grant
    Filed: January 30, 2002
    Date of Patent: December 7, 2004
    Assignee: Teijin Twaron GmbH
    Inventor: Michael H. Schmitt
  • Patent number: 6828383
    Abstract: A vulcanizable rubber composition comprises (a) a rubber component; (b) a methylene donor compound; and (c) a methylene acceptor comprising a blend of a high ortho-ortho bonded phenolic novolak resin and a resorcinolic resin. The resin blend can be made by a number of methods. For example, it can be prepared by first reacting one or more phenolic compounds represented by the following formula: where R is selected from the group consisting of H, an alkyl group chain of 1-16 carbon atoms and an aralkyl group of 8-12 carbon atoms with an aldehyde in the presence of an ortho directing catalyst and then combining a resorcinol-formaldehyde novolak resin to obtain a phenolic and resorcinolic novolak resin blend.
    Type: Grant
    Filed: February 18, 2003
    Date of Patent: December 7, 2004
    Assignee: Occidental Petroleum
    Inventors: Raj B. Durairaj, C. Michael Walkup, Mark A. Lawrence
  • Patent number: 6828079
    Abstract: A chemical amplification type positive resist composition comprising a novolak resin, a resin insoluble or poorly soluble itself in an alkali aqueous solution but becoming soluble in an alkali aqueous solution by the action of an acid, and an acid generator, wherein when the novolak resin is measured by gel permeation chromatography (GPC) using a 254 nm UV detector using polystyrene as a standard, the area ratio of components having molecular weights of 1000 or less is 25% or less based on the total pattern area excepting unreacted monomers; and the chemical amplification type positive resist composition can reduce cost without deteriorating basic abilities such as sensitivity, resolution and the like, and shows small unevenness due to standing wave, and can improved pattern profile, particularly, line edge roughness.
    Type: Grant
    Filed: September 4, 2002
    Date of Patent: December 7, 2004
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Masumi Suetsugu, Airi Yamada, Yasunori Uetani
  • Publication number: 20040229999
    Abstract: The present invention relates to hydrogenated carboxylated nitrile-butadiene rubber (HXNBR), which contain molecularly dispersed triphenylphosphine, and which is useful as a cross-linking agent for elastomers, plastics and/or adhesive systems. The present invention also relates to products which are obtainable from the HXNBR having molecularly dispersed triphenylphosphine and elastomer, plastics and/or adhesive systems, a composition containing a HXNBR having molecularly dispersed triphenylphosphine and further non-molecularly dispersed activators, a process for the preparation of the composition as well as the use of HXNBR having molecularly dispersed triphenylphosphine, as an elasticizing agent for elastomer, plastics and/or adhesive systems.
    Type: Application
    Filed: May 11, 2004
    Publication date: November 18, 2004
    Inventors: Dirk Achten, Hans-Rafael Winkelbach, Martin Mezger
  • Patent number: 6808810
    Abstract: A resin composition comprising 3 to 80 parts by weight of a resol type phenolic resin or 3 to 150 parts by weight of a polyhydric phenol, based on 100 parts by weight of a copolymer (Å) of an epoxy group-containing monomer and an &agr;-olefin, a powder of the resin composition, a laminate having a layer containing the resin composition, and producing method of the laminate.
    Type: Grant
    Filed: December 19, 2001
    Date of Patent: October 26, 2004
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Kohsuke Ohtani, Hikaru Shimizu
  • Publication number: 20040116592
    Abstract: A vulcanizable rubber composition comprises (a) a rubber component; (b) a methylene donor compound; and (c) a methylene acceptor comprising a blend of a high ortho-ortho bonded phenolic novolak resin and a resorcinolic resin. The resin blend can be made by a number of methods.
    Type: Application
    Filed: February 18, 2003
    Publication date: June 17, 2004
    Applicant: INDSPEC Chemical Corporation
    Inventors: Raj Durairaj, C. Michael Walkup, Mark A. Lawrence
  • Patent number: 6723778
    Abstract: An aqueous composition that includes (A) a butadiene polymer latex that is prepared by an emulsion polymerization in the presence of a styrene sulfonate stabilizer and (B) a phenolic resin. A preferred aqueous butadiene polymer latex is one that is prepared by emulsion polymerization of at least 60 weight percent dichlorobutadiene monomer (based on the amount of total monomers used to form the butadiene polymer), in the presence of a styrene sulfonate stabilizer.
    Type: Grant
    Filed: March 20, 2002
    Date of Patent: April 20, 2004
    Assignee: Lord Corporation
    Inventors: Helmut W. Kucera, Thomas Rizzo
  • Patent number: 6686418
    Abstract: A process for reducing the heat evolution on dynamic stressing of vulcanised rubber products, using for this purpose, in vulcanizable rubber mixtures, mixtures made from non-selfcuring novolaks A and from unetherified or partially etherified triazine resins B, as a combination of reinforcing resin and curing agent.
    Type: Grant
    Filed: May 22, 2001
    Date of Patent: February 3, 2004
    Assignee: Solutia Germany GmbH & Co. KG
    Inventors: Siegfried Wallenwein, Frank Scholl, Helmut Eckes
  • Patent number: 6653374
    Abstract: The flameproof thermoplastic resin composition of the present invention comprises (A) 40 to 95 parts by weight of a rubber modified styrene-containing resin composed of (a1) 20 to 100% by weight of a styrene-containing graft copolymer resin including 18 to 50% by weight of acrylonitrile in the copolymer excluding rubber; and (a2) 0 to 80% by weight of a styrene-containing copolymer resin containing 18 to 50% by weight of acrylonitrile; (B) 5 to 60 parts by weight of polyphenylene ether resin; (C) 2 to 40 parts by weight of a styrene-containing copolymer or styrene-containing graft copolymer resin containing 5 to 18% by weight of acrylonitrile per 100 parts by weight of the sum of (A) and (B); and (D) 5 to 30 parts by weight of an aromatic phosphoric acid ester compound per 100 parts by weight of the sum of (A) and (B).
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: November 25, 2003
    Assignee: Cheil Industries Inc.
    Inventors: Bok-Nam Jang, Se-Jong Kim, Young-Kil Chang, Gyu-Cheol Lee
  • Patent number: 6472457
    Abstract: Methods for preparing formaldehyde-free resorcinol resins are disclosed. The methods generally comprise reacting resorcinol first with dicyclopentadiene and then reacting that mixture with an olefinic compound. The resins produced by this method are also disclosed, as are rubber compositions utilizing the present resins. The resins are characterized as having a free resorcinol content of about 1 wt. % or less, and yielding a suitable softening point when used in rubber applications.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: October 29, 2002
    Assignee: Indspec Chemical Corporation
    Inventors: Raj B. Durairaj, Alex Peterson, Jr.
  • Patent number: 6437030
    Abstract: A process for forming a thermoplastic vulcanizate compromising the steps of dynamically vulcanizing a rubber within a blend that comprises the rubber and a thermoplastic polymer, where said step of vulcanizing is carried out by using a phenolic resin in the presence of a catalyst system formed by combining a metal halide and a metal carboxylate. Also, a thermoplastic vulcanizate having low moisture pick-up with a technologically useful cure.
    Type: Grant
    Filed: May 24, 2000
    Date of Patent: August 20, 2002
    Assignee: Advanced Elastomer Systems, L.P.
    Inventors: Aubert Coran, Sabet Abdou-Sabet
  • Patent number: 6403713
    Abstract: The present invention provides a novel improved method for crosslinking an isoprene-isobutylene rubber, an ethylene-propylene-diene rubber containing ethylidenenorbornene as an unsaturated component, or a mixture of an isoprene-isobutylene rubber and an ethylene-propylene-diene rubber containing ethylidenenorbornene as an unsaturated component, which method comprises thermally crosslinking the above rubber or rubber mixture using an alkylphenol-formaldehyde resin, 3-(N-salicyloyl)amino-1,2,4-triazole and, as necessary, a hydrazide compound. The method can produce a crosslinked rubber product low in compression set and corrosivity to metals, without using any halogen compound as a crosslinking co-agent.
    Type: Grant
    Filed: February 14, 2001
    Date of Patent: June 11, 2002
    Inventor: Masao Onizawa
  • Patent number: 6379800
    Abstract: Glyoxal-phenolic condensates, epoxidized products thereof, as well as their method of manufacture are disclosed. The condensates and epoxidized products have exceptionally high fluorescence as well as good ultraviolet absorbance. There is also disclosed compositions and laminates containing the condensates and epoxidized products thereof.
    Type: Grant
    Filed: January 20, 2001
    Date of Patent: April 30, 2002
    Assignee: Borden Chemical, Inc.
    Inventor: Arthur H. Gerber
  • Publication number: 20020022694
    Abstract: A process for reducing the heat evolution on dynamic stressing of vulcanised rubber products, using for this purpose, in vulcanizable rubber mixtures, mixtures made from non-selfcuring novolaks A and from unetherified or partially etherified triazine resins B, as a combination of reinforcing resin and curing agent.
    Type: Application
    Filed: May 22, 2001
    Publication date: February 21, 2002
    Inventors: Siegfried Wallenwein, Frank Scholl, Helmut Eckes
  • Patent number: 6316583
    Abstract: The specification discloses a method for the manufacture of a fluorescent polyphenolic product with high UV absorbance, its subsequent epoxidation as well as polyphenolic products and epoxidized derivatives and compositions thereof. The polyphenolic products are prepared by heating glyoxal at a temperature of about 80° C. to about 100° C. with a molar excess of a phenol in the presence of an acidic catalyst which is eliminated from the reaction mixture at a temperature below about 170° C. The total mole ratio of glyoxal to phenol charged to the reaction mixture is about 0.15 to 0.22 moles of glyoxal for each mole of phenol. The glyoxal is added continuously or by stepwise additions to the phenol so as to keep the aldehyde units in the reaction mixture to less than about 70% of the aldehyde units in the total quantity of glyoxal to be charged for making the polyphenol. Water is distilled stepwise or continuously from the reaction mixture.
    Type: Grant
    Filed: December 13, 2000
    Date of Patent: November 13, 2001
    Assignee: Borden Chemical, Inc.
    Inventor: Arthur H. Gerber
  • Patent number: 6265491
    Abstract: A curable composition including a thermoset resin a curing agent component, an amount of a thermoplast component having reactive pendant and/or end groups, an organometallic curing catalyst component. The organometallic curing catalyst component is capable of forming cross-links with reactive pendant and/or end groups of the thermoset and thermoplast resins and comprises an organometallic complex compound of the formula I=M(R)n, where M is selected from titanium, zirconium, hafnium, cerium, vanadium, niobium, R is selected from mono-, bi- and tri and/or tetra dentate organic ligands and n is four or six.
    Type: Grant
    Filed: June 14, 1999
    Date of Patent: July 24, 2001
    Assignee: Cytec Technology Corp.
    Inventors: Jeffrey T. Carter, Patrick Terence McGrail
  • Patent number: 6239248
    Abstract: The specification discloses a method for the manufacture of a fluorescent polyphenolic product with high UV absorbance, its subsequent epoxidation, polyphenolic products, epoxidized derivatives and compositions thereof as well as laminates containing fluorescent polyphenolic products and derivatives thereof. The polyphenolic products are prepared by heating glyoxal at a temperature of about 80° C. to about 100° C. with a molar excess of a phenol in the presence of an acidic catalyst which is eliminated from the reaction mixture at a temperature below about 170° C. The total mole ratio of glyoxal to phenol charged to the reaction mixture is about 0.15 to 0.22 moles of glyoxal for each mole of phenol. The glyoxal is added continuously or by stepwise additions to the phenol so as to keep the aldehyde units in the reaction mixture to less than about 70% of the aldehyde units in the total quantity of glyoxal to be charged for making the polyphenol.
    Type: Grant
    Filed: April 23, 1999
    Date of Patent: May 29, 2001
    Assignee: Borden Chemical, Inc.
    Inventor: Arthur H. Gerber
  • Patent number: 6232399
    Abstract: The specification discloses a method for the manufacture of a fluorescent polyphenolic product with high UV absorbance, its subsequent epoxidation as well as polyphenolic products and epoxidized derivatives and compositions thereof. The polyphenolic products are prepared by heating glyoxal at a temperature of about 80° C. to about 100° C. with a molar excess of a phenol in the presence of an acidic catalyst which is eliminated from the reaction mixture at a temperature below about 170° C. The total mole ratio of glyoxal to phenol charged to the reaction mixture is about 0.15 to 0.22 moles of glyoxal for each mole of phenol. The glyoxal is added continuously or by stepwise additions to the phenol so as to keep the aldehyde units in the reaction mixture to less than about 70% of the aldehyde units in the total quantity of glyoxal to be charged for making the polyphenol. Water is distilled stepwise or continuously from the reaction mixture.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: May 15, 2001
    Assignee: Borden Chemical, Inc.
    Inventor: Arthur H. Gerber
  • Patent number: 6201094
    Abstract: The specification discloses epoxidized products and compositions of a polyphenol of a phenol and glyoxal wherein the polyphenol prior to epoxidation has an ultraviolet (UV) absorbance of at lest 0.260 at 365 nanometers (nm) and/or at least 0.400 at 350 nm.
    Type: Grant
    Filed: October 20, 1999
    Date of Patent: March 13, 2001
    Assignee: Borden Chemical, Inc.
    Inventor: Arthur H. Gerber
  • Patent number: 6140421
    Abstract: The specification discloses a method for the manufacture of a fluorescent polyphenolic product with high UV absorbance, its subsequent epoxidation as well as polyphenolic products and epoxidized derivatives and compositions thereof. The polyphenolic products are prepared by heating glyoxal at a temperature of about 80.degree. C. to about 100.degree. C. with a molar excess of a phenol in the presence of an acidic catalyst which is eliminated from the reaction mixture at a temperature below about 170.degree. C. The total mole ratio of glyoxal to phenol charged to the reaction mixture is about 0.15 to 0.22 moles of glyoxal for each mole of phenol. The glyoxal is added continuously or by stepwise additions to the phenol so as to keep the aldehyde units in the reaction mixture to less than about 70% of the aldehyde units in the total quantity of glyoxal to be charged for making the polyphenol. Water is distilled stepwise or continuously from the reaction mixture.
    Type: Grant
    Filed: September 23, 1999
    Date of Patent: October 31, 2000
    Assignee: Borden Chemical, Inc.
    Inventor: Arthur Harry Gerber
  • Patent number: 6093778
    Abstract: A composition comprises organoborane polyamine complex and polyol. The composition can form a part of a polymerization initiator system that also includes polyisocyanate. The system can be used to initiate polymerization of acrylic monomer and to form a polyurethane/polyurea acrylic adhesive that has exceptionally good adhesion to low surface energy polymers.
    Type: Grant
    Filed: September 8, 1999
    Date of Patent: July 25, 2000
    Assignee: 3M Innovative Properties Company
    Inventor: Alphonsus V. Pocius
  • Patent number: 6034180
    Abstract: A resin composition which comprises 50-97% by weight of thermoplastic resin with a melting or softening point of about 330.degree. C. or below and 3-50% by weight of cured phenolic resin, in the form of powder, with an average particle diameter of about 500 .mu.m or below. This resin composition is moldable into a sliding member having excellent mechanical properties in an aqueous environment and provides economical merit.
    Type: Grant
    Filed: March 5, 1998
    Date of Patent: March 7, 2000
    Assignee: NOK Corporation
    Inventors: Toshinori Suzuki, Katsutoshi Ishioka
  • Patent number: 6008308
    Abstract: A composition comprises organoborane polyamine complex and polyol. The composition can form a part of a polymerization initiator system that also includes polyisocyanate. The system can be used to initiate polymerization of acrylic monomer and to form a polyurethane/polyurea acrylic adhesive that has exceptionally good adhesion to low surface energy polymers.
    Type: Grant
    Filed: November 7, 1997
    Date of Patent: December 28, 1999
    Assignee: 3M Innovative Properties Company
    Inventor: Alphonsus V. Pocius
  • Patent number: 6001950
    Abstract: The specification discloses a method for the manufacture of a fluorescent polyphenolic product with high UV absorbance, its subsequent epoxidation as well as polyphenolic products and epoxidized derivatives and compositions thereof. The polyphenolic products are prepared by heating glyoxal at a temperature of about 80.degree. C. to about 100.degree. C. with a molar excess of a phenol in the presence of an acidic catalyst which is eliminated from the reaction mixture at a temperature below about 170.degree. C. The total mole ratio of glyoxal to phenol charged to the reaction mixture is about 0.15 to 0.22 moles of glyoxal for each mole of phenol. The glyoxal is added continuously or by stepwise additions to the phenol so as to keep the aldehyde units in the reaction mixture to less than about 70% of the aldehyde units in the total quantity of glyoxal to be charged for making the polyphenol. Water is distilled stepwise or continuously from the reaction mixture.
    Type: Grant
    Filed: September 22, 1998
    Date of Patent: December 14, 1999
    Assignee: Borden Chemical, Inc.
    Inventor: Arthur Harry Gerber
  • Patent number: 5994484
    Abstract: A composition comprises organoborane polyamine complex and polyol. The composition can form a part of a polymerization initiator system that also includes polyisocyanate. The system can be used to initiate polymerization of acrylic monomer and to form a polyurethane/polyurea acrylic adhesive that has exceptionally good adhesion to low surface energy polymers.
    Type: Grant
    Filed: October 23, 1997
    Date of Patent: November 30, 1999
    Assignee: 3M Innovative Properties Company
    Inventor: Alphonsus V. Pocius
  • Patent number: 5891959
    Abstract: Anti-reflective coatings and methods for forming these anti-reflective coatings are disclosed that have a polymer chemistry and optical characteristics suitable for suppressing the light that reflects off a circuit substrate during a photo-lithographic process. These anti-reflective coatings include a phenolic polymer material and an epoxide-containing polymer material that can be combined in a select proportion to form a thermally curable polymeric anti-reflective coating. The select proportions of the combined materials tailors the optical characteristic of the anti-reflective coating to attenuate energy about a select range of wavelengths.
    Type: Grant
    Filed: January 27, 1997
    Date of Patent: April 6, 1999
    Assignee: Massachusetts Institute of Technology
    Inventor: Roderick R. Kunz
  • Patent number: 5863988
    Abstract: An adhesive for electronic parts, which can be used for bonding and cured at a relatively low temperature and has sufficient heat resistance and reliability, and an adhesive tape for electronic parts, for which the above adhesive is adapted, the adhesive being a liquid adhesive obtained by dissolving an acrylonitrile-butadiene copolymer as Component (a), a phenolic resin as Component (b), a compound having at least 2 maleimide groups as Component (c) and a diamine compound of the general formula (1) specified in claim 1, and/or a polysiloxane compound terminating with an amino group at each terminal, having a weight average molecular weight of 200 to 7,000 and having the general formula specified in claim 1, as Component (d) in an organic solvent, and in which the total amount of Components (b), (c) and (d) per 100 parts by weight of Component (a) is 10 to 900 parts by weight, the amount of Component (b) based on the total amount of Components (b), (c) and (d) is 10 to 90% by weight, and the amount of amino g
    Type: Grant
    Filed: December 18, 1996
    Date of Patent: January 26, 1999
    Assignee: Tomoegawa Paper Co., Ltd.
    Inventors: Takeshi Hashimoto, Katuji Nakaba, Jun Tochihira
  • Patent number: 5859169
    Abstract: Urethane-modified novolaks which are prepared by simultaneous reaction of a monohydric or polyhydric phenol (A) with an oxo compound (aldehyde or ketone) (B) and a urethane (C) in the presence of an acidic catalyst (D) at an elevated temperature of 60.degree. to 200.degree. C. and contain no interfering amounts of free starting phenol, and their use as adhesion improvers in rubbers, in particular rubbers containing reinforcing media such as steel cord or textile fibers.
    Type: Grant
    Filed: September 8, 1997
    Date of Patent: January 12, 1999
    Assignee: Vianora Resins GmbH
    Inventors: Thomas Burkhart, Siegfried Wallenwein, Gerhard Brindoepke, Gerd Walz
  • Patent number: 5726246
    Abstract: A method for improving etch resistance in a coating comprising applying to a substrate a curable coating composition comprising:(a) a first component comprising a polymer backbone having appended thereto at least one carbamate functional group, and(b) a second component comprising a compound having a plurality of functional groups that are reactive with said carbamate group, andcuring the coating composition.
    Type: Grant
    Filed: February 20, 1997
    Date of Patent: March 10, 1998
    Assignee: BASF Corporation
    Inventors: John W. Rehfuss, Donald L. St. Aubin
  • Patent number: 5686544
    Abstract: A composition comprises organoborane polyamine complex and polyol. The composition can form a part of a polymerization initiator system that also includes polyisocyanate. The system can be used to initiate polymerization of acrylic monomer and to form a polyurethane/polyurea acrylic adhesive that has exceptionally good adhesion to low surface energy polymers.
    Type: Grant
    Filed: August 11, 1995
    Date of Patent: November 11, 1997
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Alphonsus V. Pocius
  • Patent number: 5670576
    Abstract: The present invention provides a polyamide resin composition which has low water absorption and simultaneously has satisfactory combustion properties. Illustrative compositions contain 20-80 parts by weight of polyamide resin and 80-20 parts by weight of polyphenylene ether resin or a mixture of this resin and polystyrene resin, as well as 0.01-10 parts by weight of a compatibilizer, 1-50 parts by weight of an uncured phenol novolak resin, and 0-80 parts by weight of a rubber component wherein the weights of the compatibilizer, uncured phenol novolak resin and rubber component is based on a total of 100 parts by weight of polyamide and polyphenylene ether resins.
    Type: Grant
    Filed: March 11, 1996
    Date of Patent: September 23, 1997
    Assignee: General Electric Co.
    Inventors: Takayuki Takatani, Hiromi Ishida
  • Patent number: 5605962
    Abstract: A flame retarding resin composition comprising 100 parts by weight of a specific rubber-reinforced resin, 1-200 parts by weight of a phenol resin, 1-200 parts by weight of an organic phosphorus compound, 1-50 parts by weight of a nitrogen-containing compound, 0-40 parts by weight of an oligomer-type polymer containing a functional group, 0-30 parts by weight of a metal compound, a silicon compound, and/or polytetrafluoroethylene, and 0-300 parts by weight of a styrene-type resin. The composition has high impact resistance, excellent heat resistance, and a superior self-fire-extinguishing characteristic.
    Type: Grant
    Filed: February 24, 1994
    Date of Patent: February 25, 1997
    Assignee: Japan Synthetic Rubber Co., Ltd.
    Inventors: Masanori Suzuki, Hiroyuki Itoh, Koichi Sumi, Yoichi Kamoshida, Shigeru Abe, Seiichi Atomori, Tateki Furuyama
  • Patent number: 5605965
    Abstract: High gloss and/or high DOI coatings are described. The coatings are based on a curable coating composition comprising:(a) a first component comprising a polymer backbone having appended thereto at least one carbamate functional group, and(b) a second component comprising a compound having a plurality of functional groups that are reactive with said carbamate group.
    Type: Grant
    Filed: November 3, 1994
    Date of Patent: February 25, 1997
    Assignee: BASF Corporation
    Inventors: John W. Rehfuss, Donald L. St. Aubin
  • Patent number: 5552486
    Abstract: Propoxylated allyl alcohol homopolymers and copolymers of allyl alcohol and propoxylated allyl alcohol are disclosed. The polymers are soluble in many organic solvents, making them useful in a variety of applications, including polyesters, polyurethanes, alkyds, uralkyds, polyamines, acrylates, crosslinked polymeric resins, and polymer blends.
    Type: Grant
    Filed: May 25, 1995
    Date of Patent: September 3, 1996
    Assignee: ARCO Chemical Technology, L.P.
    Inventors: Shao-Hua Guo, Robert G. Gastinger
  • Patent number: 5552509
    Abstract: A phenolic resin composition herein disclosed comprises, as essential components, (i) at least one phenol resin A selected from the group consisting of residues formed through purification of bisphenol A, residues obtained by cleaving the bisphenol A-purification residue, condensates of the bisphenol A-purification residue obtained by reacting the bisphenol A-purification residue with formaldehyde and condensates of the cleavage residue obtained by reacting the cleavage residue with formaldehyde, and (ii) at least one phenolic resin B selected from the group consisting of high-boiling fraction obtained through production of bisphenol F and condensates of the high-boiling fraction obtained by reacting the high-boiling fraction with formaldehyde.
    Type: Grant
    Filed: August 31, 1993
    Date of Patent: September 3, 1996
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Tomoko Takashima, Shigeru Iimuro, Takashi Kitamura
  • Patent number: 5516843
    Abstract: An adhesion promoter composition and method for enhancing adhesion between a polysulfide polymer and a thermoplastic substrate is provided having a solid resole phenolic resin and a compatible organic solvent, optionally containing a chlorinated polyolefin.
    Type: Grant
    Filed: May 31, 1994
    Date of Patent: May 14, 1996
    Assignee: Fiber Resin Corp.
    Inventor: Steven L. Scholl