Mixed With Silicon Containing Reactant Or Polymer Derived From Patents (Class 525/431)
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Publication number: 20090297855Abstract: A non-stick coating composition comprising a waterborne phenoxy resin, a crosslinker, a silicone compound, and a Fluoropolymer. An article, such as aluminum, may be coated with the composition. The composition may be multi-layers, but only the layers other than the first layer includes the silicone compound. The invention includes the method for applying the coating or coatings.Type: ApplicationFiled: April 30, 2009Publication date: December 3, 2009Applicant: AKZO NOBEL COATINGS INTERNATIONAL B.V.Inventors: Thomas James BATE, Arthur WACHOWSKI
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Patent number: 7625976Abstract: This invention relates to a room temperature curable composition containing, inter alia, diorganopolysiloxane(s) and organic nanoclay(s), the cured composition exhibiting low permeability to gas(es).Type: GrantFiled: January 9, 2006Date of Patent: December 1, 2009Assignee: Momemtive Performance Materials Inc.Inventors: Shayne J. Landon, David A. Williams, Vikram Kumar, Edward J. Nesakumar, Indumathi Ramakrishnan
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Patent number: 7612143Abstract: Metallized nanostructured chemicals are incorporated at the molecular level as alloying agents for the reinforcement of polymer microstructures, including polymer coils, domains, chains, and segments. Direct blending processes are effective because of the tailorable compatibility of the metallized nanostructured chemicals with polymers.Type: GrantFiled: August 21, 2006Date of Patent: November 3, 2009Assignee: Hybrid Plastics, Inc.Inventors: Joseph D. Lichtenhan, Xuan Fu, Joseph J. Schwab, Paul Wheeler, Hendrikus C. L. Abbenhuis
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Patent number: 7608645Abstract: The present invention relates to the use of (meth)acrylate functionalized amide acetals as reactive components with crosslinking agents and UV radiation to give new coatings compositions.Type: GrantFiled: September 30, 2005Date of Patent: October 27, 2009Assignee: E.I. du Pont de Nemours and CompanyInventors: Neville Everton Drysdale, Laura Ann Lewin, Robert John Barsotti, Gary A. Johansson
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Publication number: 20090264602Abstract: Disclosed is a moisture-curing type curable resin composition containing: a curable resin intramolecularly having a silicon-containing functional group; and a Lewis acid or a complex of the Lewis acid as a curing catalyst, the Lewis acid being selected from the group consisting of metal halides and boron halides, which is rapidly cured at room temperature. The silicon-containing functional group is represented by general formula: —SiX1X2X3 or —SiR1X1 X2 (wherein, X1, X2 and X3 respectively represent a hydrolytic group and may be the same as or different from each other, and R1 represents a substituted or unsubstituted organic group having 1 to 20 carbons). If the silicon-containing functional group is —SiR1X1 X2, the curable resin further contains intramolecularly a polar component that is one of urethane, thiourethane, urea, thiourea, substituted urea, substituted thiourea, amide, and sulfide bonds, and hydroxyl, secondary amino and tertiary amino groups.Type: ApplicationFiled: June 30, 2009Publication date: October 22, 2009Applicant: Konishi Co., Ltd.Inventors: Shigeki Mori, Yukihiro Nomura, Kazuhiro Iyo, Shinichi Sato
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Publication number: 20090257113Abstract: A light filter or an array of filters can be either one or two dimensional. The filter or filters use multiple beam interference by varying an optical path length between semi-reflective surfaces. The optical path length between the semi-reflective surfaces is varied by changing a thickness of a polymer film in response to an electric field formed between two semi-transparent electrodes. The filter can be configured in either a transmissive or reflective mode.Type: ApplicationFiled: May 30, 2007Publication date: October 15, 2009Inventor: Timothy Smith
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Publication number: 20090258999Abstract: The invention relates to and their preparation and the production of Silicon-Isocyanates from Silicon-Urea-Azolides.Type: ApplicationFiled: October 27, 2006Publication date: October 15, 2009Inventors: Peter Bissinger, Wolf Steiger
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Publication number: 20090234078Abstract: An organotrisiloxane represented by the following general formula (I), wherein R1 and R2 may be the same or different and designate optionally substituted univalent hydrocarbon groups that do not have aliphatically unsaturated bonds, with the proviso that at least one of R1 or R2 is an aryl group, and R3 designates an organic group that contains a phenolic hydroxyl group, is a novel compound that possesses good reactivity and excellent compatibility and dispersibility with respect to the curable resins, such as epoxy resin.Type: ApplicationFiled: March 15, 2006Publication date: September 17, 2009Inventors: Hiroshi Ueki, Minoru Isshiki, Yoshitsugu Morita, Tomoko Kato
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Publication number: 20090234060Abstract: A composition comprises a blend of an aromatic polyketone and a polysiloxane/polyimide block copolymer. The composition can further comprise one or more additives.Type: ApplicationFiled: March 17, 2008Publication date: September 17, 2009Inventors: Gurulingamurthy M. Haralur, Ganesh Kailasam, Kapil Sheth
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Patent number: 7553904Abstract: A method of using olefin containing nanostructured chemicals and silanol containing nanostructured chemicals as high temperature resins is described. Vinyl containing nanostructured chemicals are particularity effective in thermosets as they control the motions of polymer chains, and segments, at the molecular level. Silanol containing nanostructured chemicals are particularity effective in thermosets containing polar groups as the silanol can enhance the reactivity of these groups. Because of their tailorable compatibility with fluorinated polymers, nanostructured chemicals can be readily and selectively incorporated into polymers by direct blending and polymerization processes. The incorporation of a nanostructured chemical into a polymer favorably impacts a multitude of polymer physical properties. Properties most favorably improved are heat distortion and flammability characteristics, permeability, optical properties, texture, feel and durability.Type: GrantFiled: September 12, 2005Date of Patent: June 30, 2009Assignee: Hybrid Plastics, Inc.Inventors: Joseph D. Lichtenhan, Qibo Liu, Yan-Jyh Lee, Xuan Fu, Sukhendu Hait, Joseph J. Schwab, Rusty L. Blanski, Patrick N. Ruth
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Publication number: 20090162665Abstract: To provide a coating fluid for forming a film, which is curable sufficiently by heat treatment at a low temperature of at most 70° C. to form a cured film excellent in abrasion resistance and which is excellent in storage stability, a film obtained from the coating fluid for forming a film, and a process for forming the film. A coating fluid for forming a film, which comprises a polysiloxane (A) obtained by condensation polymerization of a silicon compound of the formula (1) as the essential component, and a compound (B) of the formula (2): Si(OR1)4??(1) wherein R1 is a C1-5 hydrocarbon group, each of R2, R3, R4 and R5 which are independent of one another, is a hydrogen atom or a C1-12 organic group.Type: ApplicationFiled: February 26, 2009Publication date: June 25, 2009Applicant: Nissan Chemical Industries, Ltd.Inventors: Yoshihiro TANI, Kenichi Motoyama
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Publication number: 20090156754Abstract: The present invention discloses a thermally reversible composite material. The thermally reversible composite material comprises a Polyhedral Oligomeric Silsesquioxane (POSS) and a cross-linking agent. The Polyhedral Oligomeric Silsesquioxane comprises a plurality of dienophile groups. The cross-linking agent comprises at least two conjugated diene groups. The cross-linking agent interacts with the plurality of dienophile groups of the POSS though the conjugated diene groups to perform a thermally reversible Diels-Alder cycloaddition cross-linking reaction. The invention is applied as thermally reversible package materials.Type: ApplicationFiled: December 18, 2007Publication date: June 18, 2009Applicant: CHUNG YUAN CHRISTIAN UNIVERSITYInventors: YING-LING LIU, MENG-HAN FANCHIANG
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Publication number: 20090131591Abstract: Moisture curable alkoxysilyl-functional polymers crosslinkable to elastomers having improved recovery properties are prepared by incorporating in the curable composition, both an aminoalkylalkoxysilane and an epoxyalkylalkoxysilane.Type: ApplicationFiled: May 14, 2007Publication date: May 21, 2009Applicant: WACKER CHEMIE AGInventors: Wolfram Schindler, Elke Schwiebacher
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Publication number: 20090104414Abstract: An inkjet ink capable of forming a polyimide film having, for example, strong mechanical strength, is provided. The inkjet ink contains: a polyamic acid (A) having a weight-average molecular weight of 50,000-500,000; one or more of an amic acid compound (B1) and an amic acid compound (B2), in which the amic acid compound (B1) is prepared from a compound (a3) having two or more anhydride groups and a monoamine (a5), and the amic acid compound (B2) is prepared from a diamine (a4) and a compound (a6) having one anhydride group; and a solvent (C).Type: ApplicationFiled: October 22, 2008Publication date: April 23, 2009Applicant: CHISSO CORPORATIONInventors: TOMOTSUGU FURUTA, SATOSHI TANIOKA
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Patent number: 7507474Abstract: The invention relates to thermoplastic compositions comprising a polymer matrix and an additive which modifies the rheological behavior of the matrix in the molten state. The purpose of the invention is to provide a preferably non-reactive additive which can be dispersed in the matrix and which can be used to obtain a good compromise in terms of rheological properties/mechanical properties. According to the invention, the additive is a hyperbranched polymer which is functionalized by R<2> radicals, R<2> being a radical of the following type: substituted or non-substituted hydrocarbon, of the silicon type, linear or branched alkyl, aromatic, arylalkyl, alkylaryl or cycloaliphatic, which can comprise one or more unsaturations and/or one or more heteroatoms.Type: GrantFiled: December 16, 2002Date of Patent: March 24, 2009Assignee: RhodianylInventors: Joël Varlet, Florence Clement, Franck Touraud, Sandrine Rochat, Natalia Scherbakoff
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Patent number: 7504459Abstract: The present invention relates to the use of (meth)acrylate functionalized amide acetals as reactive components with crosslinking agents to give new coatings compositions.Type: GrantFiled: September 30, 2005Date of Patent: March 17, 2009Assignee: E.I. Du Pont de Nemours & CompanyInventors: Neville Everton Drysdale, Laura Ann Lewin, Robert John Barsotti
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Patent number: 7504440Abstract: The present invention relates to novel poly(meth)acrylate compositions formed by polymerization of (meth)acrylate amide acetals.Type: GrantFiled: September 30, 2005Date of Patent: March 17, 2009Assignee: E.I. du Pont de Nemours & CompanyInventors: Neville Everton Drysdale, Laura Ann Lewin, Robert John Barsotti, Patrick Henry Corcoran
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Publication number: 20090018277Abstract: Disclosed is a resin composition composed of a heat-treated resin component (A) obtained by heating and mixing an aromatic imide resin or an aromatic imidazole resin with a carboxylic acid anhydride, and a silane compound (B) having at least one functional group selected from the group consisting of an epoxy group, an amino group, an amide group, a methoxy group, an isocyanate group, a carboxyl group, a mercapto group, a vinyl group, a (poly)sulfide group and a methacrylo group. This resin composition has excellent heat resistance of aromatic imide resins and aromatic imidazole resins while being remarkably improved in adhesion to various bases.Type: ApplicationFiled: May 1, 2006Publication date: January 15, 2009Applicant: SOKEN CHEMICAL & ENGINEERING CO., LTD.Inventors: Syuji Okamoto, Hiroto Matsumoto, Jun Izumi
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Publication number: 20080312367Abstract: A method of preparing a diluted chain extended organopolysiloxane containing polymer comprising the steps of reacting a pre-formed polymer with a suitable chain extender reactable with terminal groups of the polymer in the presence of a diluent material, a suitable catalyst and optionally an end-blocking agent; and Where required quenching the polymerisation process wherein the diluent material is substantially retained within the resulting diluted organopolysiloxane containing polymer. The case additionally relates to products of the process and subsequent applications for the polymer such as for example sealants and rubbers.Type: ApplicationFiled: April 3, 2006Publication date: December 18, 2008Inventors: Isabelle Maton, Giuseppina Lavinaro, Jean Willieme, Tommy Detemmerman, Robert Drake
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Patent number: 7432335Abstract: There are provided a composition for functioning as an effective additive for epoxy resin that is solid at room temperature and has high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carboxylate composition obtained by first synthesizing an organic carboxylate of a basic silane coupling agent by reacting a basic silane coupling agent and an organic carboxylic acid, and subsequently heating and mixing the organic carboxylate of the basic silane coupling agent with a compound exhibiting good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater.Type: GrantFiled: June 1, 2006Date of Patent: October 7, 2008Assignee: Nikko Materials Co., Ltd.Inventors: Masashi Kumagai, Takashi Ouchi, Katsuyuki Tsuchida
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Patent number: 7425594Abstract: A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein at least 50% by weight of the copolymer comprises a minimum of 3n+X repeating units, wherein n is a monomer unit and X is a monomer unit and/or other reactant. The copolymer may also include less than 50% of the polymeric units having the same molecular weight. The present invention is further directed to processes for preparing the copolymer and to coating compositions employing the copolymer.Type: GrantFiled: November 23, 2005Date of Patent: September 16, 2008Assignee: PPG Industries Ohio, Inc.Inventors: Jonathan T. Martz, Stephen J. Thomas
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Publication number: 20080194773Abstract: [Problems] There is provided a curable composition having good adhesion by using a non-organotin catalyst. [Means to Solve Problems] The curable composition comprises (A) an organic polymer having a silicon-containing group being capable of crosslinking by forming siloxane bonds and (B) one or more kinds selected from a titanium catalyst, an aluminum catalyst and a zirconium catalyst, and is characterized in that a stress at 50% tension is within a range from 0.01 MPa to 0.20 MPa, when determined by adding and mixing 1.5 parts of tin octylate, 0.25 part by weight of laurylamine and 0.6 part by weight of pure water to 100 parts by weight of the component (A), subjecting the mixture to centrifugal defoaming, pouring the mixture carefully into a polyethylene frame not to mix air bubbles thereto, aging the mixture at 23° C. for one hour, and further at 70° C. for 20 hours, punching the obtained 3 mm thick cured sheet according to JIS K6251 to obtain No.Type: ApplicationFiled: April 25, 2005Publication date: August 14, 2008Inventors: Masayuki Wakioka, Katsuyu Wakabayashi, Toshihiko Okamoto, Masato Kusakabe
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Publication number: 20080003381Abstract: There has been a need for an overcoat film composition that functions as an overcoat film in terms of high transparency and flatness, and that also functions as an aligning film in terms of liquid crystal molecular alignment. There has also been a need to lower the cost of manufacturing a liquid crystal display element. There is provided an overcoat film composition comprising one or more compounds selected from the group of polyester-polyamic acids (A1) obtained using at least a polyhydric hydroxy compound (a1), a diamine (a2), and a compound having two or more acid anhydride groups (a3), and polyester-polyimides (A2) that are imidization products thereof, and a polyamic acid (B).Type: ApplicationFiled: June 28, 2007Publication date: January 3, 2008Inventors: Hiroyuki Satou, Takahiro Mori
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Publication number: 20070299213Abstract: A method of making a thermoplastic composition comprises melt blending two polysiloxane/polyimide block copolymers. Both of the block copolymers have extended polysiloxane blocks.Type: ApplicationFiled: June 22, 2006Publication date: December 27, 2007Applicant: GENERAL ELECTRIC COMPANYInventors: Susanta Banerjee, Robert Russell Gallucci, Gurulingamurthy M. Haralur, Ganesh Kailasam, William A. Kernick, Utpal Mahendra Vakil
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Patent number: 7312263Abstract: The present invention relates to thermoplastic polyamide moulding compositions which contain at least one copolyamide with at least 20% by weight polyamide 12 components and at least one aprotic compound selected from the group of N-alkylated, cyclic carboxylic acid amides with 5 to 7 ring elements and/or of urea derivatives, the alkyl rests of which are linear at the nitrogen or which form a linking of the two N-atoms, and a process for production of the moulding compositions. The thermoplastic polyamide moulding compositions are distinguished by the fact that no solid deposits are formed during thermoplastic conversion.Type: GrantFiled: December 29, 2004Date of Patent: December 25, 2007Assignee: EMS-Chemie AGInventors: Eduard Schmid, Ornulf Rexin
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Patent number: 7268246Abstract: Organosilicon compounds are described which are prepared from epoxy-functional silanes and monocarboxylic acids. The compounds are useful in coatings, adhesives, and sealants, and the like.Type: GrantFiled: December 15, 2004Date of Patent: September 11, 2007Assignee: E.I. du Pont de Nemours and CompanyInventors: Lech Wilczek, Isao Nagata
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Patent number: 7220490Abstract: The low modulus polyimide adhesive compositions of the present invention contain a low modulus polyimidosiloxane polymer, a thermosetting substantially-non-halogenated epoxy (optionally including an epoxy catalyst), a plasticizer, an insoluble halogen-free flame-retardant filler, and optionally an adhesion promoter. The adhesive can be applied upon (or incorporated into) flexible circuits using a relatively low lamination temperature, generally no higher than 200, 190, 180, 175, 170, 165, 160, 155, or 150° C. The adhesive is generally resistant to unwanted curl even in cases where the adhesive polyimide and the base film polyimide have a coefficient of linear thermal expansions (measured between 50° C. and 250° C.) that differ by more than 10, 15, 20 25, or 30 ppm/° C.Type: GrantFiled: July 16, 2004Date of Patent: May 22, 2007Assignee: E. I. du Pont de Nemours and CompanyInventors: Thomas E. Dueber, Michael W. West, Brian C. Auman, Robert V. Kasowski
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Patent number: 7215913Abstract: A transfer belt on which a developed toner image is transferred in an electrophotographic process, comprising: a matrix resin; and a chain silicone, contained in the range from 0.5 to 10% by weight to the matrix resin, and an image-forming apparatus provided therewith.Type: GrantFiled: August 16, 2004Date of Patent: May 8, 2007Assignee: Konica Minolta Business Technologies, Inc.Inventor: Takahito Miyamoto
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Patent number: 7198854Abstract: A silicone composition useful especially for the production of varnishes applicable to substrates whose coefficient of friction it is sought to reduce. The object is to provide an anti-friction silicone varnish for textiles coated with silicone elastomers which is economic and adhesive, provides the desired slip, resists soiling and is shiny. This object is achieved by a crosslinkable silicone composition containing two silicones A and B which react with one another in the presence of a catalyst C to allow crosslinking, and a particulate component D selected from the group comprising powdered (co)polyamides—preferably (co)polyamides 6, 12 and 6/12. The (co)polyamide particles are of substantially rounded shape and the mean particle diameter ?md is between 0.1 and 200 ?m, preferably between 5 and 100 ?m and particularly preferably between 10 and 50 ?m. Also disclosed is a varnishing process and a composite containing the varnished substrate.Type: GrantFiled: June 17, 2003Date of Patent: April 3, 2007Assignee: Rhodia ChimieInventors: Laurent Dumont, Alain Pouchelon, Marilyne Quemin
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Patent number: 7183370Abstract: A proton conducting polymer is formed by the copolymerization of a plurality of compounds, including a silicon compound comprising an organic chain, and a compound including at least one acid group. The polymer comprises a hybrid organic-inorganic matrix having acid groups linked through a linking group. The linking group may include one or more electron withdrawing groups. The electron withdrawing group may be a halogen.Type: GrantFiled: September 10, 2004Date of Patent: February 27, 2007Assignee: Toyota Technical Center USA, IncInventors: Siwen Li, Meilin Liu, Kohei Hase, Masatsugu Nakanishi, Wen Li, Junzo Ukai
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Patent number: 7163986Abstract: Novel siloxane copolymers have a structure as shown below. They can be applied and heat treated at relatively low temperatures into cured resin coatings which have satisfactory solvent resistance, durability, and good adhesion and bond to metal substrates such as copper even under humid conditions.Type: GrantFiled: June 1, 2004Date of Patent: January 16, 2007Assignee: Shin-Etsu Chemical Co., Ltd.Inventor: Michihiro Sugo
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Patent number: 7135530Abstract: The present invention relates to polymeric/oligomeric methacrylate functionalized amide acetals are effective in preparing coating composition based on their reaction with isocyanates.Type: GrantFiled: September 30, 2005Date of Patent: November 14, 2006Assignee: E. I. du Pont de Nemours and CompanyInventors: Neville Everton Drysdale, Laura Ann Lewin, Robert John Barsotti, Patrick Henry Corcoran
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Patent number: 7112634Abstract: A thermosetting resin composition is produced by heat treating a mixture of a polyaddition thermosetting resin, a silicic compound of the formula wherein R is an organic group containing a functional group that causes an addition reaction with the curing agent and R5 and R6 are independently a methyl group or an ethyl group, and water and adding a curing agent of the polyaddition thermosetting resin to the mixture that has undergone heat treatment.Type: GrantFiled: January 8, 2004Date of Patent: September 26, 2006Assignee: Hitachi, Ltd.Inventors: Yuichi Satsu, Harukazu Nakai, Akio Takahashi, Masao Suzuki, Katsuo Sugawara
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Patent number: 7105233Abstract: The invention provides for the use of organomodified polysiloxanes of the general formula (I) in which R1 independently at each occurrence is an aliphatic or aromatic C1-20 hydrocarbon radical, R2, R2* independently of one another are R1 or are aliphatic, saturated or unsaturated C1-60 hydrocarbon radicals, optionally containing functional groups, a=1 to 500, preferably <100, in particular 5 to 50, b=0 to 50, preferably <20, in particular <10, c=0 to 50, preferably 0 to 10, in particular 0 as additives for surface enhancement in polyolefins.Type: GrantFiled: August 3, 2004Date of Patent: September 12, 2006Assignee: Goldschmidt GmbHInventors: Nina Bechthold, Manfred Scheiba, Stefan Stadtmüller, Markus Weimann
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Patent number: 7094845Abstract: There is provided a composition for functioning as an effective additive for an epoxy resin that is a solid at room temperature and has a high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carboxylate composition obtained by first synthesizing an organic carboxylate of a basic silane coupling agent by reacting a basic silane coupling agent and an organic carboxylic acid, and subsequently heating and mixing the organic carboxylate of the basic silane coupling agent with a compound exhibiting a good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater.Type: GrantFiled: August 27, 2002Date of Patent: August 22, 2006Assignee: Nikko Materials Co., Ltd.Inventors: Masashi Kumagai, Takashi Ouchi, Katsuyuki Tsuchida
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Patent number: 7067563Abstract: A binder which is a graft polymer bearing at least two alkoxysilyl groups of the formula —Si(R1)m(OR2)3-m in which R1 and R2 are independently linear or branched alkyl groups containing 1 to 6 carbon atoms and m is an integer of 0 to 2. The graft polymer has graft branches on a graft base. The graft polymer contains at least 0.5% by weight, based on the graft base, of graft branches.Type: GrantFiled: July 18, 2001Date of Patent: June 27, 2006Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Johann Klein, Wilfried Huebner, Gaby Schilling, Felicitas Kolenda, Wolfgang Klauck
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Patent number: 7052539Abstract: An anti-fogging tray is obtained by coating a styrenic resin sheet with an anti-fogging agent to mold a tray. The anti-fogging agent comprises 1 to 50 parts by weight of a non-ether-series hydrophilic polymer excluding a polyvinyl alcohol (e.g., a polyvinylpyrrolidone), 5 to 150 parts by weight of an ether-series hydrophilic polymer (e.g., polyoxyethylene-polyoxypropylene block copolymer, and a nonionic surfactant having an oxyethylene unit), and 1 to 50 parts by weight of a silicone oil relative to 100 parts by weight of a polyhydric alcohol fatty acid ester (e.g., a sucrose fatty acid ester, a polyglycerin fatty acid ester). A coating layer comprising a surface-treating agent may be formed on one side of the resin sheet, and a mold-releasing layer containing a component selected from the ether-series hydrophilic polymer and the silicone oil may be formed on the other side of the resin sheet.Type: GrantFiled: January 2, 2004Date of Patent: May 30, 2006Assignee: Daicel Polymer, Ltd.Inventors: Yasuo Okumura, Osamu Jigami
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Patent number: 7026399Abstract: A composition including a non-silicone material, a silicone material, and a crosslinking agent. The composition forms a structure selected from the group consisting of an interpenetrating network structure and a thermoplastic vulcanizate structure.Type: GrantFiled: September 15, 2003Date of Patent: April 11, 2006Assignee: Taylor Made Golf Company, Inc.Inventors: Hyun Jin Kim, Hong Guk Jeon
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Patent number: 7005163Abstract: The present invention relates to an organic-inorganic hybrid film material consisting of polyamide and either polysilsesquioxane or silicon alkoxide and to a process for producing the organic-inorganic hybrid film material. The present process can effectively reduce the phase separation and can produce an organic-inorganic hybrid film material having 0–100% organic content. The present process can control desired properties of the resultant hybrid film material by adjusting the ratio of the organic and inorganic material, such as refractive index, birefractive index, dielectric index, and plateness of the film. Also, the present organic-inorganic hybrid film material possesses excellent heat-resistivity and is suitable for an IC process requiring high processing temperature.Type: GrantFiled: September 23, 2003Date of Patent: February 28, 2006Assignee: Chang Chun Plastics Co., Ltd.Inventors: Wen-Chang Chen, Wei-Jung Lin
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Patent number: 6951902Abstract: A polymeric composition that generates nitric oxide and a process for rendering the surface of a substrate nonthrombogenic by applying a coating of the polymeric composition to the substrate are disclosed. The composition comprises: (1) a crosslinked chemical combination of (i) a polymer having amino group-containing side chains along a backbone forming the polymer, and (ii) a crosslinking agent containing functional groups capable of reacting with the amino groups; and (2) a plurality of nitric oxide generating functional groups associated with the crosslinked chemical combination. Once exposed to a physiological environment, the coating generates nitric oxide thereby inhibiting platelet aggregation. In one embodiment, the nitric oxide generating functional groups are provided by a nitrated compound (e.g., nitrocellulose) imbedded in the polymeric composition. In another embodiment, the nitric oxide generating functional groups comprise N2O2? groups covalently bonded to amino groups on the polymer.Type: GrantFiled: August 16, 2002Date of Patent: October 4, 2005Assignee: Michigan Biotechnology InstituteInventors: William F. McDonald, Amy B. Koren
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Patent number: 6936663Abstract: Disclosed is a powder coating composition containing a powder coating resin and a polyhedral oligomeric silsesquioxane (“POSS”) compound.Type: GrantFiled: July 6, 2004Date of Patent: August 30, 2005Assignee: Conano CorporationInventor: Robert Modisette
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Patent number: 6933345Abstract: The nanoscopic dimensions of polyhedral oligomeric silsesquioxanes (POSS) and polyhedral oligomeric silicates (POS) materials ranges from 0.7 nm to 5.0 nm and enables the thermomechanical and physical properties of polymeric materials to be improved by providing nanoscopic reinforcement of polymer chains at a length scale that is not possible by physically smaller aromatic chemical systems or larger fillers and fibers. A simple and cost effective method for incorporating POSS/POS nanoreinforcements onto polymers via the reactive grafting of suitably functionalized POSS/POS entities with polymeric systems amenable to such processes is described. The method teaches that the resulting POSS-grafted-polymers are particularly well suited for alloying agents by nongrafted POSS entitles such as molecular silicas. The successful alloying of POSS-polymers is aided because their interfacial tensions are reduced relative to non-POSS containing systems.Type: GrantFiled: January 23, 2003Date of Patent: August 23, 2005Assignee: Hybrid Plastics, LLPInventors: Joseph D. Lichtenhan, Frank J. Feher, Joseph J. Schwab, Sixun Zheng
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Patent number: 6890991Abstract: The present invention relates to a thermoplastic resin composition which has an improved impact resistance while maintaining mechanical properties such as strength and rigidity. In the present invention, a thermoplastic resin (A) is mixed with a polytetrafluoroethylene-containing mixed powder (B) consisting of a polytetrafluoroethylene (b1) having a particle diameter of 10 ?m or less and an organic polymer (b2). In this case, the polytetrafluoroethylene-containing mixed powder (B) is mixed so that the amount of a polytetrafluoroethylene component is from 0.0001 to 20 parts by weight based on 100 parts by weight of the thermoplastic resin (A), and a polymer having an epoxy group was used as the organic polymer (b2). The thermoplastic resin composition of the present invention can be widely used in the fields of automotive parts, electric and electronic parts, and precision instrument parts.Type: GrantFiled: March 21, 2001Date of Patent: May 10, 2005Assignee: Mitsubishi Rayon Co., Ltd.Inventors: Hideyuki Fujimoto, Atsunori Koshirai
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Publication number: 20040214962Abstract: A melt-spun synthetic fiber and process for producing the fiber are described, the fiber including a fiber-forming synthetic polymer and a siloxane-based polyamide with a repeating unit having the formula (I) 1Type: ApplicationFiled: May 17, 2004Publication date: October 28, 2004Applicant: Polyamide High Performance GmbHInventors: Samuel Mooney, Ralf Koehnen, Britta Konrad, Qiao Xiao, Ralf Schnell
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Patent number: 6790553Abstract: A method for producing a bridged polymer membrane includes the steps of: obtaining a liquid medium comprising a basic polymer having an amino group in a repeating unit, a bridging agent, and a solvent; shaping the liquid medium into a membrane configuration to obtain the shaped membrane; and bridging the basic polymer by the bridging agent in the shaped membrane. A fuel cell has the bridged polymer membrane. The mechanical strength of the polymer electrolyte membrane is improved.Type: GrantFiled: September 6, 2001Date of Patent: September 14, 2004Assignee: Celanese Ventures GmbHInventor: Tetsu Yamamoto
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Patent number: 6787244Abstract: The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).Type: GrantFiled: July 30, 2002Date of Patent: September 7, 2004Assignee: Infineon Technologies AGInventors: Recai Sezi, Andreas Walter
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Patent number: 6780960Abstract: A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80° C. and about 160° C. is prepared. The solution or slurry is heated to a temperature between about 80° C. and about 160° C. and the other monomer is slowly added to the solution or slurry. Polyamic acid that is formed quickly imidizes to form the polyimide.Type: GrantFiled: July 22, 2002Date of Patent: August 24, 2004Assignee: Sumitomo Bakelite Company LimitedInventors: Michael C. Hausladen, Jin-O Choi
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Patent number: 6777493Abstract: A radial end-modified styrene-conjugated diene block copolymer having a general formula 1. The copolymer is obtained by synthesizing a styrene-conjugated diene block copolymer by way of copolymerization using an organic lithium initiator in the presence of a nonpolar solvent and then coupling the anionic active end of the resulting copolymer with a polyfunctional polysiloxane: (PS-PD)3Si—CH2CH2—[SiO(CH3)2—]nSi(CH3)2R Formula 1 wherein, PS is polystyrene, PD is polydiene such as polyisoprene or polyisoprene-polybutadiene, R is hydroxy group or -(PD-PS), and n is an integer of 1 to 100. The block copolymer based adhesives have low melt viscosity and excellent adhesive strength.Type: GrantFiled: October 30, 2002Date of Patent: August 17, 2004Assignee: Korea Kumho Petro Chemical Co., Ltd.Inventors: Young Hoon Ko, Sun Woo Cheen
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Patent number: 6777525Abstract: Polyimides having a desired combination of high thermo-oxidative stability, low moisture absorption and excellent chemical and corrosion resistance are prepared by reacting a mixture of compounds including (a) 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), (b) 3,4′-oxydianiline (3,4′-ODA), and (c) 5-norbornene-2,3-dicarboxylic anhydride (NA) in a high boiling, aprotic solvent to give 5 to 35% by weight of polyamic acid solution. The ratio of (a), (b), and (c) is selected to afford a family of polyimides having different molecular weights and properties. The mixture first forms a polyamic acid precursor. Upon heating at or above 300° C., the polyamic acids form polyimides, which are particularly suitable for use as a high temperature coating, adhesive, thin film, or composite matrix resin.Type: GrantFiled: April 1, 2002Date of Patent: August 17, 2004Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventor: Ruth H. Pater
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Patent number: 6743868Abstract: A method for making thermoplastic elastomeric compositions is disclosed wherein a polyamide, a silicone base, a stabilizer, and optional compatibilizer are first mixed, then a hydrosilation catalyst and subsequently an organohydrido silicon compound are added, and the silicone base is dynamically vulcanized.Type: GrantFiled: July 18, 2002Date of Patent: June 1, 2004Assignee: Dow Corning CorporationInventors: Frances Marie Fournier, Richard Leroy Rabe