Wherein One Of Said Silicon Materials Contains Si-h Bond Patents (Class 525/478)
  • Patent number: 8329831
    Abstract: A multi part hydrosilylation curable silicone elastomer composition comprising (i) an organopolysiloxane comprising at least two unsaturated groups and having a viscosity of at least 1,000 mPas at 25° C.; (ii) inorganic filler having a hydrophilic surface; (iii) a filler treating agent comprising an organopolysiloxane comprising at least 2 hydroxy or otherwise hydrolysable groups, or a mixture thereof and having an average degree of polymerization of from 2 to 50; (iv) an organohydrogensiloxane having an average of greater than two silicon bonded hydrogen atoms per molecule having a viscosity of up to about 10 PaS at 25° C.; (v) a hydrosilylation catalyst; and/or a treated filler obtained by the reaction of (ii) and (iii) above characterized in that the filler treating agent (iii) and/or treated filler is packaged separately from organohydrogensiloxane (iv) prior to curing.
    Type: Grant
    Filed: June 26, 2007
    Date of Patent: December 11, 2012
    Assignee: Dow Corning Corporation
    Inventor: Lawrence Rapson
  • Patent number: 8329307
    Abstract: This invention relates to silicon compositions particularly useful for the production of anti-fouling varnishes that can be applied to flexible or bulk supports. In particular, embodiments of the invention are directed to cross-linkable silicone composition that is cross-linkable by polyaddition and includes at least two inter-reactive polyorganosiloxane (POS) species (A) and (B) in the presence of a metal catalyst (C) in order to allow cross-linking by polyaddition; and optionally at least one particulate component (D); at least one cross-linking inhibitor (E); optionally at least one solvent (F), optionally at least one adhesion promoter (G); and optionally at least one functional additive (H) for imparting specific properties.
    Type: Grant
    Filed: December 7, 2006
    Date of Patent: December 11, 2012
    Inventors: Alain Pouchelon, Maryline Quemin
  • Publication number: 20120306363
    Abstract: One embodiment is related to a silicone composition for sealing a light emitting element, the composition comprising: (A) a vinyl group-containing organopolysiloxane having a three-dimensional network structure; (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms, each hydrogen atom being bonded to a silicon atom per molecule; and (C) a hydrosilylation catalyst.
    Type: Application
    Filed: June 5, 2012
    Publication date: December 6, 2012
    Inventors: Kikuo MOCHIZUKI, Nobuo HIRAI
  • Patent number: 8318854
    Abstract: The present invention relates to a composition for a thermosetting silicone resin, including: (1) an organopolysiloxane having a silanol group at an end thereof; (2) an alkenyl group-containing silicon compound; (3) an epoxy group-containing silicon compound; (4) an organohydrogensiloxane; (5) a condensation catalyst; (6) a hydrosilylation catalyst; and (7) a silica particle, in which the (7) silica particle has a 50% volume cumulative diameter of from 2 to 50 ?m, a content of particles having a particle size of 1 ?m or less of 15% by number or less and a content of particles having a particle size of 60 ?m or more of 15% by number or less.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: November 27, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Hiroyuki Katayama, Takashi Kondo, Hirokazu Matsuda, Ryuichi Kimura
  • Patent number: 8314184
    Abstract: The present invention relates to a liquid silicone elastomer composition comprising an unsaturated polyorganosiloxane having at least two unsaturated bonds, a hydrogenopolyorganosiloxane having at least two silicon-hydrogen bonds, a hydrosilylation catalyst, and silica. The invention is remarkable in that the composition further comprises an unsaturated organic polymer having at least two unsaturated bonds, and a cross-linking agent specific to said unsaturated organic polymer.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: November 20, 2012
    Assignee: Nexans
    Inventors: Lorrène Bayon, Christian Koelblin
  • Patent number: 8314200
    Abstract: Pt-catalyzed, addition-crosslinking silicone compositions which are self-adhesive at room temperature, develop adhesion rapidly on unpretreated substrates, and contain a functional alkoxy ?-silane as an adhesion promoter.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: November 20, 2012
    Assignee: Wacker Chemie AG
    Inventors: Markus Jandke, Werner Brennenstuhl
  • Patent number: 8304084
    Abstract: Provided is a liquid silicone rubber coating composition with a viscosity at 25° C. of 10,000 to 100,000 mPa·s, comprising: (A) (A-1) a substantially straight chain organopolysiloxane containing alkenyl groups only at both molecular chain terminals, and (A-2) a substantially straight chain organopolysiloxane containing an average of at least two alkenyl groups, only at non-terminal molecular chain positions, within each molecule, (B) an organohydrogenpolysiloxane containing an average of at least two hydrogen atoms bonded to silicon atoms within each molecule, (C) an addition reaction catalyst, and (D) an adhesion improver, as well as an air bag with a rubber coating layer comprising a cured product of such a composition. Also provided is an air bag with a rubber coating layer comprising a cured product of such a composition. The liquid silicone rubber coating composition can be used without dissolution in an organic solvent, and displays excellent adhesion to fiber and excellent rubber strength.
    Type: Grant
    Filed: May 24, 2005
    Date of Patent: November 6, 2012
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hidenori Mizushima, Masayuki Ikeno
  • Publication number: 20120276717
    Abstract: The present invention provides a non-aromatic saturated hydrocarbon group-containing organopolysiloxane containing the following units (I) to (III): (I) a siloxane unit (T unit) represented by R1SiO3/2: 40 to 99 mol %; (II) a siloxane unit (D unit) represented by R2R3SiO2/2: 59 mol % or less; and (III) a siloxane unit (M unit) represented by R4R5R6SiO1/2: 1 to 30 mol %. There can be an organopolysiloxane, which is soluble in a nonpolar organic solvent so that the organopolysiloxane can be peeled in a short time, and which is hardly soluble in a polar organic solvent to be exemplarily used upon coating a photoresist onto a semiconductor side of a joined substrate and removing the photoresist therefrom so that the organopolysiloxane is not peeled from the supporting substrate upon coating a photoresist onto a semiconductor side of a joined substrate and removing the photoresist therefrom.
    Type: Application
    Filed: February 27, 2012
    Publication date: November 1, 2012
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masahiro FURUYA, Hiroyuki YASUDA, Shohei TAGAMI, Michihiro SUGO, Hideto KATO
  • Patent number: 8298367
    Abstract: A pressure sensitive adhesive composition includes (A) a bodied MQ resin containing (i) a resinous core and (ii) a nonresinous polyorganosiloxane group, where the nonresinous polyorganosiloxane group is terminated with a silicon-bonded hydroxyl group; (B) a treated MQ resin, where (B)/(A) ratio has a value of 0.3 to 5.0, and (C) a polydiorganosiloxane terminated with a condensation reactable group; where resin/polymer ratio has a value of 2.0 to 3.0; optionally (D) a crosslinker; optionally (E) a catalyst; and optionally (F) a solvent. A pressure sensitive adhesive product prepared by curing the pressure sensitive adhesive composition is useful in structural attachment applications such as structural glazing applications.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: October 30, 2012
    Assignee: Dow Corning Corporation
    Inventors: Andrew Beger, Loren Lower, Timothy Lueder, Rochelle Nesbitt, Randall Schmidt
  • Patent number: 8299186
    Abstract: A curable organopolysiloxane composition comprising: (A) an organopolysiloxane that contains in one molecule at least two alkenyl groups and at least 30 mole % of all silicon-bonded monovalent hydrocarbon groups in the form of aryl groups: (B) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms and at least 15 mole % of all silicon-bonded organic groups in the form of aryl groups; (C) a branched-chain organopolysiloxane that contains alkenyl, aryl, and epoxy-containing organic groups; and (D) a hydrosilylation catalyst. The composition is capable of forming a cured body that has a high index of refraction and strong adhesion to substrates.
    Type: Grant
    Filed: June 11, 2009
    Date of Patent: October 30, 2012
    Assignee: Dow Corning Toray Company, Ltd.
    Inventors: Takashi Sagawa, Masayoshi Terada, Makoto Yoshitake
  • Publication number: 20120269748
    Abstract: An excellent oil-thickening or -gelling agent is provided. The agent is compatible with various oils and can freely control the form or viscosity of oily raw materials or cosmetics by changing the quantity thereof added. The agent contains a novel co-modified organopolysiloxane that contains both a group having a siloxane dendron structure and a hydrophilic group and that preferably has a degree of polymerization of 200 or more. A gel composition containing the co-modified organopolysiloxane is also provided. The gel composition is useful as a base that permits stable and easy preparation of cosmetics having various viscoelasticities and forms. An oil is kept in the form of a gel that has a viscoelasticity falling within the intermediate range between the viscoelasticity of liquid and that of solid. Cosmetics containing the thickening or gelling agent are also provided.
    Type: Application
    Filed: October 25, 2010
    Publication date: October 25, 2012
    Inventors: Seiki Tamura, Tomohiro Iimura, Tatsuo Souda, Akito Hayashi, Haruhiko Furukawa
  • Patent number: 8293849
    Abstract: A silicone composition for sealing a light emitting element includes: (A) a vinyl group-containing organopolysiloxane having a three-dimensional network structure represented by an average unit formula: (SiO4/2)a(ViR2SiO1/2)b(R3SiO1/2)c (where Vi represents a vinyl group, R's are identical or different substituted or unsubstituted monovalent hydrocarbon groups other than alkenyl groups, and a, b, and c are positive numbers satisfying that a/(a+b+c) is 0.2 to 0.6 and b/(a+b+c) is 0.001 to 0.2); (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms, each hydrogen atom being bonded to a silicon atom per molecule, the organohydrogenpolysiloxane being contained in such an amount that an amount of a hydrogen atom bonded to a silicon atom is 0.3 to 3.0 mol per 1 mol of a vinyl group bonded to a silicon atom in the component (A); and (C) a hydrosilylation catalyst (catalytic amount), wherein a coefficient of linear expansion of the composition after curing is 10×10?6 to 290×10?6/° C.
    Type: Grant
    Filed: July 22, 2005
    Date of Patent: October 23, 2012
    Assignee: Momentive Performance Materials Japan LLC
    Inventors: Kikuo Mochizuki, Nobuo Hirai
  • Patent number: 8278367
    Abstract: A subject-matter of the invention is an impression material with at least one compound with at least two alkenyl groups as component (a), at least one compound with at least one chelating group as component (b), at least one organohydropolysiloxane as component (c), at least one hydrosilylation catalyst as component (d) and at least one compound with a chelatable metal atom as component (e), the chelating group of the component (b) exhibiting no reactive groups which can react with the component (c) and/or the component (d). The invention achieves a long storage stability.
    Type: Grant
    Filed: January 16, 2008
    Date of Patent: October 2, 2012
    Assignee: Ernst Muehlbauer GmbH & Co. KG
    Inventors: Henrik Boettcher, Stephan Neffgen
  • Patent number: 8273842
    Abstract: An object of the invention is to provide a curing agent and a curable composition capable of forming a cured product, which is applicable for optical material and which has excellent heat and light transparency and crack resistance, and a cured product obtained by curing the same. Moreover, an object of the invention is to provide a method for producing with use of the components of the curing agent a cyclic polyorganosiloxane having a specific structure, in a selective manner and in high yield.
    Type: Grant
    Filed: November 7, 2008
    Date of Patent: September 25, 2012
    Assignee: Kaneka Corporation
    Inventors: Yoshikatsu Ichiryu, Masayuki Fujita
  • Patent number: 8257797
    Abstract: The general field of the invention is that of airbags. The invention relates to a process for improving the tear strength and the combing strength of coated fabrics intended for uses in the field of inflatable bags using a silicone composition comprising an additive containing a polyorganosiloxane resin (V) and a calcium carbonate. After coating the composition onto the fabric supports and curing, the coated supports not only have optimum adhesion and crease resistance properties, but also have good properties in terms of combing strength and tear strength.
    Type: Grant
    Filed: November 2, 2004
    Date of Patent: September 4, 2012
    Assignee: Bluestar Silicones France
    Inventors: Laurent Dumont, Alain Pouchelon
  • Patent number: 8247502
    Abstract: Provided is an addition reaction-curable silicone pressure-sensitive adhesive composition, including: (A) a specific diorganopolysiloxane consisting of (A1) a linear diorganopolysiloxane having two or more alkenyl groups, and (A2) a linear diorganopolysiloxane having SiOH groups at the terminals and containing no alkenyl groups, (B) a specific organopolysiloxane containing M units, Q units and SiOH group-containing siloxane units, (C) an organohydrogenpolysiloxane containing three or more SiH groups, (D) an addition reaction retarder, (E) a platinum group metal-based catalyst, and (F) a specific organopolysiloxane containing T units and D units. A cured product layer formed from a cured product of this composition can be peeled from a release film with minimal peeling force, and exhibits excellent adhesion to silicone rubbers.
    Type: Grant
    Filed: June 17, 2010
    Date of Patent: August 21, 2012
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Shunji Aoki
  • Publication number: 20120184663
    Abstract: [Object] To provide a silicone resin composition for optical semiconductor devices, which has a low gas permeability and high dependability. [Means for solution] The silicone resin composition of the present invention contains the following components (A) through (D): (A) an organopolysiloxane as shown in the following general formula (1) in which the number of alkenyl groups contained per one molecule is two or more (R1SiO3/2)x(R23SiO1/2)y(R22SiO2/2)z??(1) (wherein R1 is a cycloalkyl group, R2 is either one kind of or more than one kind of substituted or non-substituted monovalent hydrocarbon group having 1-10 carbon atoms, x is 0.5-0.9, y is 0.1-0.5, z is 0-0.2, and x+y+z=1.0), (B) a hydrogen organopolysiloxane containing at least two SiH groups per one molecule, (C) a catalyst for addition reaction, (D) an adhesion promoter agent.
    Type: Application
    Filed: January 13, 2012
    Publication date: July 19, 2012
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshihira HAMAMOTO, Tsutomu Kashiwagi
  • Patent number: 8217122
    Abstract: A silicone rubber powder obtained by curing a condensation-curable silicone rubber composition in a dispersed state in water, having an epoxy equivalent measured by a titration method equal to or lower than 3,000 and an average particle size in the range of 0.1 to 100 ?m; and a method of manufacturing a silicone rubber powder comprising the steps of dispersing in water a silicone rubber composition comprising at least components (A) through (C) listed below; adding component (D); and curing the mixture: (A) a diorganopolysiloxane capped at both molecular terminals with silanol groups and having in one molecule 30 or less silicon atoms; (B) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; (C) an epoxy-containing alkoxysilane; and (D) a condensation-reaction catalyst. The silicone rubber powder has low epoxy equivalent and possesses excellent dispersibility in organic resins, and the method is efficient in manufacturing of the aforementioned powder.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: July 10, 2012
    Assignee: Dow Corning Toray Company, Ltd.
    Inventors: Yoshitsugu Morita, Kazuo Kobayashi, Ken Tanaka
  • Publication number: 20120172472
    Abstract: A silicone composition is described that includes components having SiH/SiOH group and that can be polymerized/cross-linked by a dehydrocondensation reaction in the presence of a catalyst such as an iron-based complex or salt, requiring a low activation temperature.
    Type: Application
    Filed: June 15, 2010
    Publication date: July 5, 2012
    Applicant: BLUESTAR SILICONES FRANCE
    Inventor: Christian Maliverney
  • Publication number: 20120172473
    Abstract: A silicone composition is described that includes components having SiH/SiOH groupings and that can be polymerized/cross-linked by a dehydrogenative condensation reaction in the presence of a non-metal tri- or tetrasubstituted non-silylated guanidine catalyst and requiring a low activation temperature.
    Type: Application
    Filed: June 15, 2010
    Publication date: July 5, 2012
    Applicant: BLUESTAR SILICONES FRANCE
    Inventor: Christian Maliverney
  • Publication number: 20120172544
    Abstract: A curable organopolysiloxane composition comprises the following: (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups and having an average unit formula (I): (R12SiO2/2)a(R23SiO1/2)b(R3SiO3/2)c(SiO4/2)d(CH2CH2)e; (B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3/2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R1 to R7 and a to j are as defined in the specification.
    Type: Application
    Filed: November 22, 2011
    Publication date: July 5, 2012
    Inventors: Kwei-Wen Liang, Chih-Chiang Yang
  • Patent number: 8206831
    Abstract: This invention relates to a silicone pressure-sensitive adhesive composition including: (A) a polydiorganosiloxane composed of a linear polydiorganosiloxane (A1) having two or more alkenyl groups within each molecule and a linear polydiorganosiloxane (A2) having SiOH groups at terminals thereof and no alkenyl groups, which is represented by the formula R22(HO)SiO—(R22SiO)d—SiR22(OH), wherein d represents an integer satisfying 500?d?20,000; (B) a polyorganosiloxane including R33SiO1/2 units, SiO2 units and Si atom-bonded hydroxyl group-containing units; (C) a polyorganohydrogensiloxane having three or more SiH groups within each molecule; (D) a reaction retarder; (E) a platinum group metal-based catalyst; and (F) a metal compound represented by formula MYx, wherein the polyorganosiloxane (B) is condensed with the linear polydiorganosiloxane (A2). The composition exhibits powerful adhesive strength to silicone rubbers and is useful for, by example, producing a pressure-sensitive tape.
    Type: Grant
    Filed: June 3, 2009
    Date of Patent: June 26, 2012
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Shunji Aoki
  • Patent number: 8207241
    Abstract: Nanosize titanium dioxide having supported thereon metallic platinum are efficient hydrosilylation catalysts whose hydrosilylation activity may be increased by irradiation. The catalysts are prepared by depositing soluble platinum compounds on a titanium dioxide sol or titanium dioxide pigments followed by drying, calcining, and reduction to platinum metal. The catalysts are particularly useful in preparing addition-curable organopolysiloxane elastomers.
    Type: Grant
    Filed: December 1, 2005
    Date of Patent: June 26, 2012
    Assignee: Wacker Chemie AG
    Inventors: Marco Hofmann, Hans-Juergen Eberle
  • Publication number: 20120153818
    Abstract: This organic electroluminescent element sealing composition contains an addition reaction curing type silicone composition which is liquid at normal temperature and has a curing temperature of 100 degrees C. or below and a moisture content of 400 ppm or less. The addition reaction curing type silicone composition contains (A) polyorganosiloxane having an average of 0.2 to 5 alkenyl groups bonded to silicon atoms in one molecule, (B) polyorganohydrogensiloxane having at least two or more hydrogen atoms bonded to silicon atoms in one molecule, and (C) a platinum-based catalyst. The organic electroluminescent element sealing composition can prevent deterioration of the organic electroluminescent element and can provide the organic light-emitting device having a good light-emitting property for a long period.
    Type: Application
    Filed: December 17, 2010
    Publication date: June 21, 2012
    Inventors: Koji OKAWA, Osamu Tamura
  • Patent number: 8202933
    Abstract: The present invention provides a silicone resin composition for encapsulating light-emitting elements with which encapsulation using a potting method can be easily accomplished, and which can be easily molded into a lens shape such as hemisphere, parabola, or the like. The composition can impart high transparency to the resulting encapsulating lens molded using a potting method. More particularly, the invention provides a silicone resin composition for encapsulating light-emitting elements, including 2 to 25 wt % of silica with a mean particle size of 1 to 30 nm based on the total amount of Components (A) and (B); and having a viscosity (23° C.) of more than 10 Pa·s and less than 70 Pa·s, and a thixotropic index of 2.0 to 5.5; the composition being used for encapsulation using a potting method.
    Type: Grant
    Filed: March 10, 2008
    Date of Patent: June 19, 2012
    Assignee: Sanyu Rec Co., Ltd.
    Inventors: Yoshiteru Miyawaki, Osamu Tanaka
  • Patent number: 8198380
    Abstract: The present invention relates to a composition for a thermosetting silicone resin, the composition including: (A) an organohydrogenpolysiloxane; (B) an alkenyl group-containing epoxy compound; (C) an alkenyl group-containing cyclic siloxane; and (D) a hydrosilylation catalyst, a thermosetting silicone resin composition obtained by reacting the composition and a production method thereof, a photosemiconductor element-encapsulating material including the thermosetting silicone resin composition, and a photosemiconductor device including a photosemiconductor element encapsulated with the resin composition or the photosemiconductor element-encapsulating material.
    Type: Grant
    Filed: March 4, 2010
    Date of Patent: June 12, 2012
    Assignee: Nitto Denko Corporation
    Inventor: Hiroyuki Katayama
  • Publication number: 20120126282
    Abstract: The present invention provides a sealant for an optical semiconductor device which has high gas barrier property against corrosive gas, and is less likely to crack or is less likely to peel off even when used in harsh environments.
    Type: Application
    Filed: March 18, 2011
    Publication date: May 24, 2012
    Inventors: Mitsuru Tanikawa, Takashi Watanabe, Shintaro Moriguchi, Osamu Inui, Yoshitaka Kunihiro, Ryosuke Yamazaki, Ayuko Oki, Yasuyuki Ieda, Chizuru Kimu, Yusuke Kobayashi
  • Patent number: 8178207
    Abstract: A silicone-based pressure-sensitive adhesive composition comprising (A) a condensation-reaction product obtained by subjecting a diorganopolysiloxane having silanol groups on both molecular terminals and 2 or more silicon-bonded alkenyl groups located in side molecular chains in one molecule (a) and organopolysiloxane resin having one or more hydrolyzable groups in one molecule (b) to a condensation reaction in the presence of catalyst (c), (B) an organohydrogenpolysiloxane, (C) a diorganopolysiloxane having silicon-bonded alkenyl groups on both molecular terminals, (D) an organopolysiloxane resin and (E) a platinum catalyst.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: May 15, 2012
    Assignee: Dow Corning Toray Company, Ltd.
    Inventors: Haruna Mizuno, Seiji Hori, Takateru Yamada
  • Patent number: 8173759
    Abstract: The present invention provides an organopolysilmethylene represented by the following general formula (1): wherein R1 is, independently of each other, a group selected from the group consisting of an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, an alkoxy group, a hydroxy group, R3SiCH2— and R3SiO—, wherein R is, independently of each other, a group selected from the group consisting of an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, an alkoxy group, and a hydroxy group, m is an integer of 1 to 100, and n is an integer of 1 to 100, and wherein at least two out of R1's and R's are an alkenyl group.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: May 8, 2012
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tsutomu Kashiwagi, Toshio Shiobara
  • Patent number: 8168730
    Abstract: Provided is a curable silicone rubber composition, comprising (A) an organopolysiloxane containing two or more aliphatic unsaturated bonds within each molecule, having a viscosity at 25° C. within a range from 10 to 100,000 mm2/s, and containing a phenyl group and/or cyclohexyl group, (B) an organopolysiloxane with a resin structure comprising SiO2 units and (R1)3SiO0.5 units (wherein, each R1 represents, independently, a vinyl group, an allyl group, or a monovalent hydrocarbon group that contains no aliphatic unsaturated bonds, provided one or more of all the R1 groups within this component (B) represent, independently, a phenyl group or a cyclohexyl group), (C) an organohydrogenpolysiloxane, and (D) a platinum group metal-based catalyst, wherein the component (B) exists in a quantity that represents from 20 to 80% by mass of the combination of the component (A) and the component (B).
    Type: Grant
    Filed: January 16, 2007
    Date of Patent: May 1, 2012
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Tsutomu Kashiwagi
  • Publication number: 20120095125
    Abstract: A polymeric material with a variable modulus of elasticity is described herein. The polymeric material described herein is useful for forming implantable medical devices (e.g. ophthalmic lenses, breast implants, and body augmentation devices). In addition, medical devices formed from the polymer material can be used to controllably release a therapeutic agent. Also, the polymeric material may be used to prepare topical compositions or other applications or devices where control of a mechanical property such as material modulus is important.
    Type: Application
    Filed: December 1, 2011
    Publication date: April 19, 2012
    Applicant: Abbott Medical Optics Inc.
    Inventors: Can B. Hu, Thuy Mai, Derek D. Pham
  • Patent number: 8158265
    Abstract: Provided is an addition-curable silicone composition including A: a diorganopolysiloxane having a structure represented by a formula (1): (R1)(R2)2SiO((Ar)2SiO)nSi(R2)2(R1) (where R1 represents an aliphatic unsaturated group, R2 represents identical or different, unsubstituted or substituted monovalent hydrocarbon groups, Ar represents identical or different, unsubstituted or substituted aryl groups that may or may not contain a hetero atom, and n represents an integer of 1 or greater), B: an organosilicon compound containing at least two hydrogen atoms bonded to silicon atoms per molecule, and containing no aliphatic unsaturated groups, in an amount that is sufficient to cure the composition in the presence of the hydrosilylation catalyst described below, and C: a platinum group metal-based hydrosilylation catalyst.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: April 17, 2012
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Shinji Kimura
  • Publication number: 20120074450
    Abstract: An optical gel member to be used in a gap between light-emitting diode which is a backlight light source of an optical device and light guide plate, as well as an assembling method for an optical device and an optical device using the same. The optical gel member etc. to be used in an interposed state between light guide plate and light-emitting device consisting of a light-emitting diode (LED) in an optical device, characterized by satisfying the following requirements (i) to (iii). (i) The optical gel member consists of a transparent gel such as silicone type gel or acryl type gel, which has a hardness of 0 to 80 in JIS-A hardness according to JIS K6253, or 20 to 200 in penetration (25° C.) in accordance with JIS K2207; (ii) The optical gel member is in a string-like form, and the peripheral surface thereof is in contact with light guide plate and light-emitting device; (iii) The optical gel member has a repulsive force of 12 MPa or less at a compression rate of 30%.
    Type: Application
    Filed: August 11, 2010
    Publication date: March 29, 2012
    Applicant: TAICA CORPORATION
    Inventors: Hirohisa Sakurai, Yuichi Shiratori, Takahiro Sasazawa, Masahiko Masuda
  • Patent number: 8141324
    Abstract: A structural adhesive tape includes a closed cell silicone foam support and a structural adhesive composition on opposing sides of the closed cell silicone foam support. The structural adhesive composition may be a condensation reaction curable pressure sensitive adhesive composition. The structural adhesive tape is useful in structural glazing applications, such as curtain wall applications.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: March 27, 2012
    Assignee: Dow Corning Corporation
    Inventors: Lawrence Carbary, Timothy Lueder, Rochelle Nesbitt, Andrew Beger, Loren Lower, Randall Schmidt
  • Publication number: 20120065343
    Abstract: A hydrosilylation curable composition contains a combination of high and low viscosity polyorganosiloxanes, a silicone resin, a crosslinker, and a catalyst. The composition, and the cured product thereof, is useful in optical devices such as charged coupled devices (CCDs), light emitting diodes (LEDs), lightguides, optical cameras, photo-couplers, and waveguides. Processes for fabricating the optical devices include various molding techniques, including overmolding.
    Type: Application
    Filed: February 25, 2010
    Publication date: March 15, 2012
    Inventors: Maneesh Bahadur, Robert Nelson, Michael Strong
  • Publication number: 20120061679
    Abstract: Compositions and methods for controlled polymerization and/or oligomerization of hydrosilanes compounds including those of the general formulae SinH2n and SinH2n+2 as well as alkyl- and arylsilanes, to produce soluble silicon polymers as a precursor to silicon films having low carbon content.
    Type: Application
    Filed: November 17, 2011
    Publication date: March 15, 2012
    Inventors: Dmitry KARSHTEDT, Joerg ROCKENBERGER, Fabio ZÜRCHER, Brent RIDLEY, Erik SCHER
  • Publication number: 20120056236
    Abstract: A silicone resin composition comprising (A) an organopolysiloxane containing silicon-bonded aryl and alkenyl groups in a molecule, (B) an organohydrogenpolysiloxane, and (C) an addition reaction catalyst is low gas permeable. An optoelectronic device encapsulated therewith is highly reliable.
    Type: Application
    Filed: September 1, 2011
    Publication date: March 8, 2012
    Inventors: Yoshihira HAMAMOTO, Tsutomu Kashiwagi
  • Patent number: 8129480
    Abstract: Provided is a curable polyorganosiloxane composition which advantageously forms a cured product suitable for LED or optical lens, wherein the cured product has excellent light transmission properties in a short wavelength region, i.e., in the blue to ultraviolet region and is unlikely to suffer yellowing due to exposure to heat.
    Type: Grant
    Filed: October 19, 2007
    Date of Patent: March 6, 2012
    Assignee: Momentive Performance Materials Japan LLC
    Inventors: Masanori Takanashi, Hideki Kobayashi
  • Patent number: 8128773
    Abstract: Disclosed herein is a silicon adhesive composition for transporting a flexible substrate. The composition includes (A) 42 to 70 parts by weight of a polydiorganosiloxane containing an alkenyl group, (B) 55 to 28 parts by weight of a polyorganosiloxane copolymer including R13SiO1/2 units and SiO2 units, wherein R1 is a hydroxy group or a monovalent hydrocarbon group of 1 to 12 carbon atoms, (C) a polyorganosiloxane containing an SiH group, wherein the molar ratio of the SiH group of component (C) to the alkenyl group of component (A) is from 0.5 to 20, and (D) a platinum group catalytic compound, wherein the weight ratio of a metal component of the compound to the sum of components (A) and (B) is from 1 to 5000 ppm by weight.
    Type: Grant
    Filed: January 15, 2007
    Date of Patent: March 6, 2012
    Assignee: LG Chem, Ltd.
    Inventors: Sang-ki Chun, Dong-han Kho, Suk-Ky Chang
  • Publication number: 20120046423
    Abstract: A polyorganosiloxane composition, an encapsulation material, and an electronic device, the polyorganosiloxane composition including a linear first polyorganosiloxane resin including a moiety represented by the following Chemical Formula 1 and a moiety represented by the following Chemical Formula 2, the first polyorganosiloxane resin including double bonds at both terminal ends thereof, and a second polyorganosiloxane resin having a three dimensional network structure,
    Type: Application
    Filed: August 11, 2011
    Publication date: February 23, 2012
    Inventors: Sang-Ran KOH, June-Ho Shin, Woo-Han Kim, Sung-Hwan Cha, Hyun-Jung Ahn
  • Publication number: 20120040180
    Abstract: The present invention relates to the use of an adhesive compound, in particular a pressure-sensitive adhesive compound, based on silylated polyurethanes for bonding optical components, in particular optical films, wherein the adhesive compound has a transmission according to ASTM D 1003 of greater than 86% and a haze according to ASTM D 1003 of less than 5%.
    Type: Application
    Filed: February 16, 2010
    Publication date: February 16, 2012
    Applicant: Tasa SE
    Inventors: Marc Husemann, Nils Utesch
  • Patent number: 8110065
    Abstract: A heat-curable fluoropolyether adhesive composition comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure, (B) a fluorinated organohydrogensiloxane having at least two SiH groups, (C) a platinum group metal catalyst, (D) an organosiloxane having at least one SiH group and at least one epoxy and/or trialkoxysilyl group, and (E) a compound having at least two allyloxycarbonyl groups can be cured to metal and plastic substrates by heating at a temperature from 20° C. to less than 100° C.
    Type: Grant
    Filed: May 21, 2008
    Date of Patent: February 7, 2012
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hidenori Koshikawa, Mikio Shiono, Hiroyasu Hara, Takashi Aketa
  • Publication number: 20120027970
    Abstract: The present invention relates to a process for the manufacturing of continuously shaped cured silicone articles, particularly extrusions articles and the use of silicone compositions containing a photoactivatable metal catalyst in said process, wherein the curing is initiated by visible or UV-light.
    Type: Application
    Filed: July 4, 2008
    Publication date: February 2, 2012
    Applicant: MOMENTIVE PERFORMANCE MATERIALS GMBH
    Inventors: Uwe Irmer, Dieter Wrobel, Yi-Feng Wang
  • Patent number: 8101241
    Abstract: The invention relates to crosslinkable or crosslinked silicone compositions capable of being used to form a water-repellent and release coating for a flexible support made of paper or of polymer, in particular a heat-sensitive flexible support. These compositions are of the type of those comprising crosslinking polyorganosiloxanes carrying SiH units and unsaturated, preferably vinylated, polyorganosiloxanes capable of reacting with the crosslinking agent by polyaddition in the presence of platinum to form the release crosslinked coating on the flexible support. The targeted aim is to make possible the instantaneous crosslinking at low temperature (85-90° C.) of such silicone compositions coated on flexible supports at a very high speed. To achieve this aim, the invention provides for the use of specific crosslinking agents composed of POSs hydrogenated at the chain end and in the chain.
    Type: Grant
    Filed: May 20, 2008
    Date of Patent: January 24, 2012
    Assignee: Bluestar Silicones France
    Inventors: Jean-Paul Benayoun, Didier Dhaler, Jacques Kieffer, John White
  • Publication number: 20120016063
    Abstract: A method of preparing a diluted chain extended organopolysiloxane containing polymer comprising the steps of reacting a pre-formed polymer with a suitable chain extender reactable with terminal groups of the polymer in the presence of a diluent material, a suitable catalyst and optionally an end-blocking agent; and Where required quenching the polymerisation process wherein the diluent material is substantially retained within the resulting diluted organopolysiloxane containing polymer. The case additionally relates to products of the process and subsequent applications for the polymer such as for example sealants and rubbers.
    Type: Application
    Filed: September 27, 2011
    Publication date: January 19, 2012
    Inventors: Isabelle Maton, Giuseppina Lavinaro, Jean Willieme, Tommy Detemmerman, Robert Drake
  • Patent number: 8093339
    Abstract: Silicone composites subject to reticulation or reticulated, particularly for creating a coating or water-repellent and anti-adhesive film for flexible substrates such as paper or similar in the form of natural or synthetic polymer films. These compounds contain reticulating polyorganosiloxanes that have SiH units and unsaturated polyorganosiloxanes, preferably vinylated, suitable for reacting with the reticulating agent in an addition reaction and in the presence of platinum to form the reticulated anti-adhesive coating on the flexible substrate, plus at least one additive (D) to promote adhesion to it.
    Type: Grant
    Filed: June 27, 2007
    Date of Patent: January 10, 2012
    Assignee: Bluestar Silicones France SAS
    Inventors: John White, Michel Feder, Alain Pouchelon, Yassine Maadadi, Lucile Gambut-Garel
  • Patent number: 8084530
    Abstract: The sealing agent for an optical semiconductor device, which comprises: a silicone resin having a cyclic ether-containing group in the molecular structure; a heat curing agent capable of reacting with the cyclic ether-containing group; and a fine particulate material of silicon oxide, and the sealing agent having a viscosity of 500 to 10,000 mPa·s measured by an E-type viscometer at 25° C. at 5 rpm, a thixotropic value of 1.2 to 2.5 calculated by dividing a viscosity measured by the E-type viscometer at 25° C. at 1 rpm by a viscosity measured at 10 rpm (viscosity at 1 rpm/viscosity at 10 rpm), and a minimum viscosity of 100 mPa·s or higher measured at 1 s?1 in the temperature range of 25° C. to a curing temperature by a parallel plate rheometer.
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: December 27, 2011
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Mitsuru Tanikawa, Takashi Watanabe, Takashi Nishimura
  • Patent number: 8076427
    Abstract: Use of release fluids or agents constituting hyperbranched polymers. The three-dimensional structure imparts characteristics that make the hyperbranched polymers useful in xerographic processes. The hyperbranched polymer release fluids or agents may be used with a fuser member having a substrate, an outer layer covering the substrate, and a release coating on the outer layer, wherein the release coating includes a hyperbranched polymer.
    Type: Grant
    Filed: January 12, 2009
    Date of Patent: December 13, 2011
    Assignee: Xerox Corporation
    Inventors: David J. Gervasi, George Riehle, Samuel Kaplan
  • Patent number: 8071697
    Abstract: A process includes the steps of: 1) heating a mold at a temperature ranging from 100° C. to 200° C.; 2) feeding a silicone encapsulant composition including a mold release agent, where the composition has a viscosity ranging from 100 cps to 3,000 cps at operating temperatures of the process, to an assembly for preventing the silicone encapsulant composition from flowing backward out of the assembly; 3) injecting the silicone encapsulant composition from the assembly into a mold having a horizontal orientation and having a mold cavity through a gate, where the mold cavity has a top and a bottom, a vent is located at the top of the mold cavity, the vent comprises a channel 0.1 mm to 1 mm wide by 0.0001 mm to 0.
    Type: Grant
    Filed: March 16, 2006
    Date of Patent: December 6, 2011
    Assignee: Dow Corning Corporation
    Inventors: Lawrence Frisch, Maneesh Bahadur, Ann Norris
  • Patent number: 8067496
    Abstract: The invention relates to curable silicone compositions which contain silane based crosslinkers and a mixture of different organopolysiloxanes. The compositions are particularly suitable as curable impression materials in dental applications.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: November 29, 2011
    Assignee: 3M Innovative Properties Company
    Inventors: Joachim W. Zech, Franziska Strauss, Henning Hoffmann, Peter Bissinger, Wolf Steiger