Contains Sulfur-containing Reactant Or Polymer Therefrom Patents (Class 525/483)
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Patent number: 6605685Abstract: An improved resin for use in making honeycomb sandwich panels. The improvement involves modifying a phenolic resin so that the amount of smoke and heat generated during combustion is reduced. The reduction in smoke and heat generation is achieved by reducing the amount of phenol used to form the phenolic resin. The phenol is replaced by low-smoke producing sulfone compounds such as 4,4′-bisphenol-S, 3,3′-bisphenol-S, biphenol and bisphenol ethers which reduce the number of smoke producing methylene or methylene ether linkages present in the cured phenolic resin. The low-smoke producing resin may be used as a dip resin for coating the honeycomb or as the matrix resin for the core and face sheets of the sandwich panel.Type: GrantFiled: August 14, 2001Date of Patent: August 12, 2003Assignee: Hexcel CorporationInventor: Yen-Seine Wang
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Patent number: 5834569Abstract: A composite, polymer bonded abrasive wheel is disclosed for grinding operations and especially for use with multiple station, glass beveling machines. The abrasive wheel breaks in quickly and delivers consistent performance with little or no dressing needed over the entire life of the wheel. In one aspect, the novel abrasive wheel includes a concentrically mounted, annular abrasive rim on a cup shaped hub. The rim can contain an abrasive such as diamond or cubic boron nitride which is embedded in a bonding composition that includes amino aldehyde and phenolic thermoset polymers, a plasticizer, and optionally filler. The hub includes a crosslinkable, strong and rigid, engineering polymer, preferably melamine phenolic thermoset polymer, mixed with spodumene in amount effective to make the coefficient of thermal expansion of the hub match that of the rim. The wheel can be made by simultaneously hot pressing rim and hub preforms and without an additional baking step.Type: GrantFiled: September 3, 1997Date of Patent: November 10, 1998Assignee: Norton CompanyInventors: Srinivasan Ramanath, William H. Williston, Sergej-Tomislav Buljan
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Patent number: 5618892Abstract: A polyhydroxystyrene having a 2,4-diamino-s-triazinyl group substituted for 1-50 mol % of its hydroxyl group and a weight average molecular weight of 3,000-50,000 is provided. A negative radiation-sensitive resist composition comprising the polymer, preferably along with a photo-acid generator and a crosslinking agent has high resolution and developability, affords a resist pattern of rectangular profile, and is shelf stable. The composition is thus very useful as resist material for LSI manufacture.Type: GrantFiled: November 21, 1995Date of Patent: April 8, 1997Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Tomoyoshi Furihata, Motoyuki Yamada
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Patent number: 5391651Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with polyamines containing one or more rodlike mesogenic moieties per molecule. These curable compositions can be oriented by the application of an electric field or magnetic field or drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical and/or mechanical and/or thermal properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.Type: GrantFiled: December 8, 1993Date of Patent: February 21, 1995Assignee: The Dow Chemical CompanyInventors: Jimmy D. Earls, Robert E. Hefner, Jr., Paul M. Puckett
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Patent number: 5334675Abstract: Compositions containing an aryl phosphite and water to hydrolyze the aryl phosphite provide controlled and extended work time when used as hardening agents for the ambient temperature hardening of phenolic resins and for rapid hardening of such resins at modestly elevated temperatures. Pre-solvolysis with small quantities of water, alkanols of 1 to 4 carbon atoms or alkylene glycols of 2 to 4 carbon atoms improve compatibility of trisubstituted phosphites with the resin. Pre-hydrolysis of the phosphites as well as addition of furfuryl alcohol or alkylene glycols of 2 to 4 carbon atoms accelerate the hardening (curing) of the resin. Various compounds such as: carboxylic acid amides, urea, dicyandiamide, N-methylolated amides, N-alkyl 2-pyrrolidinones having 1 to 4 carbon atoms in the alkyl group, those having an internal epoxide group, alkanols, and Schiff bases retard the ambient temperature hardening of the resin with the aryl phosphite hardening agents.Type: GrantFiled: February 24, 1994Date of Patent: August 2, 1994Assignee: Borden, Inc.Inventor: Arthur H. Gerber
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Patent number: 5296570Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with polyamines containing one or more rodlike mesogenic moieties per molecule. These curable compositions can be oriented by the application of an electric field or magnetic field or drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical and/or mechanical and/or thermal properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.Type: GrantFiled: June 1, 1993Date of Patent: March 22, 1994Assignee: The Dow Chemical CompanyInventors: Jimmy D. Earls, Robert E. Hefner, Jr., Paul M. Puckett
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Patent number: 5288770Abstract: A resin composition for a cationically electrodepositable paint comprising(A) a resin having hydroxyl groups and cationic groups,(B) an epoxy resin having at least 2 epoxy functional groups each of which comprises an epoxy group directly bound to an alicyclic ring and/or bridged alicyclic ring on average per molecule, and(C) a finely divided gelled polymer as principal components, wherein said finely divided gelled polymer is obtained by emulsion polymerizing(C-1) a polymerizable monomer containing at least two radically polymerizable unsaturated groups in the molecule, and(C-2) a radically polymerizable unsaturated monomer other than the one mentioned in (C-1), abovein the presence of a reactive emulsifier containing an allyl group in the molecule.Type: GrantFiled: January 22, 1991Date of Patent: February 22, 1994Assignee: Kansai Paint Co., Ltd.Inventors: Teiji Katayama, Eisaku Nakatani, Haruo Nagaoka, Kenji Yamamoto, Reiziro Nishida
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Patent number: 5273792Abstract: The present invention is directed to a novel epoxy polymeric composition resulting from reacting (A) at least one compound containing an average of more than one epoxide group per molecule with (B) at least one curing agent for component (A). At least a portion of the curing agent (B) is at least a first curing agent compound which contains (a) an average of more than one active amine hydrogen atom per molecule and (b) an average of at least one aromatic ring which contains at least one pendant monovalent electron withdrawing group. The present invention also includes a process for preparing the above polymeric materials. The polymeric materials of the present invention also exhibit nonlinear optical capabilities when formed into an optically transparent medium with a noncentrosymmetric alignment of molecules. The nonlinear optical materials of the present invention are useful in electrooptic devices for use in communications and data-processing.Type: GrantFiled: March 13, 1992Date of Patent: December 28, 1993Assignee: The Dow Chemical CompanyInventor: John J. Kester
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Patent number: 5266365Abstract: The present invention is directed to an epoxy-containing polymeric material having nonlinear optical properties, particularly a glycidyl amine polymer, and a process for making the nonlinear optical (NLO) epoxy-containing polymeric material including poling the polymeric material under high voltage at elevated temperature for a period of time to bring about orientation of the nonlinear optical functionalities in the polymer. The polymers have enhanced thermal stability and good NLO properties.Type: GrantFiled: February 28, 1992Date of Patent: November 30, 1993Assignee: The Dow Chemical CompanyInventors: John J. Kester, H. Craig Silvis
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Patent number: 5227452Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with polyamines containing one or more rodlike mesogenic moieties per molecule. These curable compositions can be oriented by the application of an electric field or magnetic field or drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical and/or mechanical and/or thermal properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.Type: GrantFiled: June 29, 1992Date of Patent: July 13, 1993Assignee: The Dow Chemical CompanyInventors: Jimmy D. Earls, Robert E. Hefner, Jr., Paul M. Puckett
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Patent number: 5218062Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with polyamines containing one or more rodlike mesogenic moieties per molecule. These curable compositions can be oriented by the application of an electric field or magnetic field or drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical and/or mechanical and/or thermal properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.Type: GrantFiled: June 29, 1992Date of Patent: June 8, 1993Assignee: The Dow Chemical CompanyInventors: Jimmy D. Earls, Robert E. Hefner, Jr., Paul M. Puckett
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Patent number: 5212261Abstract: Latent, heat-curable epoxy resin compositions containing metal carboxylate curing systems provide exceptional latency, particularly at elevated temperature, as well as facile curing, high T.sub.g and adhesive strength, and other attractive properties. The metal carboxylates comprise alkali metals and alkaline earth metals, aromatic and aliphatic metal carboxylates. The preferred curing systems comprise synergistic combinations of the metal carboxylates with cure modifiers.Type: GrantFiled: December 17, 1990Date of Patent: May 18, 1993Assignee: Henkel Research CorporationInventor: Thomas J. Stierman
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Patent number: 5204025Abstract: A conductive paste composition is described, which comprises an epoxy resin having a diglycidylamino group, a resol type phenol curing agent, and copper powder. The paste composition exhibits excellent moisture resistance and adhesion and provides a cured film of high conductivity level.Type: GrantFiled: April 8, 1991Date of Patent: April 20, 1993Assignee: Mitsubishi Petrochemical Co., Ltd.Inventors: Kimiko Yamada, Katuyosi Yada, Hiromu Inoue, Yousui Nemoto
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Patent number: 5017674Abstract: An epoxy resin composition is disclosed that can be cured at a temperature of 150.degree. C. or below, and can be used to provide a high performance carbon fiber composite material having a 0.degree. direction bending strength of 220 kg/mm.sup.2 or over, and an interlayer shear strength of 10 kg/mm.sup.2 or over.The composition is made up of:(A) an epoxy compound containing 10 to 100% by weight of m- or o-methyl-p-N,N-diglycidyl-aminophenyl-ether or its oligomer,(B) diaminodiphenylsulfone and/or diaminodiphenylmethane,(C) dicyandiamide, 2,6-xylenylbiguanide, o-tolylbiguanide, diphenylguanidine, adipil dihydrazide, azelayl dihydrazide, or isophthalic acid dihydrazide, and(D) a urea compound.Type: GrantFiled: June 27, 1990Date of Patent: May 21, 1991Inventors: Hisashi Tada, Yoshinobu Shiraishi, Shigetsuga Hayashi
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Patent number: 5006611Abstract: Heat-curable compositions of matter which are stable on storage and which contain(a) 10-70 parts by weight of an epoxy resin having a functionality of at least 3,(b) 90-30 parts by weight of an epoxy resin having a functionality of 2-2.5,(c) a diphenol, the amount of the diphenol being so chosen that 0.6-1.2 hydroxyl equivalents of the diphenol (c) are employed per epoxide equivalent of the epoxy resins (a) and (b), and(d) 10-150 parts by weight, relative to 100 parts by weight of the components (a) to (c), of a thermoplastic having phenolic end groups and having a glass transition temperature of at least 150.degree. C. which is compatible with the mixture of the components (a) to (c), are particularly suitable for the production of prepregs for fiber-reinforced composite materials or for the production of adhesive films. The cured shaped articles obtained therefrom are distinguished by a high heat distortion point and excellent mechanical strength properties.Type: GrantFiled: January 11, 1990Date of Patent: April 9, 1991Assignee: Ciba-Geigy CorporationInventors: Rolf Schmid, Sameer H. Eldin
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Patent number: 4957995Abstract: A low viscosity epoxy resin, i.e., a low viscosity polyglycidyl derivative, of an aminophenol having at least one alkyl group on its aromatic ring of which viscosity is 15 poises or below as measured at 25.degree. C., a resin composition containing said resin, and a fiberreinforced composite material containing as matrix a cured product of said epoxy resin composition and a fiber as reinforcing material.Type: GrantFiled: September 5, 1989Date of Patent: September 18, 1990Assignee: Sumitomo Chemical Company, LimitedInventors: Yasuhisa Saito, Katsuya Watanabe, Kohichi Okuno, Kunimasa Kamio, Akira Morii
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Patent number: 4916203Abstract: A curable resin composition comprises an epoxy compound and a propargyl aromatic ether.Type: GrantFiled: November 14, 1988Date of Patent: April 10, 1990Assignee: Shell Oil CompanyInventors: Anthony M. Pigneri, James Vick, III, deceased
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Patent number: 4816546Abstract: Novel epoxy resins are prepared by dehydrohalogenating the reaction product of an epihalohydrin and a hydroxyalkyl containing polysulfide.Type: GrantFiled: June 23, 1987Date of Patent: March 28, 1989Assignee: The Dow Chemical CompanyInventors: Robert E. Hefner, Jr., Paul L. Wykowski
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Patent number: 4757117Abstract: Powder coating compositions suitable for use in the manufacture of laser-engraved printing rollers, comprise(a) a difunctional epoxy resin prepared from a bisphenol,(b) an epoxy resin having an epoxide functionality greater than 2,(c) a diaminodiphenylsulphone as hardener for the mixture of resins (a) and (b), and(d) an imidazole as curing accelerator.These compositions, when applied to a metal base member, fused, and cured, provide a surface that is easily engravable yet has excellent resistance to chemical attack and physical wear.Typical difunctional epoxy resins (a) are 2,2-bis(4-glycidyloxyphenyl)propane advanced with bisphenol A, while typical epoxy resins that may be used as (b) include polyglycidyl ethers of phenol-formaldehyde novolaks. The hardener (c) my be, for example, 3,3'- and 4,4'-diaminodiphenylsulphones and the imidazole accelerator (d) may be 2-methylimidazole or benzimidazole.Type: GrantFiled: April 17, 1987Date of Patent: July 12, 1988Assignee: Ciba-Geigy CorporationInventor: Noel S. Moss
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Patent number: 4501874Abstract: This invention is novel compounds containing one or more 2,3-epoxyalkyl carbamate moieties wherein the carbamate nitrogen is tertiary; prepared by a process which comprises(A) contacting an epihalohydrin carbonate with a secondary amine-containing compound wherein the secondary amine has a pKa of between 6 and 12, in a polar organic solvent under conditions such that a 3-halo-2-hydroxyalkyl carbamate wherein the carbamate nitrogen is tertiary is prepared; and(B) contacting the 3-halo-2-hydroxyalkyl carbamate with an alkali metal hydroxide, alkaline earth metal hydroxide, a secondary amine with a pH of 8 or grater, or an ion-exchange resin with pendant moieties containing hydroxide moieties or a secondary amine moiety with a pH of 8 or greater, in a lower alkanol solvent under conditions such that the 3-halo-2-hydroxy moieties are converted to 2,3-epoxyalkyl moieties so as to prepare a 2,3-epoxyalkyl carbamate.Type: GrantFiled: May 2, 1984Date of Patent: February 26, 1985Assignee: The Dow Chemical CompanyInventor: Joseph W. Hanafin
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Patent number: 4451620Abstract: Diethanolammonium sulphamate is a curing agent for modified aminoplast resins.Type: GrantFiled: May 5, 1983Date of Patent: May 29, 1984Assignee: Cassella AktiengesellschaftInventors: Steffen Piesch, Peter Dorries
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Patent number: 4343924Abstract: Disclosed is an improved method for coating a substrate with a film of a coating composition rapidly curable at room temperature in the presence of a vaporous tertiary-amine catalyst. The pot life of the coating composition is substantially increased without deleterious loss of properties of the ultimately cured film wherein the coating composition comprises three components. The first component is a phenol-functional condensation product of (a) a phenol-aldehyde reaction product bearing a plurality of methylol and phenol groups, and (b) a polyol, polycarboxylic acid, or polyepoxide, wherein the condensation product is reacted with a selective transmethylolating agent for substantially transforming residual methylol groups into non-active hydrogen groups. The second component is a multi-isocyanate cross-linking agent and the third component is an organic solvent. The coating composition is applied to a substrate and cured by exposure of the coated substrate to a vaporous tertiary amine catalyst.Type: GrantFiled: September 14, 1981Date of Patent: August 10, 1982Assignee: Ashland Oil, Inc.Inventor: Gary L. Linden
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Patent number: 4174358Abstract: Toughened multi-phase thermoplastic composition consisting essentially of one phase containing 60 to 99 percent by weight of a polyamide matrix resin of number average molecular weight of at least 5000, and 1 to 40 percent by weight of at least one other phase containing particles of at least one polymer having a particle size in the range of 0.01 to 3.0 microns and being ahdered to the polyamide, the at least one polymer having a tensile modulus in the range of 1.0 to 20,000 p.s.i., the ratio of the tensile modulus of the polyamide matrix to tensile modulus of said at least one polymer being greater than 10 to 1. Said at least one polymer is either a branched or straight chain polymer. The toughened compositions are useful for making molded and extruded parts. Such parts possess greater ductility, less reduction in toughness from scratches and molded in notches and reduced susceptibility to catastrophic failure when compared to known melt fabricated materials.Type: GrantFiled: April 11, 1977Date of Patent: November 13, 1979Assignee: E. I. Du Pont de Nemours and CompanyInventor: Bennett N. Epstein