Abstract: A resin composition that has good heat resistance and handleability and that can produce a prepreg which has a good balance between tackyness and drapability and which causes little resin flow during prepreg molding, a prepreg that is manufactured using the resin composition, and a fiber-reinforced composite are provided. A resin composition that contains a maleimide compound, diallyl bisphenol A, and a diallyl isophthalate polymer, a prepreg in which reinforcing fibers are impregnated with the resin composition, and a fiber-reinforced composite material that is obtained by molding the prepreg are provided.

Abstract: To provide a resist underlayer film forming composition for lithography that is used in a lithography process for production of a semiconductor device. There is provided a resist underlayer film forming composition used in a lithography process for production of a semiconductor device, comprising a resin (A), a liquid additive (B) and a solvent (C). The liquid additive (B) may be an aliphatic polyether compound. The liquid additive (B) may be a polyether polyol, polyglycidyl ether or a combination thereof. Further, there is provided a method of manufacturing a semiconductor device, including the steps of forming a resist underlayer film by applying the resist underlayer film forming composition on a semiconductor substrate and by calcining the composition; forming a photoresist layer on the underlayer film; exposing the semiconductor substrate coated with the resist underlayer film and the photoresist layer to light; and developing the photoresist layer after the exposure to light.

Abstract: The present invention discloses an active-hydrogen-containing curing agent having a phosphorus group, and a flame retardant cured epoxy resin which can be prepared via an addition reaction between the active hydrogen and the epoxide group of an epoxy resin. The cured flame retardant epoxy resin is environmentally friendly and is suitable for printed circuit board and semiconductor encapsulation applications. The phosphorus group of the curing agent has a chemical structure as follows: wherein Ar is a substituted or un-substituted phenyl or phenoxy.

Abstract: Antihalation compositions and methods for reducing the reflection of exposure radiation of a photoresist overcoated said compositions. The antihalation compositions of the invention comprise a resin binder and material capable of causing a thermally induced crosslinking reaction of the resin binder.

Abstract: A hardener for an epoxy resin comprises a phenolic, thiophenolic, aminophenyl, tris-phenolic, tris-thiophenolic, tris-aminophenyl, tetrakis-phenolic, tetrakis-thiophenolic, or tetrakis-aminophenyl compounds; or phenol-formaldehyde or phenol-formaldehyde/melamine-formaldehyde resins wherein the phenyl rings are substituted with at least one of the structures wherein R1 and R2 independently are H, C1-C18 alkyl, C6-C18 aryl, C6-C18 substituted aryl, C6-C18 aryl methylene, or C6-C18 substituted aryl methylene; X is O, S or NH and Ar is wherein R is C1-C4 alkyl and n=0-5.

Abstract: The use of polymers which are obtainable by polymerization of a) at least one vinyl ester of aliphatic C1-C24-carboxylic acids in the presence of b) polyethers of the general formula I,  in which the variables have, independently of one another, the meanings mentioned in the description, as coating agent, binder and/or film-forming excipient in pharmaceutical presentations.

Abstract: A composition useful as a sealant, coating, a potting agent for a printed circuit board, a prepreg or an adhesive comprises a compound (A) wherein all or a part of the oxirane rings in an epoxy compound is replaced with thiirane rings represented by the following formula (1): or compound (A) and compound (B) which contains oxirane rings and no thiirane ring in the molecule, wherein the ratio of oxirane ring/thiirane ring is from 90/10 to 10/90.

Abstract: Antihalation compositions and methods for reducing the reflection of exposure radiation of a photoresist overcoated said compositions. The antihalation compositions of the invention comprise a resin binder and material capable of causing a thermally induced crosslinking reaction of the resin binder.

Abstract: A rubber composition for a tire tread comprising 100 parts by weight of a diene rubber and 35 to 60 parts by weight of a carbon black having a nitrogen specific surface area (N.sub.2 SA) of 120-150 m.sup.2 /g, a 24M4DBP of 95-110 ml/100 g, an N.sub.2 SA/IA of 0.95-1.05, a .DELTA.Dst of less than 70 nm, a Tint of more than 130, and a toluene discoloration (T%) of not less than 70% but less than 80%.

Abstract: The present invention provides an ink composition for printing which comprises a blend of 100 parts by weight of a copolymer comprising a polycaprolactonepolyol, a diamine and a diisocyanate, 30 to 300 parts by weight of a novolac type epoxy resin, 30 to 300 parts by weight of a bisphenol type epoxy resin, 0.2 to 20 parts by weight of a thixotropic agent, 0.1 to 30 parts by weight of a defoaming agent, and 0.1 to 10 parts by weight of a leveling agent. This ink composition is excellent in storage stability, heat resistance, adhesive properties, flexibility, electrical properties, chemical resistance and printing properties as a one-pack type ink composition.

Abstract: A binding agent for molding compositions and molded bodies produced by reacting a low molecular weight lignin from the Organosolv process with phenol in a weight ratio of 1:20 to 3:1 at 100.degree. to 180.degree. C., adjusting the pH to an acidic value and condensing the mixture with 0.2 to 0.9 moles of formaldehyde per mole of phenol at 60.degree. to 120.degree. C. to form the binding agent useful for producing curable molding compositions, high-temperature molding compositions, refractory products, textile fleeces and friction coatings as well as carbon materials.

Abstract: A binding agent for molded bodies and molding compositions produced by prereacting a mixture of 5 to 60% by weight of lignin or a lignin fraction produced by the Organosolv process and 40 to 95% by weight of a phenol novolac resin and subjecting the latter to high shear forces in a kneader or extruder and optionally mixing the same with a curing agent useful in molding compositions and high temperature-stable molded products such as refractory products, friction coatings, textile fleeces and carbon or graphite materials.

Abstract: Poly(butylene terephthalate) injected molded articles which contain small uniformly distributed amounts of amorphous carbon or graphite powder, or graphitic carbon in the form of fibers, or any combination thereof, are electroconductive and possess decreased tendency to accumulate charges of static electricity. Minor amounts of glass fibers, polycarbonate resins and rubbery impact modifiers improve the electroconductivity imparted by the carbon.

Abstract: Novel cationic polymer flocculants are prepared by polycondensation of an epihalohydrin and mixed Mannich reaction products of a monohydric phenol and bisphenol with formaldehyde and dialkylamine. The flocculants are stable in aqueous solutions and show an excellent effect in purification of industrial effluents.

Abstract: Flexible packaging films of high density polyethylene capable of forming easily openable heatseals can be made by coextruding a layer of the high density polyethylene adjacent to a layer of a blend of an ionomer and a copolymer of ethylene and vinyl acetate or an ester of acrylic and or methacrylic acid. Packages made from the films by forming a blend-to-blend heatseal can be opened by a force between one and five pounds per inch width.