Abstract: An embodiment of the present invention provides a method for improving the tensile strength of foundry cores and molds over what may be conventionally achieved. The use of acidic methylene compounds in binder compositions which include strongly alkaline phenolic resoles results in an ester curable binder that may be used to make foundry cores and molds having significantly greater tensile strengths than are achieved with prior art binders. An embodiment of the present invention provides a composition which includes a phenolic resole having a pH ranging from about 10.5 to about 13.5 and an acidic methylene compound.

Abstract: An acetylide-form propargyl-containing resin composition for cationic electrocoating, which comprises a resin having a skeleton of epoxy resin and has a number average molecular weight of 500 to 20,000, and which contains, per 100 grams of the resin composition solids, 5 to 400 millimoles of sulfonium group and 10 to 495 millimoles of propargyl group, the total content of the sulfonium and propargyl groups being not more than 500 millimoles per 100 grams of the resin composition solids, said propargyl group being partly in the form of an acetylide. This resin composition may further contain unsaturated double bonds.

Abstract: An aqueous phenolic resin dispersion that includes an aqueous continuous phase and, dispersed within the aqueous phase, the reaction product of a phenolic resin precursor and a modifying agent wherein the modifying agent includes at least one ionic group and at least one functional moiety that enables the modifying agent to undergo condensation with the phenolic resin precursor. The resulting dispersed phenolic resin reaction product includes at least one phenolic ring to which is bound the ionic group from the modifying agent. The pendant ionic group is a sulfate, sulfonate, sulfinate, sulfenate or oxysulfonate and the reaction-enabling moiety preferably is a hydroxy or hydroxyalkyl.

Abstract: 1. A solid composition comprising(a) a solid oligomeric, cationically polymerisable polyglycidyl ether or polyglycidyl ester, a mixture of a solid oligomeric, cationically polymerisable polyglycidyl ether or polyglycidyl ester and a liquid or crystalline monomeric mono-, di- or polyepoxy resin, or a mixture of a solid oligomeric, cationically polymerisable polyglycidyl ether or polyglycidyl ester and a cyclic acetal, said oligomeric polyglycidyl ether or polyglycidyl ester and the mixtures containing the oligomeric polyglycidyl ether or polyglycidyl ester having a glass transition temperature (T.sub.G) higher than 35.degree. C.,(b) a multifunctional nucleophilic chain transfer agent,(c) 0.

Abstract: A polymer alloy is obtained by adding a hydrophobic compound (1) having a hydrophobic main chain and a functional group containing an active hydrogen atom and a bisoxazoline compound (2) shown by the following formula to a composition containing plural polymers incompatible with each other: ##STR1## wherein D represents an optionally substituted alkylene group, cycloalkylene group or arylene group, R.sup.1, R.sup.2, R.sup.3 and R.sup.4 respectively represent a hydrogen atom or an optionally substituted alkyl group or aryl group. The compound (1) includes a compound having an aliphatic hydrocarbon group as a main chain, containing a carboxyl group and having a molecular weight of 10,000 or less (e.g. higher fatty acids). A compatibilizing agent as produced by reacting the compound (1) and an excess amount of the compound (2) can also be used.

Abstract: A primerless method for repairing a substrate surface that includes applying to the surface a curable filler composition that includes (i) an epoxy compound, (ii) a polythiol curing agent, and (iii) a catalyst and then curing the composition. The filler composition can also include a polyamine in addition to the catalyst.

Abstract: A substantially ester-free, acid-functional thiol-functional resin is prepared via the reaction of an epoxy compound with a thiolacetic acid in the presence of an amine catalyst and heat to form a thioacetate derivative which is hydrolyzed to yield an ester-free, .beta.-hydroxy thiol-functional resin. The .beta.-hydroxy thiol-functional resin can then be reacted with a material capable of insert a group conferring aqueous-base developability such as a cyclic anhydride.

Abstract: An adhesive composition based on a combination of a water soluble amino silane and a normally water-immiscible alkenyl-functional silane wherein the latter is hydrolyzed in the presence of the former under specified conditions to form a stable, water-dilutable aqueous composition having marked bonding affinity between polymers and solid substrates.

Abstract: Epoxy resin mixtures to produce prepregs and composites contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from(a) polyepoxy compounds with at least two epoxy groups per molecule and(b) phosphinic acid anhydrides, phosphonic acid anhydrides or phosphonic acid half-esters;dicyandiamide and/or an aminobenzoic acid derivative as the hardener;an amino hardening accelerator.

Abstract: Epoxy resin mixtures for the production of prepregs and composites contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from(a) polyepoxy compounds with at least two epoxy groups per molecule, and(b) phosphinic acid anhydrides, phosphonic acid anhydrides, or phosphonic acid half-esters;an amine-substituted aromatic sulfonic acid amide or hydrazide as a hardener;an amino hardening accelerator.

Abstract: Disclosed is a thermosetting coating composition comprising (A) an epoxy compound and (B) an aromatic sulfonium salt represented by the formula ##STR1## wherein R.sup.1 represents a hydrogen atom, a hydroxyl group, an alkoxyl group, or a group represented by the formula ##STR2## wherein Y represents an alkyl group, an alkoxyl group, a phenyl group or a phenoxy group all of which may have a substituent, each of R.sup.2 and R.sup.3 represents a hydrogen atom, a halogen atom, or an alkyl group, each of R.sup.4 and R.sup.5 represents an alkyl group, an aralkyl group or an aryl group all of which may have a substituent, and X.sup.- represents SbF.sub.6.sup.-, PF.sub.6.sup.-, AsF.sub.6.sup.-, or BF.sub.4.sup.-.

Abstract: The present invention provides a cationic electrodepositable coating composition comprising:?I! a polyurethane-modified epoxy resin-amine adduct obtained by a reaction of:(A) a polyurethane compound having one terminal isocyanate group in the molecule, obtained by a reaction of (a) a polyhydroxy compound having a number-average molecular weight of 50-8,000, (b) a polyisocyanate compound, and (c) a compound having one active hydrogen atom in the molecule,(B) a bisphenol type epoxy resin having at least two epoxy groups in the molecule, and(C) an active-hydrogen-containing amine compound, and ?II! a nonionic film-forming resin.

Abstract: A coating powder based on an epoxy resin is applied to a substrate and fused and cured thereon. Curing is effected by exposing the coating powder at the point of application to a fluid curative or cure catalyst, e.g., by exposing the fusing coating powder to an ammonia-containing atmosphere.

Abstract: The invention provides a curable, structural epoxy adhesive composition comprising: (a) an epoxy resin; (b) a curing agent for the epoxy resin; and (c) a compound of the formula I: ##STR1## in which R.sup.1 and R.sup.2, which may be the same or different, are selected from an alkyl group, a hydroxyalkyl group, a cycloalkyl group, an aryl group, an arylalkyl group, or a heterocyclic group in which the one to three non-carbon atoms in the ring are independently selected from S, N, and O.

Abstract: An improved aqueous cathodic electrocoating composition having a binder of an epoxy-amine adduct which is of an epoxy resin that has been reacted with an amine, and a blocked polyisocyanate crosslinking agent; wherein the improvement is the use of an alkane sulfonic acid as the neutralizing agent for the epoxy amine adduct to provide an electrocoating composition having improved throw power.

Abstract: Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from(A) polyepoxy compounds with at least two epoxy groups per molecule and(B) at least one compound from the group consisting of phosphinic acids, phosphonic acids, pyrophosphonic acids and phosphonic acid half-esters, andan aromatic polyamine as the hardener.

Abstract: The present invention discloses novolacs and thermosets thereof containing mesogenic moieties. Certain of said novolacs and thermosets thereof exhibit nonlinear optical properties upon orientation.

Abstract: Polymer compositions comprising phenol/formaldehyde systems and polyarylsulphones having epoxy pendent or end groups are disclosed together with novel epoxy-ended polyarylsulphones and novel cross-linked epoxy-ended polyarylsulphones. The compositions can be both unreinforced and reinforced with fibres and/or other fillers.

Abstract: A resin suitable for use as a photoresist that is the esterification product of an o-quinonediazide compound and an aromatic novolak resin. The aromatic novolak resin may be the condensation product of a reactive phenol with a bis(hydroxymethyl)phenol or an aromatic aldehyde. The aromatic resin may be chain extended by further reaction with an additional aldehyde. The resin has a maximum of 20 percent of its phenolic hydroxyl groups esterified with the o-quinonediazide sulfonate compound.

Abstract: Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from(A) polyepoxy compounds with at least two epoxy groups per molecule and(B) phosphinic acid anhydrides and/or phosphonic acid anhydrides, andan aromatic polyamine as the hardener.

Abstract: A low viscosity adhesive composition which comprises:(a) an asymmetric radial block copolymer of a vinyl aromatic hydrocarbon and at least one conjugated diene having from 3 to 6 polymer arms, which:(i) contains from 33 to 85% by weight of polyvinyl aromatic hydrocarbon block/polydiene block copolymer arms and the balance polydiene homopolymer arms,(ii) has vinyl aromatic hydrocarbon blocks with block molecular weights of from 8000 to 30,000,(iii) has conjugated diene blocks in the copolymer arms with a molecular weight of at least 6000, and(iv) has a polyvinyl aromatic hydrocarbon content of from 10 to 40% by weight; and(b) from 20 to 400 parts per hundred parts of polymer of a tackifying resin.The invention also encompasses the polymers used in the adhesive.

Abstract: An alkali soluble resin, preferably a phenolic resin, having a portion of its phenolic hydroxyl groups reacted to form a blocking group inert to acid or base. The polymer is used for the formulation of acid hardening photoresists and the presence of the inert blocking group enables development of an exposed photoresist with a strong developer without formation of microbridges between fine line features.

Abstract: A thermally-curable aromatic amine-epoxy composition comprises(a) at least one polyepoxy compound;(b) a curing amount of at least one aromatic polyamine compound; and(c) a catalytically effective amount of at least one cure accelerator compound which is a .pi.-electron acceptor, and which lowers the cure exotherm peak temperature (as measured by differential scanning calorimetry (DSC) at 10.degree. C. per minute) of the composition by at least about 8 percent relative to the corresponding composition without the cure accelerator. Such accelerator compounds moderate and/or accelerate the thermal curing of aromatic amine-epoxy resins, enabling cure to occur at lower temperatures and/or in shorter time periods than those required for the unaccelerated composition.

Abstract: A stable aqueous adhesive composition based on a combination of a normally water-immiscible organo-functional silane and a phenolic resole wherein the silane is dispersed in a stabilized aqueous dispersion of a phenolic resole.

Abstract: A polymerizable composition of matter comprises a cycloaliphatic epoxy resin, a cyanate ester resin, optionally a polyol, and, as initiator, a Bronsted acid. When cured, the compositions provide interpenetrating polymer networks (IPNs). The IPNs are useful as high temperature stable vibration damping materials, adhesives, binders for abrasives, and protective coatings.

Abstract: Process for the preparation of plastoelastomeric preparations comprising an elastomeric phase of an EPDM elastomer and a plastomeric phase of a thermoplastic olefinic polymer, wherein the elastomeric phase is dynamically vulcanized with a vulcanizing binary agent consisting of an alkylphenol-formaldehydic resin and sodium bisulphite.

Abstract: A treated fibrous polyamide substrate having durable resistance to staining by acid colorants comprising a fibrous polyamide substrate having applied thereto an aqueous solution of a partially sulfonated, partially phosphated resol resin; which aqueous solution may include polymethylmethacrylates or combinations thereof, and that may include a fluorochemical; and the method of treating said substrate, and the resol resins themselves.

Abstract: A reaction resin mixture, which is able to be hardened thermally and by means of UV radiation, contains the following constituents:a cationically polymerizable epoxide resin;a latent hardening initiator in the form of an aralkyl-thiolanium salt; anda sensitizer of the structure ##STR1## A being --CO--, --NR-- and --CO--CO--, and D being --O--, --S--, --CO-- and --CH.sub.2).sub.x (where x= 1 or 2) or rather a single bond or two hydrogen atoms.

Abstract: A process for the manufacture of a stain resistant carpet by melt mixing a fiber forming synthetic polyamide with a compound, being capable to react with an amino group, to form a homogeneous polymer melt into fibers, tufting the fibers into a backing to form a carpet and treating the carpet with polymethacrylic acid, copolymers of polymethacrylic acid, a mixture of polymethacrylic acid and a sulfonated aromatic formaldehyde condensation product, and a reaction product of the polymerization or copolymerization of methacrylic acid in the presence of a sulfonated aromatic formaldehyde condensation product.

Abstract: A polymer composition especially suitable for producing fiber-reinforced structures having advantageous fracture toughness comprises a polyarylsulphone component and a thermoset resin component, each of which components is present at least partly as a phase continuous in at least one dimension. Preferred polyarylsulphones contain repeating units (PhSO.sub.2 Ph).sub.n and (Ph).sub.a linked through ether and/or thioether, where Ph is phenylene, n=1 to 2 and a=1 to 3; and such polyarylsulphones having amino end groups are provided as new compounds. The compositions can be made by spinodal decomposition of a mixture of the polyarylsulphone and a thermoset resin precursor.

Abstract: A composition for imparting stain resistance to polyamide substrates comprising a sulfonated fatty composition and sulfonated hydroxyaromatic formaldehyde condensation polymer. A method for making the stain treatment composition, a method for treating polyamide substrates with the composition, and the resulting stain resistant polyamide materials are also disclosed. Suitable sulfonated hydroxyaromatic formaldehyde condensation polymers include sulfonated phenol formaldehyde condensation polymer and sulfonated dihydroxy diphenyl formaldehyde condensate polymer. Suitable sulfonated fatty compositions include sulfonated oleic acid and marine oil.

Abstract: Anhydride compounds which contain at least one rodlike mesogenic moiety and at least two anhydride groups per molecule, wherein each of said aromatic anhydride groups is linked to the mesogen via an ester linkage are prepared. These anhydride compounds are useful in curing epoxy resins to provide the cured products with one or more improved properties.

Abstract: Toughened thermosetting resins are disclosed comprising a thermosetting resin having a Tg of at least 150.degree. C., preferably 180.degree. C., and having dispersed substantially uniformly therethrough microspheres of a thermoplastic resin having a Tg of at least 150.degree. C., preferably 180.degree. C. It is preferred to use thermoplastic resins with functional groups on the surface thereof capable of bonding to an available group on the thermosetting resin. High performance structural composites made from such toughened resins are disclosed as well as the process of making such composites.

Abstract: The invention provides epoxy resin compounds for manufacturing prepregs and composite materials, which can be obtained inexpensively and have good processibility, and provide--without having to add flameproofing agents--virtually inflammable molded materials with a high glass transition temperature. The epoxy resin compounds contain the following constituents:(A) an aromatic and/or heterocyclic polyepoxide resin that is free of phosphorous, optionally in a mixture with an aliphatic epoxy resin;(B) an epoxy-group-containing phosphorous compound and(C) an aromatic polyamine as a curing agent.

Abstract: A curable moulding composition in the form of a flowable particulate solid substantially non self-adhesive at temperatures up to 60.degree. C., flowable under shear and self-adhesive at temperatures in the range 60.degree.-150.degree. C. and hardenable at temperature over 150.degree. C., said composition comprising an uncured or partly cured thermoset resin precursor and, mixed intimately therewith, a polyarylsulphone containing the repeating units (Ph SO.sub.2 Ph).sub.n and Ph.sup.1.sub.a linked through ether and/or thioether, where Ph is paraphenylene, Ph.sup.1 is phenylene, n is 1 to 2 a is 1 to 3 and groups Ph.sup.1 are (when a exceeds 1) linked through a single chemical bond or a divalent group other than SO.sub.2 or alkylene or are fused together. Preferably the polyarylsulphone contains end-groups of formula --D--Y where D is a divalent aromatic hydrocarbon group and Y is a group reactive with the thermoset precursor and has been incipiently reacted with the thermoset precursor.

Abstract: There are disclosed methods and compositions for retarding the ambient temperature hardening of a phenolic resole resin alone or with an aggregate when such resin is contacted with a nitroalkane and a hardening agent such as lightburned magnesium oxide, an organic ester functional hardening agent, and mixtures of lightburned magnesium oxide and an organic ester functional hardening agent in an alkaline medium. There is also disclosed a hardener composition for phenolic resole resins wherein the hardener composition consists essentially of a solution of a nitroalkane in an organic ester functional hardening agent.

Abstract: A polymeric compound is derived from a polyhydric material and has pendant sulphonate groups of the general formula ##STR1## where X is an aliphatic, aromatic, carbocylic or heterocyclic group; Y is hydrogen, halogen or an alkyl, aryl, alkoxy, aryloxy or aralkyl group, CO.sub. --Z.sup.+, CO.sub.2 R or SO.sub.3 -Z.sup.+ ; Z.sup.+ is a cationic counter ion and R is hydrogen, alkyl, alkylene, aryl or aralkyl group.

Abstract: The hardening of a composition containing a phenolic resin solution and a magnesia aggregate is effected by mixing into such composition at a pH of at least 4.5: a compound which provides an acetate, adipate, 4-aminobenzenesulfonate, 1,2,4-benzenetricarboxylate, formate, glycolate, lactate, nitrate, benzenesulfonate, naphthalenesulfonate, methanesulfonate, phenolsulfonate, succinate, sulfamate, or toluenesulfonate anion to the composition; or an acetylacetone, 2-nitrophenol, 4-nitrophenol, salicylaldehyde compound; or a mixture of said compounds.

Abstract: A radiation-sensitive compound, which comprises a polymer including a plurality of azide-substituted aromatic ester groups and a plurality of carboxylic or sulphonic acid groups capable of imparting to the compound solubility in aqueous or alkaline medium. After image-wise exposure, the compound can be developed using an aqueous or alkaline developer. The compound is useful in the production of radiation sensitive plates for the manufacture of lithographic printing plates which can be baked to improve printing life.

Abstract: A polymer composition especially suitable for producing fibre-reinforced structures having advantageous fracture toughness comprises a polyarylsulphone component and a thermoset resin component, each of which components is present at least partly as a phase continuous in at least one dimension. Preferred polyarylsulphones contain repeating units (PhSO.sub.2 Ph).sub.n and (Ph).sub.a linked through ether and/or thioether, where Ph is phenylene, n=1 to 2 and a=1 to 3; and such polyarylsulphones having amino end groups are provided as new compounds. The compositions can be made by spinodal decomposition of a mixture of the polyarylsulphone and a thermoset resin precursor.

Abstract: There are disclosed methods and compositions for accelerating the hardening of phenolic resole resins having a pH of about 4.5 to 9.5 with lightburned magnesium oxide or magnesium hydroxide, with or without the addition of an ester functional hardening agent. Acceleration of hardening is achieved by incorporating into said compositions an effective quantity of a material which: increases the solubility of magnesium in the hardenable mixture; by certain amines; or by certain chelating agents. Accelerator compounds include those which provide chloride, sulfamate, nitrate, formate, and phosphite anions as well as selected tertiary amines.

Abstract: Latent, heat-curable epoxy resin compositions containing metal carboxylate curing systems provide exceptional latency, particularly at elevated temperature, as well as facile curing, high T.sub.g and adhesive strength, and other attractive properties. The metal carboxylates comprise alkali metals and alkaline earth metals, aromatic and aliphatic metal carboxylates. The preferred curing systems comprise synergistic combinations of the metal carboxylates with cure modifiers.

Abstract: The hardening of a composition containing a phenolic resin solution and a magnesia aggregate is effected by mixing into such composition at a pH of at least 4.5: a compound which provides an acetate, adipate, 1,2,4-benzenetricarboxylate, formate, glycolate, lactate, nitrate, benzenesulfonate, naphthalenesulfonate, methanesulfonate, phenolsulfonate, succinate, sulfamate, or toluenesulfonate anion to the composition; or a mixture of said compounds.

Abstract: There is disclosed methods and compositions for retarding the room temperature hardening of phenolic resole resins when such resins are mixed with lightburned magnesium oxide with or without an ester functional hardening agent. Compounds which act as retarders include azelaic acid, salicylamide, sulfanilic acid, N-methylaniline, and 2,6-diethylaniline.

Abstract: A light-emitting diode device includes a light-emitting diode chip, lead-frames respectively connected to an anode and a cathode of the light-emitting diode chip, an encapsulant for encapsulating the light-emitting diode chip and the lead-frames, and a buffer layer, formed between the encapsulant, on the one hand, and the light-emitting diode chip and the lead-frames, on the other, for reducing the stress acting from the encapsulant onto the light-emitting diode chip and the lead-frames. This device can be minimized degradation of quality caused by this stress, and maintained high product quality for a long period of time. An encapsulating epoxy resin composition contains 100 parts by weight of an epoxy resin, 70 to 140 parts by weight of a curing agent including an acid anhydride, 0.5 to 4.0 parts by weight of a curing accelerator including an onium or diazabicycloalkene salt, and 0.1 to 5.0 parts by weight of a thiophosphite. This resin composition can be suitably used as an encapsulant for LED devices.

Abstract: Hardenable mixtures of materials, comprising(a) an epoxide resin,(b) a dithiol of the formula I or II ##STR1## in which the R.sub.1 s independently of one another are hydrogen or methyl, x is an integer from 2 to 50 and y is an integer from 1 to 30, and(c) a polyamine having at least two primary amino groups,give, after hardening, flexible and tough-lasting products. They are suitable, if appropriate in combination with further additives, for example for the production of sealing compositions, injection compositions, adhesives, moulding resins, matrix resins, casting resins or coating compositions.

Abstract: Broadly, the present invention is directed to an adhesive composition which comprises an epoxy resin, an effective amount of a mercapto curing agent or curative for said epoxy resin, and a compatibilizing amount of a polysulfide compound which has a performance improving fraction of its --SH groups rendered unreactive with the epoxy groups in said composition. Optionally, the adhesive composition can contain amine or amide curing agents in addition to the mercapto curative. Advantageously, at least about 5% of the number of reactive thiol groups of the polysulfide compound are rendered unreactive, advantageously at least about 25%, and preferably at least about 50%. Preferred polysulfide compatibilizing compounds are adducts of a polysulfide and a component which contains functionality reactive with a thiol group, but which contains no residual functionality reactive with epoxy groups in the composition once the polysulfide adduct is formed.

Abstract: A polymeric compound is derived from a polyhydric material and has pendant sulphonate groups of the general formula ##STR1## where X is an aliphatic, aromatic, carbocylic or heterocyclic group; Y is hydrogen, halogen or an alkyl, aryl, alkoxy, aryloxy or aralkyl group, CO.sub.2 --Z.sup.+, CO.sub.2 R or SO.sub.3 --Z.sup.+ ; Z.sup.+ is a cationic counter ion and R is hydrogen, alkyl, alkylene, aryl or aralkyl group.Wherein the polymeric acompound is produced by reacting a polymer having a plurality of pendant hydroxyl groups with a sulphonato substituted acid or with an ester forming derivative.

Abstract: Stain-resistant compositions comprising sulfonated phenol-formaldehyde condensation products and polymers of maleic anhydride and one or more ethylenically unsaturated monomers, polyamide textile substrates treated with the same, and processes for their preparation. The stain-resistant compositions and substrates possess improved stain resistance but do not suffer from yellowing to the extent that previously known materials do.

Abstract: A moulding composition comprising an uncured or partly, cured thermoset resin precursor and, mixed intimately therewith, a polyarylsulphone containing the repeating unit (Ph, SO.sub.2, PH).sub.n, where Ph is phenylene and n is 1 or 2, linked through ether and/or thioether.