Contains Polyol Reactant Or Polymer Derived Therefrom Patents (Class 525/532)
  • Patent number: 10941311
    Abstract: Provided is a silicone contact lens having surface hydrophilicity and surface lubricity. It has been confirmed that a silicone contact lens including, on its surface, a graft polymer chain derived from a polyoxyethylene compound having a plurality of hydroxyl groups at a terminal thereof has surface hydrophilicity and surface lubricity.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: March 9, 2021
    Assignee: NOF CORPORATION
    Inventors: Yoshihisa Shimamura, Yosuke Matsuoka
  • Patent number: 10385162
    Abstract: Provided: polyolefin resin composition excellent in antistatic properties with sufficient persistence and wiping resistance, without impairment of intrinsic mechanical properties; and an automotive interior/exterior material containing the same. The polyolefin resin composition contains: 50 to 90 parts by mass of polyolefin resin; 3 to 40 parts by mass of thermoplastic elastomer; 3 to 30 parts by mass of filler, and an antistatic agent of a polymer compound (E) in an amount of 3 to 20 parts by mass with respect to a total amount of 100 parts by mass of the polyolefin resin, thermoplastic elastomer and filler, wherein the polymer compound (E) has a structure in which a diol, an aliphatic dicarboxylic acid, an aromatic dicarboxylic acid, a compound (B) containing at least one group of Formula (1) and having hydroxyl groups at both ends, and an epoxy compound (D) having two or more epoxy groups are bound via ester bonds: —CH2—CH2—O—??(1).
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: August 20, 2019
    Assignee: ADEKA CORPORATION
    Inventors: Tatsuhito Nakamura, Kazukiyo Nomura
  • Patent number: 8916656
    Abstract: A glass printing ink and a glass printing lacquer comprising at least one pigment, at least one photoinitiator, at least two resins and radicial photoinitiators. One resin is an epoxy resin having an average molecular weight based on bisphenol A, diluted in a UV hardening monomer. The other resin is a resin which contains free functional amino, hydroxy, epoxy, acid, acid anhydride and/or acrylate groups. Also, the use of the glass printing ink and glass printing lacquer when printing a glass substrate and to a method for printing a glass substrate.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: December 23, 2014
    Assignee: Marabu GmbH & Co., KG
    Inventors: Saskia Lehmann, Wolfgang Schaefer
  • Patent number: 8618194
    Abstract: A resin mortar composition suitable for construction purposes is disclosed. The composition includes a resin component (A) curable with an aliphatic amine and a peroxide and a hardener component (H) with at least one peroxide (B) and at least one amine (C). At least one of the resin component (A) and the hardener component (H) contains at least one inorganic filler and the resin component (A) and the hardener component (H) or the resin composition (A) and the at least one peroxide (B) and the at least one amine (C) of the hardener component (H) are spatially separated from one another. The resin component (A) includes a compound (a) capable of undergoing a radical polymerization, a compound (b) capable of reacting with an amine, a transition metal compound (c), at least one inhibitor (d) to adjust the gel time and a bridging compound (e) having at least two reactive functionalities.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: December 31, 2013
    Assignee: Hilti Aktiengesellschaft
    Inventor: Armin Pfeil
  • Patent number: 8575280
    Abstract: Disclosed is a thermosetting resin composition including; (A) a carboxyl group-containing polyurethane prepared by using (a) a polyisocyanate compound (b) polyol compounds (c) a carboxyl group-containing dihydroxy compound as raw materials, (B) a curing agent, wherein the polyol compounds (b) are one or more kinds of polyol compound(s) selected from Group (I) and one or more kinds of polyol compound(s) selected from Group (II); Group I: polycarbonate polyol, polyether polyol, polyester polyol, and polylactone polyol, Group II: polybutadiene polyol, polysilicone having terminal hydroxyl groups, and such a polyol that has 18 to 72 carbon atoms and oxygen atoms present only in hydroxyl groups. The thermosetting resin composition can give a protection film for flexible printed circuits that has excellent long-term reliability of electric insulation, flexibility, and low warpage from curing shrinkage, and particularly low tackiness.
    Type: Grant
    Filed: December 7, 2006
    Date of Patent: November 5, 2013
    Assignee: Showa Denko K.K.
    Inventors: Hiroshi Uchida, Ritsuko Azuma
  • Patent number: 8501876
    Abstract: The invention relates to a glass printing ink and a glass printing lacquer comprising at least one pigment, at least one photoinitiator and at least two resins. One resin is an epoxy resin having an average molecular weight based on bisphenol A, diluted in a UV hardening monomer. Another resin is a resin which contains free functional amino, hydroxy, epoxy, acid, acid anhydride and/or acrylate groups. The invention also relates to the use of the glass printing ink and glass printing lacquer when printing a glass substrate and to a method for printing a glass substrate.
    Type: Grant
    Filed: October 20, 2004
    Date of Patent: August 6, 2013
    Assignee: Marabuwerke GmbH & Co. KG
    Inventors: Saskia Lehmann, Wolfgang Schaefer
  • Patent number: 8487052
    Abstract: The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity and impregnation into a fiber base material and which produces a cured product having excellent heat resistance. A resin composition for a fiber-reinforced composite material contains, as essential components, a poly(glycidyloxyaryl) compound (A), a polymerizable monomer (B) which is an unsaturated carboxylic acid or an anhydride thereof and has a molecular weight of 160 or less, an aromatic vinyl compound or a (meth)acrylate (C), and a radical polymerization initiator (D), wherein an equivalent ratio [glycidyloxy group/acid group] of a glycidyloxy group in the component (A) to an acid group in the component (B) is 1/1 to 1/0.48, and a molar ratio [(B)/(C)] of the component (B) to the component (C) is in the range of 1/0.55 to 1/2.
    Type: Grant
    Filed: August 6, 2010
    Date of Patent: July 16, 2013
    Assignee: DIC Corporation
    Inventors: Atsuko Kobayashi, Ichirou Ogura
  • Patent number: 8450433
    Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: May 28, 2013
    Inventor: Young-Min Kim
  • Publication number: 20120322955
    Abstract: A polyoxyethylene derivative represented by the formula (1): wherein a whole molecular weight of the polyoxyethylene derivative is 500 to 160,000; n is 5 to 3650; L1, L2, and L3 each independently represent an alkylene group, a phenylene group, an ester bond, an amide bond, an ether bond, a urethane bond, a carbonate bond, a secondary amino group, or a combination thereof; X represents a functional group capable of reacting with a bio-related substance; Y represents a hydrophilic group having plural hydroxyl groups made from a residual group of xylitol or volemitol or a residual group of polyglycerin of trimer to 31-mer; Z represents a residual group of a compound having 2 to 5 active hydrogen atoms; b and c are as follows: 1?b?4, 1?c?4, and 2?b+c?5; and d and e each independently are 0 or 1.
    Type: Application
    Filed: March 30, 2012
    Publication date: December 20, 2012
    Applicant: NOF CORPORATION
    Inventors: Hiroki Yoshioka, Takashi Matani, Yuji Yamamoto
  • Patent number: 8318870
    Abstract: The disclosure relates to a composition having at least one radically polymerisable monomer M; at least one radical former, at least one epoxide resin A including an average of more than one epoxide group per molecule, and at least one compound of formula (I). Such compositions are suitable as adhesives, sealants or coatings. Shortly after the application thereof, they have a high initial strength and, after further hardening at room temperature, they reach a high level of final strength.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: November 27, 2012
    Assignee: Sika Technology AG
    Inventors: Markus Haufe, Andreas Kramer
  • Patent number: 8309666
    Abstract: A multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises a first component which comprises a first amine functional adduct and a second amine functional adduct; and a second component which comprises at least one compound having an average of more than 2.0 groups per molecule which are reactive with amines.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: November 13, 2012
    Assignee: The Sherwin-Williams Company
    Inventor: David M. Parish
  • Patent number: 8309665
    Abstract: A multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises: A. a first component which comprises: (i) a first amine functional adduct which comprises the reaction product of a stoichiometric excess of a diamine and a compound having an epoxide group and an alpha, beta unsaturated carbonyl group; B. a second component which comprises: (i) at least one compound having an average of more than 2.0 groups per molecule which are reactive with amines.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: November 13, 2012
    Assignee: The Sherwin-Williams Company
    Inventor: David M. Parish
  • Patent number: 8257796
    Abstract: A process for applying a coating to a substrate and broadcasting solid decorative or protective materials onto the liquid surface of the coating before it completely cures or dries, wherein the coating is a multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises at least a first amine functional adduct and at least one compound reactive with amines.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: September 4, 2012
    Assignee: The Sherwin-Williams Company
    Inventor: David M. Parish
  • Patent number: 8236157
    Abstract: A pigment dispersing resin is disclosed along with pigment dispersion, electrodepositable coating compositions using the pigment dispersing resin, and methods for applying the electrodepositable coating composition. The pigment dispersing resin consists essentially of the carboxylic acid salt of an aminated bisphenol epoxy resin and an alkoxylated styrenated phenol. Pigment dispersions made from the dispersing resin are especially useful for forming low or no volatile organic content electrocoating baths.
    Type: Grant
    Filed: December 12, 2008
    Date of Patent: August 7, 2012
    Assignee: E I du Pont de Nemours and Company
    Inventor: Taddesse Gebregiorgis
  • Patent number: 8158728
    Abstract: Materials and Methods are provided for fabricating microfluidic devices. The materials include low surface energy fluoropolymer compositions having multiple cure functional groups. The materials can include multiple photocurable and/or thermal-curable functional groups such that laminate devices can be fabricated. The materials also substantially do not swell in the presence of hydrocarbon solvents.
    Type: Grant
    Filed: August 9, 2006
    Date of Patent: April 17, 2012
    Assignee: The University of North Carolina at Chapel Hill
    Inventors: Joseph M. DeSimone, Jason P. Rolland, Ginger M. Denison Rothrock, Paul Resnick
  • Patent number: 8147720
    Abstract: An aluminum chelate-based latent curing agent is provided which can cure a thermosetting epoxy resin at a relatively low temperature in a short period of time. A method for producing such an aluminum chelate-based latent curing agent, whose curing conditions can be relatively easily controlled, is also provided. The aluminum chelate-based latent curing agent is made latent by reacting a silsesquioxane-type oxetane derivative with an aluminum chelating agent in the presence of an alicyclic epoxy compound.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: April 3, 2012
    Assignees: Sony Corporation, Sony Chemical & Information Device Corporation
    Inventors: Katsuhiko Komuro, Masahiko Ito, Daisuke Masuko
  • Patent number: 8101690
    Abstract: An amine functional adduct is obtained by admixing a stoichiometric excess of a cycloaliphatic diamine and a compound having an epoxide group and an alpha, beta unsaturated carbonyl group.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: January 24, 2012
    Assignee: The Sherwin-Williams Company
    Inventor: David M. Parish
  • Patent number: 8026321
    Abstract: Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include amine-curing agent having at least one a cyclic group. The adhesive compositions according to the present invention are capable of enhancing the bonding strength of the adhesive, particularly at relatively high temperatures, such as at about 80° C.
    Type: Grant
    Filed: July 16, 2007
    Date of Patent: September 27, 2011
    Assignee: Illinois Tool Works Inc.
    Inventors: Wen-Feng Liu, Barbara Bucquet, Barbara Chabut
  • Patent number: 7884172
    Abstract: To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy resins. The epoxy resin is obtained by glycidylating one or more phenol compounds comprising 95% or more 1,1,2,2-tetrakis (hydroxyphenyl)ethane, and is characterized in that in an examination by gel permeation chromatography, the epoxy resin has a tetranucleus-form content of 50 to 90% by area and an octanucleus-form content of at least 5% by area and has a total chlorine content of 5,000 ppm or smaller.
    Type: Grant
    Filed: October 10, 2006
    Date of Patent: February 8, 2011
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Masataka Nakanishi, Katsuhiko Oshimi, Ryutaro Tanaka, Toru Kurihashi
  • Patent number: 7736744
    Abstract: Aqueous resinous binders comprising graft copolymers, water-dilutable urethane polyols and epoxy-phosphorus acid reaction products are disclosed. The binders are useful in primer formulations for automotive applications.
    Type: Grant
    Filed: September 20, 2006
    Date of Patent: June 15, 2010
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Paul H. Lamers, Christopher A. Verardi, Michele L. Meli, Carolyn A. Novak
  • Patent number: 7632570
    Abstract: Aqueous resinous binders comprising graft copolymers, water-dilutable urethane polyols, epoxy-phosphorus acid reaction products, and an aqueous dispersion comprising the reaction product of trimellitic anhydride and a polyol, wherein the molar ratio of trimellitic anhydride to the polyol in the reaction product ranges from 1:2 to 1:4, and wherein the reaction product is further reacted with an anhydride to form another reaction product are disclosed. The binders are useful in primer formulations for automotive applications.
    Type: Grant
    Filed: July 5, 2007
    Date of Patent: December 15, 2009
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Paul H. Lamers, Christopher A. Verardi, Michele L. Meli, Carolyn A. K. Novak
  • Patent number: 7553890
    Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: June 30, 2009
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atsushi Kuwano
  • Patent number: 7528189
    Abstract: The disclosure relates to using metal acrylate compounds such as zinc diacrylate (ZDA), zinc dimethacrylate (ZDMA), among others for curing epoxy functional (and other cross-linking compounds), and to compositions containing such compounds for use in powder coat, film, adhesive, among other applications. ZDA and ZDMA containing compounds can cure the epoxy component of the compositions while being substantially free of conventional curing agents.
    Type: Grant
    Filed: October 27, 2004
    Date of Patent: May 5, 2009
    Assignee: Blue Goo, LLC
    Inventors: Donald W. Taylor, James W. Freitag, Don K. Howard
  • Patent number: 7488785
    Abstract: Compositions containing (a) a liquid epoxy resin, (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine, (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70° C. (measured by means of DSC at a heating rate of 10° C./min), (d) a photopolymerizable compound and (e) a photoinitiator, the ratio of the number of equivalents of epoxy groups to that of polymerizable groups being 1:0.01 to 1:0.7, are suitable as impregnating resins.
    Type: Grant
    Filed: April 5, 2007
    Date of Patent: February 10, 2009
    Assignee: Huntsman Advanced Materials Americas Inc.
    Inventor: Frans Setiabudi
  • Patent number: 7396869
    Abstract: The disclosure relates to using metallic acrylate compounds such as zinc diacrylate (ZDA), zinc dimethacrylate (ZDMA), among others for curing epoxy functional (and other cross-linking compounds), and to compositions containing such compounds for use in powder coat, film, adhesive, among other applications. ZDA and ZDMA containing compounds can also be supplied as an intermediate product that can cure the epoxy component of the compositions while being substantially free of conventional curing agents.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: July 8, 2008
    Assignee: Denovus LLC
    Inventors: Donald W. Taylor, James W. Freitag
  • Patent number: 7323242
    Abstract: A heat-curable binder based on an aqueous polymer dispersion comprising an emulsion polymer (EP), a polymer composed of at least 5% by weight of an ethylenically unsaturated monocarboxylic acid, dicarboxylic acid or dicarboxylic anhydride (acid polymer SP for short), and monofunctional or polyfunctional epoxide compounds as curatives. The monofunctional or polyfunctional epoxide compound is stirred, preferably in the liquid state, into the aqueous polymer dispersion. Besides the epoxide compound, the heat-curable binder may further comprise a polyol or an alkanolamine as hardener.
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: January 29, 2008
    Assignee: BASF Aktiengesellschaft
    Inventors: Matthias Gerst, Matthias Laubender, Bernd Reck
  • Patent number: 7247684
    Abstract: The present invention provides network polymers obtained by curing compositions that comprise an ester with at least two terminal epoxy groups. Preferred esters include those represented by the formula (1), wherein each R1 independently represents a substituted or unsubstituted homoaliphatic or heteroaliphatic group; A represents a substituted or unsubstituted homoalkylene, hetemalkylene, arylene, or heteroarylene segment; and n represents an integer equal to or greater than 2.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: July 24, 2007
    Assignee: Dow Global Technologies Inc.
    Inventors: Leonardo C. Lopez, Jimmy D. Earls, Jerry E. White, Zenon Lysenko, Marvin L. Dettloff
  • Patent number: 7244793
    Abstract: Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include amine-curing agent having at least one a cyclic group. The adhesive compositions according to the present invention are capable of enhancing the bonding strength of the adhesive, particularly at relatively high temperatures, such as at about 80° C.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: July 17, 2007
    Assignee: Illinois Tool Works Inc.
    Inventors: Wen-Feng Liu, Barbara Bucquet, Barbara Chabut
  • Patent number: 7217771
    Abstract: Compositions containing: (a) a liquid epoxy resin; (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine; (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70° C. (measured by means of DSC at a heating rate of 10° C./min); (d) a photopolymerizable compound; and (e) a photoinitiator; the ratio of the number of equivalents of epoxy groups to that of photopolymerizable groups being 1:0.01 to 1:0.7, are suitable as impregnating resins.
    Type: Grant
    Filed: July 29, 2002
    Date of Patent: May 15, 2007
    Assignee: Huntsman Advanced Materials Americas Inc.
    Inventor: Frans Setiabudi
  • Patent number: 7208538
    Abstract: The disclosure relates to using metal acrylate compounds such as zinc diacrylate (ZDA), zinc dimethacrylate (ZDMA), among others for curing epoxy functional (and other cross-linking compounds), and to compositions containing such compounds. ZDA and ZDMA containing compounds can cure the epoxy component of the compositions while being substantially free of conventional epoxy curing agents.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: April 24, 2007
    Assignee: DeNovus LLC
    Inventors: Donald W. Taylor, James W. Freitag, Don K. Howard
  • Patent number: 7196124
    Abstract: Elastomers are formed from castor oil and/or ricinoleic acid estolides and a polyester formed from an epoxidized vegetable oil such as ESO and a polycarboxylic acid such as sebacic acid, optionally in the presence of a peroxide initiator, or include crosslinked reaction products derived from ricinoleic acid or castor oil estolides, epoxy group-containing compounds such as epoxy resins and/or epoxidized vegetable oil, epoxy hardeners such as polyamine and polycarboxylic acid hardeners, thermally activated free radical initiators such as peroxides, and optionally but preferably include fillers such as limestone or wood flour. The elastomers can be prepared using a two-step, solvent-less procedure at elevated or ambient temperatures. These predominantly “all-natural” elastomers have physical properties comparable to conventional petroleum-based elastomers and composites and exhibit good flexibility, resiliency, abrasion resistance and inertness to hydrolysis.
    Type: Grant
    Filed: January 8, 2004
    Date of Patent: March 27, 2007
    Assignee: Texas Tech University
    Inventors: Harry W. Parker, Richard W. Tock, Fang Qiao, Ronald S. Lenox
  • Patent number: 7179552
    Abstract: Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a liquid state at a temperature of 20° C.; (B) an aromatic epoxy resin having 3 or more epoxy groups in one molecule and an epoxy equivalent of 200 or less; (C) a phenol type curing agent; (D) one or more resins selected from the group consisting of a phenoxy resin, a polyvinyl acetal resin, a polyamide resin, a polyamideimide resin, and mixtures thereof, and having a glass transition temperature of 100° C. or more; and (E) an inorganic filler.
    Type: Grant
    Filed: May 20, 2004
    Date of Patent: February 20, 2007
    Assignee: Ajinomoto Co., Inc.
    Inventors: Shigeo Nakamura, Kenji Kawai
  • Patent number: 7148288
    Abstract: A process is disclosed for formation of a preformed stabilizer for use in formation of graft polyols. The preformed stabilizer has a reduced level of transesterification products and results in less reactor fouling. The preformed stabilizer is prepared in the presence of phosphorous compounds, which reduces the unwanted transesterification products.
    Type: Grant
    Filed: June 27, 2003
    Date of Patent: December 12, 2006
    Assignee: BASF Corporation
    Inventors: Joseph P. Borst, Mao-Yao Huang, David D. Peters
  • Patent number: 7132483
    Abstract: Water-based coating composition comprising: (a) from 0.5 to 90% by weight of at least one epoxy resin other than self-dispersing epoxy resins; (b) from 0.5 to 90% by weight of at least one (meth)acrylate of a polyol; (c) from 5.0 to 98.0% by weight of water; and (d) from 0.5 to 10% by weight of one or more dispersants; wherein the at least one (meth)acrylate comprises at least two (meth)acrylate groups per molecule, and wherein the Brookfield viscosity of the composition is less than 15000 mPas.
    Type: Grant
    Filed: April 10, 2002
    Date of Patent: November 7, 2006
    Assignee: Cognis Deutschland GmbH & Co. KG
    Inventors: Ulrich Nagorny, Rainer Hoefer
  • Patent number: 7094816
    Abstract: Water-based coating composition comprising: (a) from 0.5 to 90% by weight of at least one epoxy resin, wherein the epoxy resin is solid at 20° C., and wherein the epoxy resin is self-dispersing in water; (b) from 0.5 to 90% by weight of at least one (meth)acrylate of a polyol; and (c) from 5.0 to 99.0% by weight of water; wherein the at least one (meth)acrylate comprises at least two (meth)acrylate groups per molecule, and wherein the Brookfield viscosity of the composition is less than 15000 mPas.
    Type: Grant
    Filed: April 10, 2002
    Date of Patent: August 22, 2006
    Assignee: Cognis Deutschland GmbH & Co. KG
    Inventors: Rainer Hoefer, Ulrich Nagorny
  • Patent number: 7041749
    Abstract: Photopolymerizable liquid oligomeric compositions are disclosed. The oligomeric compositions are formed from cycloaliphatic epoxides and Michael addition polyacrylate resins, synthesized from multifunctional acrylates and ?-dicarbonyl Michael donors, specifically ?-keto esters, ?-diketones, ?-ketoamides or ?-ketoanilides or combinations thereof. The oligomeric compositions are provided along with uses thereof and methods of fabricating.
    Type: Grant
    Filed: November 14, 2003
    Date of Patent: May 9, 2006
    Assignee: Ashland Licensing and Intellectual Property LLC
    Inventors: Laurence G. Dammann, Robert B. Fechter, Sridevi Narayan-Sarathy
  • Patent number: 6967107
    Abstract: The present invention describes carbamic acid ester-derived and valeric acid ester-derived polyfunctional cross-linker molecules, and methods for their synthesis and use. The inclusion of polymeric moieties such as poly(alkylene oxide) in the cross-linkers of the present invention can provide advantageous solubility properties in aqueous environments. Such cross-linkers may be used to form conjugates for use in a variety of assay formats.
    Type: Grant
    Filed: March 14, 2005
    Date of Patent: November 22, 2005
    Assignee: Biosite, Inc.
    Inventors: Kenneth F. Buechler, Mariusz G. Banaszczyk, Joseph Barry Noar
  • Patent number: 6887952
    Abstract: The present invention describes carbamic acid ester-derived and valeric acid ester-derived polyfunctional cross-linker molecules, and methods for their synthesis and use. The inclusion of polymeric moieties such as poly(alkylene oxide) in the cross-linkers of the present invention can provide advantageous solubility properties in aqueous environments. Such cross-linkers may be used to form conjugates for use in a variety of assay formats.
    Type: Grant
    Filed: February 12, 2004
    Date of Patent: May 3, 2005
    Assignee: Biosite, Inc.
    Inventors: Kenneth F. Buechler, Mariusz G. Banaszczyk, Joseph Barry Noar
  • Patent number: 6818702
    Abstract: A thermosetting resin composition that is useful as an epoxy resin-based overcoating agent for flexible circuit boards or for film carriers for the TAB method, and the like, providing basic properties required of general insulation protective films, since the cured coated films are excellent in adhesiveness, electric insulation property, chemical resistance, thermal resistance, and the like, reduced in warp caused by cure shrinkage, and excellent in flexibility.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: November 16, 2004
    Assignee: Ajinomoto Co., Inc.
    Inventors: Hiroshi Orikabe, Hiroshi Sakamoto, Tadahiko Yokota
  • Patent number: 6780932
    Abstract: Disclosed is a process for preparation of final graft polyols via a continuous process. In, addition, a final graft polyol formed by the process is disclosed. The process includes the steps of reacting a plurality of ethylenically unsaturated monomers and a reaction moderator with a macromer having induced unsaturation in the presence of a carrier polyol, a free radical polymerization initiator, and a first graft polyol. The process provides for the preparation of a final graft polyol having a solids level of from 30 to 70% in a continuous process. The final graft polyol produced by the process has a lower viscosity over a range of solids levels, a reduced amount of very large irregularly shaped particles, a reduced viscosity change in response to a change in reaction temperature compared to a typical graft polyol, a reduced tendency to foul the continuous reactor, and a broader particle size distribution compared to an identical graft polyol prepared by a semi-batch process.
    Type: Grant
    Filed: May 15, 2002
    Date of Patent: August 24, 2004
    Assignee: BASF Corporation
    Inventors: Duane A. Heyman, Mao-Yao Huang
  • Patent number: 6723802
    Abstract: Epoxy resin polyglycoside-based cured polymers and process for the preparation are described. A particular epoxy resin precursor is the diglycidyl ether of bisphenol A. A particular glucose based polymer is a glucose malic acid ester-vinyl copolymer. The polymers have a degree of biodegradability because of the polyglycoside as well as elevated temperature stability and are useful in transportation vehicle settings. Natural source fillers, such as cellulose fibers, which are treated or untreated, exfoliated clays or exfoliated graphite can be used.
    Type: Grant
    Filed: August 19, 2002
    Date of Patent: April 20, 2004
    Assignee: Board of Trustees of Michigan State University
    Inventors: Lawrence T. Drzal, Seong Ok Han
  • Patent number: 6555601
    Abstract: A process for impregnating an electrical coil which comprises a winding comprising two or more layers consisting of more than one turn of an electrically conducting wire-form material with a polymer material which electrically insulates the individual turns of the wire-form material from one another with the aid of a thermally curable epoxy resin composition, which composition is solid at room temperature and comprises the following constituents: (a) an epoxy resin which is solid at room temperature, selected from (a1) polyglycidyl ethers based on novolaks; (a2) diglycidyl ethers based on bisphenols, and (a3) mixtures of more than one of components (a1) and (a2); (b) a crosslinking agent for component (a); (c) a suitable accelerator for the reaction of component (a) and component (b); (d) from 15 to 70 percent by weight, based on the overall weight of the composition, of filler selected from (d1) calcium carbonate, (d2) quartz flour, (d3) wollastonite whose particles have an average ratio of length
    Type: Grant
    Filed: December 16, 1999
    Date of Patent: April 29, 2003
    Assignee: Vantico Inc.
    Inventors: Dean Tallak Behm, Ulrich Weidmann, Philip David Willis, Felix Bleuel, Hans-Fred Buchmann, Dieter Glauch
  • Patent number: 6489405
    Abstract: A curable epoxy resin formulation comprising a) 40 to 100% by weight of an epoxy group-terminated polyester of a dimerised or trimerised fatty acid and a polyhydric alcohol, and 0 to 60% by weight of a diepoxide which is not an epoxy group-terminated polyester, b) a hardener for epoxy resins consisting of 50 to 99% by weight of a polyoxyalkylene di- or triamine and 1 to 50% by weight of a hardener which is not a polyoxyalkyleneamine, and comprising as further optional components c) a curing accelerator, and d) customary modifiers for epoxy casting resins, with the proviso that the sum of the constituents in component a) as well as in component b) is in each case 100% by weight, is suitable for use as casting resin formulation for encapsulating electrical or electronic components.
    Type: Grant
    Filed: December 18, 1995
    Date of Patent: December 3, 2002
    Assignee: Vantico, Inc.
    Inventor: Christian Beisele
  • Patent number: 6479596
    Abstract: Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae II and III of the claims that are relatively highmolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerised polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.
    Type: Grant
    Filed: May 23, 1996
    Date of Patent: November 12, 2002
    Assignee: Vantico, Inc.
    Inventors: Martin Roth, Roger Salvin, Kurt Meier, Bernhard Sailer, Rolf Wiesendanger
  • Patent number: 6395806
    Abstract: Hardeners for epoxy resins produced by reacting one or more &agr;,&bgr;-unsaturated carboxylic acid esters with one or more hydroxy compounds, reacting the thus formed intermediate with one or more aminopolyalkylene oxide compounds, reacting the thus formed intermediate with one or more polyepoxide compounds, and reacting the thus formed intermediate with one or more amines are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.
    Type: Grant
    Filed: May 7, 2001
    Date of Patent: May 28, 2002
    Assignee: Cognis Deutschland GmbH
    Inventors: Horst Sulzbach, Thomas Huver, Hans-Josef Thomas, Vincenzo Foglianisi
  • Patent number: 6391983
    Abstract: A crosslinkable polymeric casting composition comprises an aromatic polyvinyl monomer such as divinyl benzene, a polythiol such as pentaerythritol tetrakis-(3-mercaptopropionate), an epoxide strain-reducing agent such as hexanediol diglycidyl ether, and, optionally, a polymerizable comonomer such as polyethylene glycol dimethacrylate.
    Type: Grant
    Filed: October 22, 1999
    Date of Patent: May 21, 2002
    Assignee: Sola International Holdings, Ltd.
    Inventors: Ian Roger Bateman, Huan Kiak Toh, David Robert Diggins, Helena Kloubek
  • Patent number: 6387989
    Abstract: Hardeners for epoxy resins produced by reacting one or more &agr;,&bgr;-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, reacting the thus formed intermediate with one or more polyhydroxy compounds, reacting the thus formed intermediate with one or more polyepoxide compounds, and reacting the thus formed intermediate with one or more amines are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.
    Type: Grant
    Filed: May 1, 2001
    Date of Patent: May 14, 2002
    Assignee: Cognis Deutschland GmbH
    Inventors: Horst Sulzbach, Thomas Huver, Hans-Josef Thomas, Vincenzo Foglianisi
  • Patent number: 6365704
    Abstract: To provide a resin material in which various properties of a polyacetal resin such as excellent appearance, slidability and thermal stability are maintained and a rigidity is improved as well. That is, a polyacetal copolymer which is prepared by a copolymerization of 100 parts by weight of trioxane (A), 0.0005 to 2 parts by weight of the component (B), which is a compound (B-1) having at least three glycidyl groups in the molecule or a compound (B-2) having at least two epoxy groups in the molecule, and 0 to 20 parts by weight of a cyclic ether compound (C) copolymerizable with trioxane, and which has a total terminal group amount of 15 to 150 mmol/kg, when (B) is (B-2).
    Type: Grant
    Filed: July 5, 2001
    Date of Patent: April 2, 2002
    Assignee: Polyplastics Co., Ltd.
    Inventors: Hidetoshi Okawa, Kaoru Yamamoto
  • Patent number: 6359082
    Abstract: The present invention relates to a process for the preparation of epoxy(meth)acrylates by simultaneously reacting 1 equivalent of organic compounds containing epoxide groups with A) 0.8 to 1.2 moles of organic dicarboxylic anhydrides having a molecular weight from 98 to 166 and B) 0.8 to 1.2 OH equivalents of OH group-containing reaction products, which are prepared at a COOH/OH equivalent ratio of 0.6:1 to 0.95:1, of a) (meth)acrylic acid and b) tri- or tetrahydric ether alcohols having a molecular weight of 180 to 1000 and containing at least two ethylene and/or propylene oxide units as part of an ether structure.
    Type: Grant
    Filed: June 18, 1997
    Date of Patent: March 19, 2002
    Assignee: Bayer Aktiengesellschaft
    Inventor: Jürgen Meixner
  • Patent number: 6319983
    Abstract: The present invention relates to a process for preparing nondispersing (meth)acrylic esters containing urethane groups, comprising a) reacting at least one hydroxyl-containing compound with (meth)acrylic acid in a solvent, to form an ester; b) removing the solvent and optionally a part of unreacted (meth) acrylic acid; c) reacting the mixture resulting from stage a) or b) with at least one epoxy-functional compound in an amount corresponding to the acid number of the mixture; and d) reacting the mixture resulting from stage c) with at least one compound containing isocyanate groups, and such esters obtainable in this way, and radiation-curable coating compositions comprising said esters, and a process for preparing these coating compositions.
    Type: Grant
    Filed: March 30, 2000
    Date of Patent: November 20, 2001
    Assignee: BASF Aktiengesellschaft
    Inventors: Matthias Lokai, Erich Beck, Wolfgang Reich, Peter Enenkel, Herbert Marky, Rainer Königer