Abstract: A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix.

Abstract: A method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

Abstract: The invention provides high solids epoxy-based autodeposition coating materials that have improved moisture barrier properties and/or anti-corrosive properties and a means to obtain the high solids epoxy-based autodeposition coating materials that eliminates/minimizes the need for process solvents. A hydrophobic water barrier enhancing agent, epoxy pre-polymer and ethylenically unsaturated monomer, as an alternative to organic solvent, are combined to yield an epoxy pre-polymer-monomer-hydrophobic water barrier enhancing agent blend, which may be blended with other coating components and additives. The resulting blend is then dispersed in water with surfactant and the ethylenically unsaturated monomer is polymerized (in the presence of other formulation components) to yield a dispersion. The dispersion may then be used as one component of a coating formulation. The coating formulation can then be applied to materials and cured to form a final coating.

Abstract: Oligomers and polymers containing epoxide groups and silane groups and preparable by reacting (A) at least one low molecular mass, oligomeric or polymeric compound containing at least two epoxide groups (a1) with (B) at least one silane containing (b1) at least one at least divalent organic radical which per se is not hydrolyzable, (b2) at least one cyclic dicarboxylic anhydride group and (b3) at least one silane group containing at least one hydrolyzable group (b31), the cyclic dicarboxylic anhydride groups (b2) being attached to the silane groups (b3) via the radicals (b1), the equivalent ratio of epoxide groups (a1) to dicarboxylic anhydride groups (b2) being 0.7 to 100; processes for preparing them, and their use for preparing anhydrous curable compositions.

Abstract: A polymerizable epoxy compound composition containing an anionic polymerization initiator which can be easily produced, can attain a high polymerization rate and a high degree of polymerization, and can realize an epoxy polymer having properties unobtainable so far, an improvement in cured polymer properties, etc.; and a method of polymerizing an epoxy compound. The composition is an anionically polymerizable composition comprising a monofunctional epoxy compound or a di- or more functional epoxy resin and a polymerization initiator, the polymerization initiator comprising the potassium or sodium salt of a monocarboxylic acid monomer. The method, which is for producing a polymer of epoxy compounds, comprises polymerizing a monofunctional epoxy compound or a di- or more functional epoxy resin by anionic polymerization with the aid of the potassium or sodium salt of a monocarboxylic acid monomer.

Abstract: A composition for forming an article having an improved resistance to hydrolysis is disclosed. The composition comprises a polyalkylene terephthalate and/or polyester thereof, a triglyceride, an epoxy component, and a plasticizer. The polyalkylene terephthalate has terminal carboxyl groups and hydroxyl groups and internal ester linkages. The triglyceride has at least one acid component with 6 to 30 carbon atoms and at least one epoxy group for reacting with the carboxyl groups. The epoxy component has internal aromatic groups and at least one terminal epoxy group for reacting with the carboxyl groups. The plasticizer comprises an esterification product of a polyoxyalkylene glycol with 1 to 20 carbon atoms and an aliphatic carboxylic acid with 1 to 25 carbon atoms for improving melt flow properties and for reducing hydrolysis of the composition.

Abstract: A method for making a lubricating fast-setting epoxy compound comprising: mixing under vacuum dispersion a first micro-crystalline filler, a first talc, and a titanium oxide into a hardenable epoxide containing liquid forming an epoxy base. A second micro-crystalline filler, a second talc, and a hydrocarbon resin are mixed forming an accelerator mixture. A methylamino accelerator is mixed into the accelerator mixture forming an epoxy accelerator. Substantially equal amounts of the epoxy base and the epoxy accelerator are mixed to form the lubricating fast-setting epoxy compound having a high lubricity and a curing time ranging from two minutes to twelve minutes. Adjusting the mixing speed and temperature of the epoxy base, the accelerator mixture, and the epoxy accelerator is contemplated to promote homogeneity. The epoxy base can also include a flatting agent. The epoxy accelerator can also include a modified aliphatic amine, an acrylic resin, a coloring agent, or combinations thereof.

Abstract: The present invention relates to molding compositions comprising A) from 40 to 99% by weight of at least one epoxy resin, B) from 1 to 60% by weight of at least one polyarylene ether sulfone containing side- or end-groups selected from the group consisting of carboxy groups and anhydride groups, C) from 0 to 60% by weight of at least one polyarylene ether sulfone containing essentially no side- or end-groups selected from the group consisting of carboxy and anhydride groups, D) from 0 to 60% by weight of at least one filler, and E) from 0 to 40% by weight of one or more various additives, where the percentages by weight of components A to E together give 100%, and also to a process for preparing these molding compositions, and to their use, and to moldings obtainable therefrom.

Abstract: A heat-curable binder based on an aqueous polymer dispersion comprising an emulsion polymer (EP), a polymer composed of at least 5% by weight of an ethylenically unsaturated monocarboxylic acid, dicarboxylic acid or dicarboxylic anhydride (acid polymer SP for short), and monofunctional or polyfunctional epoxide compounds as curatives. The monofunctional or polyfunctional epoxide compound is stirred, preferably in the liquid state, into the aqueous polymer dispersion. Besides the epoxide compound, the heat-curable binder may further comprise a polyol or an alkanolamine as hardener.

Abstract: The cyclohexanetricarboxylic monoester of the present invention is represented by the following formula 1: wherein R is as defined in the specification. The cyclohexanetricarboxylic monoester is useful particularly as the curing agent for epoxy-containing compounds. A heat-curable resin composition comprising the cyclohexanetricarboxylic monoester and an epoxy-containing compound exhibits an excellent curability without using a curing accelerator and provides a colorless transparent cured product which is little discolored even under a long-term exposure to high-temperature conditions. Such a heat-curable resin composition is suitable as sealing materials for photoelectric transducers such as blue LED and white LED, shaped articles, coating materials, adhesives, etc.

Abstract: The present invention provides a non-flammable heat-resistant resin composition that is provided with (A) modified polyamideimide resin, (B) thermosetting resin and (C) organic phosphor-based compound, and a cured film, obtained from the non-flammable heat-resistant resin composition, exerts a storage elastic modulus of 700 MPa or less, a coefficient of thermal expansion of 5×10?3/K or less and an internal stress of 20 MPa or less, in a temperature range of 25 to 250° C., and the present invention also relates to an adhesive film using the resin composition.

Abstract: An encapsulant composition is provided. The composition includes an epoxy composition including at least a silicone and a phenyl group, a curing agent, and a filler.

Abstract: The present invention relates to an epoxy compound, represented by a general formula (I), which is solid at ordinary temperature, has extremely low melt viscosity and has excellent curing property and which can provide a cured product which is excellent in mechanical strength, heat resistance, and moisture resistance. It also relates to a preparation method of the epoxy compound, an epoxy resin composition, and a cured product thereof. The epoxy compound is represented by the following general formula (I): (wherein R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more).

Abstract: An epoxy compound, represented by a general formula (I) is obtained by reacting an anthrahydroquinone compound having a following general formula (II) with epihalohydrin. (wherein R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more, and wherein A1, A2 each represent hydrogen atom or alkali metal atom, R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms.

Abstract: A powder primer composition comprising as essential components (A) a carboxyl group-containing thermosetting polyester resin, (B1) a bisphenol A-type epoxy resin with an epoxy equivalent of 400-2000 g/eq or (B2) a bisphenol-type epoxy resin with an epoxy equivalent of 400-2000 g/eq and (C1) a bisphenol F-type epoxy resin with an epoxy equivalent of 400-2000 g/eq or (C2) a modified epoxy resin containing phenolic hydroxyl groups, obtained by reacting (a) a bifunctional epoxy resin with (b) an excess of a bifunctional phenol. Coating films obtained using the powder primer composition have excellent finished appearance and corrosion resistance.

Abstract: The present invention relates to polyepoxy resins, methods for making polyepoxy resins water soluble, curable coating compositions, and kits useful in their preparation.

Abstract: An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized colloidal silica filler having a particle size ranging from about 1 nm to about 500 nm. The difunctional siloxane anhydride epoxy hardener can optionally be combined with liquid anhydride epoxy hardeners. Cure catalysts, hydroxyl-containing monomers, adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.

Abstract: The present invention provides a novel epoxy compound, which can be converted into a cured epoxy resin product having liquid crystal properties by curing with a curing agent. Since the cured epoxy resin product of the present invention exhibits good heat conductivity, it is also useful as an insulating material requiring high heat releasability such as a printed circuit substrate and the like.

Abstract: A phosphorus-containing epoxy resin has a structural unit derived from a secondary phosphine derivative represented by the following formula: wherein R1 represents an alkylene group that may have a substituent, R2 represents a cycloalkylene or arylene group that may have a substituent, and X represents an oxygen or sulfur atom.

Abstract: A process for production a high purity epoxy compound with total chlorine content of 500 ppm or less is characterized in that alkali metal hydroxide is added to a bifunctional epoxy compound represented by the general formula (I), in which content of the component with n=0 is not less than 70% and less than 100%, and that reaction is caused to take place at a temperature of 95-150° C.

Abstract: An improved aqueous cathodic electrocoating composition that contains an anti-crater agent which is a water-reducible polyester resin having an acid value less than 40 mg KOH/g. The water-reducible polyester is the reaction product of (1) a hydroxy cyclic carbonate; (2) a polycarboxylic acid anhydride; (3) optional monofunctional epoxy resin; (4) a polyfunctional isocyanate resin; and, (5) a polyamine compound containing tertiary amine and either primary or secondary functionality. The reaction product is neutralized in the presence of acid and water to convert the tertiary amine groups to water-dilutable groups. Hydrolyzable silane groups can also be incorporated into the reaction product to further enhance its crater resistance property. The electrocoat composition produces coatings having a smoother appearance with fewer craters without adversely affecting intercoat adhesion of the cured film to subsequent coating layers applied thereover.

Abstract: An improved aqueous cathodic electrocoating composition that contains an anti-crater agent which is a water-reducible polyester resin having an acid value less than 40 mg KOH/g. The water-reducible polyester is the reaction product of (1) a hydroxy cyclic carbonate; (2) a polycarboxylic acid anhydride; (3) optional monofunctional epoxy resin; (4) a polyfunctional epoxy resin; and, (5) a polyamine compound containing tertiary amine and either primary or secondary functionality. The reaction product is neutralized in the presence of acid and water to convert the tertiary amine groups to water-dilutable groups. Hydrolyzable silane groups can also be incorporated into the reaction product to further enhance its crater resistance property. The electrocoat composition produces coatings having a smoother appearance with fewer craters without adversely affecting intercoat adhesion of the cured film to subsequent coating layers applied thereover.

Abstract: A polycarboxylic acid mixture comprising 80% by weight or more of 1,3,6-hexanetricarboxylic acid, wherein the polycarboxylic acid mixture has a psychometric lightness L-value of 98 or more, a psychometric chroma a-value of from ?2.0 to 2.0 and a psychometric chroma b-value of from ?2.0 to 3.0, and has a nitrogen content of 5,000 ppm by weight or less.

Abstract: The present invention provides network polymers obtained by curing compositions that comprise an ester with at least two terminal epoxy groups. Preferred esters include those represented by the formula (1), wherein each R1 independently represents a substituted or unsubstituted homoaliphatic or heteroaliphatic group; A represents a substituted or unsubstituted homoalkylene, hetemalkylene, arylene, or heteroarylene segment; and n represents an integer equal to or greater than 2.

Abstract: A flame-retardant resin composition comprising 100 parts by weight of a rubber-reinforced polystyrene resin, from 0.1 to 20 parts by weight of an epoxy-modified phenolic resin, and from 1 to 30 parts by weight of an aromatic phosphate has good flame retardancy and good lightfastness, still having good mechanical characteristics intrinsic to the thermoplastic resin therein.

Abstract: Elastomers are formed from castor oil and/or ricinoleic acid estolides and a polyester formed from an epoxidized vegetable oil such as ESO and a polycarboxylic acid such as sebacic acid, optionally in the presence of a peroxide initiator, or include crosslinked reaction products derived from ricinoleic acid or castor oil estolides, epoxy group-containing compounds such as epoxy resins and/or epoxidized vegetable oil, epoxy hardeners such as polyamine and polycarboxylic acid hardeners, thermally activated free radical initiators such as peroxides, and optionally but preferably include fillers such as limestone or wood flour. The elastomers can be prepared using a two-step, solvent-less procedure at elevated or ambient temperatures. These predominantly “all-natural” elastomers have physical properties comparable to conventional petroleum-based elastomers and composites and exhibit good flexibility, resiliency, abrasion resistance and inertness to hydrolysis.

Abstract: There are disclosed a phosphorus-containing carboxylic acid derivative which has a group containing phosphorus atom and has in its molecule, a group represented by the following formula (1): wherein R1, R2 and R3 are each hydrogen atom or a hydrocarbon group having 1 to 18 carbon atoms, and Y is oxygen atom or sulfur atom; a process for producing the derivative; and a flame retardant comprising the foregoing derivative as an effective ingredient. The present invention can provide the phosphorus-containing carboxylic acid derivative and a flame retardant which are each excellent in solubility in an organic solvent, compatibility with a variety of resins, stability and flame retardancy.

Abstract: Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a liquid state at a temperature of 20° C.; (B) an aromatic epoxy resin having 3 or more epoxy groups in one molecule and an epoxy equivalent of 200 or less; (C) a phenol type curing agent; (D) one or more resins selected from the group consisting of a phenoxy resin, a polyvinyl acetal resin, a polyamide resin, a polyamideimide resin, and mixtures thereof, and having a glass transition temperature of 100° C. or more; and (E) an inorganic filler.

Abstract: The present invention is directed to a poly(ethylene glycol)-grafted aliphatic polyester represented by Formula 1: wherein X is an aliphatic ester, R is hydrogen or C1-5 alkyl, Z is the binding moiety of an initiator or a chain transfer agent, m/l is from 0.1 to 50, n is from 2 to 50, w is 1 or greater, and y is from 1 to 200. Further disclosed is a method for preparing the poly(ethylene glycol)-grafted aliphatic polyester of the present invention.

Abstract: The invention relates to the use of special mixtures of at least two polycarboxylic acids as crosslinker components for thermally curing powder-lacquer binding agents having groups that are capable of reacting with carboxyl groups. The mixtures include at least two polycarboxylic acids each melting above 95° C. and having up to 20 carbon atoms and consist of at least 5 wt. %, of the polycarboxylic acid with the lowest melting point and at least 10 wt. %, of the polycarboxylic acid with the highest melting point of all polycarboxylic acids present in the mixture to at least 5 wt. %. Additionally, the polycarboxylic acid mixture is a solid below 40° C. and a liquid above 160° C.

Abstract: In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing/die bonding sheet is effective for reducing the warpage of a chip after die bonding.

Abstract: The present invention relates to improved compositions for aqueous adhesives and aqueous primers that increase the durability of composites made by adhering elastomers to metal.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.

Abstract: A crosslinking agent that is an ungelled reaction product of (a) an aminoplast resin and (b) a carboxylic acid-containing compound wherein the crosslinking agent is essentially free of reactive carboxylic acid groups and has a glass transition temperature of at least 10° C. is disclosed. Methods for preparing crosslinking agents are also disclosed. Further provided is a curable powder coating composition including a polymer having a glass transition temperature of at least 30° C. containing reactive functional groups and the present crosslinking agent; a multilayer composite coating composition and substrates coated therewith are also disclosed.

Abstract: An epoxy resin composition comprising an epoxy resin, a hardening agent and a hardening accelerator as an indispensable ingredients is provided wherein the hardened resin has a high translucency and has little discoloration under high temperature and high humidity and is excellent at heat resistance and light fastness by compounding a phosphonium compound represented by the following formula (I) as a hardening accelerator.

Abstract: There is provided a composition for functioning as an effective additive for an epoxy resin that is a solid at room temperature and has a high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carboxylate composition obtained by first synthesizing an organic carboxylate of a basic silane coupling agent by reacting a basic silane coupling agent and an organic carboxylic acid, and subsequently heating and mixing the organic carboxylate of the basic silane coupling agent with a compound exhibiting a good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater.

Abstract: An expandable adhesive for a structural foam insert useful for vehicular reinforcement is described. The adhesive is characterized by containing a viscosity enhancing agent such as a polymethylmethacrylate, which results in a cured adhesive having unusually small voids and unusually high Young's modulus.

Abstract: A thermosetting resin composition comprising: (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein R1 represents hydrogen, a halogen, or a C1–C5 hydrocarbon group; R2 represents a halogen or a C1–C5 hydrocarbon group; x is 0 to 3; and each of m and n is a natural number; and (2) a cyanate resin having at least two cyanate groups per molecule; is used to provide a printed wiring board material and a printed wiring board for electronic appliances, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.

Abstract: A binder mixture comprises at least one polymer (A) with saturated main chain that is not a polyester and at least one polyester (B) with a saturated and/or unsaturated main chain, where (i) one of the two components (A) or (B) contains structural units I and/or II, or both components (A) and (B) contain structural units I and/or II, ?in which the index n is an integer from 1 to 10; and where (ii) at least polyester (B) that contains no structural units I and/or II contains maleic and/or fumaric esters incorporated in its main chain.

Abstract: The invention relates to addition compounds of formula (1): in which: n is a number from 1 to 10; R1 and R2 are identical or different and are each a hydrogen atom or a saturated or unsaturated aliphatic radical having 1 to 4 carbon atoms; R3 and R4 are identical or different and are each a hydrogen atom or alkyl having 1 to 3 carbon atoms, and the bridge member (R3+R4) is in each case positioned ortho or meta in relation to the phenolic oxygen atom; Z represents a group —CH2—CH2—, —CH2—CH(CH3)—, —CH(CH3)—CH2— or a combination thereof; s is number from 1 to 200; B represents hydrogen, —CO—CH?CH—COOM, —COCH(SO3M)CH2COOM, —CO—CH2—CH(SO3M)—COOM, —SO3M, —SO2M and/or —PO3MM, whereby M is preferably a cation selected from the group Li+, Na+, K+, NH4+, HO—CH2—CH2—NH3+, (HO—CH2—CH2—)2NH2+ or (HO—CH2—CH2—)3NH+; and Y is a radical of an amine. The inventive addition compounds are used as dispersing agents of solids, for example, pigments, particularly in aqueous media.

Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Abstract: The present invention provides a resin composition suitable for molding a microscopic structure that has small cure shrinkage, good mold transfer properties and excellent properties for post-processing such as polishing processing and laser processing. Such a resin is a thermosetting resin composition comprising 95 to 35 wt % of a thermosetting resin and 5 to 65 wt % of organic filler having a particle size of 10 ?m or less. From such a resin, an ink ejecting apparatus having a microscopic structure, for example, a nozzle of a diameter of 30 ?m, is integrally molded.

Abstract: Catalysts useful for low-cure powder coating compositions are disclosed, having the structure (I): wherein R1 is an organic radical having 6 to 25 carbon atoms; each R2 is independently a multivalent hydrocarbon group having 1 to 20 carbon atoms; Y is each R3 and R4 are independently alkyl or aryl groups having 1 to 12 carbon atoms; each Z is independently oxygen or nitrogen; R5 is absent when Z is oxygen and R5 is hydrogen, an alkyl or aryl group having 1 to 20 carbon atoms, or (Y)a —R2— when Z is nitrogen; a, b, and c are integers; each X is independently S, O, or N(R6); each R6 is independently hydrogen or an alkyl or aryl group having 1 to 12 carbon atoms; and P is a polymeric material.

Abstract: The present invention discloses an active-hydrogen-containing curing agent having a phosphorus group, and a flame retardant cured epoxy resin which can be prepared via an addition reaction between the active hydrogen and the epoxide group of an epoxy resin. The cured flame retardant epoxy resin is environmentally friendly and is suitable for printed circuit board and semiconductor encapsulation applications. The phosphorus group of the curing agent has a chemical structure as follows: wherein Ar is a substituted or un-substituted phenyl or phenoxy.

Abstract: A molding compound for use in encapsulating electronic packages which include an optoelectronic component, such as an LED, is provided. The molding compound of the present invention includes a partially cured epoxy composition having a phosphor material substantially uniformly distributed throughout the epoxy composition. The phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.

Abstract: The invention pertains to a coating composition comprising a compound comprising at least one bicyclo-orthoester group and at least one other functional group. The invention also comprises a process for curing the present coating composition. Further, a process for making a bicyclo-orthoester-functional compound from the corresponding oxetane compound is described.

Abstract: An ultraviolet curable resin composition is provided, which is excellent in developing width and resolution, and exhibits good solder heat resistance and resistance to gold plating.

Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), (wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.

Abstract: A amidoamine composition containing oligomeric amidoamine compounds having the structure: the average of x based on the amidoamine composition is at least 0.2, and Z is the residue of a polyoxyalkylene polyether polycarboxylic acid compound, and the amidoamine composition is the reaction product of primary polyamine compounds with polyoxyalkylene polyether polycarboxylic acid compounds at a corresponding equivalent weight ratio of at least 4.0:1 under oligomeric reaction conditions effective to increase the amine nitrogen equivalent weight of the amidoamine composition by at least 10% over the average acid equivalent weight of said polyoxyalkylene polyether polyacid composition. There is also provided glycidated amidoamine compositions used as epoxy functional surfactants, and the aqueous epoxy resin dispersions thereof, and the curable epoxy resin compositions thereof.