With Saturated 1,2-epoxy Reactant Containing More Than One 1,2-epoxy Group Per Mole Or Polymer Derived Therefrom; Or With Solid Copolymer Derived From At Least One Unsaturated 1,2-epoxy Reactant Wherein The Epoxy Reactant Contains More Than One 1,2-epoxy Group Per Mole And At Least One Saturated Reactant Patents (Class 525/65)
  • Patent number: 8222351
    Abstract: A thermoplastic composition comprising in combination a polycarbonate, an impact modifier composition comprising ABS or BABS, a second impact modifier different from BABS or ABS, an aromatic vinyl copolymer, and a gel-type low gloss additive, wherein the 60° gloss of the thermoplastic composition is measured to be less than or equal to 11.3 GU on 3 millimeter chips having a textured surface when measured according to ASTM D2457, and wherein a molded sample of the thermoplastic composition has a low temperature notched Izod impact at ?40° C. of at least 30 KJ/m2 when measured according to ISO 180/1A is disclosed. The composition has low gloss and a significantly improved balance of properties.
    Type: Grant
    Filed: February 12, 2007
    Date of Patent: July 17, 2012
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventor: James Louis DeRudder
  • Patent number: 8222350
    Abstract: A thermoplastic composition comprising in combination a polycarbonate, a polycarbonate-polysiloxane copolymer, an impact modifier composition comprising ABS or BABS, a second impact modifier different from BABS or ABS, an aromatic vinyl copolymer, and optionally a gel-type low gloss additive, wherein the 60° gloss of the thermoplastic composition is measured to be less than or equal to 14 GU on 3 millimeter chips having a textured surface when measured according to ASTM D2457, and wherein a molded sample of the thermoplastic composition has a low temperature notched Izod impact at ?40° C. of at least 65 KJ/m2 when measured according to ISO 180/1A is disclosed. The composition has low gloss, high low temperature impact, and a significantly improved balance of properties.
    Type: Grant
    Filed: February 12, 2007
    Date of Patent: July 17, 2012
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventor: James Louis DeRudder
  • Patent number: 8217098
    Abstract: A thermosetting resin composition having rubbery polymer particles dispersed therein of the present invention, that does not precipitate the thermosetting resin rubbery polymer particles over a long period of time, has excellent fluidity, is easily cured and molded, and sufficiently exhibits original properties of the thermosetting resin, comprises 100 parts by weight of a thermosetting resin, and 1 to 80 parts by weight of rubbery polymer particles, the rubbery polymer particles being dispersed in the form of a primary particle, wherein the solid content concentration is 60% to 90% by weight, and the water concentration is 3% by weight or less, and can efficiently be produced industrially in the state that the rubbery polymer particles are maintained in a stable state.
    Type: Grant
    Filed: January 16, 2008
    Date of Patent: July 10, 2012
    Assignee: Kaneka Corporation
    Inventors: Masakuni Ueno, Ryuji Furukawa, Shinya Hongou, Kazuki Nishiyama
  • Publication number: 20120035324
    Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 9, 2012
    Applicant: HUTCHINSON
    Inventors: Nicolas Garois, Philippe Sonntag, Grégory Martin, Matthieu Vatan, Jacques Drouvroy
  • Patent number: 8092717
    Abstract: Disclosed herein is a polymer composition comprising: a poly(arylene ether); a polyester; electrically conductive filler, and an impact modifier. The composition has a continuous phase comprising polyester and a disperse phase comprising poly(arylene ether). The amount of the disperse phase is less than 35 weight percent, based on the total weight of the composition.
    Type: Grant
    Filed: July 12, 2007
    Date of Patent: January 10, 2012
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Pravin Borade, Donna Starrup Bossman, Shreyas Chakravarti, Robert R Gallucci, Roshan Kumar Jha, Ganesh Kannan, Nitin Moghe, Przemyslaw Olszynski
  • Patent number: 8080611
    Abstract: The present invention provides a chemical and impact resistant thermoplastic resin composition that can have improved extrudability. In one embodiment, the thermoplastic resin composition comprises a base resin including (A) about 1 to about 98% by weight of an epoxy group-containing vinyl copolymer resin; (B) about 1 to about 98% by weight of a rubber modified styrene copolymer resin; and (C) about 1 to about 98% by weight of a polyester resin; and about 1 to about 6 parts by weight of an aromatic vinyl-vinyl cyanide copolymer resin having a weight average molecular weight of about 1,000,000 to about 5,000,000, per 100 parts by weight of the base resin comprising (A)+(B)+(C). In another embodiment, the thermoplastic resin composition comprises a base resin including (A) about 1 to about 98% by weight of an epoxy group-containing vinyl copolymer resin; (B) about 1 to about 98% by weight of a rubber modified styrene copolymer resin; and (C) about 1 to about 98% by weight of a polyester resin; and (E) about 0.
    Type: Grant
    Filed: June 10, 2010
    Date of Patent: December 20, 2011
    Assignee: Cheil Industries Inc.
    Inventors: Jee Kwon Park, Jun Myung Kim, Jin Hwan Choi, Jae Won Lee
  • Patent number: 8058345
    Abstract: Disclosed are adhesive compositions include polymerizable resin, preferably in an amount of from about 10 wt % to about 90 wt % and multifunctional acrylate, preferably in an amount of from about 5 wt % to about 30 wt %. The polymerizable resin can include free radical initiated vinyl addition resins. The adhesives in preferred embodiments exhibit enhanced bonding strength of the adhesive at high temperatures, such as at about 80° C., and enhanced the fire resistance.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: November 15, 2011
    Assignee: Illinois Tool Works Inc.
    Inventors: Wen-Feng Liu, Barbara Chabut
  • Patent number: 8048957
    Abstract: Disclosed is a composition comprising a blend and a modifier in which the blend comprises polycarbonate and acrylonitrile/butadiene/styrene terpolymer and 15 weight % or less of a modifier wherein the modifier comprises an ethylene ester copolymer and either an acrylonitrile butadiene styrene block copolymer or a core-shell polymer. Also disclosed are shaped articles prepared from the composition.
    Type: Grant
    Filed: May 20, 2009
    Date of Patent: November 1, 2011
    Assignee: E.I. du Pont de Nemours and Company
    Inventor: David D. Zhang
  • Patent number: 8017689
    Abstract: This invention relates to an epoxy resin composition which has better adhesive performance and flexibility at low temperatures (about ?20° C.) to normal temperature as well as elevated temperatures (about 80° C.) and is suitable for use as a structural adhesive. The epoxy resin composition includes 100 mass parts epoxy resin, 5 to 100 mass parts core-shell particles, and a curing agent. 1 to 50 mass % of the epoxy resin is a urethane-modified epoxy resin and the core-shell particles include acrylonitrile in the monomer used during the production of the shell layer, and/or comprise a structure having at least three layers of a core layer, an interlayer, and a shell layer.
    Type: Grant
    Filed: August 3, 2009
    Date of Patent: September 13, 2011
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Nao Sato, Kazunori Ishikawa
  • Patent number: 7981963
    Abstract: In a semiconductor device, the topmost wiring layer of the package board is formed from an insulation material in which the elongation at break is 20% or higher and Young's modulus is 1 GPa or less when the temperature is 10 to 30° C. This insulation material contains a reactive elastomer that reacts with epoxy resin or an epoxy resin curing agent; an epoxy resin; an epoxy resin curing agent; and a crosslinked styrene-butadiene rubber having a double bond and a hydroxyl group, a carboxylic group, or another polar group. It is therefore possible to provide a semiconductor device that has a wiring board in which the connection reliability in relation to temperature cycles is high and the adhesiveness between the insulation layer and the electroless copper plating layer is also high.
    Type: Grant
    Filed: April 10, 2007
    Date of Patent: July 19, 2011
    Assignee: NEC Corporation
    Inventors: Yukihiro Kiuchi, Masahiro Ishibashi, Yoshitaka Kyogoku, Masatoshi Iji
  • Patent number: 7956126
    Abstract: A styrene-based resin composition that can be effectively used as a structural material owing to its excellent mechanical properties and also as a functional material owing to its excellent regularity and a method for manufacturing a styrene-based resin composition structurally controllable in nanometer order to micrometer order. The styrene-based resin composition includes (A) a styrene-based resin, (B) a thermoplastic resin other than a styrene-based resin, (c1) a modified styrene-based polymer and (c2) a polycarbonate-based graft polymer.
    Type: Grant
    Filed: February 27, 2006
    Date of Patent: June 7, 2011
    Assignee: Toray Industries, Inc.
    Inventors: Akiyoshi Tamai, Shinichiro Ochiai, Sadayuki Kobayashi
  • Patent number: 7951869
    Abstract: The present system is a waterborne coating composition comprising a low VOC (<50 g/l) acrylic epoxy coating which is capable of high build coating formation (>12 mils) without foaming. The coating composition may be made, stored and transported as a two-part composition, where each part is a pourable liquid. The waterborne acrylic epoxy composition cures under ambient condition to give tenacious adhesion to a variety substrates. The coating system, described herein, is designed as an ambient cure system, but may also be cured at elevated temperatures. The two component emulsion composition is useful for coating applications. One component is an emulsion comprised of a blend of a hydroxy functional acrylic polymer co-reactant, suitable additives, pigments and epoxy resin The second component is a waterborne amine hardener for curing or crosslinking the first component.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: May 31, 2011
    Inventor: Randall A. Funston
  • Patent number: 7910655
    Abstract: A polymer composition includes a polyarylene sulfide resin, a olefinic graft copolymer, and a fluorinated polyolefin resin. Some embodiments may additionally comprise an epoxy compound and/or a filler. In some embodiments, the compositions have good flame retardancy, impact strength, and flexural strength.
    Type: Grant
    Filed: May 22, 2006
    Date of Patent: March 22, 2011
    Assignee: Cheil Industrial Inc.
    Inventors: Nam Joong Baek, Han Soo Chung
  • Patent number: 7863377
    Abstract: Thermoplastic molding compositions, comprising A) at least one thermoplastic polyester A, B) at least one graft polymer B of b1) a graft base of an elastomeric polymer B1 based on alkyl acrylates, ethylene/propylene, dienes, or on siloxanes, and with a glass transition temperature below 0° C., b2) a graft B2 composed of b21) styrene or of substituted styrenes B21 of formula I ?where R is alkyl or hydrogen and R1 is alkyl radical and n is 1, 2, or 3, or mixture, and b22) at least one unsaturated nitrile B22, C) at least one thermoplastic copolymer C of c1) styrene and/or of substituted styrenes C1 of formula I, and c2) at least one unsaturated nitrile C2, D) at least one copolymer D, obtainable via reaction of d1) at least one thermoplastic methacrylate polymer D1 comprising at least one of epoxy, carboxy, hydroxy, anhydride, or oxazoline, with d2) at least one thermoplastic polyester D2.
    Type: Grant
    Filed: July 31, 2006
    Date of Patent: January 4, 2011
    Assignee: BASF AG
    Inventors: Martin Weber, Xaver Hopfenspirger
  • Patent number: 7786214
    Abstract: Disclosed are compositions containing at least one epoxy resin A with on average more than one epoxy group per molecule; at least one epoxy adduct B with on average one epoxy group per molecule; at least one thixotropic agent C, based on a urea derivative in a non-diffusing support material; and at least one curing agent D for epoxy resins, which is activated by an increased temperature. Also disclosed are compositions containing at least one core-shell polymer E and/or filler F and/or reactive diluent G.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: August 31, 2010
    Assignee: Sika Technology AG
    Inventor: Andreas Kramer
  • Patent number: 7737218
    Abstract: Provided is a method comprising reacting the anionic living end of a polymer with a compound selected from the group consisting of tin halides and silicon halides to produced a polymer with a homolytically cleavable group containing a Sn—C bond or a Si—C bond. An engineered plastic may then be produced by adding the polymer containing a homolytically cleavable group containing a Sn—C bond or a Si—C bond to a solvent comprising at least one vinyl monomer; (b) optionally adding at least one additional inert solvent; (c) optionally adding additives selected from the group consisting of extender oils, modifiers, and antioxidants; and (d) initiating polymerization of the at least one vinyl monomer by the use of an initiator and/or heat, wherein a free radical is produced from the polymer containing a homolytically cleavable group containing a Sn—C bond or a Si—C bond.
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: June 15, 2010
    Assignee: Bridgestone Corporation
    Inventors: James E. Hall, David F. Lawson
  • Patent number: 7691944
    Abstract: The present invention provides a primer for a thermoplastic and/or elastomeric substrate, the primer comprising a film of an epoxy-modified polymer selected from the group consisting of an epoxy-modified-thermoplastic polymer, an epoxy-modified-thermoplastic polymeric composite, an epoxy-modified-elastomeric polymer, an epoxy-modified-elastomeric polymeric composite, a blend thereof, and any mixture thereof. Also provided are methods of repairing, inserting, assembling and coating a thermoplastic or elastomeric substrate using the primer of the present invention.
    Type: Grant
    Filed: August 12, 2009
    Date of Patent: April 6, 2010
    Assignee: National Research Council of Canada
    Inventors: Minh-Tan Ton-That, Johanne Denault, Kenneth C. Cole, Margaret Cole, legal representative
  • Patent number: 7649073
    Abstract: Disclosed herein is a polycarbonate copolymer comprising A) a structure derived from a dihydroxy alkylene oxide compound selected from the group consisting of formula (1a) and formula (1b): H-(E-X)l—OH??(1a) H-(E-X-E)l-OH??(1b) wherein E and X are different and each and independently are selected from the group consisting of formula (2a) and formula (2b): —(OCH2CH2)m—??(2a) —(OCHRCH2)n—??(2b) wherein R is a C1-8 alkyl group; l, m, and n are integers greater than or equal to 1; and wherein the weight average molecular weight of the total amount of the structures corresponding to formula (2b) in the copolymer is between 100 and 2,000 g/mol; and B) a structure derived from a dihydroxy aromatic compound, wherein the weight percentages are based on the total weight of the structures of A) and B).
    Type: Grant
    Filed: June 15, 2007
    Date of Patent: January 19, 2010
    Assignee: SABIC Innovative Plastics IP B.V.
    Inventors: Gary C. Davis, Dibakar Dhara, Sarah Elizabeth Genovese, Katherine Glasgow, Gautam Madan, Patrick J. McCloskey, Yohana Perez de Diego, William D. Richards
  • Patent number: 7642315
    Abstract: Disclosed herein is a polycarbonate copolymer comprising A) a structure derived from a dihydroxy alkylene oxide compound selected from the group consisting of formula (1a) and formula (1b): H-(E-X)l—OH??(1a) H-(E-X-E)l-OH??(1b) wherein E and X are different and each and independently are selected from the group consisting of formula (2a) and formula (2b): —(OCH2CH2)m—??(2a) —(OCHRCH2)n—??(2b) wherein R is a C1-8 alkyl group; l, m, and n are integers greater than or equal to 1; and wherein the weight average molecular weight of the total amount of the structures corresponding to formula (2b) in the copolymer is between 100 and 2,000 g/mol; and B) a structure derived from a dihydroxy aromatic compound, wherein the weight percentages are based on the total weight of the structures of A) and B).
    Type: Grant
    Filed: June 15, 2007
    Date of Patent: January 5, 2010
    Assignee: SABIC Innovative Plastics IP B.V.
    Inventors: Gary C. Davis, Dibakar Dhara, Sarah Elizabeth Genovese, Katherine Glasgow, Jennifer Kübel, Gautam Madan, Patrick J. McCloskey, William D. Richards
  • Patent number: 7625977
    Abstract: Epoxy adhesive compositions contain an epoxy resin, rubber modification, a toughener and a curing agent. The tougher has capped epoxide-reactive groups, and at least one polytetrahydrofuran block having a mass of 2200-4500 daltons. The selection of toughener in a rubber-modified epoxy-based structural adhesive provides for very good low temperature performance.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: December 1, 2009
    Assignee: Dow Global Technologies Inc.
    Inventors: Andreas Lutz, Daniel Schneider
  • Patent number: 7612130
    Abstract: A composition contains a polyester; an aromatic epoxy compound, in an amount sufficient to provide 5 to 300 milliequivalents of epoxy per kilogram of polyester; and 0.5 to 6 weight percent, based on the weight of the polyester, and an ethylene-glycidyl methacrylate containing copolymer; and/or a copolyester copolymer, wherein the copolyester comprises, based on the weight of the copolyester, 15 to 95 weight percent of polyester units derived from the reaction of a C6-C24 aromatic dicarboxylic acid or a chemical equivalent thereof with a C2-C6 aliphatic diol, and 5 to 85 weight percent of polyester units derived from the reaction of a C6-C24 aromatic dicarboxylic acid or a chemical equivalent thereof with a poly(alkylene oxide) glycol having a molecular weight of 400-6,000 and a carbon to oxygen ratio of 2.0-4.3. The compositions have excellent hydrolytic resistance, and are suitable for making automotive and electronic parts.
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: November 3, 2009
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventor: Sung Dug Kim
  • Patent number: 7579405
    Abstract: The present invention provides a primer for a thermoplastic and/or elastomeric substrate, the primer comprising a film of an epoxy-modified polymer selected from the group consisting of an epoxy-modified-thermoplastic polymer, an epoxy-modified-thermoplastic polymeric composite, an epoxy-modified-elastomeric polymer, an epoxy-modified-elastomeric polymeric composite, a blend thereof, and any mixture thereof. Also provided are methods of repairing, inserting, assembling and coating a thermoplastic or elastomeric substrate using the primer of the present invention.
    Type: Grant
    Filed: May 20, 2005
    Date of Patent: August 25, 2009
    Assignee: National Research Council of Canada
    Inventors: Minh-Tan Ton-That, Kenneth C. Cole, Johanne Denault
  • Patent number: 7569640
    Abstract: An adhesive sheet comprising at least one heat-activatable adhesive based on a blend of at least one nitrile rubber S1 and at least one nitrile rubber S2, said at least one nitrile rubber S1 having an acrylonitrile fraction of not more than 25% by weight and said at least one nitrile rubber S2 having an acrylonitrile fraction of not less than 30% by weight, and at least one reactive resin.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: August 4, 2009
    Assignee: tesa SE
    Inventors: Marc Husemann, Frank Hannemann, Matthias Koop
  • Patent number: 7563846
    Abstract: A thermoplastic composition comprises a polycarbonate, an acrylonitrile-styrene-acrylate terpolymer, and a low gloss additive, wherein the 60° gloss is measured to be less than or equal to 90 GU according to ASTM D2457. The thermoplastic composition has excellent low gloss performance and mechanical performance. A method of making the thermoplastic composition, and an article comprising the thermoplastic composition are also disclosed.
    Type: Grant
    Filed: July 8, 2005
    Date of Patent: July 21, 2009
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Jing Chen, Theo Hoeks, Xinmin Yang
  • Publication number: 20090181171
    Abstract: A method of orienting microphase-separated domains is disclosed, comprising applying a composition comprising an orientation control component, and a block copolymer assembly component comprising a block copolymer having at least two microphase-separated domains in which the orientation control component is substantially immiscible with the block copolymer assembly component upon forming a film; and forming a compositionally vertically segregated film on the surface of the substrate from the composition. The orientation control component and block copolymer segregate during film forming to form the compositionally vertically-segregated film on the surface of a substrate, where the orientation control component is enriched adjacent to the surface of the compositionally segregated film adjacent to the surface of the substrate, and the block copolymer assembly is enriched at an air-surface interface.
    Type: Application
    Filed: April 1, 2008
    Publication date: July 16, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Joy Cheng, Ho-Cheol Kim, Daniel P. Sanders, Linda Sundberg
  • Patent number: 7547745
    Abstract: A hardener composition useful for curing epoxy resins including a blend of (a) a carboxylic anhydride which is a copolymer of an ethylenically unsaturated anhydride and a vinyl compound; (b) a copolymer of an ethylenically unsaturated anhydride and an elastomer; and optionally (c) a stabilizing agent such as a block copolymer to prevent phase separation of components (a) and (b). The hardener composition is particularly useful in electrical laminates applications.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: June 16, 2009
    Assignee: Dow Global Technologies, Inc.
    Inventor: Ludovic Valette
  • Patent number: 7517934
    Abstract: Oligomer-modified anionically polymerized polymers, reinforced materials made with the polymers and articles made from the reinforced materials are provided. The oligomer-modified polymers are made by reacting anionically polymerized polymers with low molecular weight acrylic oligomers. The oligomer-modified polymers may be used as adhesives, compatibilizers, reinforcing agents and impact modifiers.
    Type: Grant
    Filed: July 27, 2004
    Date of Patent: April 14, 2009
    Assignees: BASF Corporation, Dynasol, LLC.
    Inventors: Gary A. Deeter, Marco A. Villalobos, Sergio Alberto Moctezuma Espiricueto, Javier Revilla Vazquez, Jose Manuel Rojas Garcia, Gerardo Gutierrez Cruz
  • Patent number: 7485680
    Abstract: A process for efficiently producing an agglomerate resulting from removal of impurities from a water-base latex of rubbery polymer particles or dry Powder thereof and producing a dispersion having rubbery polymer particles dispersed in an organic solvent, and a process for efficiently producing a resin composition of low impurity content, in which the state of dispersion of rubbery polymer particles is excellent, from the above dispersion. In particular, a rubbery polymer particle agglomerate of low impurity content is obtained by first mixing a water-base latex of rubbery polymer particles with an organic solvent exhibiting partial solubility in water, bringing the resultant mixture into contact with water to thereby form a rubbery polymer particle agglomerate, and thereafter separating the water phase from the agglomerate/water phase mixture.
    Type: Grant
    Filed: September 1, 2004
    Date of Patent: February 3, 2009
    Assignee: Kaneka Corporation
    Inventors: Ryuji Furukawa, Masakuni Ueno, Katsumi Yamaguchi, Chiho Yoshimi, Yoshihiro Ikeda
  • Patent number: 7442744
    Abstract: The present invention is improved in an enhanced impact resistance of a molded article of a PAS resin and continuous molding (mold release improvement) in mass production and adhesion to coating. The present invention provides a polyarylene sulfide resin composition comprising (A) 100 parts by weight of a polyarylene sulfide resin, (B) 1-20 parts by weight of a graft copolymer formed by the branching or crosslinking chemical bond of an olefin-based copolymer (b-1) and at least one polymer or copolymer (b-2), the olefin copolymer (b-1) composed mainly of an ?-olefin and an ?, ?-unsaturated carboxylic acid ester without a glycidyl group, the polymer or copolymer (b-2) constituted of a specific repeating unit, and (C) 1-20 parts by weight of an olefin copolymer composed mainly of an ?-olefin and a glycidyl ester of an ?,?-unsaturated carboxylic acid.
    Type: Grant
    Filed: June 3, 2004
    Date of Patent: October 28, 2008
    Assignee: Polyplastics Co., Ltd.
    Inventors: Kazutomo Tokushige, Sei Wakatsuka
  • Publication number: 20080227914
    Abstract: The present invention provides a recycled building material such as roof/Geo membrane that comprises (i) a polyolefin, (ii) a polymer containing a carboxyl group or a hydroxyl group, and (iii) a compatabilizer for the components (i) and (ii) which contains an epoxy group or an anhydride group. The present invention also provides a method of recycling building material as well as an article of manufacture such as a TPO membrane using the recycled building material. The TPO membrane has gained better physical properties such as consistent product quality, tensile strength, tear strength, wind resistance, and avoidance of tedious screening processes, among others.
    Type: Application
    Filed: March 16, 2007
    Publication date: September 18, 2008
    Inventor: L. Richard Peng
  • Patent number: 7393895
    Abstract: A method of forming a poly(arylene ether)-containing solid concentrate is described. The method includes blending a poly(arylene ether), a thermosetting resin, and a compatibilizing agent in the presence of a solvent to form a homogeneous solution, and removing the solvent to yield the solid concentrate. The solid concentrate is useful for preparing curable conditions.
    Type: Grant
    Filed: August 23, 2007
    Date of Patent: July 1, 2008
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Michael John Davis, James Estel Tracy
  • Patent number: 7307123
    Abstract: A photocurable composition, including (a) a photocurable monomer, e.g. a cationically curable monomer and/or a radically curable monomer; (b) reactive particles comprising a crosslinked elastomeric core, e.g. made of polysiloxane material, and a shell of reactive groups on an outer surface of the core, wherein the reactive groups comprise epoxy groups, ethylenically unsaturated groups, or hydroxy groups; and (c) an appropriate photoinitiator, e.g. a radical photoinitiator; and a cationic photoinitiator. A method of making a 3-D object from such a composition and a 3-D object made by the method are also provided. The cured composition generally has a smooth surface. The use of the reactive particles makes the composition more stable and the particles do not readily separate out.
    Type: Grant
    Filed: April 18, 2003
    Date of Patent: December 11, 2007
    Assignee: Huntsman Advanced Materials Americas Inc.
    Inventors: David Johnson, John Wai Fong
  • Patent number: 7262247
    Abstract: The present invention provides a binder resin solution composition, and a coating, ink, and adhesive containing the composition as an active ingredient, the binder resin solution composition having a solid content of 10 to 50 wt. % and comprising (a) a chlorinated polyolefin prepared by chlorinating to a chlorine content of 10 to 40 wt. % an ethylene-propylene-butene ternary random copolymer having an ethylene content of 3.0 to 3.7 mol %, 1-butene content of 2.4 to 2.8 mol %, and melting point of 129 to 133° C., and (b) an organic solvent.
    Type: Grant
    Filed: June 26, 2002
    Date of Patent: August 28, 2007
    Assignees: Toyo Kasei Kogyo Company Limited, Mitsui Chemicals, Inc.
    Inventors: Kenji Kashihara, Tetsuji Nishioka, Tatsuo Tsuneka, Shoji Maekawa, Isao Wada
  • Patent number: 7247683
    Abstract: A no flow fluxing underfill having a hardener component comprising a phenolic component and an anhydride component in a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1; or between about 0.8:1 and about 1.2:1. An underfill preparation method involving blending an epoxy component and a phenolic component, heating the blend, and cooling the blend, prior to incorporation of an anhydride component.
    Type: Grant
    Filed: August 5, 2004
    Date of Patent: July 24, 2007
    Assignee: Fry's Metals, Inc.
    Inventors: James M. Hurley, Mark Wilson, Xiaoyun Ye
  • Patent number: 7138445
    Abstract: The present invention relates to a flame retardant thermoplastic resin composition that contains a phenol resin derivative having good char formability, regardless of the base resin. A flame retardant thermoplastic resin composition according to the present invention comprises (A) 100 parts by weight of a thermoplastic resin as a base resin, (B) about 0.1˜100 parts by weight of a phenol resin derivative, and (C) about 0.1˜50 parts by weight of a phosphoric acid ester morpholide compound or a mixture of phosphoric acid ester morpholide compounds. Another flame retardant thermoplastic resin composition according to the present invention comprises (A) 100 parts by weight of a thermoplastic resin as a base resin, (B) about 0.1˜100 parts by weight of polyphenylene ether, (C) about 0.1˜100 parts by weight of a phenol resin derivative, and (D) about 0.1˜50 parts by weight of a phosphoric acid ester morpholide compound or a mixture of phosphoric acid ester morpholide compounds.
    Type: Grant
    Filed: December 8, 2003
    Date of Patent: November 21, 2006
    Assignee: Cheil Industries Inc.
    Inventors: Jae Ho Yang, Sang Hyun Hong, Gyu Chul Lee, Bok Nam Jang, Young Gil Jang, Sung Hee Ahn, Su Hak Bae, Jong-Cheol Lim, Kyung-Hoon Seo, Sam-Joo Yang
  • Patent number: 7119141
    Abstract: A thermoplastic resin molding composition comprising an alkylene aryl polyester, a core-shell impact modifier for enhancing heat resistance having a shell derived from an alkylacrylate and a rubbery acrylate core derived from an acrylate having 4 to 12 carbon atoms, an effective amount of a difunctional epoxy compound for enhancing hydrolysis resistance of the resin, and a combination of color enhancing stabilizers comprising a thioester stabilizer, a phosphite or phosphonite stabilizer and a hindered phenol stabilizer.
    Type: Grant
    Filed: August 20, 2003
    Date of Patent: October 10, 2006
    Assignee: General Electric Company
    Inventors: Sung Dug Kim, Robert Russell Gallucci, Sanjay Braj Mishra
  • Patent number: 7119152
    Abstract: The present invention relates to thermoplastic polyesters, which comprise, by weight: (i) a thermoplastic polyester; (ii) an impact modifier comprising: (a) a core-shell copolymer (A); (b) an ethylene copolymer (B) chosen from ethylene-unsaturated carboxylic acid anhydride copolymers (B1), ethylene-unsaturated epoxide copolymers (B2) and blends thereof; (iii) the (B)/(A) ratio being between 40/60 and 10/90 for proportions of impact modifier between 18 and 40% in 82 to 60% of polyester, respectively; (iv) the (B)/(A) ratio being between 40/60 and 25/75 for proportions of impact modifier between 2 and 18% in 98 to 82% of polyester, respectively. It is particularly useful for PET and PBT.
    Type: Grant
    Filed: November 24, 2000
    Date of Patent: October 10, 2006
    Assignee: ATOFINA
    Inventors: Christophe Lacroix, Alain Bouilloux
  • Patent number: 7071259
    Abstract: Functionalized propylene polymer compositions useful as coupling/compatibilizing agents are provided. The compositions are a mixture of two different functionalized propylene polymers. Polypropylene composites containing fillers and/or non-compatible resins and formulated using the mixed functionalized coupling/compatibilizing agents are also provided.
    Type: Grant
    Filed: July 27, 2004
    Date of Patent: July 4, 2006
    Assignee: Equistar Chemicals, LP
    Inventor: Maged G. Botros
  • Patent number: 7056978
    Abstract: A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride, a core shell polymer and a catalyst. In an alternative embodiment, the composition also contains a linear anhydride. Various additives, such as surfactants and coupling agents may also be added to the composition.
    Type: Grant
    Filed: November 6, 2002
    Date of Patent: June 6, 2006
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventor: Jayesh P. Shah
  • Patent number: 7022777
    Abstract: A moldable thermosetting composition comprises a poly(arylene ether), a thermosetting resin, a toughening agent, and an amine cure agent. The compositions may be conveniently prepared without solvents, and the poly(arylene ether) may be provided in the form of an easily dissolved solid concentrate with the thermosetting resin.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: April 4, 2006
    Assignee: General Electric
    Inventors: Michael John Davis, James Estel Tracy
  • Patent number: 7019075
    Abstract: A two-part acrylic structural adhesive comprises a first package containing from about 10 to about 90 percent by weight of at least one ethylenic unsaturated methacrylic ester selected from the group consisting of 1) an alkyl mono-, di- or tetra-substituted cyclohexyl methacrylate, wherein the substitutions occur in either the 3, 4, and/or 5 ring positions, and 2) a linear or branched C4–C10 alkyl methacrylate; from about 10 to about 80 percent by weight of a toughener, and an adhesion promoter; and a second package containing a bonding activator, and, optionally, an epoxy resin.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: March 28, 2006
    Assignee: Lord Corporation
    Inventors: Robin F. Righettini, Jeffrey A. Hatcher
  • Patent number: 6962957
    Abstract: An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 ?m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 ?m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 ?m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.
    Type: Grant
    Filed: April 24, 2003
    Date of Patent: November 8, 2005
    Assignee: Nitto Denko Corporation
    Inventors: Hideyuki Usui, Satoshi Okuda, Minoru Nakao
  • Patent number: 6949602
    Abstract: A heat and impact resistant adhesive is disclosed. The adhesive can include at least one acrylic-based monomer, at least epoxy based monomer/resin, at least one bifunctional monomer chemically reactive with the acrylic-based monomer and the epoxy based monomer/resin, at least one impact modifier, and a catalyst system.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: September 27, 2005
    Assignee: Illinois Tool Works, Inc.
    Inventors: Donald E. Gosiewski, Brian Rice
  • Patent number: 6936350
    Abstract: The present application relates to a white, biaxially oriented, flame-retardant, UV-resistant polyester film with at least one base layer which comprises, based on the weight of the base layer, from 2 to 60% by weight of a cycloolefin copolymer (COC), where the glass transition temperature of the COC is within the range from 70 to 270° C. The film also comprises from 0.01 to 5.0% by weight of a UV stabilizer as light stabilizer and also comprises from 0.5 to 30% by weight of flame retardant, based in each case on the weight of the layer comprising the UV stabilizer and/or comprising the flame retardant. The film of the invention is suitable for packing foods or other consumable items which are sensitive to light and/or to air, or for use in industry, e.g. in the production of hot-stamping foils or as a label film, or for image-recording papers, printed sheets or magnetic recording cards.
    Type: Grant
    Filed: February 12, 2001
    Date of Patent: August 30, 2005
    Assignee: Mitsubishi Polyester Film GmbH
    Inventors: Ursula Murschall, Herbert Peiffer, Gottfried Hilkert, Hans Mahl
  • Patent number: 6913792
    Abstract: A curable melt blended composition and a method of making the composition by melt blending a thermoplastic polymer comprising polyphenylene ether (PPE) polymer and a polystyrene polymer, preferably high impact polystyrene (HIPS), and optionally a compatiblizer, with an uncured epoxy component, comprising a curable epoxy and an epoxy curing agent, at a temperature greater than 150° C. and without addition of solvent wherein the epoxy component of the resulting curable melt blended composition remains substantially uncured.
    Type: Grant
    Filed: June 17, 2004
    Date of Patent: July 5, 2005
    Assignee: 3M Innovative Properties Company
    Inventors: Robert Steven Clough, Mario Alberto Perez
  • Patent number: 6894112
    Abstract: The invention relates to thermoplastic molding materials containing the following main components: A) 2 to 97.9 wt. % of at least one polyester; B) 0 to 95.9 wt. % of at least one polycarbonate; C) 1 to 80 wt. % of at least one graft polymer which is made up of c1) 40 to 80 wt. % of a graft base consisting of a rubber elastic polymer based on alkyl acrylates with 1 to 8 C-atoms in the alkyl radical and with a glass transition temperature of less than 10° C., c2) 20 to 60 wt. % of a graft support consisting of c21) 60 to 95 wt. % styrene or substituted styrenes of general formula (I), wherein R represents an alkyl radical with 1 to 8 C-atoms or a hydrogen atoms and R1 represents an alcohol radical with 1 to 8 C-atoms and the value of n is 1, 2 or 3 and c22) 5 to 40 wt. % of at least one unsaturated nitrile; D) 1 to 80 wt. % of a copolymer consisting of d1) 60 to 95 % styrene or substituted styrenes of general formula (I) or mixtures thereof and d2) 5 to 40 wt. % of at least one unsaturated nitrile; E) 0.
    Type: Grant
    Filed: November 10, 2000
    Date of Patent: May 17, 2005
    Assignee: BASF Aktiengesellschaft
    Inventors: Martin Weber, Walter Heckmann
  • Patent number: 6884854
    Abstract: Condensation products prepared from cyclic carboxylic anhydrides of dicarboxylic acids, tricarboxylic anhydrides or tetracarboxylic anhydrides and difunctional polyamines, in particular polyoxyalkyleneamines, are suitable as a builder component for epoxy resin compositions. The reaction products based on tricarboxylic anhydrides or tetracarboxylic anhydrides are distinguished by having on average more than one imide group and carboxyl group per molecule. The compositions may optionally also contain condensation products obtained from tri- or poly-functional polyols and/or tri- or poly-functional amino-terminated polymers and cyclic carboxylic anhydrides, wherein the latter reaction products contain on average more than one carboxyl group per molecule. These compositions additionally contain conventional rubber-modified epoxy resins together with liquid and/or solid polyepoxy resins and conventional hardeners and accelerators and optionally fillers and rheology auxiliaries.
    Type: Grant
    Filed: March 31, 2001
    Date of Patent: April 26, 2005
    Assignee: Henkel Kommanditgesellschaft auf Aktien
    Inventors: Rainer Schoenfeld, Hubert Schenkel, Harald Kuester
  • Patent number: 6864318
    Abstract: A composition comprising a thermoplastic polymer having incorporated therein a crosslinked phase derived from the reaction of: (A) a copolymer made from ethylene and an unsaturated epoxide, a polyolefin grafted with an unsaturated epoxide, or a product having two epoxide groups, (B) a copolymer made from ethylene and an unsaturated carboxylic acid anhydride, and (C) a copolymer made from an unsaturated carboxylic acid or an ?,?-aminocarboxylic acid.
    Type: Grant
    Filed: August 27, 1999
    Date of Patent: March 8, 2005
    Assignee: ATOFINA
    Inventors: Alain Bouilloux, Laurent Teze
  • Patent number: 6861475
    Abstract: The present invention, a powder composition for making powder coatings comprising one or more than one curable polymer or resin and an agglomerate of a core-shell polymer, wherein the agglomerate of a core-shell polymer has an average particle size of from 5 to 190 microns, preferably from 10 to 127 microns. The powders in accordance with the present invention provide a cured powder coating that is flexible, smooth, and which may be applied in a thickness of only from 0.3 to 8 mils. In a preferred embodiment of making a powder in accordance with the present invention, the agglomerate is cryoground to form a reduced agglomerate prior to adding it into a powder as a post-blend or a powder-forming mixture as a preblend. The preferred core-shell polymer for use in accordance with the present invention comprises an acrylic impact modifier having a poly(methyl methacrylate) shell and a poly(butyl acrylate) core.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: March 1, 2005
    Assignee: Rohm and Haas Company
    Inventors: Casmir Stanislaus Ilenda, Michael Louis Spera, Gordon Tullos, Andrew T. Daly
  • Patent number: 6849687
    Abstract: A thermoplastic molding composition comprising a grafted acrylate rubber (ASA) and a gloss reducing agent and a process for making the same are disclosed. The gloss reducing agent is the reaction product of (i) an epoxidized grafted rubber having two or more epoxy groups in its graft phase and (ii) a compound having two or more terminal primary amine groups per molecule The gloss reducing agent may be either incorporated in ASA as the reaction product of (i) and (ii) or, in the altemative, formed upon the reaction of (i) with (ii) in the course of the thermal processing of the a blend containing ASA, (i) and (ii).
    Type: Grant
    Filed: August 1, 2002
    Date of Patent: February 1, 2005
    Assignee: Bayer Polymers LLC
    Inventors: Moh-Ching Oliver Chang, Allen R. Padwa, Norma I. Santiago