Interpenetrating Network Patents (Class 525/903)
  • Patent number: 5132359
    Abstract: A vinyl chloride resin composition having excellent impact resistance even at a low temperature and good weather resistance is disclosed. Such vinyl chloride resin composition comprises:(A) a vinyl chloride resin, and(B) a compound rubber type graft copolymerwherein one or more vinyl monomers are graft-polymerized onto a compound rubber that has an average particle diameter of 0.08 to 0.6 .mu.m and possesses such a structure that 1 to 10 wt. % of a polyorganosiloxane rubber component and 90 to 99 wt. % of a polyalkyl (meth)acrylate rubber component are entangled in an inseparable fashion, and the total amount of the polyorganosiloxane rubber component and the polyalkyl (meth)acrylate rubber component is 100 wt. %.
    Type: Grant
    Filed: July 13, 1990
    Date of Patent: July 21, 1992
    Assignee: Mitsubishi Rayon Company, Ltd.
    Inventors: Isao Sasaki, Naoki Yamamoto, Akira Yanagase
  • Patent number: 5124393
    Abstract: The ICI viscosity of a paint is improved by incorporating into the paint a binder that comprises, in part, a supplemental polymer. The supplemental polymer comprises about 20 to about 60 weight percent of a substantially non-self-polymerizable monomer and about 40 to about 80 weight percent of a copolymerizable monomer having a water-soluble homopolymer. The supplemental polymer and binder are substantially inseparable by chromatographic means.
    Type: Grant
    Filed: April 30, 1990
    Date of Patent: June 23, 1992
    Assignee: Union Oil Company of California
    Inventors: David M. Ingle, Gaylen M. Knutson
  • Patent number: 5115020
    Abstract: The invention concerns a process for preparing composite resin particles having the so-called semi-IPN (inter penetration network) structure, in which linear thermoplastic polymer chains get entangled with a crosslinked polymer core through partial or thorough penetration. This method is very important in that both of the chain polymer and core polymer are freely selected from various resins.
    Type: Grant
    Filed: July 19, 1990
    Date of Patent: May 19, 1992
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Hisaichi Muramoto, Yusuke Ninomiya, Keizou Ishii, Shinichi Ishikura
  • Patent number: 5112915
    Abstract: Copolyetherester molding compositions comprising a copolyetherester and a modifying amount of a modulus reducing rubbery interpolymer comprising a crosslinked (meth)acrylate rubbery phase and an interpenetrating, crosslinked styrenic resin phase.
    Type: Grant
    Filed: April 16, 1990
    Date of Patent: May 12, 1992
    Assignee: General Electric Company
    Inventors: Thomas A. Morelli, Warren J. Peascoe, Stefan F. Rasch, John A. Tyrell
  • Patent number: 5110867
    Abstract: Polymeric materials comprising an interpenetrating network (IPN) prepared from allyl polymers and epoxy resins. The allyl polymers are crosslinked under the influence of a radical initiator, the epoxy resin is crosslinked by a curing agent. The curing agent is a cyclic anhydride containing a polymerizable double bond. The two networks are interlinked as a result of the double bond being involved in the curing reaction of the allyl polymers. The cyclic anhydride preferably is maleic anhydride. Preferred IPN's are prepared form triallylcyanurate or triallylisocyanurate-based allyl polymers and phenol-type epoxy resin.
    Type: Grant
    Filed: September 12, 1990
    Date of Patent: May 5, 1992
    Assignee: Akzo NV
    Inventors: Jan A. J. Schutyser, Antonius J. W. Buser, Pieter H. Zuuring, Hendrik J. Slots
  • Patent number: 5106924
    Abstract: An epoxy resinous composition suitable for impregnating windings of turbine generators comprises a reaction product of an epoxy resin and maleic anhydride combined with a vinyl monomer, a (vinyl or isopropenyl)phenyl glycidyl ether which co-reacts with the epoxy diester prepolymer formed from said reaction product, and the polymerized vinyl monomer, and an anhydride.
    Type: Grant
    Filed: February 5, 1990
    Date of Patent: April 21, 1992
    Assignee: Westinghouse Electric Corp.
    Inventors: James D. B. Smith, Donald D. Jerson
  • Patent number: 5098961
    Abstract: This invention is a semi-interpenetrating polymer network which includes a high performance thermosetting polyimide having a nadic end group acting as a crosslinking site and a high performance linear thermoplastic polyimide having the following repeating unit: ##STR1## Provided is an improved high temperature matrix resin which is capable of performing at 316.degree. C. in air for several hundreds of hours. This resin has significantly improved toughness and microcracking resistance, excellent processability and mechanical performance, and cost effectiveness.
    Type: Grant
    Filed: January 26, 1989
    Date of Patent: March 24, 1992
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Ruth H. Pater
  • Patent number: 5091455
    Abstract: Interpenetrating network polymers (IPN's) are made by admixing polyols, polyisocyanate, and a poly(vinylchloride) plastisol, followed by heating to complete the cure. The resulting polyurethane/poly(vinylchloride) IPN has superior properties as sealant, especially for automotive parts.
    Type: Grant
    Filed: July 10, 1990
    Date of Patent: February 25, 1992
    Assignee: W. R. Grace & Co.-Conn.
    Inventors: Norman E. Blank, RIchard C. Hartwig, Cung Vu
  • Patent number: 5084513
    Abstract: A process for the manufacture of stable interpenetrating polymer blend networks is provided, comprising the preparation of a gel of a poly(alkylene) polymer by dissolving it in a mixture of one or more organic solvents and one or more vinyl aromatic monomers, optionally mixed with a compatible monomer, cooling this solution to a temperature of at most 80.degree. C., adding of a radical forming initiator for the polymerization of the vinyl aromatic monomer(s), homogenizig the solution, cooling the solution to a temperature to obtain gelation of the polyalkylene polymer in the solvent mixture, followed by heating the obtained gel to a temperature of at least 80.degree. C. and subsequently polymerization of the vinyl aromatic monomer(s) in bulk or suspending the heated solution in a vigorously stirred aqueous medium of a lower temperature to obtain gelation and polymerizing the suspended gel into polymer blend beads, stable interpenetrating polymer blend networks and intermediate gel used therewith.
    Type: Grant
    Filed: February 9, 1990
    Date of Patent: January 28, 1992
    Assignee: Shell Internationale Research Maatschappij B.V.
    Inventors: Johannes M. Zijderveld, Philippe M. Scheerlinck, Hugo A. A. Berghmans
  • Patent number: 5079272
    Abstract: A porous membrane is formed from an interpenetrating polymer network of a hydrophobic polymer and a polymerized and crosslinked hydrophilic monomeric composition. A solution of the polymer and monomeric composition is cast, exposed to ultraviolet radiation, coagulated and dried. The resulting dried membrane is annealed in order to render its surface hydrophilic.
    Type: Grant
    Filed: November 30, 1989
    Date of Patent: January 7, 1992
    Assignee: Millipore Corporation
    Inventors: Anthony E. Allegrezza, Jr., Ellen C. Bellantoni
  • Patent number: 5066708
    Abstract: A process of using compositions comprising certain thermoplastic elastomeric polymers for damping and damping compositions comprising soft thermoset polymer containing microscopically discrete segments of said thermoplastic elastomeric polymers.
    Type: Grant
    Filed: January 10, 1991
    Date of Patent: November 19, 1991
    Assignee: Rohm and Haas Company
    Inventors: Robert D. Koller, Sr., Carl P. Hemenway
  • Patent number: 5066683
    Abstract: Microporous waterproof and moisture vapor permeable products are described which are formed from a matrix having an internal microstructure which is coated with a hydrophobic material. A process is described including the steps of (1) applying to the surface of the matrix a liquid hydrophobic material, (2) allowing the liquid to penetrate into the microstructure and then (3) drying, vulcanizing or curing the product.
    Type: Grant
    Filed: May 1, 1990
    Date of Patent: November 19, 1991
    Assignee: Tetratec Corporation
    Inventors: Joseph E. Dillon, Mark E. Dillon
  • Patent number: 5021519
    Abstract: A non-elastomeric epoxy having a mol wt less than about 10,000 and curing agent therefor ("epoxy-curing-agent"), both of which (epoxy/epoxy-curing-agent) are liquid while at curing temperatures, provide a continuous liquid phase in which a polyimide (PI) generally, and a bisimide (BI) in particular, may be homogeneously dispersed to form a fluidized dispersion. In one embodiment, the less viscous epoxy/epoxy-curing-agent is the dispersive medium (continuous phase) and the PI the dispersed or discontinuous phase. In the more preferred embodiment, the epoxy/epoxy-curing-agent and PI are miscible, forming a single liquid phase in which the PI is homogeneously dispersed. In each embodiment, the epoxy is essentially unreactive with the PI. Upon curing the epoxy in a first stage, to form a polymeric epoxy matrix (also referred to as "cured epoxy resin" herein) at a temperature below 150.degree. C.
    Type: Grant
    Filed: March 24, 1988
    Date of Patent: June 4, 1991
    Assignee: Aluminum Company of America
    Inventors: Uday M. Varde, Michael N. Tackie, Rakesh K. Gupta
  • Patent number: 5018337
    Abstract: Cases and cartons are formed and/or sealed using a specific class of low viscosity reactive urethane hot melt adhesive compositions which provide a fast setting, temperature resistant bond that is not attacked by aromatic oils solvents or petrochemical vapors.
    Type: Grant
    Filed: April 10, 1989
    Date of Patent: May 28, 1991
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: David G. Carter, Derek J. Green, Michael C. Collins
  • Patent number: 5011887
    Abstract: A thermoplastic resin composition superior in heat stability and impact resistance, which comprises 95-5% by weight of a thermoplastic polymer (A) selected from homopolymers and copolymers of ethylenic unsaturated monomers or from polymers of bifunctionally reactive compounds and 5-95% by weight of a compound-rubber-based graft copolymer which is produced by the graft polymerization of one or more vinyl monomers onto compound rubber particles having an average diameter of 0.08-0.6 .mu.m and structures in which 10-90% by weight of a polyorganosiloxane rubber component and 90-10% by weight of a polyalkyl(meth)acrylate rubber component are tangled together so as not to be separable from each other.
    Type: Grant
    Filed: March 8, 1989
    Date of Patent: April 30, 1991
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Isao Sasaki, Naoki Yamamoto, Akira Yanagase
  • Patent number: 5008142
    Abstract: A curable polymer composition for use in providing a dimensionally stable coating comprises a semi-interpenetrating polymer network. The semi-interpenetrating polymer network includes a reactive polymer component, cross-linking agent, and non-reactive polymer component. The non-reactive polymer component has a molecular weight of about 7,000-30,000, and preferably about 15,000. In preferred embodiments, the reactive polymer has a molecular weight of about 30,000-200,000, and preferably about 40,000-60,000. Spacecoat compositions made with formulations described, exhibit good long-term stability, and resistance to failure upon embossing of a substrate to which the retroreflective sheeting is applied.
    Type: Grant
    Filed: September 2, 1988
    Date of Patent: April 16, 1991
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Bruce B. Wilson, Raymond E. Grunzinger
  • Patent number: 4996101
    Abstract: Semi-interpenetrating polymer networks having improved processibility and compatibility are prepared by combining a linear polymer comprised of a thermoplastic polyisoimide and a short chain thermosetting polymer in the form of a cross-linkable oligomer comprised of a thermosetting imide or isoimide oligomer containing unsaturated terminal groups, e.g., an acetylene-, a maleimide-, a nadimide- or a benzocyclobutene-terminated imide or isoimide oligomer. In the resulting blend at least one of the diamine and dianhydride moieties of the structural backbone unit of the polyisoimide and of the cross-linkable oligomer are the same, and preferably both of the components of the blend have the same structural backbone unit.
    Type: Grant
    Filed: August 8, 1988
    Date of Patent: February 26, 1991
    Assignee: Lockheed Corporation
    Inventors: Abraham L. Landis, Kreisler S. Y. Lau
  • Patent number: 4994522
    Abstract: A vinyl chloride resin composition having excellent impact resistance even at a low temperature and good weather resistance is disclosed. Such vinyl chloride resin composition comprises:(A) a vinyl chloride resin, and(B) a compound rubber type graft copolymer wherein one or more vinyl monomers are graft-polymerized onto a compound rubber that has an average particle diameter of 0.08 to 0.6 .mu.m and possesses such a structure that 1 to 99 wt. % of a polyorganosiloxane rubber component and 1 to 990 wt. % of a polyalkyl (meth)acrylate rubber component are entangled in an inseparable fashion, and the total amount of the polyorganosiloxane rubber component and the polyalkyl (meth)acrylate rubber component is 100 wt. %.
    Type: Grant
    Filed: January 23, 1989
    Date of Patent: February 19, 1991
    Assignee: Mitsubishi Rayon Company Limited
    Inventors: Isao Sasaki, Naoki Yamamoto, Akira Yanagase
  • Patent number: 4994523
    Abstract: An impact-resistant resin composition having excellent impact resistance, weather resistance, surface appearance and wear characteristics is disclosed.The resin composition comprises:(A) a compound rubber type graft copolymer wherein at least one vinyl monomers is graft-polymerized onto a compound rubber that has an average particle diameter of 0.08 to 0.6 .mu.m and possesses such a structure that 10 to 90 wt. % of a polyorganosiloxane rubber component and 10 to 90 wt. % of a polyalkyl (meth)acrylate rubber component are entangled in an inseparable fashion, and the total amount of the polyorganosiloxane rubber component and the polyalkyl (meth)arcylate rubber component is 100 wt. %; and(B) a vinyl polymer obtained by polymerizing 70 to 100 wt. % of at least one vinyl monomer selected from the group consisting of aromatic alkenyl compounds, vinyl cyanide compounds, and alkyl (meth)acrylates with 0 to 30 wt. % of other vinyl monomer copolymerizable with them.
    Type: Grant
    Filed: January 23, 1989
    Date of Patent: February 19, 1991
    Assignee: Mitsubishi Rayon Company Limited
    Inventors: Isao Sasaki, Naoki Yamamoto, Akira Yanagase
  • Patent number: 4992506
    Abstract: Molding compositions comprise a copolyetherester (A), (B) an aromatic thermoplastic polyester and a multistage rubbery elastomer (C) comprising a crosslinked (meth)acrylate phase and an interpenetrating, crosslinked styrenic phase and optionally, a mineral filler (D). Such compositions are useful for making molded articles with a good balance of modulus and elongation properties.
    Type: Grant
    Filed: December 2, 1988
    Date of Patent: February 12, 1991
    Assignee: General Electric Company
    Inventors: Michael R. McCormick, Thomas A. Morelli, Warren J. Peascoe, Stefan F. Rasch, John A. Tyrell, May T. Wong
  • Patent number: 4957981
    Abstract: Polymeric material comprising an interpenetrating network of a polyol(allyl carbonate), e.g., Nouryset.RTM.200, epoxy resin. The polymeric material is prepared by polymerizing 70 to 95 parts by weight of the polyol(allyl carbonate) by radical initiation and polymerizing partially or entirely simulataneously an epoxy resin-forming mixture by acid catalysis. The epoxy resin-forming mixture comprises 10-90 wt. % of aliphatic or cycloaliphatic polyepoxide and 90-10 wt. % of a polyol/anhydride adduct having molecular weight of 500-5,000.
    Type: Grant
    Filed: February 1, 1990
    Date of Patent: September 18, 1990
    Assignee: Akzo N.V.
    Inventors: Jan Andre J. Schutyser, Tjerk O. Boonstra
  • Patent number: 4923934
    Abstract: A composition for use in forming an interpenetrating polymer network includes a blocked urethane prepolymer, a polyol, an epoxy resin and an epoxy catalyzing agent.
    Type: Grant
    Filed: January 5, 1989
    Date of Patent: May 8, 1990
    Inventor: Todd A. Werner
  • Patent number: 4921882
    Abstract: An electron beam irradiated release film is formed from a melt processible composition including a silicone component crosslinked by the reaction of a hydride-containing silicone and a silicone containing an unsaturated substituent within a polymeric thermoplastic matrix to form a silicone pseudo-interpenetrating polymer network. The crosslinking of the silicone component by reaction of the hydride and unsaturated substituents is inititated during thermoplastic melt-mixing and film forming of the component with the matrix. Coated films are preferably formed by coextrusion of a polymeric thermoplastic film and a crosslinkable mixture of the silicone components and a polymeric thermoplastic. Alternatively, extrusion coating of the mixture onto a preformed film may be used to form the coated films. Preferably, these films have a thickness of from 0.000005 to 0.2 inch. The film is electron beam irradiated with a dose of from about 50 rad to about 50 Mrad.
    Type: Grant
    Filed: June 16, 1988
    Date of Patent: May 1, 1990
    Assignee: Hercules Incorporated
    Inventor: George A. Senich
  • Patent number: 4918132
    Abstract: A thermoplastic polyester resin composition comprising from 10 to 80% by weight of a thermoplastic polyester (A); from 5 to 55% by weight of a compound rubber type graft copolymer (B) having at least one vinyl monomer graft-polymerized onto a compound rubber composed of from 10 to 90% by weight of a polyorganosiloxane rubber and from 10 to 90% by weight of a polyalkyl (meth)acrylate rubber in a total amount of 100% by weight in an inseparably interlocking fashion and having an average particle size of from 0.08 to 0.6 .mu.m; from 5 to 70% by weight of a thermoplastic polyester elastomer (C); and from 0 to 60% by weight of a filler (D), with the total amount of components (A) to (D) being 100% by weight.
    Type: Grant
    Filed: September 20, 1988
    Date of Patent: April 17, 1990
    Assignee: Mitsubishi Rayon Company Limited
    Inventors: Masafumi Hongo, Hideyuki Shigemitsu, Naoki Yamamoto, Akira Yanagase
  • Patent number: 4912174
    Abstract: A process is disclosed for preparing a thermoplastic composition having elastic memory and containing polyurethane interlocked in a network of polycaprolactone. The product of the aforementioned process is particularly useful as orthopedic cast or immobilizing device.
    Type: Grant
    Filed: December 2, 1985
    Date of Patent: March 27, 1990
    Assignee: Laboratoires D'Hygiene et de Dietetique (L.H.D.)
    Inventor: Herve Grouiller
  • Patent number: 4902737
    Abstract: A resin composition comprising:(i) at least one aromatic carbonate resin;(ii) at least one polyester resin; and(iii) an impact improving effective amount of at least one two-phase interpolymer comprised of at least one cross-linked polyacrylate and at least one cross-linked styrene-acrylontrile resin.
    Type: Grant
    Filed: June 22, 1988
    Date of Patent: February 20, 1990
    Assignee: General Electric Company
    Inventors: Angelika H. McHale, Warren J. Peascoe
  • Patent number: 4886689
    Abstract: A novel adhesive is described, consisting of a matrix-matrix polyblend of polymer components useful in an adhesive tie layer to bond incompatible polymer layers. The adhesives are a blend of the components making up the incompatible polymer layers themselves, or polymers substantially similar to these, and are melt processed to produce a matrix-matrix morphology with mechanical interlocking of the polymer components that is maintained upon cooling. Additives may be provided in one or both adhesive components to improve the cohesive strength of the adhesive formed by the mechanical interlocking.
    Type: Grant
    Filed: May 19, 1988
    Date of Patent: December 12, 1989
    Assignee: Ausimont, U.S.A., Inc.
    Inventors: Abraham M. Kotliar, William Sacks, John P. Sibilia, Rakesh Kumar
  • Patent number: 4882383
    Abstract: Thermoplastic compositions comprising rubber modified polyalkenyl aromatic resin and a modifying agent having a core-shell structure comprised of an interpenetrating, cross-linked (meth)acrylate core and a cross-linked styrenic resin shell have significantly improved impact strength, thermal resistance and surface appearance following molding into shaped articles.
    Type: Grant
    Filed: July 21, 1987
    Date of Patent: November 21, 1989
    Assignee: General Electric Co.
    Inventor: Sai-Pei Ting
  • Patent number: 4871595
    Abstract: The present invention is directed to the use of ordered polymers as a substrate material for the preparation of printed wire boards (PWB). In preferred embodiments, the PWB of the present invention comprises a generic, high density, organic multilayer PWB capable of being employed as a high density leadless perimeter and in grid array ceramic chip packages. Specific chip package density requirements are 0.020-in. centers with up to 300 input/outputs (I/Os) for perimeter type packages and 0.050-in. center grid array type packages with up to 240 I/Os per device. In its most preferred embodiments, the present invention is directed to a method of forming a PBT PWB substrate layer of 0.0025 in. or less in thickness. Another preferred aspect of the present invention concerns the discovery that a copper layer can be bonded to a PBT film substrate with a strength comparable to existing PWB materials.
    Type: Grant
    Filed: December 16, 1986
    Date of Patent: October 3, 1989
    Assignee: Foster Miller, Inc.
    Inventors: Richard W. Lusignea, William A. Stevenson
  • Patent number: 4863977
    Abstract: This invention provides hardenable compositions useful as construction media for a wide range of applications. Particular utility is found in the dental and medical arts where such compositions are highly suitable for the formation and construction of denture base, denture baseplates, denture liners, denture repair, custom trays, veneering for crowns and bridgework, artificial teeth, veneers and repair for natural teeth, and tooth restorative fillings. Such materials having improved impact strengths and elastic moduli when hardened are disclosed which include rubber-modified polymer.
    Type: Grant
    Filed: November 10, 1987
    Date of Patent: September 5, 1989
    Assignee: Dentsply Research & Development Corp.
    Inventors: Louis H Tateosian, W. Donald Wilson
  • Patent number: 4849469
    Abstract: Thermoplastic compositions and composites are produced which have fewer and smaller voids with more consistent dimensions compared to conventional unreinforced and fiber reinforced thermoplastics. The high modulus thermoplastic contains silicone semi-interpenetrating polymer networks which are formed by vulcanization within the thermoplastic and initiated during melt processing. Parts molded from the compositions are more homogeneous, with evenly distributed voids, thus reducing the possibility of strss fractures. The compositions are particularly useful in the molding in thick cross-section and variable thickness parts and have been found to have increased thermal stability.
    Type: Grant
    Filed: September 21, 1987
    Date of Patent: July 18, 1989
    Assignee: ICI Americas Inc.
    Inventors: Jane M. Crosby, MaryGail K. Hutchins, Susan K. Ward
  • Patent number: 4847333
    Abstract: Crosslinking polyamide oligomers are mixed with comparable, noncrosslinking, polyamide to provide solvent-resistant blends that are particularly suited for aerospace uses. Generally, the blend comprises an equimolar mixture of the linear or multidimensional oligomer and a polymer having substantially an identical backbone and substantially the same average formula weight as the oligomer. Prepregs and composites of the blends can easily be prepared.
    Type: Grant
    Filed: May 18, 1987
    Date of Patent: July 11, 1989
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowitz, Clyde H. Sheppard
  • Patent number: 4845162
    Abstract: The present invention relates to a composition comprising a phenolic resin, as for example phenol formaldehyde, an active hydrogen containing polymer as for example a polyamide, and a curing agent, such as a polyepoxide.
    Type: Grant
    Filed: June 1, 1987
    Date of Patent: July 4, 1989
    Assignee: Allied-Signal Inc.
    Inventors: George J. Schmitt, Dusan C. Prevorsek, Hong B. Chin, Kwok W. Lem
  • Patent number: 4845150
    Abstract: This invention relates in general to the formation of films having a controlled molecular orientation prepared from rod-like extended chain aromatic-heterocyclic ordered polymers, and containing a binder in the micro-infrastructure. Such films have high tensile strength, modulus, and environmental resistance characteristics.
    Type: Grant
    Filed: June 22, 1987
    Date of Patent: July 4, 1989
    Assignee: Foster-Miller Inc.
    Inventors: Robert Kovak, Roland R. Wallis, Jr.
  • Patent number: 4842938
    Abstract: A method for making a one package heat curable (i.e. thermosetting) composition which, on heating, forms a urethane/epoxy/silicone interpenetrating polymer network (IPN) system; one package heat curable compositions made by such a method; metal reinforcing patches, directly adherent to an oily metal surface such as an oily steel surface, comprising a sheet-like carrier having thereon such a one package heat curable composition in combination with a filler admixed therewith, said filler possibly including magnetic particles; a method for reinforcing metal which comprises applying thereto such a metal reinforcing patch and curing said heat curable composition at an elevated temperature to form a urethane/epoxy/silicone interpenetrating polymer network.
    Type: Grant
    Filed: March 23, 1988
    Date of Patent: June 27, 1989
    Assignee: Essex Specialty Products, Inc.
    Inventors: Sidky D. Rizk, Navinchandra B. Shah, John W. Powers
  • Patent number: 4831082
    Abstract: An aromatic carbonate resin composition substantially free of non-crosslinked or linear styrene-acrylonitrile resin exhibiting improved impact properties comprised of:(i) at least one thermoplastic aromatic carbonate resin; and(ii) an amount effective to improve the impact properties of said resin of at least one interpolymer of a crosslinked polyacrylate and a crosslinked styrene-acrylonitrile resin. The interpolymer is a two phase interpolymer formed by a two stage polymerization process.
    Type: Grant
    Filed: October 22, 1987
    Date of Patent: May 16, 1989
    Assignee: General Electric Company
    Inventor: Warren J. Peascoe
  • Patent number: 4831079
    Abstract: Blends of (i) an impact resistant interpolymer comprising crosslinked acrylic or methacrylic rubber, crosslinked styrene-acrylonitrile, and uncrosslinked styrene-acrylonitrile polymer components, (ii) a styrene-acrylonitrile copolymer resin, (iii) an acrylic polymer, and (iv) a multistage grafted acrylic elastomer are disclosed. The blends display a good combination of physical properties including gloss, impact strength and tensile properties.
    Type: Grant
    Filed: December 23, 1987
    Date of Patent: May 16, 1989
    Assignee: General Electric Company
    Inventor: Sai-Pei Ting
  • Patent number: 4831071
    Abstract: High modulus thermoplastic compositions and composites are produced which exhibit enhanced melt integrity and strength, allowing the composites to be melt-drawn to smooth surfaced, high tolerance profiles, such as thin-walled tubing, wire, coatings, films, etc. The melt integrity is improved by adding to the thermoplastic prior to or during thermoplastic melt processing a silicone component which will be vulcanized within the thermoplastic to form a silicone semi-interpenetrating polymer network initiated during the melt processing of the thermoplastic. The composition contains about 0.1 to 20, and preferably about 1 to 4 weight percent of the silicone network, and may also contain fibrous reinforcement and/or filler/modifiers.
    Type: Grant
    Filed: September 21, 1987
    Date of Patent: May 16, 1989
    Assignee: ICI Americas Inc.
    Inventors: Susan K. Ward, Gregory S. O'Brien
  • Patent number: 4829127
    Abstract: Composite resin particles each of which comprises a granular body portion of crosslinked polymer having a mean diameter of 0.01 to 10.mu. and a number of linear polymer chains, a part of the respective chain penetrating into the inside of the granular body portion and the remaining part extending outwardly therefrom. A dispersion of said composite resin particles in an organic solvent is useful as a resinous vehicle for coating compositions.
    Type: Grant
    Filed: July 20, 1987
    Date of Patent: May 9, 1989
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Hisaichi Muramoto, Keizou Ishii, Shinichi Ishikura
  • Patent number: 4808676
    Abstract: A polyetherimide/epoxyimide resin composition prepared by mixing a polyetherimide having a repeating unit represented, for example, by the formula of: ##STR1## with an epoxyimide represented by the following general formula of: ##STR2## wherein R is, for example, selected from the group consisting of diphenyl ether, diphenylmethane, diphenyl sulfone, m-phenylene, p-phenylene and 1,6-hexamehtylene;in a mixing ratio, by weight, of preferably from 6:1 to 1:1. The resin composition is mixed in a solvent to form a solution from which a film may be formed through a flow-coating method. The film made of the polyetherimde/epoxyimide resin composition of the invention, after being removed of the solvent followed by thermal treatment at a temperature of 150.degree. C. to 220.degree. C. for 1 to 3 hours, has improved thermal resistance, adaptability for adhesive, and low moisture permeability.
    Type: Grant
    Filed: October 7, 1987
    Date of Patent: February 28, 1989
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Shiro Nishi, Shigekuni Sasaki, Yoshinori Hasuda
  • Patent number: 4766183
    Abstract: A method for making a one package heat curable (i.e. thermosetting) composition which, on heating, forms a urethane/epoxy/silicone interpenetrating polymer network (IPN) system; one package heat curable compositions made by such a method; metal reinforcing patches, directly adherent to an oily metal surface such as an oily steel surface, comprising a sheet-like carrier having thereon such a one package heat curable composition in combination with a filler admixed therewith, said filler possibly including magnetic particles; a method for reinforcing metal which comprises applying thereto such a metal reinforcing patch and curing said heat curable composition at an elevated temperature to form a urethane/epoxy/silicone interpenetrating polymer network.
    Type: Grant
    Filed: November 4, 1986
    Date of Patent: August 23, 1988
    Assignee: Essex Specialty Products, Inc.
    Inventors: Sidky D. Rizk, Navinchandra B. Shah
  • Patent number: 4764560
    Abstract: There is provided a composition having interpenetrating matrices comprising (a) a first polymer network characterized by nodes interconnected by fibrils and (b) a second polymer network comprising diorganosiloxy units. In another aspect, there are provided compositions comprising an interpenetrating polymer network of polytetrafluoroethylene and polydiorganosiloxane. Methods for making the foregoing compositions are also provided.
    Type: Grant
    Filed: August 10, 1987
    Date of Patent: August 16, 1988
    Assignee: General Electric Company
    Inventor: Tyrone D. Mitchell
  • Patent number: 4754001
    Abstract: Interpenetrating polymer networks prepared from 60 to 99.9% by weight, of a thermoplast and 0.1 to 40% by weight of a thermosetting resin which comprises:(a) at least one polycyanate and(b) from 1 to 40% by weight, based on (a), of at least one polyester having a hydroxyl number of from 28 to 320, a number average molecular weight M.sub.n of from 700 to 8000 and containing from 50 to 92%, by weight, of alcohol residues, acid residues, or both with each of said residues containing cycloaliphatic moieties.
    Type: Grant
    Filed: September 12, 1986
    Date of Patent: June 28, 1988
    Assignee: Bayer Aktiengesellschaft
    Inventors: Johannes Blahak, Rolf Dhein, Lothar Preis, Manfred Schreckenberg
  • Patent number: 4752624
    Abstract: Process for the preparation of interpenetrating polymer network membrane, composed of hydrophilic-hydrophobic two phase structure with varying degree of segregation of the hydrophilic and hydrophobic component by a polymerization reaction comprising controlling the relative rate of polymerization of the component polymers, or controlling the reaction temperature and the reaction pressure during the interpenetrating polymer network forming reaction and particularly by a process which comprises, subjecting a monomeric reaction mixture to a simultaneous polymerization and crosslinking reaction or a sequential polymerization and crosslinking reaction, to produce at least a polymer network of a urethane resin of general formula (I) ##STR1## wherein R.sub.1 is ##STR2## wherein R.sub.3 stands for hydrogen or methyl group, n is integer of 1-3 and m is integer of 5-40,R.sub.2 is either ##STR3## wherein n is integer of 2-8, and styrene resin of general formula (II) ##STR4## wherein R.sub.4 is hydrogen or methyl group.
    Type: Grant
    Filed: January 8, 1987
    Date of Patent: June 21, 1988
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Seong C. Kim, Jae H. Lee, Jang S. Han, Joo O. Song
  • Patent number: 4742128
    Abstract: The present invention provides a molded product composed of a polymer alloy of a polyamide polymer and at least one polyurethane polymer, polyurea polymer, and/or polyisocyanurate polymer. The polymer alloy is an interpenetrated network of different polymers, a semi-interpenetrating network of different polymers, or a polyblend of different polymers.Reactant streams containing the compounds for forming the polymers of the polymer alloy are admixed to form a reaction mixture. The liquid reaction mixture is preferably a substantially homogeneous mixture of the reactant compounds. Each reactant stream thus contains only a portion of the components required to obtain the polymer alloy product. The resulting mixture is then rapidly introduced into a mold wherein chemical reaction takes place and the polymer alloy forms. Preferably, the mold is heated. The solid polymer alloy product is then recovered from the mold.
    Type: Grant
    Filed: October 15, 1985
    Date of Patent: May 3, 1988
    Assignee: Stamicarbon B.V.
    Inventors: Kurt C. Frisch, Kaneyoshi Ashida, Jozef L. M. van der Loos, Albert A. van Geenen
  • Patent number: 4731414
    Abstract: Blends of (A) an impact resistant interpolymer comprising crosslinked acrylic or methacrylic rubber, crosslinked styrene-acrylonitrile and uncrosslinked styrene-acrylonitrile polymer components, (B) an acrylic polymer, and (C) a multistage grafted acrylic elastomer are disclosed. The blends display a good combination of physical properties including gloss, impact strength and tensile properties.
    Type: Grant
    Filed: June 20, 1986
    Date of Patent: March 15, 1988
    Assignee: General Electric Company
    Inventor: Sai-Pei Ting
  • Patent number: 4711913
    Abstract: This invention provides hardenable compositions useful as construction media for a wide range of applications. Particular utility is found in the dental and medical arts where such compositions are highly suitable for the formation and construction of denture base, denture baseplates, denture liners, denture repair, custom trays, veneering for crowns and bridgework, artificial teeth, veneers and repair for natural teeth, and tooth restorative fillings. Such materials having improved impact strengths and elastic moduli when hardened are disclosed which include rubber-modified polymer.
    Type: Grant
    Filed: September 25, 1984
    Date of Patent: December 8, 1987
    Assignee: Dentsply International Inc.
    Inventors: Louis H. Tateosian, W. Donald Wilson
  • Patent number: 4708981
    Abstract: Water-insoluble proton-conducting polymers which may be formed into membranes which are used in gas separation or gas sensing processes comprise an interpenetrating polymer network. This IPN is formed from the interaction between a host polymer and a guest polymer which is subsequently cross-linked or cured. The host polymer blend is formed from a phosphoric acid or sulfuric acid and a polymer or copolymer of a compound which possesses repeat units such as, for example, hydroxy ethylene, vinyl sulfonic acid, ethylene imine, etc, while the guest polymer is formed from a monofunctional monomer such as methacrylic acid and a difunctional cross-linking agent such as methylenebisacrylamide.
    Type: Grant
    Filed: December 11, 1985
    Date of Patent: November 24, 1987
    Assignee: UOP Inc.
    Inventors: Joseph J. Zupancic, Raymond J. Swedo, Sandra Petty-Weeks
  • Patent number: 4705519
    Abstract: A repair material enabling regrowth of damaged bones is set forth. In the preferred and illustrated embodiment, the repair material is polydivinylbenzene in particulate form. The particles are typically random sizes in a specified range, relatively porous, having a relatively high surface area per unit weight, thereby enabling bone growth supported by such particles.
    Type: Grant
    Filed: August 15, 1986
    Date of Patent: November 10, 1987
    Assignee: Hayes Separation, Inc.
    Inventors: William V. Hayes, Turner, Albert H.
  • Patent number: 4699935
    Abstract: A novel inorganic filler-containing polyolefin resin composition exhibits high-level stiffness at a temperature in the vicinity of crystalline melting point of the matrix-forming polyolefin resin or even at a higher temperature. The composition comprises specified amounts of a matrix-forming polyolefin resin, a dispersion-phase-forming resin, and a fibrous or lamellate inorganic filler. In the composition, one end portion of an individual fiber or lamella of the fibrous of lamellate inorganic filler is embedded in the dispersion-phase-forming resin not uniformly miscible dispersed in the polyolefin resin and the other end portion of the individual fiber of lamella is also embedded in the dispersion-phase-forming resin located at a separate position, whereby the filler forms substantially a network structure via the dispersion-phase-forming resin.
    Type: Grant
    Filed: March 26, 1986
    Date of Patent: October 13, 1987
    Assignee: Mitsubishi Petrochemical Company Limited
    Inventor: Hironari Sano